JPH0243059A - Protective structure for electronic parts of printing head - Google Patents

Protective structure for electronic parts of printing head

Info

Publication number
JPH0243059A
JPH0243059A JP19345288A JP19345288A JPH0243059A JP H0243059 A JPH0243059 A JP H0243059A JP 19345288 A JP19345288 A JP 19345288A JP 19345288 A JP19345288 A JP 19345288A JP H0243059 A JPH0243059 A JP H0243059A
Authority
JP
Japan
Prior art keywords
substrate
parts
driver ics
respective
seal material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19345288A
Inventor
Masataka Kishi
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Priority to JP19345288A priority Critical patent/JPH0243059A/en
Publication of JPH0243059A publication Critical patent/JPH0243059A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Abstract

PURPOSE:To certainly protect electronic parts, to facilitate the control of a seal material and to also suitably avoid the deformation of a substrate or lead wire by indivisually covering the respective electronic parts provided on the substrate of a printing head is parallel with a seal material. CONSTITUTION:Resistance heating parts 5 consisting of a large number of heating resistors are provided to the upper end part of an alumina substrate 2 in the vicinity of the free end part thereof so as to extend in a left-and-right direction and driver ICs 6 for selectively driving a large number of heating resistors to generate heat are provided in the vicinity of the close contact part 9 with the resin substrate 3 on the alumina substrate 2 so as to extend in parallel to the extending direction of the resistance heating parts 5. Indivisual electrodes 7 are arranged between the respective resistance heating parts 5 and the respective corresponding driver ICs 6 and connected to the driver ICs 6 by lead wires 10 and one terminal parts of the wirings 18 connected to an external circuit are also connected to said ICs 6 by lead wires 11. The respective driver ICs 6 are indivisually covered with a seal material 12 composed of an epoxy resin.
JP19345288A 1988-08-04 1988-08-04 Protective structure for electronic parts of printing head Pending JPH0243059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19345288A JPH0243059A (en) 1988-08-04 1988-08-04 Protective structure for electronic parts of printing head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19345288A JPH0243059A (en) 1988-08-04 1988-08-04 Protective structure for electronic parts of printing head

Publications (1)

Publication Number Publication Date
JPH0243059A true JPH0243059A (en) 1990-02-13

Family

ID=16308233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19345288A Pending JPH0243059A (en) 1988-08-04 1988-08-04 Protective structure for electronic parts of printing head

Country Status (1)

Country Link
JP (1) JPH0243059A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829893A (en) * 1996-07-16 1998-11-03 Brother Kogyo Kabushiki Kaisha Portable printing device
US6015211A (en) * 1996-06-21 2000-01-18 Brother Kogyo Kabushiki Kaisha Portable printing device with shutter for covering print head
JP2008287892A (en) * 2007-05-15 2008-11-27 Hitachi Ltd Illuminating device and liquid crystal display device using the same
WO2014080843A1 (en) * 2012-11-20 2014-05-30 京セラ株式会社 Thermal head and thermal printer provided with same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6015211A (en) * 1996-06-21 2000-01-18 Brother Kogyo Kabushiki Kaisha Portable printing device with shutter for covering print head
US5829893A (en) * 1996-07-16 1998-11-03 Brother Kogyo Kabushiki Kaisha Portable printing device
JP2008287892A (en) * 2007-05-15 2008-11-27 Hitachi Ltd Illuminating device and liquid crystal display device using the same
JP4521013B2 (en) * 2007-05-15 2010-08-11 株式会社日立製作所 Lighting device and liquid crystal display device using the lighting device
WO2014080843A1 (en) * 2012-11-20 2014-05-30 京セラ株式会社 Thermal head and thermal printer provided with same
CN104812584A (en) * 2012-11-20 2015-07-29 京瓷株式会社 Thermal head and thermal printer provided with same
US9333765B2 (en) 2012-11-20 2016-05-10 Kyocera Corporation Thermal head and thermal printer equipped with the thermal head
JP5955979B2 (en) * 2012-11-20 2016-07-20 京セラ株式会社 Thermal head and thermal printer equipped with the same

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