JP2506452Y2 - Side emitting display - Google Patents
Side emitting displayInfo
- Publication number
- JP2506452Y2 JP2506452Y2 JP1990070767U JP7076790U JP2506452Y2 JP 2506452 Y2 JP2506452 Y2 JP 2506452Y2 JP 1990070767 U JP1990070767 U JP 1990070767U JP 7076790 U JP7076790 U JP 7076790U JP 2506452 Y2 JP2506452 Y2 JP 2506452Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting display
- substrate
- display device
- recessed portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 （産業上の利用分野） この考案は、側面発光表示装置に係り、特に、小さい
スペースに搭載することが可能な側面発光表示装置に関
する。TECHNICAL FIELD The present invention relates to a side light emitting display device, and more particularly to a side light emitting display device that can be mounted in a small space.
（従来の技術） 従来の側面発光表示装置として、例えば、第４図、第
５図に示すものがある。(Prior Art) As a conventional side surface light emitting display device, there is one shown in FIGS. 4 and 5, for example.
この従来の側面発光表示装置は、その側面発光表示素
子ａが次に説明する構成となっていた。In this conventional side surface light emitting display device, the side surface light emitting display element a has a configuration described below.
すなわち、第４図に示すように、一方のリードフレー
ムb1の一端に、銀ペーストｃでLEDチップｄを接着し、
このLEDチップｄと他方のリードフレームb2の一端との
間に金線等のボンディングワイヤーｅを配線してトラン
スファー成形等によって透明性を有する合成樹脂ｈで封
止したものである。That is, as shown in FIG. 4, the LED chip d is bonded to one end of one lead frame b1 with silver paste c,
A bonding wire e such as a gold wire is laid between the LED chip d and one end of the other lead frame b2 and sealed with a synthetic resin h having transparency by transfer molding or the like.
そして、上記構成の側面発光表示素子ａを基板ｆに取
着実装する場合に、基板ｆに取付孔ｇ、ｇを設け、この
取付孔ｇ、ｇに側面発光表示素子ａの両リードフレーム
b1、b2を挿入して、基板ｆの裏面に突出した両リードフ
レームb1、b2の端部を半田付けｉで電気的接続によって
取着実装していた。When the side surface light emitting display element a having the above structure is mounted on the board f, mounting holes g and g are provided in the board f, and the lead frames of the side surface light emitting display element a are provided in the mounting holes g and g.
By inserting b1 and b2, the ends of both lead frames b1 and b2 protruding on the back surface of the board f are attached and mounted by electrical connection by soldering i.
（考案が解決しようとする課題） ところが、上記従来の側面発光表示装置においては、
側面発光表示素子ａを基板ｆに取着実装する場合に、基
板ｆの裏面に突出した両リードフレームb1、b2の端部を
半田付けｉで電気的接続によって取着実装しなければな
らなかったので、必要以上のスペースを必要とし、小ス
ペース化に限界があるといった問題があった。(Problems to be Solved by the Invention) However, in the above-mentioned conventional side surface light emitting display device,
When the side surface light emitting display element a is mounted and mounted on the board f, the ends of the lead frames b1 and b2 protruding on the back surface of the board f must be mounted and mounted by electrical connection by soldering i. Therefore, there is a problem in that it requires more space than necessary and there is a limit to reducing the space.
しかも、一般に側面発光表示装置は小スペース化（薄
型化）を要求されるものであり、従来のものは上記した
ように必要以上のスペースを必要とするものであるの
で、不具合なものであった。Moreover, in general, the side surface light emitting display device is required to have a smaller space (thinner), and the conventional device needs more space as described above, which is a problem. .
この考案の課題は、上記従来の問題を解決することに
ある。An object of the present invention is to solve the above-mentioned conventional problems.
すなわち、側面発光表示装置の側面発光表示素子を基
板の表面に直接取着実装することができ、小スペース化
（薄型化）を図ることができる側面発光表示装置を提供
することである。That is, it is an object of the present invention to provide a side surface light emitting display device in which the side surface light emitting display element of the side surface light emitting display device can be directly attached and mounted on the surface of the substrate, and the space can be reduced (thinned).
