JPH10288966A - Led display unit and its driving method - Google Patents

Led display unit and its driving method

Info

Publication number
JPH10288966A
JPH10288966A JP9110414A JP11041497A JPH10288966A JP H10288966 A JPH10288966 A JP H10288966A JP 9110414 A JP9110414 A JP 9110414A JP 11041497 A JP11041497 A JP 11041497A JP H10288966 A JPH10288966 A JP H10288966A
Authority
JP
Japan
Prior art keywords
led
wiring pattern
lens cap
cover member
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9110414A
Other languages
Japanese (ja)
Inventor
Atsushi Kanbe
篤 神戸
Takeshi Suio
武 翠尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okaya Electric Industry Co Ltd
Original Assignee
Okaya Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okaya Electric Industry Co Ltd filed Critical Okaya Electric Industry Co Ltd
Priority to JP9110414A priority Critical patent/JPH10288966A/en
Publication of JPH10288966A publication Critical patent/JPH10288966A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PROBLEM TO BE SOLVED: To actualize the LED display unit which can be made thin on the whole and have the optical axes of respective LED elements easily aligned with one another and hardly generates display unevenness and is excellent in visibility from the right and left. SOLUTION: This LED display unit is equipped with a substrate 16 which has a wiring pattern 42 and recessed parts 18 formed on its surface, metallic reflecting members 38 which are arranged on the internal wall surfaces of the recessed parts 18 and connected to the wiring pattern 42, an LED modules 22 having LED chips 20a and 20b which each have one end connected to a reflecting member 38 and the other end connected to the wiring pattern 42 through a bonding wire 40, and a transparent cover member 26 which have semielliptic spherical lens cap parts 24 formed. So that the array direction of the LED chips 20a and 20b in the recessed parts 18 matches the major- diameter side center axis (X) of the elliptic opening part of the lens cap part, the cover member 26 and LED module 22 are positioned, resin 28 is charged inside, and the LED elements 14 are formed between the respective lens parts 24 and recessed parts 18.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明はLED表示器に係
り、特に、表示面に複数のLED素子を配設して一体化
した構造を備えたLED表示器に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED display, and more particularly to an LED display having a structure in which a plurality of LED elements are arranged on a display surface and integrated.

【0002】[0002]

【従来の技術】従来のLED表示器としては、例えば図
11に示すように、複数のLED素子70の各端子72を裏
面に所定の配線パターンが施された基板74の貫通孔に挿
通させ、ハンダ76を介して基板74の裏面に固着させたも
のがある。このLED表示器78は、例えば庇80を備えた
ケース82内に収納された上で、壁面に多数取り付けられ
ることにより、大型の野外ディスプレイ等の集合表示盤
を構成する一エレメントとして利用される。上記基板74
の表面側には、防水用の樹脂材84が充填されている。ま
た、ケース82の後端面86は、適当な傾斜面を形成してお
り、位置決め用の突起88が形成されている。このため、
このケースの後端面86を垂直な壁面に当接させると、各
LED素子70の光軸がやや下向きとなり、屋外で下から
見上げるのに適したディスプレイを構成することができ
る。
2. Description of the Related Art As a conventional LED display, for example, as shown in FIG. 11, each terminal 72 of a plurality of LED elements 70 is inserted into a through hole of a substrate 74 having a predetermined wiring pattern on the back surface. Some are fixed to the back surface of the substrate 74 via the solder 76. The LED display 78 is housed in a case 82 having eaves 80, for example, and is attached to a wall surface to be used as one element constituting a collective display panel such as a large outdoor display. The above substrate 74
Is filled with a resin material 84 for waterproofing. Further, a rear end surface 86 of the case 82 forms an appropriate inclined surface, and a positioning projection 88 is formed. For this reason,
When the rear end face 86 of this case is brought into contact with a vertical wall surface, the optical axis of each LED element 70 is slightly downward, so that a display suitable for looking up outdoors from below can be configured.

