CN220420604U - Direct-insert type LED packaging structure - Google Patents
Direct-insert type LED packaging structure Download PDFInfo
- Publication number
- CN220420604U CN220420604U CN202321815786.3U CN202321815786U CN220420604U CN 220420604 U CN220420604 U CN 220420604U CN 202321815786 U CN202321815786 U CN 202321815786U CN 220420604 U CN220420604 U CN 220420604U
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- China
- Prior art keywords
- pin
- cup
- die bonding
- positive electrode
- electrode bracket
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 31
- 239000000084 colloidal system Substances 0.000 claims abstract description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052737 gold Inorganic materials 0.000 claims abstract description 3
- 239000010931 gold Substances 0.000 claims abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000008393 encapsulating agent Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000005286 illumination Methods 0.000 abstract description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000003760 hair shine Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model provides a direct-insert type LED packaging structure which comprises a bracket main body, an LED chip, gold wires and an outer sealing colloid, wherein the bracket main body comprises a negative electrode bracket pin and a positive electrode bracket pin, a die bonding cup is arranged at the top end of the positive electrode bracket pin, the die bonding cup is embedded in the positive electrode bracket pin, the LED chip is arranged in the die bonding cup, the die bonding cup is positioned at one side of the center line of the bracket main body, so that light rays emitted by the LED chip are transmitted outwards according to a preset direction, and the outer sealing colloid wraps and fixes the upper half parts of the positive electrode bracket pin and the negative electrode bracket pin, so that the negative electrode bracket pin and the positive electrode bracket pin are relatively fixed. According to the direct-insert type LED packaging structure, the position of the die bonding cup is changed, so that the die bonding cup is far away from the central line, the fixed position of the LED chip is changed, the illumination angle is deviated when light passes through the outer sealing colloid, and an observer can observe the irradiated light more quickly and react in time.
Description
Technical Field
The utility model relates to the technical field of lighting equipment, in particular to a direct-insert type LED packaging structure.
Background
Lamplight is frequently used in life of people, the use of the direct-insert type LED lamp is also indispensable in life of people, when the direct-insert type LED lamp is manufactured, the direct-insert type LED lamp is usually packaged, the packaging of the common direct-insert type LED lamp is usually coated by colloid, and the direct-insert type LED lamp is sealed and light-transmitting, and is dispersed after passing through the colloid.
In the related art, the package structure of the common direct-insert type LED lamp is not considered, the light source is only diffused by lighting, the die bonding cup of the common direct-insert type LED lamp is arranged on the central line, the light-emitting type is shown in fig. 4, the curve a and the curve b are respectively an X-axis light-emitting curve and a Y-axis light-emitting curve, the light of the LED lamp bead is emitted from the center of the lens, the light emitting direction is parallel to the horizontal line, and the far observer cannot observe the light content in time, so that the response cannot be made in time.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides the direct-insert type LED packaging structure, and the illumination angle and direction are changed by changing the position of the die bonding cup, so that the direct-insert type LED packaging structure is convenient for an observer to find and observe.
An in-line LED package structure according to an embodiment of the present utility model includes:
support main part, LED chip, gold thread and outer colloid, the support main part includes negative pole support pin, anodal support pin, the negative pole support pin with anodal support pin sets up relatively, the top of anodal support pin is provided with solid brilliant cup, gu brilliant cup embedding set up in the anodal support pin, the LED chip set up in gu brilliant cup, gu brilliant cup is located one side of support main part central line for the light that the LED chip sent is according to predetermineeing the direction outwards transmission, the negative pole of LED chip with negative pole support pin passes through gold thread bonding connection, outer colloid will the first half of anodal support pin the first half of negative pole support pin is all wrapped up fixedly, makes negative pole support pin with anodal support pin is fixed relatively.
The direct-insert type LED packaging structure provided by the embodiment of the utility model has at least the following beneficial effects:
the die bond cup sets up in the position of the right skew of central line, and when the negative pole support pin of support main part and anodal support pin intercommunication power, the LED chip in the die bond cup lights up light, and light irradiation angle can take place the skew when the light source passes through outer colloid for the observer can observe the light source that the place ahead shines out rapidly.
According to some embodiments of the utility model, the cross section of the die bonding cup is round, the cup opening is larger than the cup bottom, and the depth of the die bonding cup is 0.45mm.
According to some embodiments of the utility model, the negative electrode support pin and the positive electrode support pin are provided with a plurality of buckles.
According to some embodiments of the utility model, the surface of the negative electrode support pin and the surface of the positive electrode support pin are electroplated with silver.
