JP2000049386A - Manufacturing surface-mounting components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing surface-mounting components whereby, in forming a resin molding for protecting semiconductor elements and controlling the light emission or reception of the semiconductor elements, the resin of the resin molding has little adverse effects on the directivity characteristic, moisture resistance, etc., due to hardening and shrinking of the resin to warp, together with a mother substrate. SOLUTION: A molding manufacturing process of surface mounting components has a step of covering a plurality of semiconductor elements, arrayed on rows with a resin so as to have recesses 12 between the semiconductor elements, thereby integrally forming a molding 13. A plurality of LED chips are mounted in array on a large substrate, and even if a plurality of thin and long moldings 13 are formed, the recesses 12 formed into the moldings 13 relax the shrinkage of a resin is relaxed, the material of the moldings 13, during the hardening of the resin, this reducing the warp of a mother substrate 1 and allowing the exact alignment to be made in cutting at a later step. Thus, surface mounting type components are manufactured, exactly positioned to the molding 13 having a lens action of the LED chips.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounted component having a structure enabling mounting on a surface of a printed circuit board or the like without providing a mounting hole. The present invention relates to a method for manufacturing a surface mount component having a resin mold part for controlling light emission and light reception.

[0002]

2. Description of the Related Art FIGS. 11 to 17 show a method of manufacturing a surface mount type LED 90 of this type in the order of steps. First, a copper foil 81 is attached to both sides of an insulating substrate such as glass epoxy. A substantially rectangular through-hole 82 is provided at a suitable interval in a base substrate 80 such as a known printed circuit board formed by
To form a cross section as shown in FIG.

[0003] Next, in order to electrically connect copper foils 81 provided on both surfaces of the base substrate 80, electroless plating of copper or the like, electric field plating, Ni plating are applied to the inner surfaces of the through holes 82 as shown in FIG. The conductive film 83 whose surface is covered with gold is formed by means such as repeatedly performing gold plating, and the like.
2 electrically connects both sides.

[0004] Next, a resist is applied to the copper foil 81 between the through-holes of the base substrate 80 so as to have a desired wiring pattern, and a part of the copper foil is removed by a known means such as etching to obtain a copper foil 81 as shown in FIG. A wiring pattern on which a plurality of LED chips can be mounted in parallel as shown in (1) is formed, and a pad portion 84 and a wiring portion 85 are formed on one surface side of the mother substrate 80.

A substantially rectangular insulating portion 86 is also formed on the copper foil 81 on the back surface of the opposite substrate by the same means to complete the mother substrate 80.

Then, as shown in FIG. 14, a P-type or N-type chip electrode of the LED chip 91 is mounted on the pad portion 84 with a conductive adhesive or the like, and the LED chip 9 is mounted.
The other one electrode and the wiring portion 85 are connected by bonding a wire 92 such as a gold wire.

Next, a plurality of LEDs connected as described above
As shown in FIG. 15, the chip 91 and the plurality of wires 92 are covered with an upper mold 96 and a lower mold 97 each having a substantially trapezoidal column-shaped space parallel to the through-hole 82, and the transparent insulating resin dissolved in the mold. The mother substrate 80 shown in FIG. 16 in which the mold 93 is formed by pouring and curing is formed. The mold substrate 93 is formed by cutting the mother substrate 80 along a cutting plane D shown in FIG. 17 with a cutter or the like. Mother substrate 80 is a plurality of surface-mounted LEDs having LED chips
90.

The surface-mounted LED 9 manufactured as described above
Reference numeral 0 denotes a substantially trapezoidal mold portion 9 as shown in FIG.
3 and an LED chip 9 protruding laterally from the mold portion 93.
An electrode terminal 95 connected to one chip electrode is formed on two opposing sides of the chip substrate 94.

[0009]

However, in the above-described conventional method of manufacturing the surface mount LED 90, a plurality of LEDs are mounted on a large mother substrate 80 as shown in FIG. In order to mount and form the chip 91, the mold section 93 is also formed to be elongated.