（課題を解決するための手段） 上記課題を解決するため、本考案の側面発光表示装置
は、基板への取着面の一側縁から垂直に立ち上がった発
光面に凹設部が設けられ、この凹設部内に両電極端子の
一端側が配線されるとともに、一方の電極端子の一端に
発光素子が取着され、他方の電極端子の一端とこの発光
素子との間にボンディングワイヤーが配線され、これら
発光素子とボンディングワイヤーとが透明性を有する合
成樹脂で封止されることにより、前記発光素子が前記基
板の取着実装面に対して平行な方向に発光するように形
成された側面発光表示装置において、前記各電極端子
は、前記取着面から前記発光面を挟む左右の側面に沿っ
てそれぞれ立ち上がり、前記発光面を経て前記凹設部の
底面のほぼ中央部に至るまで、めっき配線によって形成
されものである。(Means for Solving the Problems) In order to solve the above problems, a side surface light emitting display device of the present invention is provided with a recessed portion on a light emitting surface that rises vertically from one side edge of an attachment surface to a substrate. One end side of both electrode terminals is wired in the recessed portion, a light emitting element is attached to one end of one electrode terminal, and a bonding wire is wired between one end of the other electrode terminal and this light emitting element, A side surface light emitting display in which the light emitting element and the bonding wire are sealed with a synthetic resin having transparency so that the light emitting element emits light in a direction parallel to the mounting surface of the substrate. In the device, each of the electrode terminals rises up from the attachment surface along the left and right side surfaces sandwiching the light emitting surface, and extends through the light emitting surface to a substantially central portion of the bottom surface of the recessed portion to form a plated wiring. Yo Is formed.
（作用） 各電極端子が、取着面から左右の側面及び発光面を経
て凹設部の底面のほぼ中央部まで、めっき配線によって
形成されているので、取着面を基板の表面に添接するこ
とによって、基板表面の配線と取着面に形成された各電
極端子とを面接触で直接取着することが可能となり、こ
れによって小スペース化（薄型化）が可能となる。(Operation) Since each electrode terminal is formed by plating wiring from the attachment surface to the left and right side surfaces and the light emitting surface to almost the center of the bottom surface of the recessed portion, the attachment surface is attached to the surface of the substrate. As a result, the wiring on the surface of the substrate and the electrode terminals formed on the attachment surface can be directly attached by surface contact, which makes it possible to reduce the space (thinner).
（実施例） 以下、この考案に係る側面発光表示装置の実施例につ
いて、図面に基づいて説明する。(Embodiment) An embodiment of the side surface light emitting display device according to the present invention will be described below with reference to the drawings.
第１図は透明性を有する合成樹脂で封止する前の側面
発光表示素子の斜視図、第２図は透明性を有する合成樹
脂で封止された後の側面発光表示素子を基板の表面に取
着実装する状態を示す斜視図、第３図は側面発光表示素
子を基板の表面に取着実装した状態を示す側面図であ
る。FIG. 1 is a perspective view of a side surface light emitting display element before being sealed with a transparent synthetic resin, and FIG. 2 is a side surface light emitting display element after being sealed with a transparent synthetic resin on the surface of a substrate. FIG. 3 is a perspective view showing the state of attachment and mounting, and FIG. 3 is a side view showing the state of the side surface light emitting display element attached and mounted on the surface of the substrate.
符号１は側面発光表示素子であって、この側面発光表
示素子１の合成樹脂からなる反射板２の発光面側には、
凹設部21が形成されている。Reference numeral 1 denotes a side surface light emitting display element, and the side surface of the light emitting surface of the reflector 2 made of synthetic resin of the side surface light emitting display element 1 is
A recessed portion 21 is formed.
第１図に示すように、この反射板２には、この反射板
２の取着面22から側面23、23を経て、この側面23に沿っ
て立ち上がり、発光面24を経て凹設部21の内側面211、2
11から底面212のほぼ中央に至る箇所まで、両電極端子3
A、3Bがめっき配線されている。As shown in FIG. 1, the reflecting plate 2 rises along the side face 23 from the attachment surface 22 of the reflecting plate 2 through the side faces 23, 23 and through the light emitting face 24 of the concave portion 21. Inner surface 211, 2
Both electrode terminals 3 from 11 to almost the center of the bottom surface 212
A and 3B are plated wiring.
そして、一方の電極端子3Aの凹設部21側の一端31Aに
はLEDチップ４が銀ペースト９によって取着されてい
る。The LED chip 4 is attached by silver paste 9 to one end 31A of the one electrode terminal 3A on the side of the recessed portion 21.
このLEDチップ４と他方の電極端子3Bの凹設部21側の
一端31Bとの間に金線からなるボンディングワイヤー５
が配線されている。A bonding wire 5 made of a gold wire between the LED chip 4 and one end 31B of the other electrode terminal 3B on the side of the recessed portion 21.
Is wired.
