JPS611066A - Molding method of led chip mounted on printed board - Google Patents
Molding method of led chip mounted on printed boardInfo
- Publication number
- JPS611066A JPS611066A JP59121489A JP12148984A JPS611066A JP S611066 A JPS611066 A JP S611066A JP 59121489 A JP59121489 A JP 59121489A JP 12148984 A JP12148984 A JP 12148984A JP S611066 A JPS611066 A JP S611066A
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- synthetic resin
- molding
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000000465 moulding Methods 0.000 title claims description 20
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 20
- 239000000057 synthetic resin Substances 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract 2
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、ＬＥＤ （発光ダイオード）を光源とした
各種表示装置の分野に利用できるもので、プリント基板
に装着されたＬＥＤチップを合成樹脂でモールドする方
法に関するものである。Detailed Description of the Invention (Industrial Field of Application) The present invention can be used in the field of various display devices using LEDs (light emitting diodes) as light sources. It concerns a method of molding.
（従来の技術）
一般に、プリント基板に装着されたＬＥＤチップは、透
光性の合成樹脂でモールドされるが、そのモールド方法
の一例としては、第５図に示すようにプリント基板ａの
印刷導体すにボンディングしたしＥＤチップＣに、モー
ルド用の合成樹脂ｄをスプレー等にて塗布し、略山形に
コーティングするものである。(Prior Art) Generally, an LED chip mounted on a printed circuit board is molded with a light-transmitting synthetic resin. As an example of the molding method, as shown in FIG. A synthetic resin d for molding is applied by spraying or the like to the ED chip C which has been bonded to the ED chip C, and is coated in a substantially chevron shape.
ところが、この方法によると、モールドされた合成樹脂
ｄが、緩い傾斜の山形であるため、ＬＥＤデツプＣから
の光線がＬｌ、Ｌ２のように合成樹脂ｄの表面で全反ｌ
ｉ！１（空気の屈折率が１であるのに対して合成樹脂の
屈折率は１．５〜１．６である）し、あるいは光線Ｌ３
、Ｌ４、Ｌ５のようにプリント基板ａ側へ大きく屈折さ
れることになり、発光効率を著しく低下させる原因にな
っていた。However, according to this method, since the molded synthetic resin d has a gently sloped mountain shape, the light rays from the LED depth C are completely inverted on the surface of the synthetic resin d as shown in Ll and L2.
i! 1 (the refractive index of air is 1, whereas the refractive index of synthetic resin is 1.5 to 1.6), or the light ray L3
, L4, and L5, the light is largely refracted toward the printed circuit board a side, causing a significant decrease in luminous efficiency.
（発明が解決しようとする問題点）
本発明は、上記従来方法の問題点を解決するためになさ
れ、ＬＥＤチップの光線がモールド樹脂の表面で全反射
しないように、またプリント基板側へ大きく屈折しない
ようにしたＬＥＤチップのモールド方法を提供しようと
するものである。(Problems to be Solved by the Invention) The present invention has been made to solve the problems of the conventional method described above, and is designed to prevent the light beam of the LED chip from being totally reflected on the surface of the molding resin, and to be largely refracted toward the printed circuit board side. The present invention aims to provide a method for molding an LED chip that avoids this.
（問題点を解決するための手段）
上記の問題点を解決するために、本発明はプリント基板
に装着されたＬＥＤチップを合成樹脂でモールドする方
法において、プリント基板に前記ＬＥＤチップを取囲む
ようにして壁体を形成し、こ壁体の内側にモールド用合
成樹脂をポツティングし略半球状にモールドする手段を
要旨とするものである。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a method of molding an LED chip mounted on a printed circuit board with synthetic resin, in which the LED chip is surrounded by the printed circuit board. The gist of this method is to form a wall, pot a molding synthetic resin inside the wall, and mold it into a substantially hemispherical shape.
（作 用）
ＬＥＤチップは前記壁体により取囲まれており、この取
囲まれた部分にモールド用合成樹脂をポツティングする
と、その表面張力によって断面略半球状にモールドされ
、ＬＥＤチップからの光源を前方に有効に放射すること
ができる。(Function) The LED chip is surrounded by the wall, and when a synthetic resin for molding is potted into this surrounded area, the surface tension of the resin molds the resin into a substantially hemispherical cross-section, and the light source from the LED chip is Can effectively radiate forward.
