JP2008159705A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2008159705A
JP2008159705A JP2006344870A JP2006344870A JP2008159705A JP 2008159705 A JP2008159705 A JP 2008159705A JP 2006344870 A JP2006344870 A JP 2006344870A JP 2006344870 A JP2006344870 A JP 2006344870A JP 2008159705 A JP2008159705 A JP 2008159705A
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optical member
light
led chip
phosphor particles
mounting substrate
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Japanese (ja)
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Takao Hayashi
Naoko Takei
Kenichiro Tanaka
Keiichi Yamazaki
圭一 山崎
隆夫 林
健一郎 田中
尚子 竹井
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Matsushita Electric Works Ltd
松下電工株式会社
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Priority to JP2006344870A priority Critical patent/JP2008159705A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of suppressing temperature rise and color variation of phosphor particles.
SOLUTION: The light-emitting device is provided with an LED chip 10 for emitting a visible light (blue light); a mounting substrate 20 having the LED chip 10 mounted thereon; a dome-like optical member 40 disposed in a manner of surrounding the LED chip 10 between itself and the mounting substrate 20 on the mounting surface side of the LED chip 10 in the mounting substrate 20; a gel-like sealing section 50 filled in a space surrounded by the optical member 40 and the mounting substrate 20 so as to seal the LED chip 10. The optical member 40 is made of a molded body of a light-transmissive material, and the sealing section 50 is formed in such a way that a sealing resin containing the dispersed phosphor particles excited with a visible light emitted from the LED chip 10 to emit a visible light (yellow light) different from the color of the LED chip 10 is injected into the inside of the optical member 40, the optical member 40 is positioned for the mounting substrate 20 and the sealing resin is cured.
COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、LEDチップ(発光ダイオードチップ)を利用した発光装置に関するものである。 The present invention relates to a light emitting device utilizing a LED chip (light-emitting diode chip).

従来から、LEDチップとLEDチップから放射された光によって励起されてLEDチップとは異なる発光色の光を放射する蛍光体とを組み合わせ所望の混色光(例えば、白色光)を得るようにした発光装置の研究開発が各所で行われている(例えば、特許文献1参照)。 Conventionally, light emission to obtain a desired mixed color light combining the phosphors that emit light of different emission colors (e.g., white light) and the LED chip and the LED chip is excited by the light emitted from the LED chip research and development of the apparatus is performed in various places (for example, see Patent Document 1).

ここにおいて、上記特許文献1には、図6に示すように、LEDチップ10'と、LEDチップ10'が実装された平板状の実装基板20'と、実装基板20'におけるLEDチップ10'の実装面側でLEDチップ10'および当該LEDチップ10'に電気的に接続されたボンディングワイヤ14'を封止した封止部50'と、封止部50'の表面に積層された透光性樹脂層160'とを備え、封止部50'が波長変換材(蛍光体粒子)を混入したモールド樹脂(封止樹脂)により形成されてなる発光装置1'が記載されている。 Here, in the Patent Document 1, as shown in FIG. 6, 'and, LED chip 10' LED chip 10 is a flat plate mounted in mounting 'the mounting board 20' substrate 20 of the LED chip 10 'in the LED chip 10 'and the LED chip 10' 'sealed portion 50 that seals' bonding wires 14 electrically connected to at mounting surface side, the surface is laminated a transparent sealing portion 50' 'and a sealing portion 50' resin layer 160 discloses a light-emitting device 1 'of formed by wavelength conversion material (phosphor particles) entrained mold resin (sealing resin).
特開2004−87812号公報 JP 2004-87812 JP

ところで、図6に示した構成の発光装置1'では、LEDチップ10'から放射された光によって励起されてLEDチップ10'とは異なる色の可視光を放射する蛍光体粒子を封止部50'に混入させてあるので、蛍光体粒子で発生した熱が実装基板20'を通して放熱されやすくなって蛍光体粒子の温度上昇を抑制でき、また、封止部50'を半球状の形状としてあるので、指向性を広くすることができる。 Incidentally, 'in, LED chip 10' light emitting device 1 of the configuration shown in FIG. 6 the sealing portion 50 of the phosphor particles emit visible light of a color different from the excited by the light emitted from the LED chip 10 ' 'because are then mixed in, the heat generated by the phosphor particles mounting substrate 20' is easily dissipated through can suppress the temperature rise of the phosphor particles, and there a seal 50 'as the shape of a hemispherical since, it is possible to widen the directivity.

しかしながら、上述の発光装置1'の製造にあたっては、LEDチップ10'を実装基板20'に実装するとともに、実装基板20'におけるLEDチップ10'の実装面側に封止部50'の形状に応じてパターン設計した第1撥油性皮膜125'および透光性樹脂層160'の形状に応じてパターン設計した第2撥油性皮膜126'をスクリーン印刷法などにより形成し、その後、蛍光体粒子を混入した封止樹脂を実装基板20'の上記実装面側へポッティングして硬化させることにより半球状の封止部50'を形成し、続いて、封止部50'の表面に透光性樹脂を塗布して硬化させることにより透光性樹脂層160'を形成しているので、封止部50'の形状がばらつきやすく、色むらが起こりやすかった。 However, 'In the manufacture of, LED chip 10' above light-emitting device 1 'as well as mounted on mounting board 20' of the mounting board 20 according to the shape of the 'sealing portion 50 on the mounting surface side of the' LED chip 10 in the second oil repellent film 126 'which is pattern design in accordance with the shape of the first oil repellent film 125' and the transparent resin layer 160 'obtained by pattern design Te is formed by a screen printing method, then mixed phosphor particles and a sealing resin mounting substrate 20 to form a 'potted to said mounting surface of hemispherical sealing portion 50 by curing' was followed by a translucent resin on the surface of the sealing portion 50 ' 'since forming the sealing portion 50' translucent resin layer 160 by curing the coating to the easy variation shape, color unevenness was easy to occur.

本発明は上記事由に鑑みて為されたものであり、その目的は、蛍光体粒子の温度上昇を抑制でき且つ色むらを抑制できる発光装置を提供することにある。 The present invention has been made in view of the above circumstances, an object thereof is to provide a light emitting device capable of suppressing and color unevenness can suppress an increase in the temperature of the phosphor particles.

請求項1の発明は、可視光を放射するLEDチップと、当該LEDチップが実装された実装基板と、実装基板におけるLEDチップの実装面側において実装基板との間にLEDチップを囲む形で配設されたドーム状の光学部材と、光学部材と実装基板とで囲まれた空間に充実されLEDチップを封止した封止部とを備え、光学部材は、透光性材料の成形品からなり、封止部は、LEDチップから放射される可視光によって励起されてLEDチップとは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂を光学部材の内側に注入してから光学部材を実装基板に対して位置決めした後に当該封止樹脂を硬化させることにより形成されてなることを特徴とする。 The invention according to claim 1, distribution in the form of surrounding the LED chips between the LED chip to emit visible light, a mounting substrate to which the LED chip is mounted, a mounting substrate on the mounting surface side of the LED chip on the mounting substrate comprising a set dome-shaped optical member, and a sealed sealing portion of the LED chip is enriched in a space surrounded by the optical member and the mounting substrate, the optical member is made of a molded article of translucent material , sealing portion, the optical sealing resin containing dispersed phosphor particles are excited by visible light emitted from the LED chip to emit visible light of different color from the LED chip from the injection to the inside of the optical member characterized by comprising been formed by curing the sealing resin after positioning the member to the mounting board.

