JP2014212139A - Led package and method of manufacturing led package - Google Patents

Led package and method of manufacturing led package Download PDF

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Publication number
JP2014212139A
JP2014212139A JP2011266464A JP2011266464A JP2014212139A JP 2014212139 A JP2014212139 A JP 2014212139A JP 2011266464 A JP2011266464 A JP 2011266464A JP 2011266464 A JP2011266464 A JP 2011266464A JP 2014212139 A JP2014212139 A JP 2014212139A
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Japan
Prior art keywords
led
led package
conductive pattern
portion
plurality
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Pending
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JP2011266464A
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Japanese (ja)
Inventor
加藤 宣和
Nobukazu Kato
宣和 加藤
林 耕司
Koji Hayashi
耕司 林
Original Assignee
加藤 宣和
Nobukazu Kato
宣和 加藤
林 耕司
Koji Hayashi
耕司 林
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Application filed by 加藤 宣和, Nobukazu Kato, 宣和 加藤, 林 耕司, Koji Hayashi, 耕司 林 filed Critical 加藤 宣和
Priority to JP2011266464A priority Critical patent/JP2014212139A/en
Publication of JP2014212139A publication Critical patent/JP2014212139A/en
Application status is Pending legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An LED package with reduced manufacturing costs is provided.
An LED package having a plurality of LED elements mounted thereon, which is formed by pressing, and is in contact with a mounting portion on which each of the plurality of LED elements is mounted and each of the plurality of LED elements. A conductive pattern having a contact portion 12 to be mounted, and an insulator having a holding portion that is mounted around each of the plurality of LED elements and that holds the conductive pattern and a positioning portion 25 that positions the LED package. The conductive pattern further includes a dividing portion 13 that is divided after the insulator is attached.
[Selection] Figure 10

Description

  The present invention relates to an LED package on which a plurality of LED (Light Emitting Diode) elements are mounted, and a method for manufacturing the LED package.

  Conventionally, LED packages equipped with LED elements are used for backlights of liquid crystal display devices such as television receivers and personal computers. An LED package has a structure in which an LED chip is mounted on an LED package substrate. In general, an LED package is manufactured by an LED chip manufacturer and a backlight manufacturer. That is, an LED chip manufacturer mounts an LED element on a lead frame, covers the periphery of the lead frame with a resin that functions as an edge, arranges a lens on the LED element, and manufactures the LED chip. Manufacturers manufacture LED packages by mounting LED chips on an insulating LED package substrate on which a conductive pattern is formed, and disposing lenses on the LED chips. Note that the structure of the LED chip is disclosed in, for example, Patent Document 1 and the like.

JP 2011-171508 A

  By the way, the conductive pattern of the LED chip lead frame and the LED package substrate, the resin covering the periphery of the LED chip lead frame, and the insulator of the LED package substrate have the same functions. The substrate has the same functional configuration, and the manufacturing cost has been increased.

  In addition, since the light emitted from the LED element is orthogonal, a lesbian for diffusing the light is indispensable. However, in the conventional LED package, the LED chip is provided with a lens, and further, a backlight unit. In some cases, a lens is further provided on the LED package. When the lens is provided on the LED package, the lens is arranged on the LED package substrate using the alignment hole formed on the LED package substrate. However, the alignment formed on the LED package substrate is used. Since the accuracy of the formation position of the hole for use is low, it takes time to adjust the arrangement position of the lens, and the manufacturing cost is increased.

  Further, since the LED element generates heat during light emission, it is necessary to efficiently dissipate heat. However, the LED package substrate of the conventional LED package has a large thermal resistance, and thus it is difficult to efficiently dissipate heat. .

  The objective of this invention is providing the manufacturing method of the LED package and LED package which reduced manufacturing cost.

  The present invention solves the above problems by the following means. In addition, in order to make an understanding easy, it attaches | subjects and demonstrates the code | symbol corresponding to embodiment of this invention, but this invention is not limited to this.

