JP2504533B2 - LED light emitting device and method of manufacturing light emitting block used in the device - Google Patents
LED light emitting device and method of manufacturing light emitting block used in the deviceInfo
- Publication number
- JP2504533B2 JP2504533B2 JP63219675A JP21967588A JP2504533B2 JP 2504533 B2 JP2504533 B2 JP 2504533B2 JP 63219675 A JP63219675 A JP 63219675A JP 21967588 A JP21967588 A JP 21967588A JP 2504533 B2 JP2504533 B2 JP 2504533B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- led
- lead
- emitting block
- lead pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 25
- 239000011241 protective layer Substances 0.000 description 8
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
- B60Q1/2696—Mounting of devices using LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明は、発光体としてLEDを使ったLED発光装置並
びに該装置に用いる発光ブロックの製造方法に関するも
のである。TECHNICAL FIELD The present invention relates to an LED light emitting device using an LED as a light emitting body and a method for manufacturing a light emitting block used in the device.
［従来の技術］ 発光体としてLEDを使ったLED発光装置の一従来例とし
て、第８図に示すものが知られている。[Prior Art] As a conventional example of an LED light emitting device using an LED as a light emitter, one shown in FIG. 8 is known.
この発光装置は、プリント基板１の表面に多数のLED
ランプ２を配列したもので、通常、まず基板１の部品取
り付け孔（スルーホール）1aに各LEDランプ２のリード
ピン3a,3bを貫通させ、しかる後、これらのリードピン3
a,3bを基板１の裏面にプリントされた電極配線４に半田
付けすることによって製造される。This light emitting device has a large number of LEDs on the surface of the printed circuit board 1.
The lamps 2 are arranged. Usually, the lead pins 3a and 3b of each LED lamp 2 are first passed through the component mounting hole (through hole) 1a of the board 1 and then these lead pins 3 are inserted.
It is manufactured by soldering a and 3b to the electrode wiring 4 printed on the back surface of the substrate 1.
［発明が解決しようとする課題］ ところが、この従来装置の場合、多数のLEDランプ２
について、一つ一つ基板１へ位置決めしてゆかねばなら
ないため、生産性が非常に悪いという問題があった。[Problems to be Solved by the Invention] However, in the case of this conventional device, a large number of LED lamps 2 are used.
However, there is a problem that the productivity is very poor because the positioning must be done on the substrate 1 one by one.
また、LEDランプ２を基板１に位置決めする場合に、
基板１に対して正確に垂直に立てるのは容易でなく、し
かも、半田付けする際にLEDランプ２が動き易いことも
あり、結果的に、第９図に示すように、各LEDランプ２
の光軸方向ｐが不揃いになり、発光装置全体としては輝
度むらが生じるという問題もあった。Also, when positioning the LED lamp 2 on the substrate 1,
It is not easy to stand vertically perpendicular to the board 1, and the LED lamps 2 can easily move during soldering. As a result, as shown in FIG.
There is also a problem in that the optical axis directions p are uneven, and uneven brightness occurs in the light emitting device as a whole.
また、前記発光装置を、例えば、極めて高い輝度が要
求される自動車用ストップランプ等に利用する場合、予
め、各LEDランプ２に高輝度のものを用いなければなら
ない、高輝度のLEDランプは一般に輝度のばらつきが大
きいため、LEDランプを予め選別して発光装置毎に輝度
の揃ったものを準備しなければならない。In addition, when the light emitting device is used for, for example, an automobile stop lamp that requires extremely high brightness, a high brightness LED lamp 2 must be used in advance. Since there is a large variation in brightness, it is necessary to select LED lamps in advance and prepare ones with uniform brightness for each light emitting device.
しかし、LEDランプ２は、第８図にも示すように、一
対のリードピン3a,3bの外に、リードピン相互を一定の
間隔で固定するための底部ケース3c、一方のリードピン
3a上に接着されるLEDチップ3d、このチップ3dと他方の
リードピン3bとを電気的に接続する導線3e、前記チップ
3dの周囲を覆うケースを兼ねたレンズ部3f等の部材が必
要で、幾つもの工程を経て製造される。However, as shown in FIG. 8, the LED lamp 2 has a bottom case 3c for fixing the lead pins 3a and 3b to each other at regular intervals, and one lead pin as shown in FIG.
LED chip 3d adhered on 3a, conducting wire 3e for electrically connecting this chip 3d and the other lead pin 3b, said chip
A member such as a lens portion 3f that also serves as a case that covers the periphery of 3d is required, and is manufactured through several steps.
このように、幾つもの工程を経て製造したものを選別
にかけるということは、多数の部材、工程が無駄にさ
れ、結果的に、製造コストが高価になるという問題もあ
った。As described above, there is a problem in that the selection of products manufactured through a number of processes wastes many members and processes, resulting in a high manufacturing cost.
この発明は、前記事情に鑑みてなされたもので、高輝
度の発光が要求されるような場合でも、多数の部材およ
び工程を費やしたLEDランプを選別にかけるような無駄
を省くことができ、しかも、LEDランプを一つ一つ基板
上に位置ぎめするような作業も必要にならず、製造コス
トの低減および生産性の向上の点で優れたLED発光装置
を提供することを目的としており、さらには、該LED発
光装置に用いる発光ブロックを得るに際して、LEDの発
光の光軸の不揃いに起因した輝度むらの発生を防止する
ことのできる発生ブロックの製造方法を提供することを
目的とする。The present invention has been made in view of the above circumstances, and even when high-luminance light emission is required, it is possible to eliminate the waste of sorting a large number of members and LED lamps that have spent steps. Moreover, it is not necessary to position each LED lamp on the substrate one by one, and it is an object of the present invention to provide an excellent LED light emitting device in terms of manufacturing cost reduction and productivity improvement. Further, it is another object of the present invention to provide a method of manufacturing a light emitting block that can prevent the occurrence of uneven brightness caused by the unevenness of the optical axis of the light emission of the LED when obtaining the light emitting block used in the LED light emitting device.
