JP4830321B2 - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device Download PDF

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JP4830321B2
JP4830321B2 JP2005070700A JP2005070700A JP4830321B2 JP 4830321 B2 JP4830321 B2 JP 4830321B2 JP 2005070700 A JP2005070700 A JP 2005070700A JP 2005070700 A JP2005070700 A JP 2005070700A JP 4830321 B2 JP4830321 B2 JP 4830321B2
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semiconductor light
light emitting
emitting device
terminal
case
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JP2006253551A (en
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美智雄 宮脇
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Description

本発明は、プリント配線基板に表面実装される側面発光型の半導体発光装置に関する。   The present invention relates to a side-emitting semiconductor light-emitting device that is surface-mounted on a printed wiring board.

従来、面実装型で、かつ側面発光型の半導体発光装置として、以下の２種類のタイプが多く用いられている。   Conventionally, the following two types are often used as surface-mount type and side-emitting type semiconductor light-emitting devices.

図３（Ａ）は従来の半導体発光装置の正面図、（Ｂ）は同側面図、（Ｃ）は同底面図、（Ｄ）は同底断面図である。図３に示すように、プリント配線基板に搭載される側面発光型の半導体発光装置７０は、前方が開口した直方体状の反射ケース７１と、反射ケース７１内に埋設された一対の端子部材７２，７３と、反射ケース７１内で端子部材７２，７３に接続された半導体発光素子７４とを有している。半導体発光素子７４は、樹脂モールド８１により覆われている。   3A is a front view of a conventional semiconductor light emitting device, FIG. 3B is a side view thereof, FIG. 3C is a bottom view thereof, and FIG. As shown in FIG. 3, a side light emitting semiconductor light emitting device 70 mounted on a printed wiring board includes a rectangular parallelepiped reflecting case 71 having a front opening, and a pair of terminal members 72 embedded in the reflecting case 71. 73 and a semiconductor light emitting element 74 connected to the terminal members 72 and 73 in the reflection case 71. The semiconductor light emitting element 74 is covered with a resin mold 81.

反射ケース７１は、天板部７５、底板部７６、両側板部７７，７７ａおよび背板部７８を有し、背板部７８の前方に樹脂モールド８１が充填された空間部７９が設けられている。底板部７６の下面の中央部には補助支持部８０が設けられている。   The reflection case 71 has a top plate portion 75, a bottom plate portion 76, both side plate portions 77 and 77a, and a back plate portion 78, and a space portion 79 filled with a resin mold 81 is provided in front of the back plate portion 78. Yes. An auxiliary support portion 80 is provided at the center of the bottom surface of the bottom plate portion 76.

端子部材７２、７３は平板状の部材を屈曲させて形成されている。端子部材７２，７３の基部は、背板部７８の前面に並べて配置され、半導体発光素子７４は、一方の端子部材７３の基部に導電性ペースト等の導電性材料により接続され、他方の端子部材７２にワイヤ８１ａによって接続されている。   The terminal members 72 and 73 are formed by bending a flat member. The base portions of the terminal members 72 and 73 are arranged side by side on the front surface of the back plate portion 78, the semiconductor light emitting element 74 is connected to the base portion of one terminal member 73 by a conductive material such as a conductive paste, and the other terminal member. 72 is connected by a wire 81a.

端子部材７２，７３は、底板部７６の下部から外側に突出したリード端子８２，８３を有している。各リード端子８２，８３は、基側に設けられた接続部８４，８５と、先側に設けられた接続補助部８６，８７とをそれぞれ有している。   The terminal members 72 and 73 have lead terminals 82 and 83 that protrude outward from the lower portion of the bottom plate portion 76. Each of the lead terminals 82 and 83 has connection portions 84 and 85 provided on the base side and connection auxiliary portions 86 and 87 provided on the front side, respectively.

接続部８４，８５は、基端部を前側に屈曲させ底板部７６に沿って配置されている。接続補助部８６，８７は、接続部８４，８５のそれぞれの前側の外側端部に一体的に接続され、上方に屈曲されて両側板部７７，７７ａに沿って配置されている。   The connecting portions 84 and 85 are arranged along the bottom plate portion 76 with the base end portions bent forward. The connection auxiliary portions 86 and 87 are integrally connected to the front outer end portions of the connection portions 84 and 85, bent upward, and disposed along the side plate portions 77 and 77a.