  The LED package (50) of the present invention is an LED package on which a plurality of LED elements (30) are mounted, and is formed by pressing, and a mounting portion (11) on which each of the plurality of LED elements is mounted and A conductive pattern (10) having a contact portion (12) in contact with each of the plurality of LED elements, and an insulator (20) mounted around each of the plurality of LED elements and having a holding portion for holding the conductive pattern. ), And the conductive pattern further includes a dividing portion (13) which is divided after the insulator is mounted.

  Moreover, the LED package of this invention is provided with the lens (40) arrange | positioned at the light emission direction side of the said LED element.

  The LED package of the present invention is characterized in that the conductive pattern has an alignment portion (16) for aligning with the lens, and the lens is arranged using the alignment portion.

  Further, the LED package of the present invention is characterized in that the conductive pattern includes a heat transfer portion (14) formed so as to protrude from the back side of the mounting portion and transferring heat to the heat radiating member.

  The LED package of the present invention is characterized in that the heat transfer part is formed of an elastic body.

  Further, the LED package of the present invention is characterized by including a reflector portion (21a) that reflects light emitted from the LED element to the light emitting direction side around the LED element in the light emitting direction side.

  The LED package of the present invention is characterized in that the insulator includes a positioning portion (25) for positioning the LED package.

  Moreover, the manufacturing method of the LED package of this invention is a manufacturing method of the LED package (50) by which several LED element (30) was mounted, Comprising: Each of these LED elements is press-processed by a metal plate. A pressing process for forming a conductive pattern (10) having a mounting portion (11) to be mounted, a contact portion (12) in contact with each of the plurality of LED elements, and a dividing portion (13) to be divided; A mounting step of mounting an insulator (20) having a holding portion for holding the conductive pattern around each of the LED elements, a cutting step of cutting the cutting portion (13), and the plurality of mounting portions And an LED element mounting step for mounting each of the plurality of LED elements.

  Moreover, the manufacturing method of the LED package of this invention further includes the arrangement | positioning process which arrange | positions the said lens (40) in the light emission direction side of the said LED element.

  Moreover, the manufacturing method of the LED package of this invention forms the alignment part (16) which aligns with the said lens in the said conductive pattern in the said press work process, and uses the said alignment part in the said arrangement | positioning process. And arranging the lenses.

  The LED package manufacturing method of the present invention is characterized in that, in the press working step, the conductive pattern is formed with a heat transfer portion (14) projecting on the back side of the mounting portion and transferring heat to the heat radiating member. And

  Moreover, the manufacturing method of the LED package of this invention is characterized by the said heat-transfer part being formed with the elastic body.

  Moreover, the manufacturing method of the LED package of this invention WHEREIN: In the said press work process, the reflector part which reflects the light inject | emitted from the said LED element to the circumference of the said light emitting direction side of the said LED element to the said light emitting direction side in the said conductive pattern ( 21a) is formed.

  The LED package manufacturing method of the present invention is characterized in that the insulator includes a positioning portion (25) for positioning the LED package.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the LED package and LED package which reduced manufacturing cost can be provided.

It is a perspective view of the conductive pattern which concerns on embodiment. It is the expansion perspective view which looked at the conductive pattern which concerns on embodiment from the surface side. It is the expansion perspective view which looked at the conductive pattern which concerns on embodiment from the back surface side. It is the perspective view which looked at the insulator with which the electrically conductive pattern which concerns on embodiment was mounted | worn from the surface side. It is the perspective view which looked at the insulator with which the conductive pattern which concerns on embodiment was mounted | worn from the back surface side. It is a figure which shows the state by which the parting part which concerns on embodiment was parted. It is a figure which shows the state by which the LED element was mounted in the mounting part which concerns on embodiment. It is a figure which shows the lens attached to the insulator which concerns on embodiment. It is the perspective view which looked at the LED package which concerns on embodiment from the surface side. It is the perspective view which looked at the LED package which concerns on embodiment from the back surface side. It is a figure which shows the large sized lens attached to the electrically conductive pattern which concerns on embodiment. It is a figure which shows the state by which the large sized lens was attached to the electrically conductive pattern which concerns on embodiment. It is a perspective view of the LED package to which the large sized lens which concerns on embodiment was attached.