［課題を解決するための手段］ 前述の目的を達成するために、本発明のLED発光装置
は、複数個のLEDチップが平面状に並ぶ発光ブロック
と、前記複数個のLEDチップに給電するために該発光ブ
ロックの裏面に密接して取り付けられる給電用基板と、
LEDチップの発光を活かすために前記発光ブロックの表
面にその裏面を密接して取り付けられるレンズブロック
とを備え、 前記発光ブロックは、略平行に近接して配置される２
本のリードピンを１対とし、この対が所定の間隔をおい
て多数配置され、これらが不透明樹脂層に埋設されて一
体に保持され、前記１対のリードピンの一方の先端部に
はプレス加工で形成した反射皿が形成されてその上にLE
Dチップが取り付けられているとともにこのLEDチップと
他方のリードピンの先端部とが給電用導線で接続され、
前記不透明樹脂層の表面側の前記各リードピン対が位置
する部分に窪み部が形成され、この窪み部の底面部に前
記リードピンの先端部が露出し、かつ、前記不透明樹脂
層の窪み部が形成された側と反対側の裏面側は平坦面に
形成されてこの裏面から前記リードピンの基端部が僅か
に突出するように形成され、さらに、前記窪み部には透
明な樹脂が充填されて全体の表面が平坦に形成されたも
のであり、 前記給電用基板は、前記発光ブロックの裏面から突出
するリードピンを差し込む部品取付孔と、この部品取付
孔に差し込まれたリードピンに給電するための給電回路
とを有するものであり、 前記レンズブロックは、一体成形によって形成され、
その裏面は平坦面とされ、その表面には前記発光ブロッ
クにおけるLEDチップの配列に合わせて複数個の凸面か
らなる集光レンズを配列したものであることを特徴とす
る構成をなしている。[Means for Solving the Problems] In order to achieve the above-mentioned object, an LED light-emitting device of the present invention includes a light-emitting block in which a plurality of LED chips are arranged in a plane and power is supplied to the plurality of LED chips. A power supply board closely attached to the back surface of the light emitting block,
A lens block whose back surface is closely attached to the front surface of the light emitting block in order to make the best use of the light emission of the LED chip;
One pair of lead pins are arranged, and a large number of these pairs are arranged at a predetermined interval. These pairs are embedded in an opaque resin layer and integrally held, and one end portion of the pair of lead pins is press-worked. The reflection dish that was formed is formed and the LE is placed on it.
While the D chip is attached, this LED chip and the tip of the other lead pin are connected by a power supply lead wire,
A recess is formed in a portion of the surface side of the opaque resin layer where each of the lead pin pairs is located, the tip of the lead pin is exposed at the bottom of the recess, and the recess of the opaque resin layer is formed. The back side opposite to the formed side is formed into a flat surface so that the base end of the lead pin slightly protrudes from the back side, and the recess is filled with a transparent resin so that the whole surface is formed. The surface of the power supply board is flat, the power supply substrate is a component mounting hole into which a lead pin protruding from the back surface of the light emitting block is inserted, and a power supply circuit for supplying power to the lead pin inserted into the component mounting hole. And the lens block is formed by integral molding,
The back surface is a flat surface, and a condensing lens composed of a plurality of convex surfaces is arranged on the front surface in accordance with the arrangement of the LED chips in the light emitting block.
また、前記LED発光装置における発光ブロックの製造
方法においては、 ほぼ棒状をなす複数本のリードピン部とこれらのリー
ドピン部の基端部を連結する連結用帯部とを一体に形成
したリードフレームを用意し、該リードフレームの中間
部を未硬化樹脂に埋設させ、前記樹脂の硬化後に前記リ
ードフレームの連結用帯部を切除することによって、樹
脂層の裏面にリードピンの端部を突出させた構造を得る
ことを特徴とする。Further, in the method of manufacturing the light emitting block in the LED light emitting device, a lead frame in which a plurality of substantially rod-shaped lead pin portions and a connecting band portion that connects the base end portions of these lead pin portions are integrally formed is prepared. Then, by burying the middle portion of the lead frame in an uncured resin and cutting off the connecting band portion of the lead frame after the resin is cured, the end portion of the lead pin is projected to the back surface of the resin layer. It is characterized by obtaining.
［作用］ この発明のLED発光装置は、独立したLEDランプを使用
するものではなく、複数個のLEDチップおよび複数対の
リードピンを一体化した発光ブロックとレンズブロック
とを重ね合わせることによって、等価的に、複数個のLE
Dランプを集合させたLED集合体を構成するものである。[Operation] The LED light emitting device of the present invention does not use an independent LED lamp, but is equivalent to a light emitting block in which a plurality of LED chips and a plurality of pairs of lead pins are integrated with a lens block. And multiple LEs
It constitutes an LED assembly in which D lamps are assembled.
したがって、高輝度の発光が要求されるような場合に
は、発光ブロックを製造する際に、LEDチップの段階で
選別を行えば良く、多数の部材、工程を費やしたLEDラ
ンプの段階で選別にかけるような無駄を省くことができ
る。Therefore, when high-luminance light emission is required, it is sufficient to perform selection at the LED chip stage when manufacturing the light-emitting block, and at the LED lamp stage where many members and processes are spent. It is possible to eliminate unnecessary waste.
また、給電用基板における部品取り付け穴の配列を、
前記発光ブロックの裏面から突出するリードピンの配列
に合わせているため、前記発光ブロックの裏面に給電用
基板を重ね合わせるだけで、複数対のリードピンを一括
して対応する部品取り付け穴に挿通した状態にすること
ができ、独立した多数のLEDランプを基板上に一つ一つ
位置ぎめするような手間のかかる作業が必要にならな
い。In addition, the arrangement of the component mounting holes on the power supply board
Since it is aligned with the arrangement of the lead pins protruding from the back surface of the light emitting block, a plurality of pairs of lead pins can be collectively inserted into the corresponding component mounting holes by simply stacking the power supply board on the back surface of the light emitting block. Therefore, the laborious work of positioning a large number of independent LED lamps one by one on the substrate is not required.