このLEDチップ４と金線からなるボンディングワイヤ
ー５とが配置された反射板２の凹設部21は、第２図に示
すように、透明性を有する合成樹脂７で封止される。As shown in FIG. 2, the recessed portion 21 of the reflection plate 2 on which the LED chip 4 and the bonding wire 5 made of a gold wire are arranged is sealed with a synthetic resin 7 having transparency.
このようにして、側面発光表示素子１が形成される。 In this way, the side surface light emitting display element 1 is formed.
この側面発光表示素子１は、第２図、第３図に示すよ
うにして、基板６に取着実装される。The side surface light emitting display element 1 is attached and mounted on the substrate 6 as shown in FIGS. 2 and 3.
すなわち、側面発光表示素子１の取着面22に形成され
た両電極端子3A、3Bの他端32A、32Bが、基板６の表面の
めっき配線部分6A、6Bの端部に半田付け８によって取着
実装される。That is, the other ends 32A and 32B of both electrode terminals 3A and 3B formed on the attachment surface 22 of the side surface light emitting display element 1 are attached to the ends of the plated wiring portions 6A and 6B on the surface of the substrate 6 by soldering 8. Will be implemented.
このように、側面発光表示素子１の両電極端子3A、3B
が合成樹脂製の反射板６にめっき配線されて形成されて
いて、この両電極端子3A、3Bの他端32A、32Bを基板６の
表面のめっき配線部分6A、6Bの端部に面接触にて直接取
着実装することができるものであるから、側面発光表示
素子１を基板６の表面に直接取着実装することができて
小スペース化（薄型化）を図ることができる。In this way, both electrode terminals 3A and 3B of the side surface light emitting display element 1 are
Are formed by plating wiring on the reflector plate 6 made of synthetic resin, and the other ends 32A, 32B of the both electrode terminals 3A, 3B are brought into surface contact with the ends of the plating wiring portions 6A, 6B on the surface of the substrate 6. Since the side surface light emitting display element 1 can be directly attached and mounted on the surface of the substrate 6, the space can be reduced (thinned).
尚、この側面発光表示装置における側面発光表示素子
１は取着実装面に対して側面方向（平行方向）に発光す
るものである。The side surface light emitting display element 1 in this side surface light emitting display device emits light in the side surface direction (parallel direction) to the mounting surface.
（考案の効果） 以上説明したように、この考案は、基板への取着面の
一側縁から垂直に立ち上がった発光面に凹設部が設けら
れ、この凹設部内に両電極端子の一端側が配線されると
ともに、一方の電極端子の一端に発光素子が取着され、
他方の電極端子の一端とこの発光素子との間にボンディ
ングワイヤーが配線され、これら発光素子とボンディン
グワイヤーとが透明性を有する合成樹脂で封止された構
造の側面発光表示装置において、各電極端子を、取着面
から左右の側面に沿ってそれぞれ立ち上がり、発光面を
経て凹設部の底面のほぼ中央部に至るまでめっき配線に
よって形成し、各電極端子の他端を基板の表面に形成さ
れた配線部分に面接触で直接取着するものであるから、
以下に述べる効果を奏する。(Effect of the Invention) As described above, according to the present invention, the light emitting surface that rises vertically from one side edge of the attachment surface to the substrate is provided with the recessed portion, and one end of both electrode terminals is provided in the recessed portion. Side is wired and the light emitting element is attached to one end of one of the electrode terminals,
In a side surface light emitting display device having a structure in which a bonding wire is wired between one end of the other electrode terminal and the light emitting element, and the light emitting element and the bonding wire are sealed with a synthetic resin having transparency, each electrode terminal From the attachment surface along the left and right side surfaces, respectively, and formed by plating wiring from the light emitting surface to almost the center of the bottom surface of the recessed portion, and the other end of each electrode terminal is formed on the surface of the substrate. Since it is directly attached to the wiring part with surface contact,
The following effects are achieved.
すなわち、側面発光表示装置の側面発光表示素子を基
板の表面に直接取着実装することができ、小スペース化
（薄型化）を図ることができる。That is, the side surface light emitting display element of the side surface light emitting display device can be directly attached and mounted on the surface of the substrate, and the space can be reduced (thinned).
また、非常に薄いスペース等で必要な側面発光を実現
させることができる。Further, it is possible to realize the required side light emission in a very thin space or the like.
更に、設計及び製造工程の簡略化を図ることができ
る。Furthermore, the design and manufacturing process can be simplified.
