US20140001505A1 - Light emitting diode package with lens and method for manufacturing the same - Google Patents
Light emitting diode package with lens and method for manufacturing the same Download PDFInfo
- Publication number
- US20140001505A1 US20140001505A1 US13/919,755 US201313919755A US2014001505A1 US 20140001505 A1 US20140001505 A1 US 20140001505A1 US 201313919755 A US201313919755 A US 201313919755A US 2014001505 A1 US2014001505 A1 US 2014001505A1
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- United States
- Prior art keywords
- blocking structure
- emitting diode
- light emitting
- encapsulation body
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Definitions
- the present disclosure generally relates to light sources, and particularly to a light emitting diode (LED) package with lens and a method for manufacturing the LED package with lens.
- LED light emitting diode
- LEDs are solid state light emitting sources, which are more stable and reliable than other conventional light sources such as incandescent bulbs. Thus, LEDs are being widely used in various fields such as numeral/character displaying elements, signal lights, light sources for lighting and display devices.
- a lens is usually attached to an LED chip of the LED to modulate lights emitted from the LED.
- the lens is formed by injection molding or dispensing molding.
- the lens is formed by injection molding, the lens is formed firstly, and then is adhered to a substrate by glue to cover an LED chip mounted on the substrate.
- glue is directly dispensed and cured on the substrate to form the lens.
- the lens formed by the dispensing molding has a large radius of curvature whereby an angle of incidence of light generated by the LED die to a light output surface of the lens is more likely to be equal to or larger than a critical angle of the lens. In this state, more light is prone to be totally reflected by the lens.
- the LED has a low light output efficiency.
- FIG. 1 is a cross-sectional view of an LED package with lens in accordance with one embodiment of the present disclosure.
- FIG. 2 is a cross-sectional view of an LED package with lens in accordance with another embodiment of the present disclosure.
- FIGS. 3 to 6 are the first step to the fourth step of the method for manufacturing the LED package with lens of FIG. 1 .
- the LED package 100 includes a substrate 10 , an LED chip 20 mounted on the substrate 10 , a blocking structure 30 arranged around the LED chip 20 , and an encapsulation body 40 covering the LED chip 20 and the blocking structure 30 .
- the substrate 10 is rectangular, and a top surface 11 of the substrate 10 is flat.
- the substrate 10 is a printed circuit board.
- the LED chip 20 is mounted on the top surface 11 of the substrate 10 .
- the LED chip 20 includes a pair of wires 21 .
- the LED chip 20 electrically connects with circuit (not shown) of the substrate 10 via the wires 21 .
- the LED chip 20 can be a chip assembly having a plurality of chips which can generate light beams with different wavelengths.
- the blocking structure 30 is disposed on the substrate 10 .
- the blocking structure 30 is annular.
- the blocking structure 30 includes a resisting surface 31 ; that is, the resisting surface 31 is an outer surface of the blocking structure 30 .
- the blocking structure 30 is made of ceramic materials such as aluminum oxides (AL 2 O 3 ) or aluminum nitride (AlN).
- a metal layer can be formed on surfaces of the blocking structure, to function as a reflecting layer for strengthening the light outputting efficiency of the LED chip 20 .
- the blocking structure 30 is not limit to annular.
- the blocking structure 30 could include a plurality of blocks spaced from each other, and the blocks are arranged to be annular to thereby surround the LED chip 20 . In such an embodiment, preferably at least three spaced and arced blocks are arranged together to form the blocking structure 30 to surround the LED chip 20 .
- the blocking structure 30 can be made of metal or silicone.
- the encapsulation body 40 is formed on the substrate 10 .
- the encapsulation body 40 includes a mounting surface 41 and a light outputting surface 42 .
- the LED chip 20 and the blocking structure 30 are received in the encapsulation body 40 .
- the encapsulation body 40 is made of transparent materials such as silicone.