【0003】上記LED素子70は、図12に示すよう
に、いわゆるハット型の外囲器90を備えており、一方の
端子72aの先端部分に形成された凹部92の底面にLED
チップ94の一端が接続されると共に、該LEDチップ94
の他端はボンディングワイヤ(金線)96を介して他方の
端子72bの先端に接続されている。両端子72a,72bの
先端側には、エポキシ樹脂によるモールドが施されてい
る。また、この外囲器90の先端部分には、集光用のレン
ズ部98が一体的に形成されている。上記凹部92は、底面
から開口部に向けて口径が広がる漏斗形状を備えてお
り、その壁面は反射鏡を構成している。
As shown in FIG. 12, the above-mentioned LED element 70 has a so-called hat-shaped envelope 90, and an LED element 70 is provided on the bottom surface of a concave portion 92 formed at the tip of one terminal 72a.
One end of the chip 94 is connected and the LED chip 94
Is connected to the tip of the other terminal 72b via a bonding wire (gold wire) 96. The front ends of the terminals 72a and 72b are molded with epoxy resin. In addition, a lens portion 98 for condensing light is integrally formed at a distal end portion of the envelope 90. The concave portion 92 has a funnel shape whose diameter increases from the bottom surface to the opening, and the wall surface forms a reflecting mirror.

【0004】[0004]

【発明が解決しようとする課題】従来のLED表示器78
にあっては、上記のように個々に独立した複数のLED
素子70を集合させ、各端子72を基板74に挿通させて取り
付けているため、端子72の分だけどうしても全体的な厚
さが嵩むこととなり、これが野外ディスプレイ等の薄型
化を阻む要因となっていた。また、各LED素子70の端
子72を基板に挿通させてハンダ付けする際には、端子72
の傾きや反り、曲がりに起因して各LED素子70のレン
ズ部98の向きがバラバラとなり易く、それぞれの光軸を
一定方向に揃えることは困難であった。しかも、各LE
D素子70は、ハット型の樹脂製外囲器90内に溶融した樹
脂を充填しておき、これに先端部分に反射鏡を兼ねた凹
部92を形成した端子72aと他方の端子72bを挿入した
後、樹脂を硬化させることによって形成されるものであ
るため、反射鏡(凹部92)とレンズ98との位置精度を高
く維持することは困難であった。このため、例え各LE
D素子70のレンズ部98を一定方向に揃えられたとして
も、個々のLED素子70の光軸が揃わないため、従来の
LED表示器78を多数集合させてディスプレイを構成し
た場合、部分的に明るさのムラが生じてしまい、高い表
示品質を実現できないという問題があった。さらには、
各LED素子70のレンズ部98が略半球状であり、LED
チップ94も一つしか備えていたいため、正面方向に対す
る表示性はともかくとして、左右方向からの視認性に劣
るという問題があった。
SUMMARY OF THE INVENTION A conventional LED display 78
In the above, a plurality of individually independent LEDs as described above
Since the elements 70 are assembled and the respective terminals 72 are inserted and mounted on the substrate 74, the overall thickness is inevitably increased by the amount of the terminals 72, which is a factor that hinders the thinning of outdoor displays and the like. Was. When soldering the terminal 72 of each LED element 70 by inserting the terminal 72 into the substrate,
The orientation of the lens portion 98 of each LED element 70 is likely to vary due to the inclination, warpage, or bending of the LED element 70, and it has been difficult to align the optical axes of the LED elements 70 in a certain direction. Moreover, each LE
The D element 70 was filled with molten resin in a hat-shaped resin envelope 90, and a terminal 72a having a concave portion 92 also serving as a reflecting mirror at a tip portion and the other terminal 72b were inserted into the hat. After that, since it is formed by curing the resin, it has been difficult to maintain high positional accuracy between the reflecting mirror (recess 92) and the lens 98. Therefore, even if each LE
Even if the lens portions 98 of the D elements 70 are aligned in a certain direction, the optical axes of the individual LED elements 70 are not aligned. There is a problem that brightness unevenness occurs and high display quality cannot be realized. Moreover,
The lens part 98 of each LED element 70 is substantially hemispherical,
Since it is desired to provide only one chip 94, there is a problem that visibility from the left and right directions is poor, irrespective of display properties in the front direction.