この発明によれば、光学部材が、透光性材料の成形品からなり、封止部が、LEDチップから放射される可視光によって励起されてLEDチップとは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂を光学部材の内側に注入してから光学部材を実装基板に対して位置決めした後に当該封止樹脂を硬化させることにより形成されているので、蛍光体粒子で発生した熱を実装基板側へ放熱させることができて蛍光体粒子の温度上昇を抑制できるとともに、封止部の形状が光学部材の形状により規定されるから、封止部の形状ばらつきが起こりにくくなり、色むらを抑制できる。 According to the present invention, the fluorescence optical member made of a molded article of light-transmissive material, sealing portion, emits visible light of different colors from the LED chip and excited by the LED chip by the visible light emitted because it is formed by curing the sealing resin after positioning the optical member to the mounting board sealing resin dispersed body particles from injected inside the optical member is generated by the phosphor particles to be able to dissipate heat to the mounting substrate side it is possible to suppress the temperature rise of the phosphor particles, because the shape of the sealing portion is defined by the shape of the optical member, hardly occur variations in shape of the sealing portion, color unevenness can be suppressed.

請求項2の発明は、請求項1の発明において、前記光学部材の光出射面との間に空気層が形成される形で配設された色度調整用部材を備え、色度調整用部材は、前記封止部の蛍光体粒子である第1の蛍光体粒子と同一色の可視光を放射する第2の蛍光体粒子を分散した透光性材料の成形品からなることを特徴とする。 According to a second aspect of the invention, in the invention of claim 1, comprising a chromaticity adjusting member disposed in the form of an air layer is formed between the light exit surface of the optical member, the chromaticity adjusting member is characterized by comprising a molded article of light-transmissive material dispersed the second phosphor particles emitting a first fluorescent material particle the same color as the visible light is a phosphor particle of the sealing portion .

この発明によれば、前記光学部材の出射面から出射した混色光が色度調整用部材で色度調整されて出射されることとなるので、製造時に、あらかじめ第2の蛍光体粒子の濃度の異なる複数種の色度調整用部材を用意しておき、前記光学部材から出射される混色光の色度と目標とする混色光との色度のずれに応じて適宜濃度の色度調整用部材を採用することにより、発光装置ごとの色度のばらつきを低減できる。 According to the present invention, the so mixed-color light emitted from the exit surface of the optical member is to be emitted are chromaticity adjustment by the member for chromaticity adjustment, at the time of manufacture, in advance the concentration of the second phosphor particles are prepared a plurality of different kinds of chromaticity adjusting member, the chromaticity adjusting member suitable concentration depending on the deviation of the chromaticity of the mixed color light to be the mixed color light chromaticity and a target emitted from the optical member by adopting, you can reduce the variation in the chromaticity of each light emitting device.

請求項3の発明は、請求項1の発明において、前記光学部材は、前記透光性材料としてLEDチップよりも長波長かつ前記封止部の蛍光体粒子である第1の蛍光体粒子よりも短波長の可視光を放射する第2の蛍光体粒子を分散した透光性材料を用いてなることを特徴とする。 The invention according to claim 3, characterized in that in the invention of claim 1, wherein the optical member, than said LED chip as the light-transmitting material than the first phosphor particles are phosphor particles in a long wavelength and the sealing portion and characterized by using a light-transmitting material dispersed the second phosphor particles emit visible light of short wavelength.

この発明によれば、LEDチップと1種類の蛍光体粒子との組み合わせにより所望の混色光を得る場合に比べて、演色性の高い混色光を得ることが可能となり、しかも、発光色の異なる第1の蛍光体粒子および第2の蛍光体粒子のうち発光ピーク波長が低波長側にある第2の蛍光体粒子から放射された可視光が、発光ピーク波長が長波長側にある第1の蛍光体粒子に二次吸収されるのを抑制することが可能となる。 According to the present invention, as compared with the case where the combination of the LED chip and one of the phosphor particles to obtain the desired mixed color light, it is possible to obtain a high color mixing light color rendering properties, moreover, different from the first emission colors first fluorescence emission peak wavelength visible light emitted from the second phosphor particles in the low wavelength side, the emission peak wavelength in the long wavelength side of the first phosphor particles and the second phosphor particles it is possible to suppress from being secondary absorbent body particles.

請求項4の発明は、請求項1の発明において、前記光学部材である第1の光学部材を囲む形で配設されたドーム状の第2の光学部材と、前記LEDチップよりも長波長かつ前記封止部の蛍光体粒子である第1の蛍光体粒子よりも短波長の可視光を放射する第2の蛍光体粒子を分散した封止樹脂により形成され第1の光学部材と第2の光学部材との間の空間に充実された色変換部とを備え、色変換部は、第2の蛍光体粒子を分散した封止樹脂を第2の光学部材の内側に注入してから第2の光学部材を第1の光学部材および実装基板に対し位置決めした後に当該封止樹脂を硬化させることにより形成されてなることを特徴とする。 The invention of claim 4 is the invention of claim 1, wherein the second optical member domed arranged in a manner surrounding the first optical member is an optical member, a long wavelength and than the LED chip wherein the sealing portion phosphor first is a particle phosphor having a shorter wavelength than the particle second emitting visible light phosphor particles first formed by sealing resin dispersed optical member and the second and a color conversion unit which is enriched in the space between the optical member, the color conversion unit, second after injecting a sealing resin containing dispersed second phosphor particles inside the second optical member It is an optical member formed by curing the sealing resin after the positioning with respect to the first optical member and the mounting substrate, characterized by comprising.

この発明によれば、LEDチップと1種類の蛍光体粒子との組み合わせにより所望の混色光を得る場合に比べて、演色性の高い混色光を得ることが可能となり、しかも、発光色の異なる第1の蛍光体粒子および第2の蛍光体粒子のうち発光ピーク波長が低波長側にある第2の蛍光体粒子から放射された可視光が、発光ピーク波長が長波長側にある第1の蛍光体粒子に二次吸収されるのを抑制することが可能となる。 According to the present invention, as compared with the case where the combination of the LED chip and one of the phosphor particles to obtain the desired mixed color light, it is possible to obtain a high color mixing light color rendering properties, moreover, different from the first emission colors first fluorescence emission peak wavelength visible light emitted from the second phosphor particles in the low wavelength side, the emission peak wavelength in the long wavelength side of the first phosphor particles and the second phosphor particles it is possible to suppress from being secondary absorbent body particles.

請求項5の発明は、請求項1の発明において、前記光学部材である第1の光学部材の光出射面との間に空気層が形成される形で配設されたドーム状の第2の光学部材を備え、第2の光学部材は、前記LEDチップよりも長波長かつ前記封止部の蛍光体粒子である第1の蛍光体粒子よりも短波長の可視光を放射する第2の蛍光体粒子を分散した透光性材料の成形品からなることを特徴とする。 The invention of claim 5 is the invention of claim 1, wherein the optical member first optical member light emitting surface and form an air layer is formed disposed dome shaped second during a comprising an optical member, second optical member, the second fluorescent emitting visible light having a shorter wavelength than the first phosphor particles than the LED chip is a phosphor particle having a long wavelength and the sealing portion characterized by comprising a body particles from the molded article of the dispersed light-transmitting material.