したがって、本発明のLED発光装置においては、製造
コストを低減させるだけでなく、生産性を向上させるこ
ともできる。Therefore, in the LED light emitting device of the present invention, not only the manufacturing cost can be reduced, but also the productivity can be improved.
また、前記発光ブロックの製造に際しては、複数本の
リードピン部が連結用帯部によって相互に連結されたリ
ードフレームを用意しておいて、各リードピン部相互の
位置関係を樹脂層で固定した後に連結用帯部を切除する
ことによって、複数本のリードピンの端部を樹脂層の裏
面に突出させた構造を得るため、リードピン相互の向き
合わせるような作業が一切不要であり、確実に総てのリ
ードピンの向きが揃った状態を得ることができ、また、
これによって、リードピンの上に接着されるLEDチップ
の向きも揃えることができる。In addition, in manufacturing the light emitting block, a lead frame in which a plurality of lead pin portions are connected to each other by a connecting band is prepared, and the positional relationship between the lead pin portions is fixed by a resin layer and then connected. By cutting the strip for use, the end parts of multiple lead pins are projected onto the back surface of the resin layer, so there is no need to align the lead pins with each other. It is possible to obtain a state in which the
As a result, the LED chips bonded on the lead pins can be aligned in the same direction.
したがって、本発明の製造方法によれば、LEDの発光
の光軸の不揃いに起因した輝度むらの発生を防止して、
品質の向上を図るとともに製品歩留りの向上を図ること
ができる。Therefore, according to the manufacturing method of the present invention, it is possible to prevent the occurrence of uneven brightness due to the unevenness of the optical axis of the light emission of the LED,
It is possible to improve not only the quality but also the product yield.
［実施例］ 以下、本発明の一実施例であるLED発光装置と、このL
ED発光装置における発光ブロックの製造方法とを説明す
る。[Embodiment] An LED light-emitting device according to an embodiment of the present invention and this L
A method of manufacturing a light emitting block in an ED light emitting device will be described.
第１図は、本発明の一実施例であるLED発光装置を使
った自動車用ストップランプの横断面を示したものであ
る。FIG. 1 is a cross-sectional view of a vehicle stop lamp using an LED light emitting device according to an embodiment of the present invention.
このストップランプは、車体の高位置に配置されるハ
イマウントタイプのもので、不透明な合成樹脂等によっ
て形成されて車体に組み込まれる外ケース６と、この外
ケース６の前面開口部を覆う透明（又は半透明）のレン
ズ板７と、一実施例のLED発光装置８とから構成されて
いる。This stop lamp is of a high mount type arranged at a high position of the vehicle body, and is made of an opaque synthetic resin or the like and is incorporated in the vehicle body. The transparent case 6 covers the front opening of the outer case 6 ( (Or semi-transparent) lens plate 7 and the LED light emitting device 8 of the embodiment.
この一実施例のLED発光装置８は、発光ブロック10
と、給電用基板11と、レンズブロック12との３つのユニ
ットとからなり、これらのユニットを重ね合わせること
によって形成されている。The LED light emitting device 8 of this embodiment includes a light emitting block 10
And a power supply substrate 11 and a lens block 12, which are three units, and are formed by stacking these units.
各ユニットについて詳述すると、前記発光ブロック10
は、複数個のLEDチップ14と、各LEDチップ14に給電する
ための複数対のリードピン15a,15bと、これらのLEDチッ
プ14とリードピン15a,15bとを向き・間隔を揃えて保持
する樹脂層16とを具備しており、前記樹脂層16によって
全体として一体化されている。Each unit will be described in detail below.
Is a plurality of LED chips 14, a plurality of pairs of lead pins 15a, 15b for supplying power to each LED chip 14, and a resin layer that holds the LED chips 14 and the lead pins 15a, 15b in the same direction and at the same intervals. 16 and are integrated as a whole by the resin layer 16.
互いに対をなすリードピン15a,15bは、後述の製造方
法の項で説明するリードフレーム（第３図参照）によっ
て提供されるもので、同じリードフレームを２個並列に
配置することによって、平行に２列に並ぶ配列を得てい
る（第７図参照）。The lead pins 15a and 15b forming a pair are provided by a lead frame (see FIG. 3) described in the section of the manufacturing method described later, and by placing two of the same lead frames in parallel, two We have obtained an array of rows (see Figure 7).
これらのリードピン15a,15bは、金属板をプレス加工
機で打ち抜くことによって形成されている。また、それ
ぞれのリードピン15a,15bは、ほぼ棒状を呈していて、
基端部が樹脂層16の裏面側（第１図で下側）に突出して
いる。また、一方のリードピン15aは、＋の電極となる
もので、その先端部には、前記LEDチップ14を載せるた
めの反射皿17が形成されている。この反射皿17は、リー
ドピン15aの先端面にプレス加工によって窪部を形成し
たもので、その底部17aはピンの長手方向に直交する平
坦面に形成され、この底部17aの周囲を囲う周壁部17bは
先端側に向けて徐々に径を広げたコーン形に形成されて
いる。この反射皿17は、底部17aに載置したLEDチップ14
の発光による光りが側方に散乱するのを防止して、光量
をupさせる。These lead pins 15a and 15b are formed by punching out a metal plate with a press machine. Further, each of the lead pins 15a, 15b has a substantially rod shape,
The base end portion projects to the back surface side (lower side in FIG. 1) of the resin layer 16. Further, one of the lead pins 15a serves as a + electrode, and a reflection dish 17 for mounting the LED chip 14 is formed at the tip thereof. This reflection dish 17 is one in which a recess is formed on the tip surface of the lead pin 15a by press working, and the bottom portion 17a is formed on a flat surface orthogonal to the longitudinal direction of the pin, and a peripheral wall portion 17b surrounding the periphery of this bottom portion 17a. Is formed in a cone shape whose diameter gradually increases toward the tip side. This reflection dish 17 is an LED chip 14 mounted on the bottom 17a.