【0005】この発明は、このような従来の問題点を解
決するために案出されたものであり、全体として薄型化
が可能であると共に、各LED素子の光軸を容易に揃え
ることができるため表示ムラが生じ難く、左右からの視
認性も良好なLED表示器を実現することを目的とす
る。
The present invention has been devised to solve such a conventional problem, and it is possible to reduce the thickness as a whole and easily align the optical axes of the LED elements. Therefore, it is an object to realize an LED display in which display unevenness hardly occurs and visibility from the left and right is good.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、この発明に係るLED表示器は、表面に所定の配線
パターンが形成された基板、該基板の表面に形成された
複数の凹部、各凹部内壁面に配置され上記配線パターン
に接続された金属製の複数の反射部材、各凹部内に配置
され一端が上記反射部材と接続された一対のLEDチッ
プ、各LEDチップの他端と上記配線パターンとを接続
するボンディングワイヤとを有するLEDモジュール
と、略半楕円球状のレンズキャップ部を複数形成した透
光性材料よりなるカバー部材とを備え、該カバー部材の
各レンズキャップ部によって上記LEDモジュールの各
凹部が覆われると共に、各凹部内のLEDチップの配列
方向と各レンズキャップ部の略楕円状開口部の長径側中
心軸の方向とが略一致するように、カバー部材とLED
モジュールとが位置決めされ、上記カバー部材内面とL
EDモジュール表面との間に樹脂材が充填されることに
よって、各レンズキャップ部と上記凹部との間にそれぞ
れLED素子が形成されていることを特徴とする。
In order to achieve the above object, an LED display according to the present invention comprises a substrate having a predetermined wiring pattern formed on a surface thereof, a plurality of recesses formed on the surface of the substrate, A plurality of metal reflecting members arranged on the inner wall surface of each recess and connected to the wiring pattern, a pair of LED chips arranged in each recess and having one end connected to the reflecting member, and the other end of each LED chip and An LED module having a bonding wire for connecting to a wiring pattern; and a cover member made of a light-transmitting material having a plurality of substantially semi-elliptical spherical lens cap portions formed thereon. Each concave portion of the module is covered, and the direction of the arrangement of the LED chips in each concave portion and the direction of the central axis on the major diameter side of the substantially elliptical opening of each lens cap portion are substantially the same. As to the cover member and the LED
The module is positioned, and the inner surface of the cover member and L
An LED element is formed between each lens cap portion and the concave portion by filling a resin material with the surface of the ED module.

【0007】このLED表示器は、例えば、以下の工程
によって製造される。まず、基板の表面に予め所定の配
線パターンを形成すると共に、該配線パターンと接続さ
れた金属製の反射パターンを複数形成しておき、該反射
パターン形成箇所に対して絞り加工を施すことにより、
上記基板表面に複数の凹部を形成すると同時に複数の反
射部材を形成する。つぎに、上記基板の各凹部内に一対
のLEDチップを配置させて、各LEDチップの一端と
上記反射部材とを接続し、また各LEDチップの他端と
上記配線パターンとをボンディングワイヤを介して接続
することによってLEDモジュールを形成する。つぎ
に、略半楕円球状のレンズキャップ部が複数形成された
透光性材料よりなるカバー部材の内側に所定の樹脂材を
充填させ、上記LEDモジュールのLEDチップ配置面
を下に向けて、各凹部内のLEDチップの配列方向と各
レンズキャップ部の略楕円状開口部の長径側中心軸の方
向とが略一致するように、カバー部材とLEDモジュー
ルとを位置決めする。最後に、上記LEDモジュールを
上記カバー部材内に挿入させた後、上記樹脂材を硬化さ
せることによって、各レンズキャップ部と凹部との間に
それぞれLED素子を形成する。
This LED display is manufactured, for example, by the following steps. First, a predetermined wiring pattern is formed in advance on the surface of the substrate, a plurality of metal reflection patterns connected to the wiring pattern are formed, and a drawing process is performed on the reflection pattern forming portion.
A plurality of concave portions are formed on the surface of the substrate, and a plurality of reflective members are formed at the same time. Next, a pair of LED chips is arranged in each recess of the substrate, one end of each LED chip is connected to the reflection member, and the other end of each LED chip is connected to the wiring pattern via a bonding wire. To form an LED module. Next, a predetermined resin material is filled inside a cover member made of a translucent material in which a plurality of substantially semi-elliptical spherical lens cap portions are formed, and the LED chip arrangement surface of the LED module is turned downward. The cover member and the LED module are positioned so that the arrangement direction of the LED chips in the concave portion and the direction of the central axis on the long diameter side of the substantially elliptical opening of each lens cap portion substantially match. Finally, after the LED module is inserted into the cover member, the resin material is cured to form an LED element between each lens cap and the recess.