この発明によれば、LEDチップと1種類の蛍光体粒子との組み合わせにより所望の混色光を得る場合に比べて、演色性の高い混色光を得ることが可能となり、しかも、発光色の異なる第1の蛍光体粒子および第2の蛍光体粒子のうち発光ピーク波長が低波長側にある第2の蛍光体粒子から放射された可視光が、発光ピーク波長が長波長側にある第1の蛍光体粒子に二次吸収されるのを抑制することが可能となる。 According to the present invention, as compared with the case where the combination of the LED chip and one of the phosphor particles to obtain the desired mixed color light, it is possible to obtain a high color mixing light color rendering properties, moreover, different from the first emission colors first fluorescence emission peak wavelength visible light emitted from the second phosphor particles in the low wavelength side, the emission peak wavelength in the long wavelength side of the first phosphor particles and the second phosphor particles it is possible to suppress from being secondary absorbent body particles.

請求項1の発明では、蛍光体粒子の温度上昇を抑制でき且つ色むらを抑制できるという効果がある。 In the invention of claim 1, there is an effect that a and color unevenness can suppress an increase in the temperature of the phosphor particles can be suppressed.

(実施形態1) (Embodiment 1)
本実施形態の発光装置1は、図1に示すように、可視光を放射するLEDチップ10と、当該LEDチップ10が実装された実装基板20と、実装基板20におけるLEDチップ10の実装面側において実装基板20との間にLEDチップ10を囲む形で配設されたドーム状の光学部材40と、光学部材40と実装基板20とで囲まれた空間に充実されLEDチップを封止したゲル状の封止部50とを備え、光学部材40が、透光性材料により形成され、封止部50が、LEDチップ10から放射される可視光によって励起されてLEDチップ10とは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂により形成されている。 The light emitting device 1 of this embodiment, as shown in FIG. 1, the LED chip 10 to emit visible light, and the LED chip 10 mounting substrate 20 is mounted, the mounting surface side of the LED chip 10 on the mounting board 20 an optical member 40 domed arranged in a manner surrounding the LED chip 10 between the mounting board 20, sealing the LED chip is enriched in a space surrounded by the optical member 40 and the mounting substrate 20 gel in a Jo of the sealing portion 50, the optical member 40 is formed by a light-transmitting material, the sealing portion 50, a different color of the LED chip 10 is excited by visible light emitted from the LED chip 10 is formed by a sealing resin containing dispersed phosphor particles emit visible light.

本実施形態の発光装置1では、LEDチップ10として、青色光を放射するGaN系青色LEDチップを用い、封止部50における蛍光体粒子として、LEDチップ10から放射された青色光によって励起されてブロードな黄色系の光を放射する黄色蛍光体粒子を用いており、LEDチップ10へ通電することにより、LEDチップ10から放射され封止部50を透過した青色光と、封止部50の黄色蛍光体粒子から放射される黄色光との混色光からなる白色光を得ることができる。 In the light emitting device 1 of the present embodiment, as the LED chip 10, a GaN-based blue LED chip that emits blue light, as phosphor particles in the sealing portion 50 is excited by blue light emitted from the LED chip 10 uses a yellow phosphor particles which emit light of broad yellowish, by energizing the LED chip 10, and the blue light that has passed through the sealing portion 50 is emitted from the LED chip 10, the yellow of the sealing portion 50 it is possible to obtain white light composed of mixed light with yellow light emitted from the phosphor particles.

LEDチップ10は、厚み方向の一表面側(図1における下面側)にアノード電極(図示せず)が形成されるとともに、厚み方向の他表面側(図1における上面側)にカソード電極(図示せず)が形成されており、上記他表面側を光取り出し面11側としているが、側面からも青色光が放射される。 LED chip 10, with one surface in the thickness direction anode electrode (not shown) on the surface (lower surface side in FIG. 1) is formed, the other surface side in the thickness direction the cathode electrode (figure (top side in FIG. 1) Shimese not) is formed, although the other surface side is the light extraction surface 11 side, a blue light is radiated from the side surface. ここにおいて、アノード電極およびカソード電極は、下層側のNi膜と上層側のAu膜との積層膜により構成されている。 Here, the anode electrode and the cathode electrode is composed of a stacked film of a lower layer side of the Ni film and an upper side of the Au film.

実装基板20は、LEDチップ10が一表面側に搭載される矩形板状のサブマウント部材30と、熱伝導性材料により形成されサブマウント部材30が一面側の中央部に固着される矩形板状の伝熱板21と、伝熱板21の一面側(図1における上面側)に例えばポリオレフィン系の固着シート(図示せず)を介して固着される矩形板状のフレキシブルプリント配線板により形成され中央部にサブマウント部材30を露出させる矩形状の窓孔24を有する配線基板22とで構成されている。 Mounting substrate 20 includes a rectangular plate-shaped sub-mount member 30 of the LED chip 10 is mounted on the one surface side, a rectangular plate-like submount member 30 is formed by thermally conductive material is fixed to the central portion of one surface a heat transfer plate 21 of, formed by a rectangular plate-like flexible printed wiring board which is fixed through a fixing sheet one side polyolefin for example (upper side in FIG. 1) of the heat transfer plate 21 (not shown) It is composed of a wiring board 22 having a rectangular window hole 24 to expose the sub-mount member 30 in the central portion. したがって、LEDチップ10で発生した熱が配線基板22を介さずにサブマウント部材30および伝熱板21に伝熱されるようになっている。 Therefore, so as to heat is transferred to the sub-mount member 30 and the heat transfer plate 21 to the heat generated in the LED chip 10 without passing through the wiring board 22. なお、実装基板20は、全体として平板状の形状に形成されている。 Incidentally, the mounting board 20 is formed in a plate-like shape as a whole.

上述の伝熱板21は、Cuからなる金属板21aを基礎とし、当該金属板21aの厚み方向の両面にAu膜からなるコーティング膜21bが形成されている。 Heat transfer plate 21 described above, the basis of the metal plate 21a made of Cu, coating film 21b made of Au film on both surfaces in the thickness direction of the metal plate 21a is formed.

一方、配線基板22は、ポリイミドフィルムからなる絶縁性基材22aの一表面側に、LEDチップ10への給電用の一対の配線パターン23,23が設けられるとともに、各配線パターン23,23および絶縁性基材22aにおいて配線パターン23,23が形成されていない部位を覆う白色系の樹脂からなるレジスト層26が積層されている。 On the other hand, the wiring board 22, on one surface side of the insulating substrate 22a made of a polyimide film, a pair of wiring patterns 23 for supplying power to the LED chip 10 is provided, 23, 23 and insulating the wiring patterns resist layer 26 made of white resin that covers a portion where the wiring pattern 23 is not formed are laminated in sexual substrate 22a. ここにおいて、LEDチップ10は、上記カソード電極がボンディングワイヤ14を介して一方の配線パターン23と電気的に接続され、上記アノード電極がサブマウント部材30の電極パターン31およびボンディングワイヤ14を介して他方の配線パターン23と電気的に接続されている。 Here, LED chip 10, the cathode electrode is electrically connected to one wiring pattern 23 through the bonding wire 14, the anode electrode via the electrode pattern 31 and the bonding wires 14 of the sub-mount member 30 other It is electrically connected to the wiring pattern 23. なお、各配線パターン23,23は、絶縁性基材22aの外周形状の半分よりもやや小さな外周形状に形成されている。 Incidentally, the wiring patterns 23, 23 are formed slightly smaller peripheral shape than a half of the outer peripheral shape of the insulating substrate 22a. また、絶縁性基材22aの材料としては、FR4、FR5、紙フェノールなどを採用してもよい。 Further, as the material of the insulating substrate 22a, FR4, FR5, may be employed, such as paper phenol.