The light emitted by the light is prevented from being scattered sideways to increase the light amount.
底部17aに載置されるLEDチップ14の下面は、導電性接
着剤により底部17aに固定され、また、このLEDチップ14
の上面は、導線（材質としては、例えば、金、あるいは
銅、あるいはアルミニウム等が使用される）18を介し
て、−の電極となる他方のリードピン15bに電気的に接
続されている。The lower surface of the LED chip 14 placed on the bottom portion 17a is fixed to the bottom portion 17a by a conductive adhesive, and the LED chip 14 is
The upper surface of is electrically connected to the other lead pin 15b serving as a negative electrode via a conductive wire (material such as gold, copper, or aluminum is used) 18.
前記樹脂層16は、前述の複数対のリードピン15a,15b
相互を一定の間隔で、しかも総てのリードピンの向きを
揃えた状態で固定するピン固定層16aと、前述の導線18
やLEDチップ14を埋設状態にして保護する保護層16bとか
らなる。The resin layer 16 includes a plurality of pairs of lead pins 15a, 15b described above.
The pin fixing layer 16a for fixing each other at a constant interval and with all the lead pins aligned in the same direction, and the above-mentioned conductor 18
And a protective layer 16b for protecting the LED chip 14 in an embedded state.
また、この一実施例のものの場合、固定層16aは、各
リードピン15a,15bの先端部を露呈させる窪み16cを有し
ている。そして、前記保護層16bは、前記窪み16cを透明
な合成樹脂（例えば、エポキシ樹脂）によって埋めたも
のである。なお、窪み16cの側面は、第１図にも示すよ
うに、傾斜している。この傾斜は、LEDチップ14からの
光りをレンズブロック12側に行き易くしている。Further, in the case of this embodiment, the fixed layer 16a has a recess 16c that exposes the tip end portions of the lead pins 15a and 15b. The protective layer 16b is formed by filling the recess 16c with a transparent synthetic resin (eg, epoxy resin). The side surface of the recess 16c is inclined as shown in FIG. This inclination makes it easier for the light from the LED chip 14 to go to the lens block 12 side.
以上のような構成によって、発光ブロック10は、複数
個のLEDチップ14を平面状に並べて一体化したユニット
となっている。With the above configuration, the light emitting block 10 is a unit in which a plurality of LED chips 14 are arranged in a plane and integrated.
前記給電用基板11は、発光ブロック10上の複数個のLE
Dチップ14に給電するために発光ブロック10の裏面に重
ね合わすプリント基板で、前記発光ブロック10の裏面に
突出するリードピン15a,15bの配列に合わせて、リード
ピンを差し込む部品取り付け穴11aが貫通形成されてい
る。また、該基板11の裏面には、これらの部品取り付け
穴11aに差し込まれたリードピン15a,15bに給電するため
給電回路（図示略）がプリントされている。The power supply substrate 11 includes a plurality of LEs on the light emitting block 10.
A printed circuit board overlaid on the back surface of the light emitting block 10 for supplying power to the D chip 14, and in accordance with the arrangement of the lead pins 15a, 15b protruding on the back surface of the light emitting block 10, a component mounting hole 11a for inserting the lead pin is formed through. ing. Further, a power supply circuit (not shown) is printed on the back surface of the substrate 11 to supply power to the lead pins 15a and 15b inserted into the component mounting holes 11a.
したがって、前記発光ブロック10の各リードピン15a,
15bは、発光ブロック10の裏面に基板11を重ね合わせた
状態にすることによって、基板11における部品取り付け
穴11bに一括して挿通させることができ、また、基板11
の裏面に突出した各リードピンを半田付けすることによ
って、各リードピンと給電回路とが電気的に接続され
る。Therefore, each lead pin 15a of the light emitting block 10,
The substrate 15b can be inserted into the component mounting holes 11b in the substrate 11 all together by placing the substrate 11 on the back surface of the light emitting block 10, and the substrate 11 can also be inserted.
By soldering the lead pins projecting to the back surface of the, the lead pins and the power supply circuit are electrically connected.
前記レンズブロック12は、発光ブロック10のLEDチッ
プ14の発光を活かすために、前記発光ブロック10の表面
に重ね合わせるもので、発光ブロック10におけるLEDチ
ップの配列に合わせて複数個の集光レンズ12aを平面状
に連続させて配列した構造をなす。このレンズブロック
12は、透明の合成樹脂等の一体成形により形成されてい
る。このレンズブロック12は、例えば、接着剤によって
発光ブロック10の上面に固定され、このレンズブロック
12と発光ブロック10との一体化によって、等価的に、複
数個のLEDランプを集合させたLED集合体が構成される。The lens block 12 is superposed on the surface of the light emitting block 10 in order to utilize the light emission of the LED chip 14 of the light emitting block 10, and a plurality of condenser lenses 12a are arranged according to the arrangement of the LED chips in the light emitting block 10. It has a structure in which are continuously arranged in a plane. This lens block
12 is formed by integral molding of transparent synthetic resin or the like. The lens block 12 is fixed to the upper surface of the light emitting block 10 with an adhesive, for example.
By integrating 12 and the light emitting block 10, an LED assembly in which a plurality of LED lamps are assembled is equivalently configured.
以上の如きLED発光装置８においては、高輝度の発光
が要求されるような場合には、発光ブロック10を製造す
る際に、LEDチップの段階で選別を行えば良く、多数の
部材及び工程を費やしたLEDランプの段階で選別にかけ
るような無駄を省くことができる。In the LED light emitting device 8 as described above, when high-luminance light emission is required, when manufacturing the light emitting block 10, it suffices to perform selection at the LED chip stage. It is possible to eliminate waste such as sorting when spent LED lamps.