According to some embodiments of the utility model, the outer sealing colloid is made of epoxy resin and comprises a sealing part and a lens part, wherein the sealing part wraps and fixes the upper half part of the anode support pin and the upper half part of the cathode support pin, so that the cathode support pin and the anode support pin are relatively fixed, and the lens part is arranged at one end of the sealing part and is positioned at one side of the luminous direction of the LED chip.
According to some embodiments of the utility model, the lens portion is elliptical.
According to some embodiments of the utility model, the portions of the positive electrode holder pins and the negative electrode holder pins located outside the sealing portion are fixed by fixing rods.
According to some embodiments of the utility model, the positive and negative support pins are soldered to the circuit board at their bottoms, and a waterproof cover is provided on the circuit board and covers the exterior of the sealing portion.
According to some embodiments of the utility model, the LED chip is fixed on the bottom surface of the die bonding cup through silver colloid.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
Fig. 1 is a front view of an in-line LED package structure of an embodiment of the present utility model, without packaging;
FIG. 2 is a front view of an in-line LED package structure according to an embodiment of the present utility model;
FIG. 3 is a top view of an in-line LED package structure according to an embodiment of the present utility model;
FIG. 4 is a light illumination angle diagram of a conventional in-line LED package structure;
FIG. 5 is a light illumination angle diagram of an in-line LED package structure according to an embodiment of the present utility model;
fig. 6 is a diagram showing the installation completion and use of the in-line LED package structure according to the embodiment of the present utility model.
Reference numerals: the LED chip comprises a bracket main body 1, an LED chip 2, gold wires 3, an outer sealing colloid 4, a negative electrode bracket pin 5, a positive electrode bracket pin 6, a die bonding cup 7, a buckle 8, a sealing part 9, a lens part 10, a fixing rod 11, a circuit board 12 and a waterproof cover 13.
Detailed Description
The technical scheme protected by the utility model is specifically described below with reference to the accompanying drawings.
Referring to fig. 1, 2, 5 and 6, the direct-insert type LED package structure according to the embodiment of the present utility model includes a support body 1, an LED chip 2, a gold wire 3 and an external sealing body 4, where the support body 1 includes a negative electrode support pin 5 and a positive electrode support pin 6, a die bonding cup 7 is embedded in the positive electrode support pin 6, the die bonding cup 7 is located at one side of the center line of the support body 1, the LED chip 2 is fixed at the bottom of the die bonding cup 7 by a silver adhesive, the negative electrode and the negative electrode support pin 5 are connected by the gold wire 3 in a bonding manner, the external sealing body 4 is coated outside the support body 1, after the support body 1 is connected with a power source, the LED chip 2 emits a light source outwards through the external sealing body 4 after being turned on.
The direct-insert type LED packaging structure provided by the embodiment of the utility model has at least the following beneficial effects: the circuit is constituteed between negative pole support pin 5, anodal support pin 6, gold thread 3 and the LED chip 2, when the negative pole support pin 5 of support main part 1 and anodal support pin 6 intercommunication power, LED chip 2 in the solid brilliant cup 7 lights the light and throws light on, and the position of solid brilliant cup 7 is located one side of support main part 1 central line, its luminous light type is as shown in fig. 5, c is X axle luminous curve in fig. 5, d is Y axle luminous curve, the light source that shines when the light source passes through outer colloid 4 down skew 7, make the observer outside 50 meters can observe the light source that the place ahead shines fast.
Referring to fig. 1 and 2, in some embodiments of the present utility model, the cross section of the die bonding cup 7 is circular, the cup opening is larger than the cup bottom, the depth of the die bonding cup 7 is 0.45mm, and the inclined surface of the cup wall has a light reflection and condensation effect, so that the brightness and the light intensity of the light source can be improved.
Referring to fig. 1 and 2, in some embodiments of the present utility model, a plurality of buckles 8 are provided on the negative electrode support pins 5 and the positive electrode support pins 6, and the buckles 8 can effectively clamp the outer sealing body 4 when the outer sealing body 4 is encapsulated, so as to prevent the outer sealing body 4 from being separated from the negative electrode support pins 5 and the positive electrode support pins 6 under the condition of external force and high temperature.
The bracket main body 1 is formed by stamping iron for a plurality of times, and silver plating is performed on the surfaces of the anode bracket pin 5 and the cathode bracket pin 6 after forming, so that the corrosion prevention effect is achieved, and the service life is prolonged.