【0008】このLED表示器にあっては、独立した個
々のLED素子を集合させることなく、最初から複数の
LED素子を一体的に形成するものであり、各LED素
子毎に端子を備えているものではないため、その分全体
形状の薄型化を実現することができる。また、各LED
素子毎に端子が存在しない以上、端子の不具合に起因し
て各LED素子の光軸が不揃いとなることはあり得ず、
上記カバー部材におけるレンズキャップ部の形成位置及
び上記基板における凹部の形成位置を正確に設定すると
共に、カバー部材と基板との位置決めを正確に行いさえ
すれば、凹部内の反射部材とレンズキャップ部とを高い
位置精度で揃えることが可能となる。少なくとも、端子
の先端部に樹脂モールドを施す際に、該端子の先端部に
形成された反射鏡兼用の凹部とレンズ部との位置合わせ
を行わなければならない従来のLED素子に比べ、レン
ズキャップ部と反射部材との位置精度を飛躍的に向上さ
せることができる。さらに、各LED素子は一対のLE
Dチップを備え、しかも各LEDチップは略半楕円球状
のレンズキャップ部の長手方向に沿って配置されている
ため、横方向に対する配光特性が向上し、左右からの視
認性を高めることができる。
In this LED display, a plurality of LED elements are integrally formed from the beginning without assembling independent individual LED elements, and a terminal is provided for each LED element. Therefore, the overall shape can be reduced in thickness. In addition, each LED
As long as there is no terminal for each element, it is unlikely that the optical axes of each LED element will be irregular due to terminal failure,
Along with accurately setting the formation position of the lens cap portion in the cover member and the formation position of the concave portion in the substrate, as long as the positioning between the cover member and the substrate is accurately performed, the reflection member and the lens cap portion in the concave portion Can be aligned with high positional accuracy. At least, when a resin mold is applied to the distal end of the terminal, the lens cap portion needs to be aligned with the concave portion also serving as a reflecting mirror formed at the distal end of the terminal and the lens portion. The position accuracy between the mirror and the reflecting member can be dramatically improved. Further, each LED element has a pair of LEs.
Since a D chip is provided, and each LED chip is arranged along the longitudinal direction of the lens cap portion having a substantially semi-elliptical sphere, light distribution characteristics in the horizontal direction are improved, and visibility from the left and right can be improved. .

【0009】[0009]