すなわち、リード端子８２，８３は、正面視して、接続部８４，８５と接続補助部８６，８７とを、それぞれＪ字状またはＬ字状に屈曲して形成されている。   That is, the lead terminals 82 and 83 are formed by bending the connection portions 84 and 85 and the connection auxiliary portions 86 and 87 into a J shape or an L shape, respectively, when viewed from the front.

半導体発光装置７０は、接続部８４，８５の下面と、接続補助部８６，８７の外側面を半田付けされて基板８７ａに導通固定される。   The semiconductor light emitting device 70 is conductively fixed to the substrate 87a by soldering the lower surfaces of the connection portions 84 and 85 and the outer surfaces of the connection auxiliary portions 86 and 87.

接続部８４，８５と接続補助部８６，８７とは、反射ケース７１の底板部７６および両側板部７７，７７ａに当接して形成されているので、外力によって変形しにくくなっている。なお、このようなタイプの半導体発光装置には、例えば、特許文献１に示すものがある。   Since the connection portions 84 and 85 and the connection auxiliary portions 86 and 87 are formed in contact with the bottom plate portion 76 and the side plate portions 77 and 77a of the reflection case 71, they are not easily deformed by an external force. An example of such a type of semiconductor light emitting device is disclosed in Patent Document 1.

図４（Ａ）は従来の他の半導体発光装置の平面図、（Ｂ）は同正面図、（Ｃ）は同側面図である。図４に示すように、他の半導体発光装置８８は、前述した半導体発光装置７０の補助支持部８０をなくして、端子部材８９，９０のリード端子９６，９７を側面から取り出し、装置の薄型化を図ったものである。他の部分の構造は略同じなので、ここでは、リード端子９６，９７についてのみ説明する。   4A is a plan view of another conventional semiconductor light emitting device, FIG. 4B is a front view thereof, and FIG. 4C is a side view thereof. As shown in FIG. 4, in the other semiconductor light emitting device 88, the auxiliary support portion 80 of the semiconductor light emitting device 70 described above is eliminated, and the lead terminals 96 and 97 of the terminal members 89 and 90 are taken out from the side surfaces, thereby thinning the device. Is intended. Since the structure of other parts is substantially the same, only the lead terminals 96 and 97 will be described here.

リード端子９６，９７は、基側に設けられた接続補助部９１，９２と、先側に設けられた接続部９３，９４とを有している。   The lead terminals 96 and 97 have connection auxiliary portions 91 and 92 provided on the base side and connection portions 93 and 94 provided on the front side.

接続補助部９１，９２は、基端部を前側に屈曲させて側板部７７，７７ａに沿って配置されている。接続部９３，９４は、接続補助部９１，９２のそれぞれの前側の下端部に一体的に接続され、外側方にＪ字状またはＬ字状に屈曲され、下面のレベルを底板部９５の下面のレベルと略同じ高さに配置している。   The connection assisting portions 91 and 92 are arranged along the side plate portions 77 and 77a with the base end portions bent to the front side. The connection parts 93 and 94 are integrally connected to the front lower ends of the connection auxiliary parts 91 and 92, bent outwardly in a J-shape or L-shape, and the level of the bottom surface is lowered to the bottom surface of the bottom plate portion 95. It is arranged at the same height as the level.

半導体発光装置８８は、接続部９３，９４の下面を半田付けされて基板９９に導通固定される。リード端子９６，９７は、反射ケース９８の両側部にそれぞれ突出して配置されるので、全体の厚みを薄くすることができる。
意匠登録第９８４２２４号の類似意匠登録第１号公報（正面斜視図、底面斜視図、Ａ−Ａ断面図） The semiconductor light emitting device 88 is conductively fixed to the substrate 99 by soldering the lower surfaces of the connecting portions 93 and 94. Since the lead terminals 96 and 97 are disposed so as to protrude from both sides of the reflective case 98, the overall thickness can be reduced.
Similar design registration No. 1 publication of design registration No. 984224 (front perspective view, bottom perspective view, AA cross-sectional view)