レジスト層26は、配線基板22の窓孔24の近傍において各配線パターン23,23の2箇所が露出し、配線基板22の周部において各配線パターン23,23の1箇所が露出するようにパターニングされており、各配線パターン23,23は、配線基板22の窓孔24近傍において露出した部位が、ボンディングワイヤ14が接続される端子部23aを構成し、配線基板22の周部において露出した円形状の部位が外部接続用の電極部23bを構成している。 Resist layer 26 is patterned as two points of each wiring pattern 23 in the vicinity of the window hole 24 of the wiring board 22 are exposed, one portion of the wiring pattern 23 in the circumferential portion of the wiring board 22 is exposed circles are, the wiring patterns 23 and 23, an exposed portion in the window hole 24 near the wiring substrate 22, which constitutes the terminal portion 23a of the bonding wire 14 is connected, is exposed at the periphery of the wiring board 22 site shapes constitute the electrode portion 23b for external connection. なお、配線基板22の配線パターン23,23は、Cu膜とNi膜とAu膜との積層膜により構成され、最上層がAu膜となっている。 The wiring patterns 23 of the wiring board 22 is formed by a laminated film of a Cu film and the Ni film and Au film, and the top layer is a Au film.

また、サブマウント部材30は、熱伝導率が比較的高く且つ電気絶縁性を有するAlNにより形成されており、平面サイズをLEDチップ10のチップサイズよりも大きく設定してあり、伝熱板21とLEDチップ10との線膨張率差に起因してLEDチップ10に働く応力を緩和する応力緩和機能と、LEDチップ10で発生した熱を伝熱板21においてLEDチップ10のチップサイズよりも広い範囲に伝熱させる熱伝導機能とを有している。 The sub-mount member 30 has a thermal conductivity is formed by a relatively high and AlN having an electrical insulating property and have set larger than the chip size of the LED chip 10 to the planar size, the heat transfer plate 21 and the stress relaxation function of relaxing the stress acting on the LED chip 10 due to the difference in linear expansion coefficient between the LED chip 10 is wider than the chip size of the LED chip 10 in the heat transfer plates 21 generated by the LED chip 10 ranges and a heat conducting function of transferring heat to. したがって、本実施形態の発光装置1では、LEDチップ10と伝熱板21との線膨張率差に起因してLEDチップ10に働く応力を緩和することができるとともに、LEDチップ10で発生した熱をサブマウント部材30および伝熱板21を介して効率良く放熱させることができる。 Thus, in light emitting device 1 of the present embodiment, the stress can be relaxed acting on the LED chip 10 due to the difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21, generated by the LED chip 10 heat the can be efficiently dissipated through the sub-mount member 30 and the heat transfer plate 21. なお、サブマウント部材30の材料はAlNに限らず、例えば、複合SiC、Siなどを採用してもよい。 The material of the sub-mount member 30 is not limited to AlN, for example, may be a composite SiC, Si, etc. is adopted.

また、サブマウント部材30の一表面側には、LEDチップ10におけるサブマウント部材30側の電極である上記アノード電極と接合される上述の電極パターン31が形成され、当該電極パターン31の周囲にLEDチップ10の側面から放射された光を反射する反射膜32が形成されている。 The sub-mount on the one surface side of the member 30, the electrode pattern 31 described above which is bonded to the anode electrode is an electrode of the submount member 30 side in the LED chip 10 is formed, LED around the electrode patterns 31 reflective film 32 for reflecting light emitted from the side surface of the chip 10 is formed. したがって、LEDチップ10の側面から放射された可視光がサブマウント部材30に吸収されるのを防止することができ、外部への光取出し効率をさらに高めることが可能となる。 Therefore, visible light radiated from the side surface of the LED chip 10 can be prevented from being absorbed into the sub-mount member 30, it is possible to further increase the light extraction efficiency to the outside. ここにおいて、電極パターン31は、Auを主成分とするAuとSnとの合金(例えば、80Au−20Sn、70Au−30Snなど)により形成されている。 Here, the electrode pattern 31, an alloy of Au and Sn mainly composed of Au (e.g., 80Au-20Sn, such as 70 AU-30Sn) is formed by. また、反射膜32は、Alにより形成されているが、Alに限らず、Ag,Ni,Auなどにより形成してもよい。 The reflection film 32 has been formed by Al, not limited to Al, Ag, Ni, or may be formed by a Au.

また、本実施形態の発光装置1では、サブマウント部材30の厚み寸法を、当該サブマウント部材30の表面が配線基板22のレジスト層26の表面よりも伝熱板21から離れるように設定してあり、LEDチップ10から側方に放射された光が配線基板22の窓孔24の内周面を通して配線基板22に吸収されるのを防止することができる。 Further, the light emitting device 1 of the present embodiment, the thickness of the submount member 30, the surface of the sub-mount member 30 is set away from the resist layer heat transfer plate 21 than the surface 26 of the wiring board 22 There, it is possible to prevent the LED chip 10 of the light emitted laterally is absorbed into the wiring board 22 through the inner peripheral surface of the window hole 24 of the wiring board 22.

上述の封止部50の材料である封止樹脂としては、黄色蛍光体粒子を分散させたシリコーン樹脂を用いているが、黄色蛍光体粒子を分散させたエポキシ樹脂などを用いてもよい。 The sealing resin which is the material of the sealing portion 50 described above, but using a silicone resin containing a dispersed yellow phosphor particles, or the like may be used epoxy resin containing a dispersed yellow phosphor particles.

光学部材40は、透光性材料(例えば、シリコーン樹脂など)の成形品であってドーム状に形成されている。 The optical member 40, light-transmissive material (e.g., silicone resin, etc.) a molded article is formed in a dome shape. ここで、本実施形態では、光学部材40をシリコーン樹脂により形成してあるので、光学部材40と封止部50との屈折率差および線膨張率差を小さくすることができる。 In the present embodiment, the optical member 40 so is formed by silicone resin, it is possible to reduce the refractive index difference and the difference in linear expansion coefficient between the optical member 40 and the sealing portion 50. なお、光学部材40の材料として用いる透光性材料は、シリコーン樹脂に限らず、例えば、アクリル樹脂、エポキシ樹脂、ガラス、有機成分と無機成分とがnmレベルもしくは分子レベルで混合、結合した有機・無機ハイブリッド材料などを採用してもよい。 Note that translucent material used as the material of the optical member 40 is not limited to a silicone resin, such as acrylic resin, epoxy resin, glass, mixing the organic and inorganic components in nm level or molecular level, organic-bound such as inorganic hybrid material may be employed. また、光学部材40は、肉厚が一様となるように形成されている。 The optical member 40, the thickness is formed so as to be uniform. また、光学部材40は、実装基板20側の端縁(開口部の周縁)を実装基板20に対して、例えば接着剤(例えば、シリコーン樹脂、エポキシ樹脂など)を用いて固着すればよい。 The optical member 40, the edge of the mounting substrate 20 side (periphery of the opening) to the mounting substrate 20, for example, an adhesive (e.g., silicone resin, epoxy resin) may be secured using.