Therefore, as described above, in forming the mold portion 93, the transparent insulating resin is shrunk in the step of pouring and dissolving the transparent insulating resin dissolved in the upper mold 96, and warps with the base substrate 80. Sometimes.

In the conventional surface mount type LED 90, this warpage is corrected and cut by a cutter or the like.
Since the correction cannot be performed by 0%, a positional shift occurs when cutting, and a position of the LED chip 91 with respect to the mold portion 93 having a lens function also shifts, thereby deteriorating directional characteristics.

In addition, since the correction requires time and effort, and stress is applied to the mold portion 93 accompanying the correction, the moisture resistance of the mold portion 93 may deteriorate.
The solution of these points has been an issue.

[0013]

In order to solve the above-mentioned problems, the present invention provides a step of preparing a base material substrate in which a large number of through holes and conductive patterns are formed in a predetermined arrangement. Forming a plurality of semiconductor elements and electrically connecting the plurality of semiconductor elements in a row, and forming a mold part in which the plurality of semiconductor elements are integrally covered with a resin so as to have a recess between the semiconductor elements. And a step of cutting a mold portion as the base material substrate.

Further, the side surface of the concave portion is formed as a curved surface.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a surface mount type LED according to the present invention.
Will be described in detail based on the embodiment shown in FIGS.

First, a substantially square through-hole 2 is formed at an appropriate interval in a base substrate 1 such as a known printed circuit board formed by attaching copper foil 3 to both surfaces of an insulating substrate such as glass epoxy. And a sectional shape as shown in FIG.

Next, in order to electrically connect the copper foils 3 provided on both surfaces of the base substrate 1, electroless plating of copper or the like, electric field plating, Ni plating is applied to the inner surface of the through hole 2 as shown in FIG. Then, a conductive film 4 whose surface is covered with gold is formed by means such as repeatedly performing gold plating, and both surfaces are electrically connected through the through hole 2.

Next, a resist is applied to the copper foil 3 between the through holes of the base substrate 1 so as to have a desired wiring pattern, and a part of the copper foil 3 is removed by a known means such as etching. A wiring pattern on which a plurality of LED chips can be mounted in parallel as shown in FIG. 3 is formed, and a pad portion 5 and a wiring portion 6 are formed on one surface side of the mother substrate 1.

Further, a substantially rectangular insulating portion 7 is formed on the copper foil 3 on the back surface of the opposite substrate by the same means, whereby the mother substrate 1 is completed.

Then, as shown in FIG.
Then, a P-type or N-type chip electrode of the LED chip 8 is mounted with a conductive adhesive or the like, and the other electrode of the LED chip 8 is connected to the wiring portion 6 by bonding a wire 9 such as a gold wire.

The above steps are the same as those of the manufacturing method described as the prior art, but the manufacturing method of the present invention further includes the following steps.

In the prior art, a plurality of LED chips 8 and a plurality of wires 9 connected as described above are covered with a mold having a series of substantially trapezoidal column-shaped spaces parallel to the through holes 2. The resin was poured and cured to form a series of substantially trapezoidal column-shaped mold portions shown in FIG. 16. In the present invention, the mold is made as follows.

FIG. 5 shows a mold 10 used in the first embodiment.
5A is a sectional perspective view of a main part, and FIG.
FIG. 6B is a sectional view taken along line AA of FIG.

The mold 10 has a convex portion 11 corresponding to a space between the plurality of LED chips 8 in a longitudinal direction parallel to the through hole 2. The convex portion 11 does not reach the base material substrate 1 and does not hinder the flow of the transparent insulating resin when the transparent insulating resin dissolved therein is poured into the mold 10.

The cross section of the mold 10 perpendicular to the through holes 2 is substantially trapezoidal as in the prior art.

Then, as in the conventional case, the plurality of LED chips 8 and the plurality of wires 9 are covered with the mold 10, and a transparent insulating resin dissolved in the mold 10 is poured and cured, and the LED chips shown in FIG. A mold portion 13 having a concave portion 12 corresponding to the above is formed.