しかしながら、前記従来の半導体発光装置では、リード端子が反射ケースの下側に配置されるので、リード端子を曲がりにくくすることはできるが、装置の厚みが厚くなってしまう。この反射ケースの下部にリード端子の収納部を形成して厚みを薄くすることも考えられるが、反射ケースには、光を出射させるための開口部を設ける必要があるので、この開口部とリード端子の干渉を避けなければならない。このため、反射ケースの底板部を薄くすることができないという問題がある。   However, in the conventional semiconductor light emitting device, since the lead terminal is disposed below the reflecting case, the lead terminal can be made difficult to bend, but the thickness of the device is increased. Although it is conceivable to reduce the thickness by forming a lead terminal storage portion at the bottom of the reflective case, the reflective case needs to be provided with an opening for emitting light. Terminal interference must be avoided. For this reason, there exists a problem that the baseplate part of a reflective case cannot be made thin.

また、他の半導体発光装置では、リード端子が外側に屈曲しているので、全体の厚みを薄くすることはできるが、リード端子の接続部が反射ケースから離れた位置に形成されているので、外力が加わると簡単に屈曲してしまう。接続部が曲がると、半田による接続が十分にできず、接続不良が発生するという問題がある。   Further, in other semiconductor light emitting devices, since the lead terminal is bent outward, the overall thickness can be reduced, but the lead terminal connection portion is formed at a position away from the reflective case, If an external force is applied, it will bend easily. If the connection portion is bent, there is a problem that connection by solder cannot be sufficiently performed and connection failure occurs.

そこで本発明は、装置の厚みを薄くしながらリード端子の曲がりを防止する半導体発光装置を提供することを目的とする。   Therefore, an object of the present invention is to provide a semiconductor light emitting device that prevents bending of a lead terminal while reducing the thickness of the device.

本発明の半導体発光装置においては、反射ケースの後部に端子保持部を設け、反射ケースの両側部に接続されたリード端子に、後方に伸びる接続補助部と、反射ケースの下部に形成された切欠き部に収納される接続部とを設けた半導体発光装置としたものである。   In the semiconductor light emitting device of the present invention, a terminal holding part is provided at the rear part of the reflection case, a lead terminal connected to both sides of the reflection case, a connection auxiliary part extending backward, and a cut formed at the lower part of the reflection case. The semiconductor light-emitting device is provided with a connection portion housed in the notch portion.

この発明によれば、装置の厚みを薄くしながらリード端子の曲がりを防止する半導体発光装置が得られる。   According to the present invention, it is possible to obtain a semiconductor light emitting device that prevents the bending of the lead terminal while reducing the thickness of the device.

本発明によれば、反射ケースの後部に端子保持部を設け、反射ケースの両側部に接続されたリード端子に、後方に伸びる接続補助部と、反射ケースの下部に形成された切欠き部に収納される接続部とを設けたので、端子保持部に切欠き部を形成しても反射ケース内の光路には影響がなく、リード端子を下方に突出しないように配置でき、また、端子部に外力が加わってもこの外力を端子保持部で受けることができる。このようにして、装置の厚みを薄くしながらリード端子の変形を防止することができる。   According to the present invention, the terminal holding portion is provided at the rear portion of the reflection case, the lead terminal connected to both sides of the reflection case, the connection auxiliary portion extending rearward, and the notch portion formed at the lower portion of the reflection case. Since a notched part is formed in the terminal holding part, the optical path in the reflective case is not affected, and the lead terminal can be arranged so as not to protrude downward. Even if an external force is applied, the external force can be received by the terminal holding portion. In this way, deformation of the lead terminal can be prevented while reducing the thickness of the device.

また、反射ケースの開口部の両側に、ピンにより押圧可能な中実部をそれぞれ設けると、強度が増加し、ピンにより中実部を押圧するときに、両側の中実部に力が均等に加わり、装置の変形が防止できる。   Also, if solid parts that can be pressed with pins are provided on both sides of the opening of the reflective case, the strength increases, and when pressing the solid parts with pins, the force is evenly applied to both solid parts. In addition, deformation of the device can be prevented.