（実施例）
以下、本発明の実施例を図面により説明すると、１はプ
リント基板であり、印刷導体により配線１ａが施され、
その所定の箇所にＬＥＤチップ２が装着されると共にワ
イヤーボンディング３されている。４はドーナツ状モー
ルド用枠体であり、下部の方が上部より若干大径に形成
されており、この枠体は前記ＬＥＤチップ２を取囲むよ
うにして前記プリント基板１上に接着固定される。５は
モールド用合成樹脂であり、前記枠体４により形成され
たＬＥＤチップ２を取囲む壁体の内側にポツティングさ
れる。このとき、合成樹脂５は枠体４で囲まれた容量よ
り多めに供給され、その表面張力によって断面略半球状
となる。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. 1 is a printed circuit board, on which wiring 1a is provided with a printed conductor,
An LED chip 2 is attached to the predetermined location and is wire bonded 3. Reference numeral 4 denotes a donut-shaped molding frame, the lower part of which is formed to have a slightly larger diameter than the upper part, and this frame is adhesively fixed onto the printed circuit board 1 so as to surround the LED chip 2. Reference numeral 5 denotes a synthetic resin for molding, which is potted inside the wall surrounding the LED chip 2 formed by the frame 4. At this time, the synthetic resin 5 is supplied in an amount larger than the capacity surrounded by the frame 4, and its surface tension causes the synthetic resin 5 to have a substantially hemispherical cross section.
第４図（イ）〜（ニ）は、本発明の他の実施例を工程順
に示すもので、プリント基板１１に装着されたＬＥＤチ
ップ１２が凹部１４の内側面により取囲まれており、こ
の壁体の内側即ち凹部１４内にモールド用合成樹脂１５
がポツティングされる。この場合も、合成樹脂１５は凹
部１４の容量よりも多めに供給され、表面張力により断
面略半球状にモールドされる。図において、１１ａはプ
リント基板１１の配線であり、１３はワイヤ−ボンティ
ングである。FIGS. 4(A) to 4(D) show another embodiment of the present invention in the order of steps, in which the LED chip 12 mounted on the printed circuit board 11 is surrounded by the inner surface of the recess 14. A molding synthetic resin 15 is placed inside the wall, that is, in the recess 14.
is spotted. In this case as well, the synthetic resin 15 is supplied in an amount larger than the capacity of the recess 14, and is molded into a substantially hemispherical cross section due to surface tension. In the figure, 11a is wiring on the printed circuit board 11, and 13 is wire bonding.
（発明の効果）
本発明によれば、ＬＥＤチップの樹脂モールドが断面略
半球状に形成されるので、ＬＥＤチップからの光がモー
ルドの表面で全反射することはなく、かつプリント基板
側へ大きく屈折することもなく、これによりＬＥＤラン
プとしての発光効率を著しく高めることができる。また
、本発明はモールド用合成樹脂の表面張力を利用して略
半球状に自己形成する方法であるから、成形用の型が不
要であり、製造も容易である。(Effects of the Invention) According to the present invention, since the resin mold of the LED chip is formed to have a substantially hemispherical cross section, the light from the LED chip is not totally reflected on the surface of the mold and is greatly directed toward the printed circuit board. There is no refraction, and as a result, the luminous efficiency of the LED lamp can be significantly increased. Furthermore, since the present invention is a method of self-forming into a substantially hemispherical shape by utilizing the surface tension of a synthetic resin for molding, a mold for molding is not required and manufacturing is easy.
第１図は、本発明の実施要領を示す説明図、第２図はモ
ールド用枠体を取付けた状態を示す要部の断面図、第３
図は合成樹脂モールドされた状態を示す要部の断面図、
第４図（イ）〜（ニ）は本発明の他の実施例を工程順に
示す断面図、第５図は従来例の説明図である。
１．１１・・・プリント基板、ｉａ、ｌｌａ・・・配線
、２．１２・・・Ｌ Ｅ Ｄチップ、
３．１３・・・ワイヤーボンティング、４・・・枠体、
１４・・・凹部、５．１５・・・モールド
用合成樹脂。
特許出願人 スタンレー電気株式会社Ｉ４
第５閉Fig. 1 is an explanatory diagram showing the implementation procedure of the present invention, Fig. 2 is a sectional view of the main part showing the state in which the mold frame is attached, and Fig. 3
The figure is a cross-sectional view of the main parts showing the state in which they are molded with synthetic resin.
FIGS. 4A to 4D are sectional views showing another embodiment of the present invention in the order of steps, and FIG. 5 is an explanatory view of a conventional example. 1.11... Printed circuit board, ia, lla... wiring, 2.12... LED chip, 3.13... wire bonding, 4... frame,
14... Concavity, 5.15... Synthetic resin for mold. Patent applicant Stanley Electric Co., Ltd. I4 No. 5
Claims (3)
脂でモールドする方法において、前記プリント基板に前
記ＬＥＤチップを取囲むようにして壁体を形成し、この
壁体の内側にモールド用合成樹脂をポッティングして略
半球状にモールドすることを特徴とするプリント基板に
装着されたＬＥＤチップのモールド方法。(1) In a method of molding an LED chip mounted on a printed circuit board with a synthetic resin, a wall is formed on the printed circuit board so as to surround the LED chip, and a synthetic resin for molding is potted inside the wall. A method for molding an LED chip mounted on a printed circuit board, the method comprising molding an LED chip into a substantially hemispherical shape.