ところで、本実施形態の発光装置1の製造にあたっては、例えば、LEDチップ10を実装基板20に実装した後、LEDチップ10を封止部50の一部となる液状の第1の封止樹脂(本実施形態では、黄色蛍光体粒子を分散させたシリコーン樹脂)により覆ってから硬化させ、その後、ドーム状の光学部材40の内側に上述の封止部50の残りの部分の基礎となる液状の第2の封止樹脂(本実施形態では、黄色蛍光体粒子を分散させたシリコーン樹脂)を注入してから、光学部材40を実装基板20に対して位置決めして第2の封止樹脂を硬化させることによりゲル状の封止部50を形成するのと同時に光学部材40を実装基板20に固着する製造方法を採用すればよく、このような製造方法を採用することで封止部50にボイドが発生す Incidentally, when manufacturing the light emitting device 1 of the present embodiment, for example, after mounting the LED chip 10 to the mounting substrate 20, LED chips 10 of the first liquid sealing resin which becomes a part of the sealing portion 50 ( in this embodiment, cured from covering a silicone resin) obtained by dispersing the yellow phosphor particles, then the liquid underlying the remaining portion of the sealing portion 50 of the above-mentioned inside of the dome-shaped optical members 40 (in the present embodiment, the silicone resin containing a dispersed yellow phosphor particles) second sealing resin cured after injection of the second sealing resin to position the optical member 40 to the mounting board 20 production method to fix the optical member 40 at the same time as forming a gel-like sealing portion 50 to the mounting substrate 20 by well be adopted, voids in the sealing portion 50 by adopting such a production method be but occurrence のを抑制することが可能となる。 It is possible to prevent the.

以上説明した本実施形態の発光装置1では、光学部材40が、透光性材料の成形品からなり、封止部50が、LEDチップ10から放射される可視光によって励起されてLEDチップ10とは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂を光学部材40の内側に注入してから光学部材40を実装基板20に対して位置決めした後に当該封止樹脂を硬化させることにより形成されているので、蛍光体粒子で発生した熱を実装基板20側へ放熱させることができて蛍光体粒子の温度上昇を抑制できるとともに、封止部50の形状が光学部材40の形状により規定されるから、封止部50の形状ばらつきが起こりにくくなり、色むらを抑制できる。 In the light emitting device 1 of the present embodiment described above, the optical member 40 is made of a molded article of light-transmissive material, the sealing portion 50, the LED chip 10 is excited by visible light emitted from the LED chip 10 it cures the sealing resin after positioning for different colors phosphors optical member 40 to the mounting substrate 20 dispersed encapsulating resin particles from injected inside the optical member 40 to emit visible light of because it is formed by, it is possible to suppress the temperature rise of the phosphor particles can be dissipate heat generated by the phosphor particles to the mounting substrate 20 side, the shape of the sealing portion 50 is the shape of the optical member 40 since defined, hardly occur variations in shape of the sealing portion 50, the color unevenness can be suppressed. なお、本実施形態の発光装置1では、実装基板20に光学部材40を位置決めする位置決め用の凹部や凸部などを設けて光学部材40の位置精度を高めることで、色度のばらつきや色むらをさらに抑制することができる。 In the light emitting device 1 of the present embodiment, by increasing the positional accuracy of the optical member 40 provided with such recesses or protrusions for positioning for positioning the optical member 40 on the mounting substrate 20, the chromaticity variations and color unevenness it can be further suppressed.

(実施形態2) (Embodiment 2)
本実施形態の発光装置1の基本構成は実施形態1と略同じであって、図2に示すように、光学部材40の光出射面との間に空気層70が形成される形で配設された色度調整用部材60を備え、色度調整用部材60が、封止部50の蛍光体粒子である第1の蛍光体粒子と同一色の可視光を放射する第2の蛍光体粒子を分散した透光性材料の成形品により構成されている点が相違する。 The basic configuration of the light emitting device 1 of the present embodiment is substantially the same as that in Embodiment 1, as shown in FIG. 2, arranged in the form of an air layer 70 is formed between the light exit surface of the optical member 40 It includes a chromaticity adjusting member 60 that is, the chromaticity adjusting member 60, the second phosphor particles emitting a first fluorescent material particle the same color as the visible light is a phosphor particle of the sealing portion 50 that is composed of a molded article of the dispersed light-transmitting material is different. なお、実施形態1と同様の構成要素には同一の符号を付して説明を省略する。 Incidentally, the same components as in Embodiment 1 will not be described are denoted by the same reference numerals.

本実施形態の発光装置1では、実施形態1と同様に、LEDチップ10として、青色光を放射するGaN系青色LEDチップを用い、封止部50における第1の蛍光体粒子として、黄色蛍光体粒子を用いているので、色度調整用部材60における第2の蛍光体粒子として、黄色蛍光体粒子を用いている。 In the light emitting device 1 of the present embodiment, similarly to Embodiment 1, as the LED chip 10, a GaN-based blue LED chip that emits blue light as the first phosphor particles in the sealing unit 50, the yellow phosphor because of the use of particles, as the second phosphor particles in the chromaticity adjusting member 60 is used a yellow phosphor particles. なお、第1の蛍光体粒子と第2の蛍光体粒子とは同一材料の黄色蛍光体粒子でもよいし、異種材料の黄色蛍光体粒子でもよい。 Note that the first fluorescent material particle and the second fluorescent material particle may be a yellow phosphor particles of the same material or may be yellow phosphor particles of different materials.

しかして、本実施形態の発光装置1では、光学部材40の出射面から出射した混色光が色度調整用部材60で色度調整されて出射されることとなるので、製造時に、あらかじめ第2の蛍光体粒子の濃度の異なる複数種の色度調整用部材60を用意しておき、光学部材40から出射される混色光の色度と目標とする混色光との色度のずれに応じて適宜濃度の色度調整用部材60を採用することにより、発光装置1ごとの色度のばらつきを低減できる。 Thus, in light emitting device 1 of the present embodiment, since the the mixed light emitted from the exit surface of the optical member 40 is emitted are chromaticity adjustment chromaticity adjusting member 60, at the time of manufacture, in advance second of the phosphor more of chromaticity adjusting member 60 concentrations of different particles are prepared in advance, depending on the chromaticity shift between mixed color light to chromaticity and a target mixed color light emitted from the optical member 40 by employing the chromaticity adjusting member 60 appropriate concentration, it can reduce the variation of chromaticity of each light emitting device 1. なお、本実施形態の発光装置1では、色度調整用部材60における黄色蛍光体粒子の濃度が封止部50における黄色蛍光体粒子の濃度に比べて低濃度なので、比較例として封止部50に黄色蛍光体粒子を分散させずに色度調整用部材60のみに黄色蛍光体粒子を分散させてなる発光装置に比べて、黄色蛍光体粒子の温度上昇を抑制することができる。 In the light emitting device 1 of the present embodiment, since the concentration of the yellow phosphor particles in the chromaticity adjusting member 60 low concentration compared to the concentration of the yellow phosphor particles in the sealing portion 50, the sealing portion 50 as a comparative example compared to the yellow phosphor particles formed by dispersing the yellow phosphor particles only chromaticity adjusting member 60 without dispersing the light-emitting device, it is possible to suppress the temperature rise of the yellow phosphor particles.