本願の第１の発明は、前方が開口し、平面状の底部を有する反射ケースの両側部にリード端子の基部がそれぞれ接続された面実装型の半導体発光装置において、反射ケースの後部には、下部に端子収納用の切欠き部を形成した端子保持部が一体的に設けられ、リード端子には、反射ケースの側部から端子保持部に沿って後方に伸びる接続補助部と、この接続補助部の先側に設けられ、切欠き部に収納される接続部とが設けられていることを特徴とする半導体発光装置としたものであり、端子保持部が反射ケースの後部に設けられているので、切欠き部を形成しても反射ケース内の光路には影響がない。また、リード端子の接続部は、切欠き部内に設けられるので、端子保持部の底面よりも下方に突出しないように配置される。また、リード端子を端子保持部に当接または近接させて設けるので、端子部に外力が加わったときに、この外力を端子保持部で受けるという作用を有する。   The first invention of the present application is a surface-mount type semiconductor light emitting device in which the front portion is open and the base of the lead terminal is connected to both sides of the reflective case having a flat bottom portion. A terminal holding portion having a notch for housing the terminal is integrally provided at the bottom, and the lead terminal has a connection auxiliary portion extending backward from the side of the reflective case along the terminal holding portion, and this connection auxiliary. The semiconductor light emitting device is provided with a connection portion that is provided on the front side of the portion and accommodated in the notch portion, and the terminal holding portion is provided at the rear portion of the reflection case. Therefore, even if the notch is formed, the optical path in the reflection case is not affected. Moreover, since the connection part of a lead terminal is provided in a notch part, it arrange | positions so that it may not protrude below the bottom face of a terminal holding part. In addition, since the lead terminal is provided in contact with or close to the terminal holding portion, the external force is received by the terminal holding portion when an external force is applied to the terminal portion.

本願の第２の発明は、反射ケースの開口部の両側には、ピンにより押圧可能な中実部がそれぞれ設けられていることを特徴とする請求項１に記載の半導体発光装置としたものであり、中実部を形成することにより強度が増加し、成型加工を行う金型の押し出し用のピンにより中実部を押圧するときに、両側の中実部に力が均等に加わるという作用を有する。   The second invention of the present application is the semiconductor light emitting device according to claim 1, wherein solid portions that can be pressed by pins are provided on both sides of the opening of the reflection case. Yes, the strength increases by forming the solid part, and when pressing the solid part by the extrusion pin of the mold for molding, the force is applied evenly to the solid part on both sides Have.

以下、本発明の実施の形態について、図１、図２を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

（第１の実施の形態）
図１（Ａ）は本発明の第１の実施の形態の半導体発光装置の正面図、（Ｂ）は同側面図、（Ｃ）は同部分底断面図、（Ｄ）は同側断面図である。図１に示すように、本発明の第１の実施の形態の半導体発光装置１は、前方が開口した反射ケース３の両側部にリード端子４，５の基部がそれぞれ接続された面実装型の装置である。 (First embodiment)
1A is a front view of a semiconductor light emitting device according to a first embodiment of the present invention, FIG. 1B is a side view thereof, FIG. 1C is a partial bottom sectional view thereof, and FIG. is there. As shown in FIG. 1, the semiconductor light emitting device 1 according to the first embodiment of the present invention is a surface mount type in which the bases of lead terminals 4 and 5 are respectively connected to both sides of a reflective case 3 having an open front. Device.

反射ケース３の後方には端子保持部６が一体的に設けられ、リード端子４，５は、平板状の接続補助部７および接続部８とをそれぞれ有している。   A terminal holding portion 6 is integrally provided behind the reflection case 3, and the lead terminals 4 and 5 have a flat plate-like connection auxiliary portion 7 and a connection portion 8, respectively.

反射ケース３は、天板部９、底板部１０、両側板部１１，１２を有して外形を直方体状に形成され、同じく直方体状に形成された端子保持部６によって背面を塞がれている。   The reflection case 3 has a top plate portion 9, a bottom plate portion 10, and both side plate portions 11 and 12, and the outer shape is formed in a rectangular parallelepiped shape. The back surface is closed by a terminal holding portion 6 that is also formed in a rectangular parallelepiped shape. Yes.