第１図はこの考案に係る側面発光表示装置の一実施例を
示すものであって、透明性を有する合成樹脂で封止する
前の側面発光表示素子の斜視図、第２図は透明性を有す
る合成樹脂で封止された後の側面発光表示素子を基板の
表面に取着実装する状態を示す斜視図、第３図は側面発
光表示素子を基板の表面に取着実装した状態を示す側面
図、第４図は従来の側面発光表示装置の側面発光表示素
子を示す斜視図、第５図は従来の側面発光表示装置の側
面図である。 １……側面発光表示素子 ２……反射板 3A、3B……電極端子 31A、31B……一端 32A、32B……他端 ４……LEDチップ ５……金線等のボンディングワイヤー ６……基板 ７……透明性を有する合成樹脂FIG. 1 shows an embodiment of a side surface light emitting display device according to the present invention. FIG. 1 is a perspective view of a side surface light emitting display element before sealing with a synthetic resin having transparency, and FIG. FIG. 3 is a perspective view showing a state in which the side surface light emitting display element after being sealed with the synthetic resin is attached and mounted on the surface of the substrate, and FIG. 3 is a side view showing a state in which the side surface light emitting display element is attached and mounted on the surface of the substrate. FIG. 4 is a perspective view showing a side surface light emitting display element of a conventional side surface light emitting display device, and FIG. 5 is a side view of a conventional side surface light emitting display device. 1 ... Side light emitting display element 2 ... Reflector 3A, 3B ... Electrode terminal 31A, 31B ... One end 32A, 32B ... The other end 4 ... LED chip 5 ... Bonding wire such as gold wire 6 ... Substrate 7: Transparent synthetic resin
Claims (1)
がった発光面に凹設部が設けられ、この凹設部内に両電
極端子の一端側が配線されるとともに、一方の電極端子
の一端に発光素子が取着され、他方の電極端子の一端と
この発光素子との間にボンディングワイヤーが配線さ
れ、これら発光素子とボンディングワイヤーとが透明性
を有する合成樹脂で封止されることにより、前記発光素
子が前記基板の取着実装面に対して平行な方向に発光す
るように形成された側面発光表示装置において、 前記各電極端子は、前記取着面から前記発光面を挟む左
右の側面に沿ってそれぞれ立ち上がり、前記発光面を経
て前記凹設部の底面のほぼ中央部に至るまで、めっき配
線によって形成されていることを特徴とする側面発光表
示装置。1. A light emitting surface vertically rising from one side edge of an attachment surface to a substrate is provided with a recessed portion, one end side of both electrode terminals is wired in the recessed portion, and one electrode terminal is provided. A light emitting element is attached to one end of the electrode, a bonding wire is wired between one end of the other electrode terminal and the light emitting element, and the light emitting element and the bonding wire are sealed with a transparent synthetic resin. According to the aspect, in the side surface light emitting display device in which the light emitting element is formed to emit light in a direction parallel to the mounting surface of the substrate, each of the electrode terminals includes a left side and a right side that sandwich the light emitting surface from the mounting surface. The side surface light emitting display device is characterized in that it is formed by plating wiring up to the respective side surfaces of the concave portion and extending to the substantially central portion of the bottom surface of the recessed portion through the light emitting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990070767U JP2506452Y2 (en) | 1990-07-02 | 1990-07-02 | Side emitting display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990070767U JP2506452Y2 (en) | 1990-07-02 | 1990-07-02 | Side emitting display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0428687U JPH0428687U (en) | 1992-03-06 |
| JP2506452Y2 true JP2506452Y2 (en) | 1996-08-07 |
Family
ID=31607204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990070767U Expired - Lifetime JP2506452Y2 (en) | 1990-07-02 | 1990-07-02 | Side emitting display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2506452Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4731696B2 (en) * | 2001-02-01 | 2011-07-27 | 三菱電機株式会社 | Optical semiconductor device and method for supplying power to optical semiconductor element |
| JP2005197318A (en) * | 2003-12-26 | 2005-07-21 | Stanley Electric Co Ltd | Lateral emission surface-mounted led and manufacturing method thereof |
| JP4868735B2 (en) * | 2004-07-12 | 2012-02-01 | 日亜化学工業株式会社 | Semiconductor device |
| JP4830321B2 (en) * | 2005-03-14 | 2011-12-07 | パナソニック株式会社 | Semiconductor light emitting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111340Y2 (en) * | 1971-08-05 | 1976-03-26 |
-
1990
- 1990-07-02 JP JP1990070767U patent/JP2506452Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0428687U (en) | 1992-03-06 |
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