  Hereinafter, an LED package on which a plurality of LED elements according to an embodiment of the present invention are mounted and a method for manufacturing the LED package will be described with reference to the drawings.

  When manufacturing an LED package, first, a thin metal plate for forming a conductive pattern is prepared. Here, the thin metal plate has a predetermined width and a shape extending in the arrangement direction of the LED elements so that a plurality of LED elements can be mounted in a row. As a metal material of the conductive pattern metal thin plate, a copper alloy such as C5210 or an alloy such as Fe—Ni or Cu—Ni—Sn is used.

  Next, the conductive pattern 10 having a three-dimensional shape is formed by pressing the metal thin plate (pressing process). When pressing the metal thin plate, the same shape is repeatedly formed on the metal thin plate with a mold while feeding the metal thin plate in the longitudinal direction. In this pressing process, the conductive pattern 10 is processed into a shape that can be pressed.

  FIG. 1 is a perspective view of a conductive pattern 10 formed by pressing. The conductive pattern 10 includes a mounting portion 11 on which each of the plurality of LED elements 30 (see FIG. 7) is to be mounted, a contact portion 12 on which each of the plurality of LED elements 30 is to contact, and an insulator 20 (see FIG. 4). 5), a plurality of dividing portions 13 that are to be divided after being mounted, and an auxiliary portion 15 that is connected by the dividing portions 13 and used for feeding the metal thin plate in the longitudinal direction during press working. Here, the mounting portion 11 also serves as a contact portion that comes into contact with the LED element 30 and a holding portion that holds an insulator 20 described later. The mounting portion 11 serves as a base-side conductive portion (anode electrode portion), and the contact portion 12 serves as a terminal-side conductive portion (cathode electrode portion).

  2 is an enlarged perspective view of the mounting portion 11, the contact portion 12, and the dividing portion 13 of the conductive pattern 10 formed by pressing, as viewed from the front side, and FIG. 3 is the mounting portion 11, the contact portion of the conductive pattern 10. It is the expansion perspective view which looked at 12 and the parting part 13 from the back surface side. As shown in FIGS. 2 and 3, the mounting portion 11 and the contact portion 12 of the conductive pattern 10 formed by pressing are divided. Further, around the mounting portion 11, four L-shaped heat transfer portions 14 protruding from the back surface side of the mounting portion 11 are formed. Here, since the heat transfer section 14 is formed in an L shape, the heat generated in the LED element 30 mounted on the mounting section 11 is transferred to the heat radiating member such as the back chassis as an elastic body. It functions, the tip part of heat transfer part 14 can be made to contact heat dissipation members, such as a back chassis, reliably, and reliable and efficient heat dissipation can be performed.

  Next, the insulator 20 is mounted at a position covering the mounting portion 11, the contact portion 12, and the dividing portion 13 of the conductive pattern 10 formed by press working (mounting process). Here, the insulator 20 insulates between the conductive patterns 10 and between the conductive pattern 10 and another metal such as a back chassis. The insulator 20 is mounted by three-dimensionally molding a white resin that functions as the insulator 20 on the conductive pattern 10. As the white resin, for example, an epoxy resin or a silicone resin containing silica and titanium oxide is used.

  As shown in FIG. 4, the insulator 20 has a rectangular flat plate shape and holds the conductive pattern 10. The insulator 20 is formed with a cylindrical opening 21 for exposing the mounting portion 11 and the contact portion 12, and further four rectangular openings 22 for exposing the dividing portion 13. . Therefore, when the LED element 30 is mounted on the mounting portion 11, the periphery of the LED element 30 is covered with the insulator 20. Here, since the insulator 20 is formed of white resin, the inner wall surface of the cylindrical opening 21 functions as a reflector 21a (see FIGS. 6 and 7), and emits light emitted from the LED element 30. The light is reflected on the direction side, that is, on the upper side of the LED element 30.