- the encapsulation body 40 can be mixed with fluorescent particles whereby light generated by the LED chip 20 can be mixed with light generated by the fluorescent particles to generate light having a desired color.
- the encapsulation body 40 is formed by dispensing molding.
- the blocking structure 30 is covered by the encapsulation body 40 .
- An outer (i.e., lateral) surface of the blocking structure 30 is continuously and smoothly connected with the light outputting surface 42 .
- the light outputting surface 42 above the outer surface of the blocking structure 30 forms a hemispherical surface.
- a bottom end of the encapsulation body 40 is enclosed by the blocking structure 30 .
- a normal line A is defined which is extended from the resisting surface 31 and perpendicular to the substrate 10 .
- a tangent line B is defined which is tangent to the light outputting surface 42 at a point thereof adjacent to the blocking structure 30 .
- An angle ⁇ is defined between the normal line A and the tangent line B.
- a periphery of the encapsulation body 40 directly connects with the resisting surface 31 of the blocking structure 30 in a vertical direction, instead of the conventional method that the periphery of the encapsulation body 40 directly connects with the top surface 11 of the substrate 10 in a horizontal direction.
- the blocking structure 30 holds the encapsulation body 40 therein and blocks the encapsulation body 40 from spreading on the substrate 10 . Since the blocking structure 30 can help more material for forming the encapsulation body 40 to be accumulated in height direction of the LED package 100 , the blocking structure 30 can help the encapsulation body 40 to be substantially hemisphere-shaped, and the angle ⁇ between the normal line A and the tangent line B is smaller than 60 degrees. In this embodiment, the angle ⁇ is smaller than 15 degrees.
- a blocking structure 30 is disposed on the substrate 10 , and the resisting surface of the blocking structure is continuously connected with the light outputting surface 42 .
- the encapsulation body 40 is dispensed on the substrate 10 before the encapsulation body 40 is solidified, a bottom end of the periphery of the encapsulation body 40 is adjacent to the resisting surface 31 .
- the blocking structure 30 holds the encapsulation body 40 therein and blocks the encapsulation body 40 from spreading on the substrate 10 .
- the angle ⁇ is smaller relative to the conventional LED package.
- the light outputting surface 42 is substantially hemisphere-shaped. An incident angle of the light generated by the LED chip 20 reaching the light outputting surface 42 of the encapsulation body 40 is more likely to be smaller than the critical angle of the encapsulation body 40 , whereby probabilities of the lights being totally reflected are reduced, and the whole light output of the LED package 100 is increased.
- the blocking structure 30 encloses the bottom end of the encapsulation body 40 , there's no need to provide an extra structure to adjust a shape of the light outputting surface 42 of the encapsulation body 40 .
- an LED package 100 a in accordance with a second exemplary embodiment is shown.
- the LED package 100 a is similar to the LED package 100 of the first embodiment.
- the difference between the LED package 100 and the LED package 100 a is that the LED package 100 a includes two groups of the blocking structure 30 and the encapsulation body 40 .
- the encapsulation bodies 40 of the two groups are stacked together and are concentric with each other. In other words, the encapsulation body 40 of the outer group overlaps the encapsulation body 40 of the inner group.
- the blocking structure 30 of the outer group surrounds the blocking structure 30 of the inner group.
- each blocking structure 30 supports a corresponding encapsulation body 40 and limits the angle ⁇ to be arranged in a small degree.
- the encapsulation body 40 can be mixed with fluorescent particles whereby light generated by the LED chip 20 can be mixed with light generated from the fluorescent particles to obtain light with a desired color.
- the fluorescent particles in the inner encapsulation body 40 to be different from those in the outer encapsulation body 40 , for example, that the fluorescent particles in the outer encapsulation body 40 can have a larger density.
- the disclosure provides a manufacturing method for the LED package 100 which includes following steps:
- a substrate 10 is provided.
- the substrate 10 is rectangular.
- a top surface 11 of the substrate 10 is flat.