また、前述したように、前記発光ブロック10の裏面に
給電用基板11を重ね合わせるだけで、複数対のリードピ
ン15a,15bの総てを一括して対応する部品取り付け穴11a
に挿通した状態にすることができ、独立した多数のLED
ランプを基板上に一つ一つ位置ぎめするような手間のか
かる作業が必要にならない。Further, as described above, by simply superposing the power supply substrate 11 on the back surface of the light emitting block 10, all the plurality of pairs of lead pins 15a and 15b are collectively attached to the corresponding component mounting holes 11a.
A large number of independent LEDs that can be inserted into
There is no need for the laborious work of positioning the lamps on the board one by one.
したがって、実施例のLED発光装置８においては、製
造コストを低減させるだけでなく、生産性を向上させる
こともできる。Therefore, in the LED light emitting device 8 of the embodiment, not only the manufacturing cost can be reduced, but also the productivity can be improved.
また、この実施例のLED発光装置８においては、LEDチ
ップ14が反射皿17に上にセットされていて、LEDチップ1
4の側面からでた光が該反射皿によって集光レンズ12aの
方向に集められるため、分散による損失が効果的に防止
され、光量のupを図ることができる。Further, in the LED light emitting device 8 of this embodiment, the LED chip 14 is set on the reflection dish 17 and the LED chip 1
Since the light emitted from the side surface of 4 is collected in the direction of the condenser lens 12a by the reflecting dish, loss due to dispersion is effectively prevented, and the amount of light can be increased.
次に、前記発光ブロック10の製造方法を第３図〜第７
図に基づいて説明する。Next, a method of manufacturing the light emitting block 10 will be described with reference to FIGS.
It will be described with reference to the drawings.
まず、第３図に示すようなリードフレーム25を２本用
意する。このリードフレーム25は、後にリードピン15a,
15bとなる複数対のリードピン部25a,25bと、これらのリ
ードピン部25a,25bの下部を連結する連結用帯部25c,25d
とを一体に形成したもので、金属板をプレス加工で打ち
抜くことによって形成されている。そして、それぞれの
リードピン部25a,25bは、ほぼ棒状をなすとともに、延
在する方向が揃えられている。また、後にリードピン15
aとなるリードピン部25aの先端部には、前述の反射皿17
が形成されている。この反射皿17は、前述のようにプレ
ス加工によってリードピン部25aの先端面に窪みを形成
したもので、LEDチップ15の載置部となる。First, two lead frames 25 as shown in FIG. 3 are prepared. This lead frame 25 will be provided with lead pins 15a,
A plurality of pairs of lead pin portions 25a, 25b, which are 15b, and connecting band portions 25c, 25d for connecting the lower portions of these lead pin portions 25a, 25b.
And are integrally formed, and are formed by punching a metal plate by pressing. The lead pin portions 25a and 25b are substantially rod-shaped and are aligned in the extending direction. Also, after the lead pin 15
At the tip of the lead pin 25a, which will be a,
Are formed. As described above, the reflection dish 17 has a recess formed in the tip surface of the lead pin portion 25a by pressing, and serves as a mounting portion for the LED chip 15.
そして、次には、第４図に示すように、固定層16aを
形成する工程と、チップ14を反射皿17にセットして、こ
のチップ14と他方のリードピン部25bの先端と導線18で
接続する工程とを行う。これらの工程は、どちらを先に
行っても良いが、チップ14と導線18とをセットする工程
を後にしたほうが、作業が行い易い。Then, as shown in FIG. 4, the step of forming the fixing layer 16a, the chip 14 is set in the reflection dish 17, and the chip 14 is connected to the tip of the other lead pin portion 25b by the conductor wire 18. And the step of performing. Either of these steps may be performed first, but the work is easier to perform after the step of setting the chip 14 and the conductive wire 18 is performed.
固定層16aを形成する工程は、２本のリードフレーム2
5を平行に立てた状態にし、この状態でそれぞれのリー
ドフレーム25の中間部等を成形型の中に位置決めする。
そして、成形型内に不透明の未硬化の合成樹脂を充填し
て、リードピン部25a,25bの中間から先端までの部分を
樹脂中に埋設した状態にする。そして、前記樹脂が硬化
したら、リードフレーム25を型から取り出せば良い。The process of forming the fixed layer 16a is performed by using the two lead frames 2
5 are set up in parallel, and in this state, the intermediate portion of each lead frame 25 is positioned in the molding die.
Then, an opaque uncured synthetic resin is filled in the molding die so that the portions from the middle to the tips of the lead pin portions 25a and 25b are embedded in the resin. Then, when the resin is cured, the lead frame 25 may be taken out of the mold.
次には、第５図に示すように、保護層16bを形成す
る。この保護層16bの形成は、前記固定層16aの窪み16c
に透明または半透明の合成樹脂（例えば、エポキシ樹
脂）等を充填させて、硬化させれば良い。Next, as shown in FIG. 5, a protective layer 16b is formed. The protective layer 16b is formed by forming the recess 16c in the fixed layer 16a.
A transparent or semi-transparent synthetic resin (for example, epoxy resin) or the like may be filled in and cured.
前述の固定層16aおよび保護層16bの成形法としては、
例えば、射出成形法、圧縮成形法、キャスティング成形
法等の既存の成形法だけでなく、既存のものに改良を加
えた方法も利用することができる。As a method of molding the above-mentioned fixed layer 16a and protective layer 16b,
For example, not only the existing molding methods such as the injection molding method, the compression molding method and the casting molding method, but also a method obtained by improving the existing one can be used.
次には、第６図に示すように、連結用帯部25c,25dを
切除する。この切除によって、今まで連結状態にあった
各リードピン部25a,25bが独立して、リードピン15a,15b
となり、発光ブロック10が完成する。Next, as shown in FIG. 6, the connecting belt portions 25c and 25d are cut off. By this excision, the lead pin portions 25a, 25b that have been in the connected state until now become independent, and the lead pins 15a, 15b
The light emitting block 10 is completed.