端子保持部６の裏面の後部両側には、リード端子４，５の接続部８を収納可能な矩形の切欠き部１６が形成されている。   On both sides of the rear portion of the rear surface of the terminal holding portion 6, rectangular cutout portions 16 that can accommodate the connection portions 8 of the lead terminals 4 and 5 are formed.

リード端子４，５は、端子部材１３，１４の先側に設けられている。この端子部材１３，１４の基側は、端子保持部６の前面に左右に並べて配置されている。一方の端子部材１４の基部には、導電性ペースト等の導電性材料により半導体発光素子１５が搭載され、他方の端子部材１３へは、ワイヤ１３ａによって接続されている。   The lead terminals 4 and 5 are provided on the front side of the terminal members 13 and 14. The base sides of the terminal members 13 and 14 are arranged side by side on the front surface of the terminal holding portion 6. A semiconductor light emitting element 15 is mounted on a base portion of one terminal member 14 by a conductive material such as a conductive paste, and is connected to the other terminal member 13 by a wire 13a.

リード端子４，５の接続補助部７の基端部は、反射ケース３の側部で後側に折り曲げられ、端子保持部６の側面に沿って後方に伸びている。   The base end portion of the connection auxiliary portion 7 of the lead terminals 4 and 5 is bent rearward at the side portion of the reflection case 3 and extends rearward along the side surface of the terminal holding portion 6.

また、接続部８は、接続補助部７の後端部の下側に一体的に接続され、それぞれ内側に折り曲げられて、端子保持部６の切欠き部１６に収納されている。接続部８の下面は、反射ケース３の下面と同じレベルに配置されている。   Further, the connecting portion 8 is integrally connected to the lower side of the rear end portion of the connection assisting portion 7, bent inward, and stored in the notch portion 16 of the terminal holding portion 6. The lower surface of the connection portion 8 is disposed at the same level as the lower surface of the reflection case 3.

図１（Ｃ）に二点鎖線で示すように、反射ケース３の開口部の両側にそれぞれ配置された両側板部１１，１２には、直方体状の中実部１７が一体的に設けられている。   As shown by a two-dot chain line in FIG. 1 (C), a rectangular parallelepiped solid portion 17 is integrally provided on both side plate portions 11 and 12 respectively disposed on both sides of the opening of the reflection case 3. Yes.

次に、半導体発光装置１の製造方法について説明する。   Next, a method for manufacturing the semiconductor light emitting device 1 will be described.

まず、プレス機を用いて、端子部材１３，１４を展開させた状態の平板状端子を形成する。次いで、この平板状端子を成型金型にセットし、反射ケース３および端子保持部６を一体的に成型する。このとき、中実部１７も反射ケース３とともに成型される。   First, a flat terminal in a state where the terminal members 13 and 14 are developed is formed using a press machine. Next, the flat terminal is set in a molding die, and the reflection case 3 and the terminal holding part 6 are integrally molded. At this time, the solid portion 17 is also molded together with the reflective case 3.

図１（Ｃ）のＰ．Ｌは、金型のパーティングラインを示す。反射ケース３を形成する金型は、開口部を形成する必要があるため、金型から抜けにくくなっている。しかし、反射ケース３に中実部１７を形成しているので、金型の押し出し用のピンで中実部１７を押圧することによって、反射ケース３を金型から容易に抜くことができる。中実部１７は、他の部分より肉厚に形成されており、ピンで押圧しても変形することが少ない。また、中実部１７の中間部には端子部材１３，１４が埋設されているので、中実部１７の強度が強くなり、反射ケース３はさらに変形しにくくなっている。   P. of FIG. L shows the parting line of a metal mold | die. The mold for forming the reflective case 3 is difficult to be removed from the mold because it is necessary to form an opening. However, since the solid part 17 is formed in the reflective case 3, the reflective case 3 can be easily removed from the mold by pressing the solid part 17 with a pin for extruding the mold. The solid portion 17 is formed thicker than the other portions, and is hardly deformed even when pressed with a pin. Moreover, since the terminal members 13 and 14 are embedded in the intermediate part of the solid part 17, the intensity | strength of the solid part 17 becomes strong and the reflection case 3 becomes further difficult to deform | transform.

次に、反射ケース３内の端子部材１４に半導体発光素子１５を導電性接着剤等の接合手段を用いて導通固定する。半導体発光素子１５と端子部材１３とをワイヤ１３ａにて導通接続する。そして、半導体発光素子１５を樹脂（図示せず）で封止する。   Next, the semiconductor light emitting element 15 is conductively fixed to the terminal member 14 in the reflection case 3 using a bonding means such as a conductive adhesive. The semiconductor light emitting element 15 and the terminal member 13 are electrically connected by a wire 13a. Then, the semiconductor light emitting element 15 is sealed with a resin (not shown).

次いで、反射ケース３および端子保持部６をプレス装置で保持し、平板状端子を、２回折り曲げてリード端子４，５を形成する。   Next, the reflective case 3 and the terminal holding part 6 are held by a press device, and the flat terminals are bent twice to form lead terminals 4 and 5.

このようにして、半導体発光装置１を製造することができる。   In this way, the semiconductor light emitting device 1 can be manufactured.

次に、半導体発光装置１の使用状態について説明する。   Next, the usage state of the semiconductor light emitting device 1 will be described.

半導体発光装置１を基板１８に接続するときには、基板１８上の半田ペーストが塗布された電極（図示せず）に半導体発光装置１の両接続部８を載せる。そして、リフロー槽を通過させて、溶融した半田ペーストを接続部８および接続補助部７に付着させ硬化させる。   When connecting the semiconductor light emitting device 1 to the substrate 18, both connecting portions 8 of the semiconductor light emitting device 1 are placed on electrodes (not shown) coated with a solder paste on the substrate 18. Then, the molten solder paste is attached to the connection portion 8 and the connection auxiliary portion 7 and cured by passing through the reflow tank.

半導体発光装置１のリード端子４，５は端子保持部６の側面および底面に沿って配置されているので、リード端子４，５に外側から加わる力を端子保持部６で受けることができ、リード端子４，５の曲がりによる接続不良を防止することができる。   Since the lead terminals 4 and 5 of the semiconductor light emitting device 1 are arranged along the side surface and the bottom surface of the terminal holding portion 6, the terminal holding portion 6 can receive the force applied to the lead terminals 4 and 5 from the outside. Connection failure due to bending of the terminals 4 and 5 can be prevented.

また、リード端子４，５の接続部８が、反射ケース３の後方にある端子保持部６の切欠き部１６内に配置されているので、光路を形成する反射ケースと接続部との干渉を防止しながら、半導体発光装置１の高さを低く形成することができる。   Further, since the connecting portion 8 of the lead terminals 4 and 5 is disposed in the notch 16 of the terminal holding portion 6 at the rear of the reflecting case 3, interference between the reflecting case forming the optical path and the connecting portion is prevented. While preventing, the height of the semiconductor light emitting device 1 can be reduced.

（第２の実施の形態）
図２（Ａ）は本発明の第２の実施の形態の半導体発光装置の正面図、（Ｂ）は同部分底断面図である。 (Second Embodiment)
FIG. 2A is a front view of a semiconductor light emitting device according to a second embodiment of the present invention, and FIG. 2B is a partial bottom sectional view thereof.

第２の実施の形態の半導体発光装置２０は、第１の実施の形態の半導体発光装置１の中実部１７を無くして、側板部２２，２３の厚みを薄くしたものである。中実部１７がないので、半導体発光装置２０の幅を、半導体発光装置１よりさらに小さく形成することができる。   In the semiconductor light emitting device 20 of the second embodiment, the solid portions 17 are eliminated and the thickness of the side plate portions 22 and 23 is reduced. Since there is no solid portion 17, the width of the semiconductor light emitting device 20 can be made smaller than that of the semiconductor light emitting device 1.

なお、金型に設けられた押し出し用のピンは、開口部の内側に設けておくとよい。   In addition, it is good to provide the pin for extrusion provided in the metal mold | die inside an opening part.