Thereafter, the mother substrate 1 on which the mold portion 13 is formed is cut along a cutting plane D shown in FIG. 7 by a cutter or the like, so that the mother substrate 1 on which the mold portion 13 is formed has the LED chips 8. Multiple surface mount LEDs
20, which are shown in FIG.

The surface mount type LE formed as described above
As described in the conventional example, D20 is used as a reflow type component that is mounted on a surface without providing a mounting hole in a printed circuit board or the like.

Next, the operation and effect of the present invention as described above will be described. First, the concave portion 12 corresponding to the space between the LED chips 8 in the longitudinal direction of the mold portion 13 is formed. Therefore, even if a plurality of LED chips 8 are mounted in a row on a large-sized substrate and a plurality of elongated mold portions 13 are formed, the recesses 12 formed in the mold portions 13 allow the mold portions 13 to be formed. Shrinkage that occurs when the transparent insulating resin, which is a material, is cured is reduced, and the warpage of the base material substrate 1 is greatly reduced.

The fact that the warpage of the base material substrate 1 is greatly reduced allows accurate alignment at the time of cutting, which is a subsequent step, and the LED chip 8 has a lens function with respect to the mold portion 13 having a lens function. Surface mount LE with accurate placement
D20 can be formed.

Further, since the base material substrate 1 hardly warps, it is not necessary to apply a stress for correcting the warpage, and the joint portion between the mold portion 13 and the base material substrate 1 is not deteriorated.
Further, as described above, the LED chip 8 and the molding
Since the arrangement of the LED chips is accurate, there is no possibility that the LED chip approaches the resin end face and causes a problem with the moisture-proof surface unlike the related art.

Second, a single surface-mounted LED 20
Then, the side surface 14 of the concave portion 12 formed in the mold portion 13 forms a surface that functions as a lens that radiates light emitted from the LED chip 8 to the outside from the mold portion 13 satisfactorily. This serves to improve the performance of the LED 20.

Further, since the bottom of the concave portion may be cut, it is possible to visually confirm the cut position.

FIG. 9 shows a second embodiment of the present invention. The difference from the first embodiment is that the shape of the side surface 14 of the concave portion 12 formed in the mold portion 13 is different from that of the first embodiment. However, in the present example, a concave shape having a curved surface is used. The other manufacturing method is the same as that of the first embodiment, and the description is omitted.

FIG. 10 shows a mold 1 used in the second embodiment.
FIG. 10 (a) is a sectional perspective view of a main part, and FIG.
11B is a cross-sectional view taken along the line BB of FIG.

The shape of the recess 12 will be described.
As shown in FIG. 10, by forming the side surface of the convex portion 11 of the mold 10 used when forming the mold portion 13 into a curved surface such as a parabola, the concave portion 12 having a curved side surface 14 in the mold portion 13 is formed. Is formed.

The concave portion 12 having the curved surface formed in this manner is cut into individual surface-mounted LEs by cutting in a later step.
When it is set to D20, it appears as a curved surface shape on the end face of the mold portion 13. In the surface-mounted LED 20 thus formed, the same effect as that of the first embodiment can be obtained, and the LED can be further increased. The light radiated from the chip 8 can be efficiently derived from the mold portion 13, and the light distribution can be controlled by the curved shape of the side surface of the concave portion 12.

In the above embodiments, the LED chip 8 which is a light emitting element is described as an example of a semiconductor element.
Alternatively, a light receiving element such as a phototransistor may be used. Further, the resin material used for the mold portion is appropriately selected depending on the type of the semiconductor element used for the surface mount component. For example, if the light emitting device emits infrared light, the mold portion may transmit infrared light. An opaque resin may be used.

In the above embodiment, the through-hole 2 is formed in a slender, substantially rectangular shape.
There is no problem in the present invention even if a plurality of rows are provided corresponding to the positions of the D chips 8.

Further, in the above embodiment, an example of a surface-mounted component including one semiconductor element has been described. However, the present invention is not limited to this, and the present invention can be applied to the manufacture of a surface-mounted component on which two or more semiconductor elements are mounted. It is.