なお、第６図は第５図におけるVI−VI線の位置での断
面図であり、第７図は第５図における矢印VII方向から
の矢視図である。6 is a sectional view taken along the line VI-VI in FIG. 5, and FIG. 7 is a view from the direction of arrow VII in FIG.
以上のような製造方法によって発光ブロック10を製造
した場合では、リードピン15a,15b相互の向きを一致さ
せるための位置調整作業が一切不要であり、確実に総て
のリードピン15a,15bの向きが揃った状態を得ることが
でき、また、これによって、リードピン15aの上に接着
されるLEDチップ14の向きも揃えることができる。When the light emitting block 10 is manufactured by the manufacturing method as described above, no position adjustment work is required to match the directions of the lead pins 15a and 15b with each other, and the directions of all the lead pins 15a and 15b are surely aligned. It is possible to obtain a state in which the LED chips 14 are adhered on the lead pins 15a.
したがって、この製造方法によれば、LEDの発光の光
軸の不揃いに起因した輝度むらの発生を防止して、品質
の向上を図るとともに製品歩留りの向上を図ることがで
きる。Therefore, according to this manufacturing method, it is possible to prevent the occurrence of luminance unevenness due to the unevenness of the optical axis of the light emission of the LED, improve the quality, and improve the product yield.
なお、この製造方法で使用したリードフレーム25は、
一対のリードピン25a,25bを交互に一列に配列したもの
であるが、LEDチップ14の向き揃えるという効果を得る
ためだけであれば、LEDチップ14を載せるリードピン部2
5aだけを一定間隔で並べたリードフレームを作ることも
考えることができる。The lead frame 25 used in this manufacturing method is
Although a pair of lead pins 25a and 25b are alternately arranged in a line, the lead pin portion 2 on which the LED chip 14 is mounted is only to obtain the effect of aligning the LED chips 14 in the same direction.
It is also possible to think of making a lead frame in which only 5a are arranged at regular intervals.
また、前述の方法では、樹脂層16を固定層16aと保護
層16bとの２層に分けて、各層毎に工程を分けて形成し
たが、使用する合成樹脂の種類や成形法を適宜選定する
ことによって、一工程で形成したり、一層の構造にする
こともできる。Further, in the above-described method, the resin layer 16 is divided into two layers, the fixed layer 16a and the protective layer 16b, and the steps are formed separately for each layer. However, the type of synthetic resin used and the molding method are appropriately selected. As a result, they can be formed in one step or can have a single layer structure.
［発明の効果］ この発明のLED発光装置は、独立したLEDランプを使用
するものではなく、複数個のLEDチップおよび複数対の
リードピンを一体化した発光ブロックとレンズブロック
とを重ね合わせることによって、等価的に、複数個のLE
Dランプを集合させたLED集合体を構成するものである。[Effect of the Invention] The LED light emitting device of the present invention does not use an independent LED lamp, but by stacking a light emitting block and a lens block in which a plurality of LED chips and a plurality of pairs of lead pins are integrated, Equivalently, multiple LEs
It constitutes an LED assembly in which D lamps are assembled.
したがって、高輝度の発光が要求されるような場合に
は、発光ブロックを製造する際に、LEDチップの段階で
選別を行えば良く、多数の部材、工程を費やしたLEDラ
ンプの段階で選別にかけるような無駄を省くことができ
る。Therefore, when high-luminance light emission is required, it is sufficient to perform selection at the LED chip stage when manufacturing the light-emitting block, and at the LED lamp stage where many members and processes are spent. It is possible to eliminate unnecessary waste.
また、給電用基板における部品取り付け穴の配列を、
前記発光ブロックの裏面から突出するリードピンの配列
に合わせているため、前記発光ブロックの裏面に給電用
基板を重ね合わせるだけで、複数対のリードピンを一括
して対応する部品取り付け穴に挿通した状態にすること
ができ、独立した多数のLEDランプを基板上に一つ一つ
位置ぎめするような手間のかかる作業が必要にならな
い。In addition, the arrangement of the component mounting holes on the power supply board
Since it is aligned with the arrangement of the lead pins protruding from the back surface of the light emitting block, a plurality of pairs of lead pins can be collectively inserted into the corresponding component mounting holes by simply stacking the power supply board on the back surface of the light emitting block. Therefore, the laborious work of positioning a large number of independent LED lamps one by one on the substrate is not required.
したがって、本発明のLED発光装置においては、製造
コストを低減させるだけでなく、生産性を向上させるこ
ともできる。Therefore, in the LED light emitting device of the present invention, not only the manufacturing cost can be reduced, but also the productivity can be improved.
また、前記LED発光装置における発光ブロックの製造
方法においては、複数本のリードピン部が連結用帯部に
よって相互に連結されたリードフレームを用意しておい
て、各リードピン部相互の位置関係を樹脂層で固定した
後に連結用帯部を切除することによって、複数本のリー
ドピンの端部を樹脂層の裏面に突出させた構造を得るた
め、リードピン相互の向きを合わせるような作業が一切
不要であり、確実に総てのリードピンの向きが揃った状
態を得ることができ、また、これによって、リードピン
の上に接着されるLEDチップの向きも揃えることができ
る。Further, in the method for manufacturing a light emitting block in the LED light emitting device, a lead frame in which a plurality of lead pin portions are connected to each other by a connecting band portion is prepared, and a positional relationship between the lead pin portions is determined by a resin layer. By cutting the connecting band after fixing with, to obtain a structure in which the ends of multiple lead pins are projected to the back surface of the resin layer, there is no need to align the lead pins with each other. It is possible to surely obtain a state in which all the lead pins are aligned, and this also makes it possible to align the LED chips bonded on the lead pins.
したがって、本発明の製造方法によれば、LEDの発光
の光軸の不揃いに起因した輝度むらの発生を防止して、
品質の向上を図るとともに製品歩留りの向上を図ること
ができる。Therefore, according to the manufacturing method of the present invention, it is possible to prevent the occurrence of uneven brightness due to the unevenness of the optical axis of the light emission of the LED,
It is possible to improve not only the quality but also the product yield.