Referring to fig. 1, 2 and 3, in some embodiments of the present utility model, the outer encapsulant 4 is made of epoxy resin, and includes a sealing portion 9 and a lens portion 10, the sealing portion 9 encapsulates the upper half portions of the anode support leads 6 and the cathode support leads 5, and the LED chip 2 and the gold wire 3 together, so as to perform sealing and fixing functions, one end of the cathode support leads 5 and one end of the anode support leads 6 extend out of the sealing portion 9, and the lens portion 10 is disposed at one end of the sealing portion 9 and located at one side of the light emitting direction of the LED chip 2, so as to perform light gathering and refraction functions, thereby irradiating the light source with a better offset.
Referring to fig. 2, 3 and 5, in some embodiments of the present utility model, the lens portion 10 on the encapsulant 4 is elliptical, and after the light emitted by the LED chip 2 passes through the lens portion 10, the irradiation angle is shifted, so that the observation is facilitated.
Referring to fig. 1 and 2, in some embodiments of the present utility model, the parts of the positive electrode support pins 6 and the negative electrode support pins 5 located outside the sealing part 9 are fixed by fixing bars 11, so that the positive electrode support pins 6 and the negative electrode support pins 5 can be prevented from being deviated during the packaging process, and the redundant parts of the fixing bars 11 can be directly cut off after the encapsulation of the outer encapsulant 4 is completed.
Referring to fig. 2 and 6, in some embodiments of the present utility model, bottoms of the positive electrode support pins 6 and the negative electrode support pins 5 are soldered to the circuit board 12, and the waterproof cover 13 is disposed on the circuit board 12 and covers the outside of the sealing portion 9, so as to play a role of waterproof sealing, and the entire light source can be installed in a traffic light or a traffic warning sign, so that it is convenient for a viewer out of 50 meters to look and observe.
The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model. Furthermore, embodiments of the utility model and features of the embodiments may be combined with each other without conflict.
Claims (9)
1. The direct-insert type LED packaging structure is characterized by comprising a bracket main body, an LED chip, gold wires and an outer sealing colloid;
the LED lamp comprises a bracket body and is characterized in that the bracket body comprises a negative electrode bracket pin and a positive electrode bracket pin, the negative electrode bracket pin and the positive electrode bracket pin are oppositely arranged, a die bonding cup is arranged at the top end of the positive electrode bracket pin, the die bonding cup is embedded into the positive electrode bracket pin, an LED chip is arranged in the die bonding cup, the die bonding cup is positioned at one side of the center line of the bracket body, so that light rays emitted by the LED chip are transmitted outwards in a preset direction, the negative electrode of the LED chip is connected with the negative electrode bracket pin through gold wire bonding, and the upper half part of the positive electrode bracket pin and the upper half part of the negative electrode bracket pin are wrapped and fixed, so that the negative electrode bracket pin and the positive electrode bracket pin are relatively fixed.
2. The direct-insert type LED packaging structure according to claim 1, wherein the cross section of the die bonding cup is circular, the cup opening of the die bonding cup is larger than the cup bottom, and the depth of the die bonding cup is 0.45mm.
3. The in-line LED package structure of claim 1, wherein a plurality of snaps are provided on the negative and positive support pins.
4. The in-line LED package structure of claim 1, wherein the negative and positive support leads have surface electroplated with silver.
5. The in-line LED package structure of claim 1, wherein the outer encapsulant is made of epoxy resin and comprises a sealing portion and a lens portion, wherein the sealing portion wraps and fixes the upper half of the anode support pin and the upper half of the cathode support pin, so that the cathode support pin and the anode support pin are relatively fixed, and the lens portion is disposed at one end of the sealing portion and is located at one side of the light emitting direction of the LED chip.
6. The in-line LED package structure of claim 5, wherein said lens portion is elliptical.
7. The in-line LED package structure of claim 5, wherein the portions of the positive and negative electrode holder pins outside the sealing portion are fixed by a fixing rod.
8. The in-line LED package structure of claim 5, further comprising a circuit board and a waterproof cover, wherein the anode support pin and the cathode support pin are bottom-welded on the circuit board, and the waterproof cover is disposed on the circuit board and covers the outside of the sealing portion.
9. The in-line LED package structure of claim 1, wherein the LED chip is fixed to the bottom surface of the die attach cup by a silver paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321815786.3U CN220420604U (en) | 2023-07-11 | 2023-07-11 | Direct-insert type LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321815786.3U CN220420604U (en) | 2023-07-11 | 2023-07-11 | Direct-insert type LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220420604U true CN220420604U (en) | 2024-01-30 |
Family
ID=89642971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321815786.3U Active CN220420604U (en) | 2023-07-11 | 2023-07-11 | Direct-insert type LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220420604U (en) |
-
2023
- 2023-07-11 CN CN202321815786.3U patent/CN220420604U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |