JPS6413750U - - Google Patents
Info
- Publication number
- JPS6413750U JPS6413750U JP1987110394U JP11039487U JPS6413750U JP S6413750 U JPS6413750 U JP S6413750U JP 1987110394 U JP1987110394 U JP 1987110394U JP 11039487 U JP11039487 U JP 11039487U JP S6413750 U JPS6413750 U JP S6413750U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- resistor
- conductive pattern
- substitute
- serve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図は本考案に係る灯具の一実施例を示す一
部破断状態の平面図、第２図及び第３図は同実施
例の正面図及び側面図、第４図は同実施例におけ
るＬＥＤチツプの実装状態を示す正面図、第５図
は第４図の−線断面図、第６図は従来例を示
す一部破断状態の平面図である。
１……ハウジング、１Ａ……取付部、２……導
電パターン、３……ＬＥＤチツプ、４……金線、
５……透明樹脂、６……ワイヤーハーネス、７…
…アウターレンズ。
Fig. 1 is a partially cutaway plan view showing an embodiment of the lamp according to the present invention, Figs. 2 and 3 are front and side views of the embodiment, and Fig. 4 is an LED in the embodiment. FIG. 5 is a sectional view taken along the line -- in FIG. 4, and FIG. 6 is a partially cutaway plan view showing a conventional example. 1... Housing, 1A... Mounting part, 2... Conductive pattern, 3... LED chip, 4... Gold wire,
5...Transparent resin, 6...Wire harness, 7...
...outer lens.
Claims (1)
電流制限用抵抗の代用となる抵抗分を含むように
形成して所要数のＬＥＤチツプ、逆電圧保護ダイ
オードなどを装着するとともに、各ＬＥＤチツプ
の部分を透明樹脂でレンズ作用を持つように被覆
し、ハウジングの前面にアウターレンズを取付け
たことを特徴とする灯具。 A predetermined conductive pattern is formed on the inner surface of the rear part of the housing to include a resistor to serve as a substitute for the current limiting resistor, and the required number of LED chips, reverse voltage protection diodes, etc. are mounted, and the portion of each LED chip is made transparent. A light fixture characterized by being coated with resin to have a lens effect and having an outer lens attached to the front of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110394U JPH0514531Y2 (en) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110394U JPH0514531Y2 (en) | 1987-07-17 | 1987-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413750U true JPS6413750U (en) | 1989-01-24 |
| JPH0514531Y2 JPH0514531Y2 (en) | 1993-04-19 |
Family
ID=31347511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987110394U Expired - Lifetime JPH0514531Y2 (en) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514531Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0665525U (en) * | 1991-10-11 | 1994-09-16 | 株式会社マルハチ | Retractable skylight |
| JP2002009349A (en) * | 2000-06-26 | 2002-01-11 | Koha Co Ltd | Surface emission led and its manufacturing method |
| JP3125289U (en) * | 2006-07-03 | 2006-09-14 | 株式会社シンプル | Miniature light kit using chip LED for mounting |
-
1987
- 1987-07-17 JP JP1987110394U patent/JPH0514531Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0665525U (en) * | 1991-10-11 | 1994-09-16 | 株式会社マルハチ | Retractable skylight |
| JP2002009349A (en) * | 2000-06-26 | 2002-01-11 | Koha Co Ltd | Surface emission led and its manufacturing method |
| JP3125289U (en) * | 2006-07-03 | 2006-09-14 | 株式会社シンプル | Miniature light kit using chip LED for mounting |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514531Y2 (en) | 1993-04-19 |