ーナツ状の枠体であることを特徴とする特許請求の範囲
第（１）項記載のプリント基板に装着されたＬＥＤチッ
プのモールド方法。(2) The method for molding an LED chip attached to a printed circuit board according to claim (1), wherein the wall is a donut-shaped frame attached to the printed circuit board.
側面を前記壁体としたことを特徴とする特許請求の範囲
第（１）項記載のプリント基板に装着されたＬＥＤチッ
プのモールド方法。(3) A method for molding an LED chip mounted on a printed circuit board according to claim (1), characterized in that a recess is formed in the printed circuit board, and the inner surface of the recess is used as the wall. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59121489A JPS611066A (en) | 1984-06-13 | 1984-06-13 | Molding method of led chip mounted on printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59121489A JPS611066A (en) | 1984-06-13 | 1984-06-13 | Molding method of led chip mounted on printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS611066A true JPS611066A (en) | 1986-01-07 |
Family
ID=14812426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59121489A Pending JPS611066A (en) | 1984-06-13 | 1984-06-13 | Molding method of led chip mounted on printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS611066A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS64350U (en) * | 1987-06-19 | 1989-01-05 | ||
| EP0552497A3 (en) * | 1992-01-22 | 1994-06-01 | Fujikura Ltd | Light illumination membrane switch with reduced size and improved light illumination |
| EP1059667A2 (en) * | 1999-06-09 | 2000-12-13 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| JP2001044512A (en) * | 1999-07-29 | 2001-02-16 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
| JP2005502205A (en) * | 2001-08-31 | 2005-01-20 | フェアチャイルド セミコンダクター コーポレイション | Surface mountable optical coupling device package |
| WO2005057082A1 (en) * | 2003-12-10 | 2005-06-23 | Okaya Electric Industries Co., Ltd. | Indicator lamp |
| WO2012000943A1 (en) * | 2010-06-28 | 2012-01-05 | Osram Opto Semiconductors Gmbh | Method for producing a surface-mountable semiconductor component |
| US8373183B2 (en) | 2011-02-22 | 2013-02-12 | Hong Kong Applied Science and Technology Research Institute Company Limited | LED package for uniform color emission |
| JP2014209602A (en) * | 2013-03-29 | 2014-11-06 | 日亜化学工業株式会社 | Light emitting device and manufacturing method of the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5247692A (en) * | 1975-10-14 | 1977-04-15 | Minolta Camera Co Ltd | Printed circuit board for holding light emitting element |
-
1984
- 1984-06-13 JP JP59121489A patent/JPS611066A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5247692A (en) * | 1975-10-14 | 1977-04-15 | Minolta Camera Co Ltd | Printed circuit board for holding light emitting element |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS64350U (en) * | 1987-06-19 | 1989-01-05 | ||
| EP0552497A3 (en) * | 1992-01-22 | 1994-06-01 | Fujikura Ltd | Light illumination membrane switch with reduced size and improved light illumination |
| US5471023A (en) * | 1992-01-22 | 1995-11-28 | Fujikura Ltd. | Light illumination membrane switch with reduced size and improved light illumination |
| EP1059667A3 (en) * | 1999-06-09 | 2007-07-04 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| EP1059667A2 (en) * | 1999-06-09 | 2000-12-13 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device |
| JP2001044512A (en) * | 1999-07-29 | 2001-02-16 | Sanyo Electric Co Ltd | Hybrid integrated circuit device |
| JP2011124602A (en) * | 2001-08-31 | 2011-06-23 | Fairchild Semiconductor Corp | Surface-mountable optical coupler element package |
| JP2005502205A (en) * | 2001-08-31 | 2005-01-20 | フェアチャイルド セミコンダクター コーポレイション | Surface mountable optical coupling device package |
| WO2005057082A1 (en) * | 2003-12-10 | 2005-06-23 | Okaya Electric Industries Co., Ltd. | Indicator lamp |
| US7473013B2 (en) | 2003-12-10 | 2009-01-06 | Okaya Electric Industries Co., Ltd. | Indicator lamp having a converging lens |
| WO2012000943A1 (en) * | 2010-06-28 | 2012-01-05 | Osram Opto Semiconductors Gmbh | Method for producing a surface-mountable semiconductor component |
| US8735928B2 (en) | 2010-06-28 | 2014-05-27 | Osram Opto Semiconductors Gmbh | Method for producing a surface-mountable semiconductor component |
| US8373183B2 (en) | 2011-02-22 | 2013-02-12 | Hong Kong Applied Science and Technology Research Institute Company Limited | LED package for uniform color emission |
| JP2014209602A (en) * | 2013-03-29 | 2014-11-06 | 日亜化学工業株式会社 | Light emitting device and manufacturing method of the same |
| US10153415B2 (en) | 2013-03-29 | 2018-12-11 | Nichia Corporation | Light emitting device having dual sealing resins |
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