本発明は、装置の厚みを薄くしながらリード端子の曲がりを防止することができるので、プリント配線基板に表面実装される側面発光型の半導体発光装置に好適である。   The present invention can prevent the bending of the lead terminals while reducing the thickness of the device, and is therefore suitable for a side-emitting semiconductor light-emitting device that is surface-mounted on a printed wiring board.

（Ａ）は本発明の第１の実施の形態の半導体発光装置の正面図、（Ｂ）は同側面図、（Ｃ）は同部分底断面図、（Ｄ）は同側断面図(A) is a front view of the semiconductor light emitting device according to the first embodiment of the present invention, (B) is a side view, (C) is a partial bottom sectional view, and (D) is a side sectional view. （Ａ）は本発明の第２の実施の形態の半導体発光装置の正面図、（Ｂ）は同部分底断面図(A) is a front view of the semiconductor light-emitting device of the 2nd Embodiment of this invention, (B) is the partial bottom sectional drawing. （Ａ）は従来の半導体発光装置の正面図、（Ｂ）は同側面図、（Ｃ）は同底面図、（Ｄ）は同底断面図(A) is a front view of a conventional semiconductor light emitting device, (B) is a side view thereof, (C) is a bottom view thereof, and (D) is a sectional view of the bottom portion. （Ａ）は従来の他の半導体発光装置の平面図、（Ｂ）は同正面図、（Ｃ）は同側面図(A) is a plan view of another conventional semiconductor light emitting device, (B) is the same front view, and (C) is the same side view.

符号の説明Explanation of symbols

１ 半導体発光装置
３ 反射ケース
４，５ リード端子
６ 端子保持部
７ 接続補助部
８ 接続部
９ 天板部
１０ 底板部
１１，１２ 側板部
１３，１４ 端子部材
１３ａ ワイヤ
１５ 半導体発光素子
１６ 切欠き部
１７ 中実部
１８ 基板
２０ 半導体発光装置
２１ 反射ケース
２２，２３ 側板部 DESCRIPTION OF SYMBOLS 1 Semiconductor light-emitting device 3 Reflective case 4,5 Lead terminal 6 Terminal holding part 7 Connection auxiliary part 8 Connection part 9 Top plate part 10 Bottom plate part 11,12 Side plate part 13,14 Terminal member 13a Wire 15 Semiconductor light emitting element 16 Notch part 17 Solid part 18 Substrate 20 Semiconductor light emitting device 21 Reflective case 22, 23 Side plate part

Claims (2)

前方が開口し、平面状の底部を有する外形を直方体状に形成した反射ケースの両側部に平板状のリード端子の基部がそれぞれ接続された面実装型の半導体発光装置において、
前記反射ケースの後部には、端子保持部が一体的に設けられ、
前記端子保持部の下部に端子収納用の切欠き部を形成し、
前記リード端子には、前記反射ケースの側部から前記端子保持部の側面に沿って後方に伸びる接続補助部と、前記接続補助部の先側に設けられ、かつ前記端子保持部の下面の内側に折り曲げられ前記切欠き部に収納される接続部とが設けられ、
前記接続部の下面は、前記反射ケースの下面と同じレベルに配置されていることを特徴とする半導体発光装置。 In the surface-mount type semiconductor light emitting device in which the front portion of the flat lead terminal is connected to both sides of the reflection case that is open at the front and has an outer shape having a flat bottom in a rectangular parallelepiped shape ,
A terminal holding part is integrally provided at the rear part of the reflective case,
Form a notch for storing the terminal at the bottom of the terminal holding part,
The lead terminal is provided with a connection auxiliary portion extending rearward along the side surface of the terminal holding portion from a side portion of the reflection case, and provided on a front side of the connection auxiliary portion, and inside the lower surface of the terminal holding portion. And a connecting portion that is bent into the notch and is provided,
The semiconductor light emitting device according to claim 1, wherein a lower surface of the connection portion is disposed at the same level as a lower surface of the reflection case. 前記反射ケースの開口部の両側には、ピンにより押圧可能な中実部がそれぞれ設けられていることを特徴とする請求項１に記載の半導体発光装置。 The semiconductor light emitting device according to claim 1, wherein solid portions that can be pressed by pins are provided on both sides of the opening of the reflection case.
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