  As shown in FIG. 5, an opening 23 is formed at a position corresponding to the opening 22 on the back surface side of the insulator 20, and a rectangular opening 24 that exposes the heat transfer section 14 is formed. Further, positioning portions 25 used for positioning the completed LED package 50 (see FIGS. 9 and 10) are formed at the four corners on the back side of the insulator 20.

  Next, as shown in FIG. 6, the dividing portion 13 connected to the auxiliary portion 15 is divided (dividing step). Thereby, the unnecessary auxiliary | assistant part 15 is cut | disconnected from the conductive pattern 10 formed by press work, and the some conductive pattern division | segmentation piece which has the mounting part 11 and the contact part 12 is formed.

  Next, as shown in FIG. 7, the LED element 30 is mounted on the mounting portion 11 of each conductive pattern division piece and fixed by die bonding (LED element mounting step). Next, the anode electrode of the LED element 30 is electrically connected to the mounting portion 11 of the conductive pattern division piece by wire bonding, and the cathode electrode of the LED element 30 is connected to the contact portion 12 of the adjacent conductive pattern division piece by wire bonding. Electrically connect to Thereby, each conductive pattern division piece is electrically connected via the LED element 30.

  Next, the phosphors and the transparent resin are filled in the openings 21 on the respective LED elements 30 and cured. As the transparent resin, an epoxy resin, a modified epoxy resin, a silicone resin, an acrylic resin, a polycarbonate resin, a polyphthalamide resin, or the like can be used. A resin obtained by mixing two or more of these resins may be used.

  Next, as shown in FIG. 8, the opening 22 formed in the insulator 20 is used as an alignment hole, the alignment protrusion of the lens 40 is fitted into the opening 22, and the lens 40 is attached to the LED element 30. It arrange | positions at the upper part of the LED element 30 which is a light emission direction side (lens arrangement | positioning process). Thereby, the LED package 50 in which the plurality of LED elements 30 are mounted in a row is completed.

  9 is a perspective view of the completed LED package 50 as viewed from the front surface side, and FIG. 10 is a perspective view of the LED package 50 as viewed from the back surface side. As shown in FIGS. 9 and 10, the LED package 50 has a plurality of LED elements 30 mounted in a row. Accordingly, the LED package 50 can be used as a backlight as it is by arranging it on the back side or the back side end of a liquid crystal display device of a television receiver or a personal computer, for example.

  According to the LED package according to this embodiment, the manufacturing cost can be reduced. That is, when the conventional LED chip is used as a backlight of a television receiver or the like, the LED chip is mounted on an LED package substrate, and the LED chip and the LED package substrate are each made of a conductor or an insulator. Therefore, the LED chip and the LED package substrate are provided with the same functional configuration redundantly, and the manufacturing cost is increased, but the LED package according to this embodiment is redundant. Since there is no configuration, the manufacturing cost can be reduced. Further, since the conductive pattern is manufactured by pressing a metal thin plate, the manufacturing cost can be further reduced.

  Further, according to the LED package manufacturing method according to the above-described embodiment, in a conventional LED chip manufacturer, an LED element is mounted on a lead frame, and the periphery of the lead frame is covered with a resin that functions as an edge, The LED chip is manufactured by disposing the lens on the substrate, and then the backlight manufacturer manufactures the LED package by mounting the LED chip on the insulating LED package substrate on which the conductive pattern is formed. When used, a lens was further arranged on the LED chip. However, according to this embodiment, the LED package that can be used as it is as a backlight can be manufactured as a series of steps. Can reduce the number of processes and reduce the manufacturing cost of LED packages. That.

  In the above-described embodiment, the opening 22 of the insulator 20 is used as an alignment hole for the lens 40. However, a large lens 42 as shown in FIG. 11B, the hole 16 formed in the auxiliary portion 15 of the conductive pattern 10 shown in FIG. 11B is used as an alignment hole, and as shown in FIG. The alignment protrusion 43 is fitted into the hole 16, and the large lens 42 is disposed on the LED element 30 that is the light emitting direction side of the LED element 30. Thereby, the LED package 60 shown in FIG. 13 in which the large lens 42 is arranged on the light emitting direction side of the LED element 30 is completed.

