JPS6413754U - - Google Patents
Info
- Publication number
- JPS6413754U JPS6413754U JP1987110398U JP11039887U JPS6413754U JP S6413754 U JPS6413754 U JP S6413754U JP 1987110398 U JP1987110398 U JP 1987110398U JP 11039887 U JP11039887 U JP 11039887U JP S6413754 U JPS6413754 U JP S6413754U
- Authority
- JP
- Japan
- Prior art keywords
- attached
- housing
- resistor
- conductive pattern
- outer lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第1図は本考案に係る灯具の一実施例を示す一
部破断状態の平面図、第2図及び第3図は同実施
例の正面図及び側面図、第4図は同実施例におけ
るLEDチツプの実装状態を示す正面図、第5図
は第4図の−線断面図、第6図は従来例を示
す一部破断状態の平面図である。
1……ハウジング、1A……取付部、2……導
電パターン、3……LEDチツプ、4……金線、
5……ワイヤーハーネス、6……アウターレンズ
。
Fig. 1 is a partially cutaway plan view showing an embodiment of the lamp according to the present invention, Figs. 2 and 3 are front and side views of the embodiment, and Fig. 4 is an LED in the embodiment. FIG. 5 is a sectional view taken along the line -- in FIG. 4, and FIG. 6 is a partially cutaway plan view showing a conventional example. 1... Housing, 1A... Mounting part, 2... Conductive pattern, 3... LED chip, 4... Gold wire,
5... Wire harness, 6... Outer lens.
Claims (1)
ンを電流制限用抵抗の代用となる抵抗分を含むよ
うに形成して所要数のLEDチツプ、逆電圧保護
ダイオードなどを装着し、ハウジングの前面にア
ウターレンズを取付けたことを特徴とする灯具。 A conductive pattern of a predetermined shape is formed on the inner surface of the rear part of the housing so as to include a resistor as a substitute for the current limiting resistor, and the required number of LED chips, reverse voltage protection diodes, etc. are attached, and an outer lens is attached to the front of the housing. A light fixture characterized by being attached.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987110398U JPS6413754U (en) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987110398U JPS6413754U (en) | 1987-07-17 | 1987-07-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6413754U true JPS6413754U (en) | 1989-01-24 |
Family
ID=31347519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987110398U Pending JPS6413754U (en) | 1987-07-17 | 1987-07-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6413754U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018022742A (en) * | 2016-08-02 | 2018-02-08 | 日亜化学工業株式会社 | Light emitting device |
-
1987
- 1987-07-17 JP JP1987110398U patent/JPS6413754U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018022742A (en) * | 2016-08-02 | 2018-02-08 | 日亜化学工業株式会社 | Light emitting device |