第１図は本発明のLED発光装置の一実施例の横断面図、
第２図は第１図の要部の斜視図、第３図〜第７図は前記
一実施例における発光ブロックの製造方法を説明するた
めのもので、第３図は該方法に使用するリードフレーム
の構造説明図、第４図は固定層を形成する工程の説明
図、第５図は保護層を形成する工程の説明図、第６図は
第５図におけるVI−VI線に沿う位置で断面した場合の図
でリードフレームの連結用帯部を切除する工程の説明
図、第７図は第５図における矢印VIIによる矢視図、第
８図は従来のLED発光装置の構成説明図、第９図はこの
従来装置における問題点の説明図である。 ８……LED発光装置、10……発光ブロック、11……給電
用基板、11a……部品取り付け穴、12……レンズブロッ
ク、12a……集光レンズ、14……LEDチップ、15a,15b…
…リードピン、16……樹脂層、16a……固定層、16b……
保護層、17……反射皿、18……導線。FIG. 1 is a cross-sectional view of an embodiment of the LED light emitting device of the present invention,
FIG. 2 is a perspective view of an essential part of FIG. 1, FIGS. 3 to 7 are for explaining a method of manufacturing a light emitting block in the above-mentioned embodiment, and FIG. 3 is a lead used in the method. FIG. 4 is an explanatory view of the structure of the frame, FIG. 4 is an explanatory view of the step of forming the fixed layer, FIG. 5 is an explanatory view of the step of forming the protective layer, and FIG. 6 is a position along the line VI-VI in FIG. FIG. 7 is an explanatory view of a step of cutting the connecting band portion of the lead frame in a cross-sectional view, FIG. 7 is a view taken along the arrow VII in FIG. 5, and FIG. 8 is a configuration explanatory view of a conventional LED light-emitting device. FIG. 9 is an explanatory diagram of problems in this conventional device. 8 ... LED light emitting device, 10 ... light emitting block, 11 ... feeding substrate, 11a ... component mounting hole, 12 ... lens block, 12a ... condensing lens, 14 ... LED chip, 15a, 15b ...
… Lead pin, 16 …… Resin layer, 16a …… Fixed layer, 16b ……
Protective layer, 17 ... Reflector, 18 ... Conductor.
フロントページの続き (72)発明者 小原 直美 静岡県磐田郡竜洋町宮本364―１ 浜松 光電株式会社内 (72)発明者 青木 重憲 東京都中央区日本橋小伝馬町10―11 カ イト化学工業株式会社 (56)参考文献 特開 昭61−158606（ＪＰ，Ａ) 実開 昭56−67772（ＪＰ，Ｕ) 実開 昭63−4009（ＪＰ，Ｕ)Front Page Continuation (72) Inventor Naomi Obara, 364-1 Miyamoto, Ryoyo-cho, Iwata-gun, Shizuoka Hamamatsu Koden Co., Ltd. 56) References Japanese Unexamined Patent Publication No. 61-158606 (JP, A) Actually opened 56-67772 (JP, U) Actually opened 63-4009 (JP, U)
Claims (2)
ロックと、前記複数個のLEDチップに給電するために該
発光ブロックの裏面に密接して取り付けられる給電用基
板と、LEDチップの発光を活かすために前記発光ブロッ
クの表面にその裏面を密接して取り付けられるレンズブ
ロックとを備え、 前記発光ブロックは、略平行に近接して配置される２本
のリードピンを１対とし、この対が所定の間隔をおいて
多数配置され、これらが不透明樹脂層に埋設されて一体
に保持され、前記１対のリードピンの一方の先端部には
プレス加工で形成した反射皿が形成されてその上にLED
チップが取り付けられているとともにこのLEDチップと
他方のリードピンの先端部とが給電用導線で接続され、
前記不透明樹脂層の表面側の前記各リードピン対が位置
する部分に窪み部が形成され、この窪み部の底面部に前
記リードピンの先端部が露出し、かつ、前記不透明樹脂
層の窪み部が形成された側と反対側の裏面側は平坦面に
形成されてこの裏面から前記リードピンの基端部が僅か
に突出するように形成され、さらに、前記窪み部には透
明な樹脂が充填されて全体の表面が平坦に形成されたも
のであり、 前記給電用基板は、前記発光ブロックの裏面から突出す
るリードピンを差し込む部品取付孔と、この部品取付孔
に差し込まれたリードピンに給電するための給電回路と
を有するものであり、 前記レンズブロックは、一体成形によって形成され、そ
の裏面は平坦面とされ、その表面には前記発光ブロック
におけるLEDチップの配列に合わせて複数個の凸面から
なる集光レンズを配列したものであることを特徴とする
LED発光装置。1. A light emitting block in which a plurality of LED chips are arranged in a plane, a power supply substrate closely attached to the back surface of the light emitting block for supplying power to the plurality of LED chips, and light emission of the LED chips. In order to make full use of the light emitting block, a lens block whose back surface is closely attached to the front surface of the light emitting block is provided, and the light emitting block includes two lead pins arranged in parallel and close to each other. A large number of them are arranged at a predetermined interval, embedded in an opaque resin layer and integrally held, and a reflecting dish formed by press working is formed on one of the tip ends of the pair of lead pins. led
With the chip attached, this LED chip and the tip of the other lead pin are connected by a power supply lead wire,
A recess is formed in a portion of the surface side of the opaque resin layer where each of the lead pin pairs is located, the tip of the lead pin is exposed at the bottom of the recess, and the recess of the opaque resin layer is formed. The back side opposite to the formed side is formed into a flat surface so that the base end of the lead pin slightly protrudes from the back side, and the recess is filled with a transparent resin so that the whole surface is formed. The surface of the power supply board is flat, the power supply substrate is a component mounting hole into which a lead pin protruding from the back surface of the light emitting block is inserted, and a power supply circuit for supplying power to the lead pin inserted into the component mounting hole. The lens block is formed by integral molding, the back surface of which is a flat surface, and the front surface of the lens block has a plurality of surfaces in accordance with the arrangement of LED chips in the light emitting block. Characterized in that it is obtained by arranging a condenser lens comprising a number of convex
LED light emitting device.