【発明の実施の態様】以下にこの発明を、添付図面に沿
って説明する。図1に示すように、このLED表示器10
は、表示面12に一体的に形成され、それぞれマトリクス
状に配列された合計9個のLED素子14を備えている。
また、このLED表示器10は、図2に示すように、基板
16の表面の9箇所に凹部18を形成して内部にLEDチッ
プ20を配置させたLEDモジュール22と、各凹部18の上
方を覆う集光用のレンズキャップ部24を9個備えたカバ
ー部材26と、該カバー部材26とLEDモジュール22との
間に充填される光散乱材(ガラスビーズ)入りエポキシ
樹脂28とを備えている(図2は断面図であるため、凹部
18及びレンズキャップ部24が3個づつしか表されていな
いが、実際には上記LED素子14の数に対応し、それぞ
れ9個づつ形成されている)。上記LEDモジュール22
からは、第1の外部端子30、第2の外部端子32及び第3
の外部端子34が導出されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the accompanying drawings. As shown in FIG.
Has a total of nine LED elements 14 formed integrally with the display surface 12 and arranged in a matrix.
Further, as shown in FIG.
An LED module 22 in which concave portions 18 are formed at nine locations on the surface of the LED chip 16 and LED chips 20 are disposed therein, and a cover member 26 having nine lens cap portions 24 for condensing light over the concave portions 18 And an epoxy resin 28 containing a light scattering material (glass beads) filled between the cover member 26 and the LED module 22 (FIG. 2 is a sectional view,
Although only three pieces 18 and three lens cap parts 24 are shown, actually nine pieces each are formed corresponding to the number of the LED elements 14). LED module 22 above
From the first external terminal 30, the second external terminal 32 and the third
The external terminal 34 is derived.

【0010】上記LEDモジュール22の基板16は、エポ
キシ樹脂等よりなり、該基板16の表面に絞り加工を施す
ことにより、上記凹部18が形成される(この絞り加工の
結果、基板16の裏側には凹部18に対応した凸部36が形成
される)。図3は、この凹部18周辺を示す拡大断面図で
あり、上記凹部18は底面側から開口側に向けて口径が拡
大する漏斗形状をなしており、その内面は反射部材38に
よって覆われている。
The substrate 16 of the LED module 22 is made of epoxy resin or the like, and the surface of the substrate 16 is subjected to drawing to form the concave portion 18 (as a result of the drawing, the backside of the substrate 16 is formed). Is formed with a convex portion 36 corresponding to the concave portion 18). FIG. 3 is an enlarged cross-sectional view showing the periphery of the concave portion 18. The concave portion 18 has a funnel shape whose diameter increases from the bottom side toward the opening side, and its inner surface is covered by a reflecting member 38. .

【0011】反射部材38は、銅などの導電性金属よりな
り、その表面には金メッキが施されている。この反射部
材38の表面には、一対のLEDチップ20a,20bが所定
の間隔をおいて配置されており、各LEDチップ20a,
20bの一端はそれぞれ反射部材38に電気的に接続されて
いる。各LEDチップ20a,20bの他端は、金線等より
なるボンディングワイヤ40を介して、基板16の表面に予
め配設された配線パターン42に接続されている。また、
各反射部材38も、図示は省略したが、配線パターン42に
接続されている。
The reflection member 38 is made of a conductive metal such as copper, and its surface is plated with gold. A pair of LED chips 20a and 20b are arranged at a predetermined interval on the surface of the reflecting member 38.
One end of each 20b is electrically connected to the reflection member 38. The other end of each of the LED chips 20a and 20b is connected to a wiring pattern 42 provided in advance on the surface of the substrate 16 via a bonding wire 40 made of a gold wire or the like. Also,
Although not shown, each reflection member 38 is also connected to the wiring pattern 42.