  Moreover, in the above-mentioned embodiment, although the reflector part 21a is formed in the inner wall of the opening part 21 of the insulator 20, the light emission of the LED element 30 is obtained by processing the conductive pattern 10 into a three-dimensional shape in the pressing process. You may make it form the reflector part which reflects the light inject | emitted from the LED element 30 to the light emission direction side around the direction side.

  In the above-described embodiment, the heat transfer section 14 is formed in an L shape so that the heat transfer section 14 functions as an elastic body. However, the heat transfer section 14 protrudes from the back surface side of the mounting section 11 by pressing. You may make it equip the front-end | tip part of the provided heat-transfer part 14 with heat conductive resin. Thereby, the front-end | tip part of the heat-transfer part 14 can be made to contact further reliably to heat radiating members, such as a back chassis, and reliable and efficient heat dissipation can be performed.

  In the above-described embodiment, the LED element 30 is mounted on the mounting portion 11, the anode electrode of the LED element 30 is wire-bonded to the mounting portion 11, and the cathode electrode is wire-bonded to the contact portion 12 of the adjacent conductive pattern segment. However, the LED element 30 is mounted on the contact portion 12, and the anode electrode of the LED element 30 is wire-bonded to the contact portion 12, and the cathode electrode is wire-bonded to the mounting portion 11 of the adjacent conductive pattern segment. Good.

  In the above-described embodiment, the reflector portion 21a has a cylindrical shape formed so as to surround the LED element 30 from the periphery, but is disposed so as to surround the LED element from the periphery, and is separated from the LED element 30. It may have a conical shape that expands according to the above.

  In the above-described embodiment, the insulator 20 is formed of white resin, but thermoplastic resin such as LCP (liquid crystal polymer), PBT (polybutylene terephthalate), 6-6Ny (6,6-nylon), etc. May be formed.

  In the above-described embodiment, the insulator 20 is formed on the conductive pattern 10. However, a tape-like or film-like insulator is provided on the front and back surfaces of the conductive pattern 10, and the conductive pattern 10 is taped or You may make it pinch | interpose with a film-form insulator. The tape-like or film-like insulator may be one in which openings for exposing the mounting portion 11 and the connecting portion 12 of the conductive pattern 10 are formed in advance, or a tape-like insulator on the conductive pattern 10. Or after arrange | positioning a film-form insulator, you may form the opening part for exposing the mounting part 11 and the connection part 12 of the conductive pattern 10.

  DESCRIPTION OF SYMBOLS 10 ... Conductive pattern, 11 ... Mounting part, 12 ... Connection part, 13 ... Dividing part, 14 ... Heat-transfer part, 20 ... Insulator, 21, 22, 23, 24 ... Opening part, 25 ... Positioning part, 30 ... LED Element, 40, 42 ... lens, 50, 60 ... LED package

Claims (14)