ブロックの製造方法であって、 ほぼ棒状をなす複数のリードピン部とこれらのリードピ
ン部の基端部を連結する連結用帯部とを一体に形成した
リードフレームを用意し、該リードフレームの中間部を
未硬化樹脂に含浸させ、前記樹脂の硬化後に前記リード
フレームの連結用帯部を切除することによって、樹脂層
の裏面にリードピンの基端部を突出させた構造を得るこ
とを特徴とした発光ブロックの製造方法。2. A method of manufacturing a light emitting block in an LED light emitting device according to claim 1, wherein a plurality of substantially pin-shaped lead pin portions and a connecting band portion connecting the base end portions of these lead pin portions are integrated. Of the lead frame formed on the back surface of the resin layer by cutting the connecting band portion of the lead frame after the resin is cured by impregnating the middle portion of the lead frame with the uncured resin. A method for manufacturing a light-emitting block, characterized in that a structure having an end protruding is obtained.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63219675A JP2504533B2 (en) | 1988-09-02 | 1988-09-02 | LED light emitting device and method of manufacturing light emitting block used in the device |
| DE3929125A DE3929125A1 (en) | 1988-09-02 | 1989-09-01 | LED array with diode coupled pins - has light emitting block with several LED chips on power supply substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63219675A JP2504533B2 (en) | 1988-09-02 | 1988-09-02 | LED light emitting device and method of manufacturing light emitting block used in the device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0267769A JPH0267769A (en) | 1990-03-07 |
| JP2504533B2 true JP2504533B2 (en) | 1996-06-05 |
Family
ID=16739214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63219675A Expired - Fee Related JP2504533B2 (en) | 1988-09-02 | 1988-09-02 | LED light emitting device and method of manufacturing light emitting block used in the device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2504533B2 (en) |
| DE (1) | DE3929125A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210217926A1 (en) * | 2005-02-03 | 2021-07-15 | Epistar Corporation | Light emitting device and the manufacturing method thereof |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2792722B2 (en) * | 1990-07-16 | 1998-09-03 | 三菱電機株式会社 | Semiconductor light emitting device |
| FR2680859B1 (en) * | 1991-09-02 | 1993-10-29 | Valeo Vision | OPTICAL COLLIMATION ELEMENT AND ITS ASSOCIATED SUPPORT ELEMENT, IN PARTICULAR FOR A MOTOR VEHICLE SIGNALING LIGHT. |
| FR2680862B1 (en) * | 1991-09-02 | 1997-08-08 | Valeo Vision | SIGNAL LIGHT WITH LIGHT EMITTING ELEMENTS, PARTICULARLY FOR MOTOR VEHICLE. |
| DE4311937A1 (en) * | 1993-04-10 | 1994-10-13 | Telefunken Microelectron | Light-emitting device |
| EP0632511A3 (en) * | 1993-06-29 | 1996-11-27 | Mitsubishi Cable Ind Ltd | A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module. |
| DE19741585C1 (en) * | 1997-09-20 | 1998-10-01 | Parsytec Computer Gmbh | Production of light emitting diode LED matrix |
| FR2794927B1 (en) * | 1999-06-09 | 2001-08-10 | Ass Pour La Promotion Et Le De | POLYCHROMATIC LIGHTING DEVICE WITH LIGHT EMITTING DIODES |
| EP1153792A1 (en) * | 2000-05-09 | 2001-11-14 | SIDLER GMBH & CO | Lighting device with a plurality of LEDs |
| FR2809796B1 (en) | 2000-06-05 | 2002-07-12 | Zedel | PORTABLE LIGHTING LIGHT WITH LIGHT EMITTING DIODES |
| CA2410978A1 (en) | 2002-11-04 | 2004-05-04 | John Spencer | Solid state illuminator for bi-colour ported water level gauges |
| JP4345518B2 (en) * | 2004-02-18 | 2009-10-14 | 市光工業株式会社 | Vehicle lighting |
| US9222645B2 (en) | 2010-11-29 | 2015-12-29 | RTC Industries, Incorporated | LED lighting assembly and method of lighting for a merchandise display |
| US11274808B2 (en) | 2010-06-17 | 2022-03-15 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5130930Y2 (en) * | 1971-01-27 | 1976-08-03 | ||
| JPS5667772U (en) * | 1979-10-30 | 1981-06-05 | ||
| JPS5871671A (en) * | 1981-10-23 | 1983-04-28 | Idec Izumi Corp | Light emitting diode lamp |
| JPS6049652U (en) * | 1983-09-14 | 1985-04-08 | スタンレー電気株式会社 | Two-color light emitting semiconductor device |
| JPS6079758U (en) * | 1983-11-04 | 1985-06-03 | スタンレー電気株式会社 | Multicolor light emitting semiconductor device |
| JPS61113290A (en) * | 1984-11-08 | 1986-05-31 | Sanyo Electric Co Ltd | Linear light source |
| JPS61181002A (en) * | 1985-02-05 | 1986-08-13 | 株式会社小糸製作所 | Lighting apparatus |
| JPS61158606A (en) * | 1984-12-28 | 1986-07-18 | 株式会社小糸製作所 | Lighting apparatus |
| JPS634009U (en) * | 1986-06-27 | 1988-01-12 | ||
| JPH0424561Y2 (en) * | 1987-01-28 | 1992-06-10 |
-
1988
- 1988-09-02 JP JP63219675A patent/JP2504533B2/en not_active Expired - Fee Related
-
1989
- 1989-09-01 DE DE3929125A patent/DE3929125A1/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210217926A1 (en) * | 2005-02-03 | 2021-07-15 | Epistar Corporation | Light emitting device and the manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3929125A1 (en) | 1990-03-22 |
| JPH0267769A (en) | 1990-03-07 |
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