【0012】各凹部18内に配置された一対のLEDチッ
プ20a,20bは、それぞれ同色の発光色を備えたものが
選定されており、LEDモジュール22全体では、赤色発
光用のLEDチップ20a,20bを備えた凹部18が4箇
所、また緑色発光用のLEDチップ20a,20bを備えた
凹部18が5箇所形成されている。図4は、このLEDモ
ジュール22に含まれる各LEDチップ20a,20bの接続
状態を示す回路図であり、各凹部18内のLEDチップ20
a,20b同士は並列接続されると共に、赤色発光用のL
EDチップ20a,20bは直列に接続されて群Rを形成す
ると共に、緑色発光用のLEDチップ20a,20bも直列
に接続されて群Gを形成し、それぞれの一端は第1の外
部端子30及び第2の外部端子32に接続され、他端は第3
の外部端子34に共通接続されている。上記基板16の表面
には、このような回路構成を実現できるように、上記配
線パターン42が描かれているのである。このLEDモジ
ュール22の場合、群Rに属する全LEDチップ20a,20
bを点灯させれば赤色表示が実現され、群Gに属する全
LEDチップ20a,20bを点灯させれば緑色表示が実現
される。また、群R及び群Gに属する全LEDチップ20
a,20bを点灯させることにより、赤色と緑色との混色
表示を実現することができる。
A pair of LED chips 20a and 20b arranged in each recess 18 are selected to have the same luminescent color, and the LED module 22 as a whole emits red LED chips 20a and 20b. Are formed at four places, and five recesses 18 are provided with LED chips 20a and 20b for emitting green light. FIG. 4 is a circuit diagram showing a connection state of the LED chips 20a and 20b included in the LED module 22.
a and 20b are connected in parallel, and L for red emission is used.
The ED chips 20a and 20b are connected in series to form a group R, and the LED chips 20a and 20b for green light emission are also connected in series to form a group G. The other end is connected to the second external terminal 32, and the other end is connected to the third
Are commonly connected to an external terminal 34 of The wiring pattern 42 is drawn on the surface of the substrate 16 so as to realize such a circuit configuration. In the case of this LED module 22, all the LED chips 20a, 20
When b is turned on, a red display is realized, and when all the LED chips 20a and 20b belonging to the group G are turned on, a green display is realized. Further, all the LED chips 20 belonging to the groups R and G
By lighting a and 20b, a mixed color display of red and green can be realized.

【0013】上記カバー部材26は、図5に示すように、
底の浅い升状に形成されており、その底面26aには9個
の略半楕円球状のレンズキャップ部24と、4個の円形ス
ペーサ44が一体的に形成されている。このカバー部材26
は、透明な耐候性アクリル樹脂等より形成されている。
図6はこのようなケース部材のA−A断面図であり、図
7はB−B断面図である。図示の通り、レンズキャップ
部24の開口部46は、そのA−A断面図に現れた中心軸X
の方が、B−B断面図に現れた中心軸Yよりも長い楕円
状を呈しており、上記基板16の凹部18内のLEDチップ
20a,20bは、この楕円状開口部46の長径側中心軸Xに
沿うように配列されている。
The cover member 26 is, as shown in FIG.
It is formed in a shallow square shape, and on its bottom surface 26a, nine substantially semi-elliptical spherical lens cap portions 24 and four circular spacers 44 are integrally formed. This cover member 26
Is formed of a transparent weather-resistant acrylic resin or the like.
FIG. 6 is an AA sectional view of such a case member, and FIG. 7 is a BB sectional view. As shown in the figure, the opening 46 of the lens cap portion 24 has a central axis X that appears in the AA cross-sectional view thereof.
Has an elliptical shape longer than the central axis Y appearing in the BB cross-sectional view, and the LED chip in the concave portion 18 of the substrate 16
20a and 20b are arranged along the major axis X of the elliptical opening 46.

【0014】つぎに、このLED表示器10の製造方法に
ついて説明する。まず、一面に銅箔が被着された基板16
の表面に対して選択的にエッチングを施すことによっ
て、予め必要な配線パターン42を形成すると共に、該配
線パターン42と接続された円形の反射パターンを9個形
成しておく。また、この配線パターン42及び反射パター
ンの表面にニッケルメッキを施した上に、さらに金メッ
キを施しておく。つぎに、上記反射パターン形成箇所に
対して絞り加工を施して、上記凹部18を形成すると同時
に、上記反射パターンを反射部材38に仕上げる。つぎ
に、反射部材38の表面に一対のLEDチップ20a,20b
の一端を直接接続させた後、各LEDチップ20a,20b
の他端と上記配線パターン42との間をボンディングワイ
ヤ40を介して接続して上記の回路構成を実現する。
Next, a method of manufacturing the LED display 10 will be described. First, the substrate 16 with copper foil on one side
By selectively etching the surface, a required wiring pattern 42 is formed in advance, and nine circular reflection patterns connected to the wiring pattern 42 are formed. The surfaces of the wiring pattern 42 and the reflection pattern are plated with nickel, and further plated with gold. Next, a drawing process is performed on the reflection pattern forming portion to form the concave portion 18 and, at the same time, finish the reflection pattern on the reflection member 38. Next, a pair of LED chips 20a, 20b
Of the LED chips 20a, 20b
Is connected via the bonding wire 40 to the other end of the wiring pattern 42 and the wiring pattern 42 to realize the above circuit configuration.