  1. An LED package having a plurality of LED elements mounted thereon,
    A conductive pattern formed by pressing and having a mounting portion on which each of the plurality of LED elements is mounted and a contact portion in contact with each of the plurality of LED elements;
    An insulator having a holding part that is mounted around each of the plurality of LED elements and holds the conductive pattern;
    With
    The LED package according to claim 1, wherein the conductive pattern further includes a divided portion that is divided after the insulator is attached.
  2.   The LED package according to claim 1, further comprising a lens disposed on a light emitting direction side of the LED element.
  3. The conductive pattern has an alignment portion that aligns with the lens,
    The LED package according to claim 2, wherein the lens is disposed using the alignment portion.
  4.   The LED according to any one of claims 1 to 3, wherein the conductive pattern includes a heat transfer portion that protrudes from the back surface side of the mounting portion and performs heat transfer to the heat dissipation member. package.
  5.   The LED package according to claim 4, wherein the heat transfer portion is formed of an elastic body.
  6.   6. The LED package according to claim 1, further comprising a reflector that reflects light emitted from the LED element toward the light emission direction side around the light emission direction side of the LED element. .
  7.   The LED package according to claim 1, wherein the insulator includes a positioning portion that positions the LED package.
  8. A method of manufacturing an LED package having a plurality of LED elements mounted thereon,
    A press working step of forming a conductive pattern having a mounting portion on which each of the plurality of LED elements is mounted, a contact portion in contact with each of the plurality of LED elements, and a part to be divided by pressing a metal plate. When,
    A mounting step of mounting an insulator having a holding portion that holds the conductive pattern around each of the plurality of LED elements;
    A dividing step of dividing the divided portion;
    LED element mounting step of mounting each of the plurality of LED elements on each of the plurality of mounting portions;
    A method for manufacturing an LED package, comprising:
  9.   9. The method of manufacturing an LED package according to claim 8, further comprising an arrangement step of arranging the lens on the light emitting direction side of the LED element.
  10. In the pressing process, forming an alignment portion for aligning the lens with the conductive pattern,
    The method for manufacturing an LED package according to claim 9, wherein in the arranging step, the lens is arranged using the alignment portion.
  11.   The heat processing part which protrudes in the back surface side of the said mounting part and heat-transfers with respect to a thermal radiation member is formed in the said electrically conductive pattern in the said press work process, The heat transfer part characterized by the above-mentioned. LED package manufacturing method.
  12.   12. The method of manufacturing an LED package according to claim 11, wherein the heat transfer part is formed of an elastic body.
  13.   The said press work process WHEREIN: The reflector part which reflects the light inject | emitted from the said LED element to the said light emission direction side around the said light emission direction side of the said LED element is formed in the said conductive pattern. 13. The method for producing an LED package according to any one of 12 above.
  14. The method of manufacturing an LED package according to claim 8, wherein the insulator includes a positioning portion that positions the LED package.

JP2011266464A 2011-12-06 2011-12-06 Led package and method of manufacturing led package Pending JP2014212139A (en)

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JP2011266464A JP2014212139A (en) 2011-12-06 2011-12-06 Led package and method of manufacturing led package
PCT/JP2012/081276 WO2013084842A1 (en) 2011-12-06 2012-12-03 Led package and production method for led package
TW101145492A TW201330336A (en) 2011-12-06 2012-12-04 LED package and manufacturing methods of the same

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WO (1) WO2013084842A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016200979A (en) * 2015-04-10 2016-12-01 ホーチキ株式会社 Smoke detector
KR101944375B1 (en) * 2017-10-17 2019-02-01 주식회사 에이치엘옵틱스 Lens unit for display

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0422351B2 (en) * 1984-10-16 1992-04-16 Stanley Electric Co Ltd
JPH0983018A (en) * 1995-09-11 1997-03-28 Nippon Denyo Kk Light emitting diode unit
JP3488570B2 (en) * 1996-03-29 2004-01-19 ローム株式会社 Led light-emitting device and a surface-emitting illuminating device using the same
JPH10144853A (en) * 1996-11-07 1998-05-29 Toshiba Corp Semiconductor device
JP3831504B2 (en) * 1997-12-25 2006-10-11 三洋電機株式会社 Lead frame
DE19803936A1 (en) * 1998-01-30 1999-08-05 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Expansion compensated optoelectronic semiconductor component, in particular UV-emitting light emitting diode and method for its preparation
TW558622B (en) * 2002-01-24 2003-10-21 Yuan Lin Lamp on sheet and manufacturing method thereof
JP2009283654A (en) * 2008-05-22 2009-12-03 Sanyo Electric Co Ltd Light-emitting device and its fabrication process
JP2010003877A (en) * 2008-06-20 2010-01-07 Panasonic Corp Lead frame, optical semiconductor package, optical semiconductor device, and method of manufacturing optical semiconductor package
JP2010021374A (en) * 2008-07-10 2010-01-28 Hitachi Cable Ltd Semiconductor package
KR101543333B1 (en) * 2010-04-23 2015-08-11 삼성전자주식회사 Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016200979A (en) * 2015-04-10 2016-12-01 ホーチキ株式会社 Smoke detector
KR101944375B1 (en) * 2017-10-17 2019-02-01 주식회사 에이치엘옵틱스 Lens unit for display

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