- the substrate 10 is a printed circuit board.
- an LED chip 20 is mounted on the top surface 11 of the substrate 10 .
- the LED chip 20 includes a pair of wires 21 ; the LED chip 20 electrically connects with the substrate 10 via the two wires 21 .
- a blocking structure 30 is provided and disposed on the substrate 10 ; the blocking structure 30 surrounds the LED chip 20 .
- the blocking structure 30 is annular.
- the blocking structure 30 includes a resisting surface 31 ; the resisting surface 31 is an outer lateral surface of the blocking structure 30 .
- a metal layer is attached to surfaces of the blocking structure 30 to be a reflecting layer for increasing the light output of the LED package 100 .
- gelatinous material for forming the encapsulation body 40 is dispensed into the space surrounded by the blocking structure 30 until the gelatinous material is positioned over the blocking structure 30 so that the whole blocking structure 30 and the LED chip 20 are covered by the gelatinous material.
- the encapsulation body 40 directly and smoothly connects with the resisting surface 31 of the blocking structure 30 in a vertical direction.
- the blocking structure 30 holds the encapsulation body 40 therein and blocks the encapsulation body 40 from spreading on the substrate 10 .
- the light outputting surface 42 of the encapsulation body 40 forms a hemispherical surface.
- the blocking structure 30 and the encapsulation body 40 are not limited to be one group. Several groups of the blocking structure 30 and the encapsulation body 40 can be formed on the substrate 10 and stacked together, wherein the encapsulations 40 of the different groups are concentric, as shown in FIG. 2 .
Abstract
Description
- 1. Technical Field
- The present disclosure generally relates to light sources, and particularly to a light emitting diode (LED) package with lens and a method for manufacturing the LED package with lens.
- 2. Description of the Related Art
- LEDs are solid state light emitting sources, which are more stable and reliable than other conventional light sources such as incandescent bulbs. Thus, LEDs are being widely used in various fields such as numeral/character displaying elements, signal lights, light sources for lighting and display devices. A lens is usually attached to an LED chip of the LED to modulate lights emitted from the LED.
- Conventionally, the lens is formed by injection molding or dispensing molding. When the lens is formed by injection molding, the lens is formed firstly, and then is adhered to a substrate by glue to cover an LED chip mounted on the substrate. However, it costs more to use the injection molding. When the lens is formed by dispensing molding, glue is directly dispensed and cured on the substrate to form the lens. However, the lens formed by the dispensing molding has a large radius of curvature whereby an angle of incidence of light generated by the LED die to a light output surface of the lens is more likely to be equal to or larger than a critical angle of the lens. In this state, more light is prone to be totally reflected by the lens. Thus, the LED has a low light output efficiency.
- Therefore, it is desirable to provide an LED package with lens which can overcome the above-described problems.
- Many aspects of the disclosure can be better understood with reference to the drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present LED package with lens. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the views.