【0015】以上のようにしてLEDモジュール22を形
成した後、図8に示すように、カバー部材26の内側に溶
融したエポキシ樹脂28を充填させた後、上記LEDモジ
ュール22を逆さまにしてカバー部材26の開口26b内に挿
入させる。この際、基板16の表面が上記スペーサ44の端
面に当接するため、LEDチップ20a,20bとレンズキ
ャップ部24の内面との間の距離が一定に維持される。ま
た、基板16に形成された貫通孔48を通じて、余分な樹脂
28が基板16の裏側に逃がされる。
After the LED module 22 is formed as described above, as shown in FIG. 8, the interior of the cover member 26 is filled with a molten epoxy resin 28, and the LED module 22 is turned upside down. 26 into the opening 26b. At this time, the distance between the LED chips 20a, 20b and the inner surface of the lens cap portion 24 is kept constant since the surface of the substrate 16 is in contact with the end surface of the spacer 44. In addition, through the through hole 48 formed in the substrate 16, excess resin
28 is released to the back side of the substrate 16.

【0016】この後、樹脂28を硬化させることによって
LED表示器10が完成し、その表示面12には、カバー部
材26のレンズキャップ部24、基板16の凹部18、反射部材
38、一対のLEDチップ20a,20b、ボンディングワイ
ヤ40等を備えた9個のLED素子14が配設されることと
なる(図1)。因みに、図1に示したLED表示器10の
場合、中心部及び4つの角部に緑色発光用のLED素子
14が配置されると共に、残りの4箇所に赤色発光用のL
ED素子14が配置されている。
Thereafter, the LED display 10 is completed by curing the resin 28, and the display surface 12 has the lens cap portion 24 of the cover member 26, the concave portion 18 of the substrate 16, the reflection member
38, nine LED elements 14 including a pair of LED chips 20a and 20b, bonding wires 40, and the like are provided (FIG. 1). Incidentally, in the case of the LED display 10 shown in FIG. 1, a green light emitting LED element is provided at the center and four corners.
14 are arranged, and L for red emission is provided in the remaining four places.
The ED element 14 is provided.

【0017】このLED表示器10にあっては、上記基板
16の形状・寸法とカバー部材の開口26bの形状・寸法と
を揃えると共に、基板16の凹部18とカバー部材26のレン
ズキャップ部24とを、それぞれ決められた位置に正確に
形成してさえおけば、LEDモジュール22とカバー部材
26との係合に際して、反射部材38とレンズキャップ部24
との位置精度を高いレベルに維持することができる。
In the LED display 10, the substrate
The shape and size of the cover 16 and the shape and size of the opening 26b of the cover member are made uniform, and the concave portion 18 of the substrate 16 and the lens cap portion 24 of the cover member 26 are accurately formed at predetermined positions. For example, the LED module 22 and the cover member
When engaging with 26, the reflecting member 38 and the lens cap 24
And the positional accuracy of the position can be maintained at a high level.