(実施形態3) (Embodiment 3)
図3に示す本実施形態の発光装置1の基本構成は実施形態1と略同じであって、光学部材40の透光性材料として、LEDチップ10よりも長波長かつ封止部50の蛍光体粒子である第1の蛍光体粒子よりも短波長の可視光を放射する第2の蛍光体粒子を分散した透光性材料を用いている点などが相違する。 The basic configuration of the light emitting device 1 of this embodiment shown in FIG. 3 is a substantially same as that in Embodiment 1, as the translucent material of the optical member 40, a phosphor having a long wavelength and the sealing portion 50 than the LED chip 10 etc. are different that it uses a light-transmitting material dispersed the second phosphor particles emit visible light having a shorter wavelength than the first phosphor particles are particles. なお、実施形態1と同様の構成要素には同一の符号を付して説明を省略する。 Incidentally, the same components as in Embodiment 1 will not be described are denoted by the same reference numerals.

本実施形態の発光装置1では、LEDチップ10として、青色光を放射するGaN系青色LEDチップを用い、封止部50における第1の蛍光体粒子として、LEDチップ10から放射された青色光によって励起されて赤色光を放射する赤色蛍光体粒子を用い、光学部材40における第2の蛍光体粒子として、LEDチップ10から放射された青色光によって励起されて緑色光を放射する緑色蛍光体粒子を用いており、LEDチップ10から放射され封止部50および光学部材40を透過した青色光と、封止部50の赤色蛍光体粒子から放射され光学部材40を透過した赤色光と、光学部材40の緑色蛍光体粒子から放射された緑色光との混色光からなる白色光を得ることができる。 In the light emitting device 1 of the present embodiment, as the LED chip 10, a GaN-based blue LED chip that emits blue light as the first phosphor particles in the sealing unit 50, the blue light emitted from the LED chip 10 is excited using a red phosphor particles that emit red light, as the second phosphor particles in the optical member 40, the green phosphor particles are excited by blue light emitted from the LED chip 10 emits green light used and the blue light that has passed through the sealing portion 50 and the optical member 40 is emitted from the LED chip 10, the red light transmitted through the optical member 40 is emitted from the red phosphor particles of the sealing portion 50, the optical member 40 it can be from the green phosphor particles to obtain a white light composed of mixed color light of the green light emitted.

しかして、本実施形態の発光装置1では、実施形態1のようにLEDチップ10と1種類の蛍光体粒子との組み合わせにより所望の混色光である白色光を得る場合に比べて、演色性の高い白色光を得ることが可能となり、しかも、発光色の異なる赤色蛍光体粒子および緑色蛍光体粒子のうち発光ピーク波長が低波長側にある緑色蛍光体粒子から放射された緑色光が、発光ピーク波長が長波長側にある赤色蛍光体粒子に二次吸収されるのを抑制することが可能となる。 Thus, in light emitting device 1 of the present embodiment, as compared with the case of obtaining white light is desired mixed color light by the combination of the LED chip 10 as in the embodiment 1 with one of the phosphor particles, the color rendering properties it is possible to obtain a high white light, moreover, the green light emitting luminescent peak wavelength of the emission color different red phosphor particles and the green phosphor particles from the green phosphor particles in the low wavelength side, the emission peak it is possible to suppress the wavelength is secondarily absorbed by the red phosphor particles in the long wavelength side.

(実施形態4) (Embodiment 4)
本実施形態の発光装置1の基本構成は実施形態1と略同じであって、図4に示すように、封止部50に密着している光学部材40(以下、第1の光学部材40と称す)を囲む形で実装基板20の上記実装面側に配設されたドーム状の第2の光学部材80と、LEDチップ10よりも長波長かつ封止部50の蛍光体粒子である第1の蛍光体粒子よりも短波長の可視光を放射する第2の蛍光体粒子を分散した封止樹脂により形成され第1の光学部材40と第2の光学部材80との間の空間に充実された色変換部90とを備えている点が相違する。 The basic configuration of the light emitting device 1 of the present embodiment is substantially the same as that in Embodiment 1, as shown in FIG. 4, the optical member 40 (hereinafter, which is in close contact with the sealing portion 50, a first optical member 40 a second optical member 80 implemented in the substrate 20 of the mounting surface side is disposed in the dome shape surrounding the referred), a than the LED chip 10 is a phosphor particle having a long wavelength and the sealing portion 50 1 is a phosphor first optical member 40 is formed by sealing resin visible light with a short wavelength by dispersing the second phosphor particles that emit than the particle enriched in the space between the second optical member 80 points are different are provided and the color conversion unit 90. なお、実施形態1と同様の構成要素には同一の符号を付して説明を省略する。 Incidentally, the same components as in Embodiment 1 will not be described are denoted by the same reference numerals.

上述の第2の光学部材80は、第1の光学部材40と同様に、透光性材料(例えば、シリコーン樹脂など)の成形品であってドーム状に形成されている。 The second optical member 80 described above, like the first optical member 40, light-transmissive material (e.g., silicone resin, etc.) a molded article is formed in a dome shape. ここにおいて、第2の光学部材80は、第1の光学部材40との間の距離が一定となるようなドーム状で且つ肉厚が一様となるように形成されている。 Here, the second optical member 80, the wall thickness and a dome shape as the distance is constant between the first optical member 40 is formed so as to be uniform. なお、第2の光学部材80は、実装基板20側の端縁(開口部の周縁)を実装基板20に対して、例えば接着剤(例えば、シリコーン樹脂、エポキシ樹脂など)を用いて固着すればよい。 The second optical member 80 to the mounting substrate 20 to the edge of the mounting substrate 20 side (periphery of the opening), for example, an adhesive (e.g., silicone resin, epoxy resin or the like) if affixed with good.

また、色変換部90の材料として用いる封止樹脂は、シリコーン樹脂に限らず、例えば、アクリル樹脂、エポキシ樹脂などでもよい。 The sealing resin used as the material of the color conversion unit 90 is not limited to the silicone resin, e.g., acrylic resin, or the like may be used epoxy resin.

本実施形態の発光装置1では、LEDチップ10として、青色光を放射するGaN系青色LEDチップを用い、封止部50における第1の蛍光体粒子として、LEDチップ10から放射された青色光によって励起されて赤色光を放射する赤色蛍光体粒子を用い、色変換部90における第2の蛍光体粒子として、LEDチップ10から放射された青色光によって励起されて緑色光を放射する緑色蛍光体粒子を用いており、LEDチップ10から放射され封止部50および第1の光学部材40および色変換部90および第2の光学部材80を透過した青色光と、封止部50の赤色蛍光体粒子から放射され第1の光学部材40および色変換部90および第2の光学部材80を透過した赤色光と、色変換部90の緑色蛍光体粒子から放射され第2の光 In the light emitting device 1 of the present embodiment, as the LED chip 10, a GaN-based blue LED chip that emits blue light as the first phosphor particles in the sealing unit 50, the blue light emitted from the LED chip 10 is excited using a red phosphor particles that emit red light, as the second phosphor particles in the color conversion unit 90, the green phosphor particles are excited by blue light emitted from the LED chip 10 emits green light and using a blue light that has passed through the emitted sealing portion 50 and the first optical member 40 and the color conversion unit 90 and the second optical member 80 from the LED chip 10, red phosphor particles of the sealing portion 50 the second light emitted from the emitted red light transmitted through the first optical member 40 and the color conversion unit 90 and the second optical member 80, the green phosphor particles of the color conversion section 90 from 部材80を透過した緑色光との混色光からなる白色光を得ることができる。 It is possible to obtain white light composed of mixed color light of the green light transmitted through the member 80.