-
FIG. 1 is a cross-sectional view of an LED package with lens in accordance with one embodiment of the present disclosure. -
FIG. 2 is a cross-sectional view of an LED package with lens in accordance with another embodiment of the present disclosure. -
FIGS. 3 to 6 are the first step to the fourth step of the method for manufacturing the LED package with lens ofFIG. 1 . - Referring to
FIG. 1 , anLED package 100 in accordance with a first exemplary embodiment is provided. TheLED package 100 includes asubstrate 10, anLED chip 20 mounted on thesubstrate 10, ablocking structure 30 arranged around theLED chip 20, and anencapsulation body 40 covering theLED chip 20 and theblocking structure 30. - Specifically, the
substrate 10 is rectangular, and atop surface 11 of thesubstrate 10 is flat. In this embodiment, thesubstrate 10 is a printed circuit board. - The
LED chip 20 is mounted on thetop surface 11 of thesubstrate 10. TheLED chip 20 includes a pair ofwires 21. TheLED chip 20 electrically connects with circuit (not shown) of thesubstrate 10 via thewires 21. Alternatively, theLED chip 20 can be a chip assembly having a plurality of chips which can generate light beams with different wavelengths. - The
blocking structure 30 is disposed on thesubstrate 10. In this embodiment, theblocking structure 30 is annular. Theblocking structure 30 includes a resistingsurface 31; that is, the resistingsurface 31 is an outer surface of theblocking structure 30. Theblocking structure 30 is made of ceramic materials such as aluminum oxides (AL2O3) or aluminum nitride (AlN). Alternatively, a metal layer can be formed on surfaces of the blocking structure, to function as a reflecting layer for strengthening the light outputting efficiency of theLED chip 20. In other embodiment, theblocking structure 30 is not limit to annular. Theblocking structure 30 could include a plurality of blocks spaced from each other, and the blocks are arranged to be annular to thereby surround theLED chip 20. In such an embodiment, preferably at least three spaced and arced blocks are arranged together to form theblocking structure 30 to surround theLED chip 20. Alternatively, theblocking structure 30 can be made of metal or silicone. - The
encapsulation body 40 is formed on thesubstrate 10. Theencapsulation body 40 includes amounting surface 41 and alight outputting surface 42. TheLED chip 20 and theblocking structure 30 are received in theencapsulation body 40. When theLED package 100 works, light emitted from theLED chip 20 directly enters theencapsulation body 40 and radiates out of theencapsulation body 40 via thelight outputting surface 42. Theencapsulation body 40 is made of transparent materials such as silicone. Furthermore, theencapsulation body 40 can be mixed with fluorescent particles whereby light generated by theLED chip 20 can be mixed with light generated by the fluorescent particles to generate light having a desired color. - The
encapsulation body 40 is formed by dispensing molding. Theblocking structure 30 is covered by theencapsulation body 40. An outer (i.e., lateral) surface of theblocking structure 30 is continuously and smoothly connected with thelight outputting surface 42. Thelight outputting surface 42 above the outer surface of theblocking structure 30 forms a hemispherical surface. A bottom end of theencapsulation body 40 is enclosed by theblocking structure 30. Specifically, a normal line A is defined which is extended from the resistingsurface 31 and perpendicular to thesubstrate 10. A tangent line B is defined which is tangent to thelight outputting surface 42 at a point thereof adjacent to theblocking structure 30. An angle θ is defined between the normal line A and the tangent line B. - When the
encapsulation body 40 is manufactured, a periphery of theencapsulation body 40 directly connects with the resistingsurface 31 of theblocking structure 30 in a vertical direction, instead of the conventional method that the periphery of theencapsulation body 40 directly connects with thetop surface 11 of thesubstrate 10 in a horizontal direction. Theblocking structure 30 holds theencapsulation body 40 therein and blocks theencapsulation body 40 from spreading on thesubstrate 10. Since theblocking structure 30 can help more material for forming theencapsulation body 40 to be accumulated in height direction of theLED package 100, theblocking structure 30 can help theencapsulation body 40 to be substantially hemisphere-shaped, and the angle θ between the normal line A and the tangent line B is smaller than 60 degrees. In this embodiment, the angle θ is smaller than 15 degrees. - A
blocking structure 30 is disposed on thesubstrate 10, and the resisting surface of the blocking structure is continuously connected with thelight outputting surface 42. Theencapsulation body 40 is dispensed on thesubstrate 10 before theencapsulation body 40 is solidified, a bottom end of the periphery of theencapsulation body 40 is adjacent to the resistingsurface 31. - The
blocking structure 30 holds theencapsulation body 40 therein and blocks theencapsulation body 40 from spreading on thesubstrate 10. Thus, the angle θ is smaller relative to the conventional LED package. Thelight outputting surface 42 is substantially hemisphere-shaped. An incident angle of the light generated by theLED chip 20 reaching thelight outputting surface 42 of theencapsulation body 40 is more likely to be smaller than the critical angle of theencapsulation body 40, whereby probabilities of the lights being totally reflected are reduced, and the whole light output of theLED package 100 is increased. In addition, since the blockingstructure 30 encloses the bottom end of theencapsulation body 40, there's no need to provide an extra structure to adjust a shape of thelight outputting surface 42 of theencapsulation body 40. - Referring to
FIG. 2 , anLED package 100 a in accordance with a second exemplary embodiment is shown. TheLED package 100 a is similar to theLED package 100 of the first embodiment. The difference between theLED package 100 and theLED package 100 a is that theLED package 100 a includes two groups of the blockingstructure 30 and theencapsulation body 40. Theencapsulation bodies 40 of the two groups are stacked together and are concentric with each other. In other words, theencapsulation body 40 of the outer group overlaps theencapsulation body 40 of the inner group. The blockingstructure 30 of the outer group surrounds the blockingstructure 30 of the inner group. When theLED package 100 a is formed by dispensing molding, each blockingstructure 30 supports acorresponding encapsulation body 40 and limits the angle θ to be arranged in a small degree. Alternatively, theencapsulation body 40 can be mixed with fluorescent particles whereby light generated by theLED chip 20 can be mixed with light generated from the fluorescent particles to obtain light with a desired color. The fluorescent particles in theinner encapsulation body 40 to be different from those in theouter encapsulation body 40, for example, that the fluorescent particles in theouter encapsulation body 40 can have a larger density. - The disclosure provides a manufacturing method for the
LED package 100 which includes following steps: - Referring to
FIG. 3 , asubstrate 10 is provided. Thesubstrate 10 is rectangular. Atop surface 11 of thesubstrate 10 is flat. In this embodiment, thesubstrate 10 is a printed circuit board. - Referring to
FIG. 4 , anLED chip 20 is mounted on thetop surface 11 of thesubstrate 10. TheLED chip 20 includes a pair ofwires 21; theLED chip 20 electrically connects with thesubstrate 10 via the twowires 21. - Referring to
FIG. 5 , a blockingstructure 30 is provided and disposed on thesubstrate 10; the blockingstructure 30 surrounds theLED chip 20. In this embodiment, the blockingstructure 30 is annular. The blockingstructure 30 includes a resistingsurface 31; the resistingsurface 31 is an outer lateral surface of the blockingstructure 30. Alternatively, a metal layer is attached to surfaces of the blockingstructure 30 to be a reflecting layer for increasing the light output of theLED package 100. - Referring to
FIG. 6 , gelatinous material for forming theencapsulation body 40 is dispensed into the space surrounded by the blockingstructure 30 until the gelatinous material is positioned over the blockingstructure 30 so that thewhole blocking structure 30 and theLED chip 20 are covered by the gelatinous material. After the gelatinous material is cured to from theencapsulation body 40, theencapsulation body 40 directly and smoothly connects with the resistingsurface 31 of the blockingstructure 30 in a vertical direction. The blockingstructure 30 holds theencapsulation body 40 therein and blocks theencapsulation body 40 from spreading on thesubstrate 10. Thelight outputting surface 42 of theencapsulation body 40 forms a hemispherical surface. - Alternatively, the blocking
structure 30 and theencapsulation body 40 are not limited to be one group. Several groups of the blockingstructure 30 and theencapsulation body 40 can be formed on thesubstrate 10 and stacked together, wherein theencapsulations 40 of the different groups are concentric, as shown inFIG. 2 . - It is to be understood that the above-described embodiments are intended to illustrate rather than limit the disclosure. Variations may be made to the embodiments without departing from the spirit of the disclosure. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure.
