JPS63200550A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS63200550A
JPS63200550A JP62033862A JP3386287A JPS63200550A JP S63200550 A JPS63200550 A JP S63200550A JP 62033862 A JP62033862 A JP 62033862A JP 3386287 A JP3386287 A JP 3386287A JP S63200550 A JPS63200550 A JP S63200550A
Authority
JP
Japan
Prior art keywords
lead frame
recess
semiconductor device
thickness
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62033862A
Inventor
Hiromasa Hasegawa
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP62033862A priority Critical patent/JPS63200550A/en
Publication of JPS63200550A publication Critical patent/JPS63200550A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE: To prevent a lead frame from rising off the surface of a semiconductor device and facilitate assembly work of the semiconductor device by selecting the thickness of the lead frame material so as to make the depth of a necessary recess less than 60% of the thickness.
CONSTITUTION: A lead frame unit for a semiconductor device is composed of a semiconductor element mounting part 1, a plurality of inner lead parts 2 and a plurality of outer lead parts 3 and the lead frame units are repeatedly formed in one plane to constitute a lead frame. A recess 4 with a depth of 0.3 mm is formed in the element mounting part 1 and the lead frame is covered with sealing resin 6 composed of Fe-Ni with a thickness of 0.5 mm. A light emitting diode is employed as the semiconductor element 7 placed and bonded in the recess 4 with conductive paste. The recess 4 is formed by a stamping process to reduce the influence upon the other parts, prevent the lead frame from rising off the surface of the semiconductor device and facilitate assembly of the device.
COPYRIGHT: (C)1988,JPO&Japio
JP62033862A 1987-02-17 1987-02-17 Lead frame Pending JPS63200550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62033862A JPS63200550A (en) 1987-02-17 1987-02-17 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62033862A JPS63200550A (en) 1987-02-17 1987-02-17 Lead frame

Publications (1)

Publication Number Publication Date
JPS63200550A true JPS63200550A (en) 1988-08-18

Family

ID=12398311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62033862A Pending JPS63200550A (en) 1987-02-17 1987-02-17 Lead frame

Country Status (1)

Country Link
JP (1) JPS63200550A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999063594A1 (en) * 1998-05-29 1999-12-09 Rohm Co., Ltd. Semiconductor device
WO2004107443A1 (en) * 2003-06-03 2004-12-09 Asetronics Ag Insulated metal substrate with at least one light diode, light diode matrix and production method
US7317181B2 (en) 2001-12-07 2008-01-08 Hitachi Cable, Ltd. Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
US20100270571A1 (en) * 2007-12-03 2010-10-28 Seoul Semiconductor Co., Ltd. Slim led package
WO2012113249A1 (en) * 2011-02-22 2012-08-30 广东德豪润达电气股份有限公司 Led encapsulation bracket structure and led device
KR101346799B1 (en) * 2006-12-28 2014-01-02 서울반도체 주식회사 Light emitting diode package and method for fabricating the same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999063594A1 (en) * 1998-05-29 1999-12-09 Rohm Co., Ltd. Semiconductor device
US6603148B1 (en) 1998-05-29 2003-08-05 Rohm Co., Ltd. Semiconductor device
US7317181B2 (en) 2001-12-07 2008-01-08 Hitachi Cable, Ltd. Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
WO2004107443A1 (en) * 2003-06-03 2004-12-09 Asetronics Ag Insulated metal substrate with at least one light diode, light diode matrix and production method
KR101346799B1 (en) * 2006-12-28 2014-01-02 서울반도체 주식회사 Light emitting diode package and method for fabricating the same
US8319248B2 (en) * 2007-12-03 2012-11-27 Seoul Semiconductor Co., Ltd. Slim LED package
US9530942B2 (en) 2007-12-03 2016-12-27 Seoul Semiconductor Co., Ltd. Slim LED package
JP2011505689A (en) * 2007-12-03 2011-02-24 ソウル セミコンダクター カンパニー リミテッド Slim-type led package
US20100270571A1 (en) * 2007-12-03 2010-10-28 Seoul Semiconductor Co., Ltd. Slim led package
US8659050B2 (en) 2007-12-03 2014-02-25 Seoul Semiconductor Co., Ltd. Slim LED package
US8963196B2 (en) 2007-12-03 2015-02-24 Seoul Semiconductor Co., Ltd. Slim LED package
US9412913B2 (en) 2007-12-03 2016-08-09 Seoul Semiconductor Co., Ltd. Slim LED package
US9899573B2 (en) 2007-12-03 2018-02-20 Seoul Semiconductor Co., Ltd. Slim LED package
WO2012113249A1 (en) * 2011-02-22 2012-08-30 广东德豪润达电气股份有限公司 Led encapsulation bracket structure and led device

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