ところで、本実施形態の発光装置1の製造にあたっては、例えば、実施形態1にて説明した製造方法と同様の工程を経ることで、ゲル状の封止部50を形成するのと同時に第1の光学部材40を実装基板20に固着した後、第2の蛍光体粒子を分散した封止樹脂を第2の光学部材80の内側に注入してから第2の光学部材80を第1の光学部材40および実装基板20に対し位置決めした後に当該封止樹脂を硬化させることにより色変換部90を形成するのと同時に第2の光学部材80を実装基板20に固着すればよい。 Incidentally, when manufacturing the light emitting device 1 of the present embodiment, for example, Embodiment 1 by steps similar to those of the manufacturing method described in, gel-like to a first time to form the sealing portion 50 of the after fixing the optical member 40 to the mounting substrate 20, the second optical member 80 from the injection of the sealing resin containing dispersed second phosphor particles inside the second optical member 80 first optical member to 40 and the mounting board 20 may be secured to the second optical member 80 simultaneously with forming the color conversion unit 90 to the mounting board 20 by curing the sealing resin after the positioning.

しかして、本実施形態の発光装置1では、実施形態1のようにLEDチップ10と1種類の蛍光体粒子との組み合わせにより所望の混色光である白色光を得る場合に比べて、演色性の高い白色光を得ることが可能となり、しかも、発光色の異なる赤色蛍光体粒子および緑色蛍光体粒子のうち発光ピーク波長が低波長側にある緑色蛍光体粒子から放射された緑色光が、発光ピーク波長が長波長側にある赤色蛍光体粒子に二次吸収されるのを抑制することが可能となる。 Thus, in light emitting device 1 of the present embodiment, as compared with the case of obtaining white light is desired mixed color light by the combination of the LED chip 10 as in the embodiment 1 with one of the phosphor particles, the color rendering properties it is possible to obtain a high white light, moreover, the green light emitting luminescent peak wavelength of the emission color different red phosphor particles and the green phosphor particles from the green phosphor particles in the low wavelength side, the emission peak it is possible to suppress the wavelength is secondarily absorbed by the red phosphor particles in the long wavelength side. なお、本実施形態の発光装置1では、実装基板20に第2の光学部材80を位置決めする位置決め用の凹部や凸部などを設けて第2の光学部材80の位置精度を高めることで、色度のばらつきや色むらをさらに抑制することができる。 In the light emitting device 1 of the present embodiment, by increasing the positional accuracy of the second optical member 80 provided with such recesses or protrusions for positioning for positioning the second optical member 80 to the mounting substrate 20, color it is possible to further suppress the degree of variation and color unevenness.

(実施形態5) (Embodiment 5)
本実施形態の発光装置1の基本構成は実施形態1と略同じであって、図5に示すように、封止部50に密着している光学部材40(以下、第1の光学部材40と称す)の光出射面との間に空気層70が形成される形で配設されたドーム状の第2の光学部材80を備え、第2の光学部材80が、LEDチップ10よりも長波長かつ封止部50の蛍光体粒子である第1の蛍光体粒子よりも短波長の可視光を放射する第2の蛍光体粒子を分散した透光性材料の成形品により構成されている点などが相違する。 The basic configuration of the light emitting device 1 of the present embodiment is substantially the same as that in Embodiment 1, as shown in FIG. 5, the optical member 40 (hereinafter, which is in close contact with the sealing portion 50, a first optical member 40 a second optical member 80 domed arranged in the form of an air layer 70 is formed between the light emitting surface of the called), the second optical member 80, a wavelength longer than the LED chip 10 and such that it is composed of a molded article of the phosphor particles at a first fluorescent material particle translucent material dispersed the second phosphor particles emit visible light of wavelength shorter than the sealing portion 50 There are different. なお、実施形態1と同様の構成要素には同一の符号を付して説明を省略する。 Incidentally, the same components as in Embodiment 1 will not be described are denoted by the same reference numerals.

上述の第2の光学部材80は、第1の光学部材40との間の距離が一定となるようなドーム状で且つ肉厚が一様となるように形成されている。 The second optical member 80 described above, the wall thickness and a dome shape as the distance is constant between the first optical member 40 is formed so as to be uniform. なお、第2の光学部材80は、実装基板20側の端縁(開口部の周縁)を実装基板20に対して、例えば接着剤(例えば、シリコーン樹脂、エポキシ樹脂など)を用いて固着すればよい。 The second optical member 80 to the mounting substrate 20 to the edge of the mounting substrate 20 side (periphery of the opening), for example, an adhesive (e.g., silicone resin, epoxy resin or the like) if affixed with good.

本実施形態の発光装置1では、LEDチップ10として、青色光を放射するGaN系青色LEDチップを用い、封止部50における第1の蛍光体粒子として、LEDチップ10から放射された青色光によって励起されて赤色光を放射する赤色蛍光体粒子を用い、第2の光学部材80における第2の蛍光体粒子として、LEDチップ10から放射された青色光によって励起されて緑色光を放射する緑色蛍光体粒子を用いており、LEDチップ10から放射され封止部50および第1の光学部材40および空気層70および第2の光学部材80を透過した青色光と、封止部50の赤色蛍光体粒子から放射され第1の光学部材40および空気層70および第2の光学部材80を透過した赤色光と、第2の光学部材80の緑色蛍光体粒子から放射され In the light emitting device 1 of the present embodiment, as the LED chip 10, a GaN-based blue LED chip that emits blue light as the first phosphor particles in the sealing unit 50, the blue light emitted from the LED chip 10 is excited using a red phosphor particles that emit red light, as the second phosphor particles in the second optical member 80, green fluorescence emit when excited green light by blue light emitted from the LED chip 10 and using somatic particles, and blue light that has passed through the emitted sealing portion 50 and the first optical member 40 and the air layer 70 and the second optical member 80 from the LED chip 10, the red phosphor of the sealing portion 50 the red light transmitted through the emitted first optical member 40 and the air layer 70 and the second optical member 80 from the particles, emitted from the green phosphor particles in the second optical member 80 緑色光との混色光からなる白色光を得ることができる。 It is possible to obtain white light composed of mixed light with the green light.