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210221020.2A CN103515511B (en) | 2012-06-29 | 2012-06-29 | Package structure for LED and method for packing thereof |
CN2012102210202 | 2012-06-29 |
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US20140001505A1 true US20140001505A1 (en) | 2014-01-02 |
US8981407B2 US8981407B2 (en) | 2015-03-17 |
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US13/919,755 Active US8981407B2 (en) | 2012-06-29 | 2013-06-17 | Light emitting diode package with lens and method for manufacturing the same |
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US (1) | US8981407B2 (en) |
KR (1) | KR101457806B1 (en) |
CN (1) | CN103515511B (en) |
TW (1) | TWI531091B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10401557B2 (en) | 2015-05-29 | 2019-09-03 | Samsung Electronics Co., Ltd. | Semiconductor light emitting diode chip and light emitting device having the same |
Families Citing this family (6)
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TWI553918B (en) * | 2015-03-26 | 2016-10-11 | 艾笛森光電股份有限公司 | Light-emitting diode packaging element |
KR102400249B1 (en) * | 2015-03-31 | 2022-05-26 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Light emitting module and display including the module |
DE102016112293A1 (en) * | 2016-07-05 | 2018-01-11 | Osram Opto Semiconductors Gmbh | METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT |
US20190267525A1 (en) * | 2018-02-26 | 2019-08-29 | Semicon Light Co., Ltd. | Semiconductor Light Emitting Devices And Method Of Manufacturing The Same |
CN112447896A (en) | 2020-05-26 | 2021-03-05 | 开发晶照明(厦门)有限公司 | Photoelectric device and manufacturing method thereof |
CN113675312A (en) * | 2021-07-09 | 2021-11-19 | 福建天电光电有限公司 | Photodiode device with increased light-emitting angle and method for manufacturing the same |
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US6661084B1 (en) * | 2000-05-16 | 2003-12-09 | Sandia Corporation | Single level microelectronic device package with an integral window |
US20060043401A1 (en) * | 2004-09-01 | 2006-03-02 | Samsung Electro-Mechanics Co., Ltd. | High power light emitting diode package |
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US7365371B2 (en) * | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
US8049230B2 (en) * | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
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KR100964812B1 (en) | 2008-09-29 | 2010-06-22 | 주식회사 에피밸리 | Semiconductor light emitting device package |
TWI411142B (en) * | 2009-06-23 | 2013-10-01 | Delta Electronics Inc | Illuminating device and packaging method thereof |
US20120097985A1 (en) | 2010-10-21 | 2012-04-26 | Wen-Huang Liu | Light Emitting Diode (LED) Package And Method Of Fabrication |
-
2012
- 2012-06-29 CN CN201210221020.2A patent/CN103515511B/en active Active
- 2012-07-04 TW TW101124022A patent/TWI531091B/en active
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2013
- 2013-06-17 US US13/919,755 patent/US8981407B2/en active Active
- 2013-06-19 KR KR1020130070143A patent/KR101457806B1/en active IP Right Grant
Patent Citations (5)
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US7126273B2 (en) * | 1999-04-22 | 2006-10-24 | Osram Gmbh | LED light source with lens |
US6661084B1 (en) * | 2000-05-16 | 2003-12-09 | Sandia Corporation | Single level microelectronic device package with an integral window |
US20060043401A1 (en) * | 2004-09-01 | 2006-03-02 | Samsung Electro-Mechanics Co., Ltd. | High power light emitting diode package |
US7365371B2 (en) * | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
US8049230B2 (en) * | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
Cited By (1)
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US10401557B2 (en) | 2015-05-29 | 2019-09-03 | Samsung Electronics Co., Ltd. | Semiconductor light emitting diode chip and light emitting device having the same |
Also Published As
Publication number | Publication date |
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KR20140002501A (en) | 2014-01-08 |
CN103515511A (en) | 2014-01-15 |
US8981407B2 (en) | 2015-03-17 |
TW201401564A (en) | 2014-01-01 |
TWI531091B (en) | 2016-04-21 |
KR101457806B1 (en) | 2014-11-03 |
CN103515511B (en) | 2016-08-03 |
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