[0041]

As described above, according to the present invention, in the step of forming a mold portion when manufacturing a surface mount component,
Since the resin is integrally covered with the resin so as to have the concave portions 12 between the LED chips 8, a plurality of LED chips 8 are mounted in a row on a large-sized substrate, and a plurality of elongated mold portions 13 are formed. Even if the mold part 1
Due to the recess 12 formed in 3, the shrinkage that occurs when the resin that is the material of the mold portion 13 is cured is reduced, the warpage of the base material substrate 1 is greatly reduced, and accurate cutting is performed in the subsequent process. This makes it possible to manufacture a surface mount component in which the LED chip 8 is accurately positioned with respect to the mold portion 13 having a lens function.

Further, since the base material substrate hardly warps, it is not necessary to apply a stress for correcting the warpage, and the joint portion between the mold portion 13 and the base material substrate 1 is not deteriorated.
Further, as described above, the LED chip 8 and the molding
The arrangement of the LED chips 8 is
Does not come close to the resin end face and cause a problem with the moisture-resistant surface.

Further, when a single surface mount LED 20 is formed, the concave portion 12 formed in the mold portion 13
Since a surface having a lens function of radiating light emitted from the chip 8 to the outside from the mold portion 13 is formed, the performance of the surface mount component is improved.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view of a base material substrate for explaining a manufacturing process of a surface-mounted LED according to the present invention.

FIG. 2 is a schematic cross-sectional view of a base material substrate for explaining a manufacturing process of the surface mount LED according to the present invention.

FIG. 3 is a schematic plan view of a base material substrate for explaining a manufacturing process of the surface mount LED according to the present invention.

FIG. 4 is a schematic cross-sectional view of a base material substrate for explaining a manufacturing process of the surface mount LED according to the present invention.

FIG. 5 is a schematic cross-sectional view of a mold for explaining a manufacturing process of the surface-mounted LED according to the present invention.

FIG. 6 is a schematic perspective view showing a base material substrate before cutting for explaining a manufacturing process of the surface mount LED according to the present invention.

FIG. 7 is a schematic plan view illustrating a state when the base material substrate molded in FIG. 6 is cut.

FIG. 8 is a schematic perspective view of a surface-mounted LED formed by the manufacturing method according to the present invention.

FIG. 9 is a schematic perspective view of a surface-mounted LED formed by another manufacturing method according to the present invention.

FIG. 10 is a schematic view of a mold for explaining a manufacturing process of another surface mount LED according to the present invention.

FIG. 11 is a schematic cross-sectional view of a base material substrate for explaining a manufacturing process of a conventional surface mount LED.

FIG. 12 is a schematic cross-sectional view of a base material substrate for explaining a manufacturing process of a conventional surface mount LED.

FIG. 13 is a schematic plan view of a base material substrate for explaining a manufacturing process of a conventional surface mount LED.

FIG. 14 is a schematic cross-sectional view of a base material substrate for explaining a manufacturing process of a conventional surface-mount type LED.

FIG. 15 is a schematic explanatory view showing a conventional resin molding process.

FIG. 16 is a schematic perspective view showing a base material substrate before cutting for explaining a manufacturing process of a conventional surface mount LED.

FIG. 17 is a schematic plan view illustrating a state in which the base material substrate molded in FIG. 16 is cut.

FIG. 18 is a schematic perspective view showing an example of a conventional surface mount LED.

[Explanation of symbols]

 Reference Signs List 1 base material substrate 2 through hole 3 copper foil 4 conductive film 5 pad portion 6 wiring portion 7 insulating portion 8 LED chip 9 wire 10 type 11 convex portion 12 concave portion 13 mold portion 14 side surface 20 surface mount type LED

Claims (2)

[Claims] A step of preparing a mother substrate having a large number of through holes and conductive patterns formed in a predetermined arrangement; a step of mounting a plurality of semiconductor elements on the mother substrate and making an electrical connection; Forming a molded portion by integrally covering a plurality of the semiconductor elements arranged in a matrix with a resin so as to have a concave portion between the semiconductor elements, and cutting the base material substrate and the molded portion; A method for manufacturing a surface-mounted component, comprising: 2. The method according to claim 1, wherein a side surface of the concave portion is a curved surface.