しかして、本実施形態の発光装置1では、実施形態1のようにLEDチップ10と1種類の蛍光体粒子との組み合わせにより所望の混色光である白色光を得る場合に比べて、演色性の高い白色光を得ることが可能となり、しかも、発光色の異なる赤色蛍光体粒子および緑色蛍光体粒子のうち発光ピーク波長が低波長側にある緑色蛍光体粒子から放射された緑色光が、発光ピーク波長が長波長側にある赤色蛍光体粒子に二次吸収されるのを抑制することが可能となる。 Thus, in light emitting device 1 of the present embodiment, as compared with the case of obtaining white light is desired mixed color light by the combination of the LED chip 10 as in the embodiment 1 with one of the phosphor particles, the color rendering properties it is possible to obtain a high white light, moreover, the green light emitting luminescent peak wavelength of the emission color different red phosphor particles and the green phosphor particles from the green phosphor particles in the low wavelength side, the emission peak it is possible to suppress the wavelength is secondarily absorbed by the red phosphor particles in the long wavelength side. なお、本実施形態の発光装置1では、実装基板20に第2の光学部材80を位置決めする位置決め用の凹部や凸部などを設けて第2の光学部材80の位置精度を高めることで、色度のばらつきや色むらをさらに抑制することができる。 In the light emitting device 1 of the present embodiment, by increasing the positional accuracy of the second optical member 80 provided with such recesses or protrusions for positioning for positioning the second optical member 80 to the mounting substrate 20, color it is possible to further suppress the degree of variation and color unevenness.

また、本実施形態の発光装置1では、第2の光学部材80と第1の光学部材40との間に空気層70が形成されているので、第2の光学部材80の緑色蛍光体粒子から放射された緑色光が封止部50の赤色蛍光体に二次吸収されるのをより確実に抑制することが可能となる。 Further, the light emitting device 1 of the present embodiment, since the air layer 70 is formed between the second optical member 80 and the first optical member 40, the green phosphor particles of the second optical member 80 emitted green light can be more reliably inhibited from secondary absorption in the red phosphor of the sealing portion 50.

実施形態1の発光装置の概略断面図である。 It is a schematic sectional view of a light emitting device of Embodiment 1. 実施形態2の発光装置の概略断面図である。 It is a schematic sectional view of a light emitting device of Embodiment 2. 実施形態3の発光装置の概略断面図である。 It is a schematic sectional view of a light emitting device of Embodiment 3. 実施形態4の発光装置の概略断面図である。 It is a schematic cross-sectional view of a light-emitting device of the fourth embodiment. 実施形態5の発光装置の概略断面図である。 It is a schematic sectional view of a light emitting device of Embodiment 5. 従来例の発光装置の概略断面図である。 It is a schematic cross-sectional view of a conventional light emitting device.

符号の説明 DESCRIPTION OF SYMBOLS

1 発光装置 10 LEDチップ 11 光取り出し面 20 実装基板 40 光学部材(第1の光学部材) 1 light emitting device 10 LED chip 11 light extraction surface 20 mounting substrate 40 an optical member (first optical member)
50 封止部 60 色度調整用部材 70 空気層 80 第2の光学部材 90 色変換部 50 sealing portion 60 chromaticity adjusting member 70 air layer 80 second optical member 90 color conversion section

Claims (5)

  1. 可視光を放射するLEDチップと、当該LEDチップが実装された実装基板と、実装基板におけるLEDチップの実装面側において実装基板との間にLEDチップを囲む形で配設されたドーム状の光学部材と、光学部材と実装基板とで囲まれた空間に充実されLEDチップを封止した封止部とを備え、光学部材は、透光性材料の成形品からなり、封止部は、LEDチップから放射される可視光によって励起されてLEDチップとは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂を光学部材の内側に注入してから光学部材を実装基板に対して位置決めした後に当該封止樹脂を硬化させることにより形成されてなることを特徴とする発光装置。 An LED chip that emits visible light, the a mounting substrate on which the LED chip is mounted, the optical dome which is arranged in a manner surrounding the LED chips between the mounting substrate on the mounting surface side of the LED chip on the mounting substrate and the member, and a sealing portion that seals an LED chip is enriched in a space surrounded by the optical member and the mounting substrate, the optical member is made of a molded article of light-transmissive material, the sealing portion, LED is excited by visible light emitted from the chip to different colors mounting substrate of the optical member from the injection to the inside of the sealing resin optical member obtained by dispersing phosphor particles emit visible light of the LED chip the light emitting device characterized by comprising been formed by curing the sealing resin after the positioning.
  2. 前記光学部材の光出射面との間に空気層が形成される形で配設された色度調整用部材を備え、色度調整用部材は、前記封止部の蛍光体粒子である第1の蛍光体粒子と同一色の可視光を放射する第2の蛍光体粒子を分散した透光性材料の成形品からなることを特徴とする請求項1記載の発光装置。 Includes a chromaticity adjusting member disposed in the form of an air layer is formed between the light exit surface of the optical member, the chromaticity adjusting member, first a phosphor particle of the sealing portion phosphor particles and the same color light-emitting device according to claim 1, characterized in that the visible light from the molded article of light-transmissive material dispersed the second phosphor particles that emit in.
  3. 前記光学部材は、前記透光性材料としてLEDチップよりも長波長かつ前記封止部の蛍光体粒子である第1の蛍光体粒子よりも短波長の可視光を放射する第2の蛍光体粒子を分散した透光性材料を用いてなることを特徴とする請求項1記載の発光装置。 The optical member, the second phosphor particles that emit visible light having a shorter wavelength than the first phosphor particles also phosphor particles having a long wavelength and the sealing portion from the LED chip as the light-transmitting material the light emitting device according to claim 1, characterized by using a dispersed light-transmitting material.
  4. 前記光学部材である第1の光学部材を囲む形で配設されたドーム状の第2の光学部材と、前記LEDチップよりも長波長かつ前記封止部の蛍光体粒子である第1の蛍光体粒子よりも短波長の可視光を放射する第2の蛍光体粒子を分散した封止樹脂により形成され第1の光学部材と第2の光学部材との間の空間に充実された色変換部とを備え、色変換部は、第2の蛍光体粒子を分散した封止樹脂を第2の光学部材の内側に注入してから第2の光学部材を第1の光学部材および実装基板に対し位置決めした後に当該封止樹脂を硬化させることにより形成されてなることを特徴とする請求項1記載の発光装置。 A second optical member domed arranged in a manner surrounding the first optical member is the optical member, the first fluorescent a phosphor particle having a long wavelength and the sealing portion than the LED chip the color converting unit enrich the space between the second phosphor particles formed by a sealing resin containing dispersed first optical member and second optical member emits visible light having a shorter wavelength than the body particles with the door, the color conversion unit, to the second optical member from the injection of the sealing resin containing dispersed second phosphor particles inside the second optical member first optical member and the mounting substrate the light-emitting device according to claim 1, wherein the sealing resin be formed by curing the after positioning.
  5. 前記光学部材である第1の光学部材の光出射面との間に空気層が形成される形で配設されたドーム状の第2の光学部材を備え、第2の光学部材は、前記LEDチップよりも長波長かつ前記封止部の蛍光体粒子である第1の蛍光体粒子よりも短波長の可視光を放射する第2の蛍光体粒子を分散した透光性材料の成形品からなることを特徴とする請求項1記載の発光装置。 A second optical member of the dome-shaped arranged in the form of an air layer is formed between the light emitting surface of the first optical member is the optical member, second optical member, the LED made from the molded article of light-transmissive material and the second phosphor particles dispersed emitting visible light having a shorter wavelength than the first phosphor particles also phosphor particles having a long wavelength and the sealing portion than the chip the light-emitting device according to claim 1, wherein a.
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