【0018】このLED表示器10は、図9に示すよう
に、庇50を備えたケース52内に収納された後、壁面上に
ドットマトリクス状に多数組み付けられて電光表示盤の
一エレメントとして利用される。上記ケース52の前面部
53は、LED表示器10の形状に合わせた矩形状をなして
おり、この前面部53の開口内にLED表示器10は収納さ
れている。このケース52の後部には、後端面54aが傾斜
面となされた円筒状の胴部54が接続されている。また、
この後端面54aには、位置決め用の突起56が形成されて
いる。さらに、後端面54aからは、LED素子14の点灯
用の電源に接続される電源接続コード58が導出されてい
る。
As shown in FIG. 9, the LED display 10 is housed in a case 52 having an eaves 50 and then assembled in a dot matrix on a wall surface to be used as one element of an electric display panel. Is done. Front of case 52
Reference numeral 53 denotes a rectangular shape that matches the shape of the LED display 10, and the LED display 10 is housed in the opening of the front surface 53. The rear portion of the case 52 is connected to a cylindrical body portion 54 having a rear end surface 54a formed as an inclined surface. Also,
A projection 56 for positioning is formed on the rear end face 54a. Further, from the rear end face 54a, a power supply connection cord 58 connected to a power supply for lighting the LED element 14 is led out.

【0019】上記突起56を、垂直に立設された図示しな
い壁面の係合凹部に挿入して胴部54の後端面54aを壁面
に当接させると、LED表示器10の各LED素子14は、
その光軸がやや下方向に傾くこととなる。この結果、野
外において下方向からディスプレイを見上げた際に、十
分な明るさでの表示を実現することができる。また、各
LED素子14先端のレンズ部分が、横方向に広がる略半
楕円球状のレンズキャップ部24によって構成されてお
り、しかも各LED素子14内には一対のLEDチップ20
a,20bが横方向に並んで配置されているため、左右横
方向からの視認性も良好となる。
When the projections 56 are inserted into the vertically recessed engaging recesses on the wall (not shown) and the rear end surface 54a of the body 54 contacts the wall, each LED element 14 of the LED display 10 is ,
The optical axis is inclined slightly downward. As a result, when the display is looked up from below in the field, display with sufficient brightness can be realized. Further, the lens portion at the tip of each LED element 14 is constituted by a lens cap portion 24 having a substantially semi-elliptical sphere extending in the lateral direction, and a pair of LED chips 20 is provided in each LED element 14.
Since a and 20b are arranged side by side in the horizontal direction, the visibility in the left and right horizontal directions is also good.

【0020】なお、上記ケース52の胴部54は円筒状に形
成されているため、図10に示すように、複数のLED
表示器10を集合させた際には、各ケース52の胴部54間に
隙間が形成され、前面部53の裏側に適当な結合部材60を
装着させるスペースを確保することができる。このよう
に4個以上のLED表示器10を予め結合部材60で連結さ
せた後に、上記壁面に取り付けるようにすれば、単体の
LED表示器10を個別に取り付ける場合に比べ、作業の
効率化を図ることができる。
Since the body 54 of the case 52 is formed in a cylindrical shape, as shown in FIG.
When the display devices 10 are assembled, a gap is formed between the body portions 54 of the cases 52, and a space for mounting an appropriate coupling member 60 behind the front surface portion 53 can be secured. If four or more LED displays 10 are connected in advance by the connecting member 60 and then attached to the wall, work efficiency can be improved as compared with a case where a single LED display 10 is individually attached. Can be planned.

【0021】[0021]

【発明の効果】この発明に係るLED表示器にあって
は、独立した個々のLED素子を集合させることなく、
最初から複数のLED素子を一体的に形成するものであ
り、個々のLED素子毎に端子を設ける必要がないた
め、全体形状の薄型化を実現できると共に、各LED素
子の光軸を比較的容易に揃えることができる。また、各
LED素子は、略半楕円球状のレンズキャップ部の長手
方向に沿って配置された一対のLEDチップを備えてい
るため、横方向に対する配光特性に優れ、左右からの視
認性を高めることができる。
In the LED display according to the present invention, the independent individual LED elements are not assembled.
Since a plurality of LED elements are integrally formed from the beginning, it is not necessary to provide a terminal for each LED element, so that the overall shape can be reduced in thickness and the optical axis of each LED element is relatively easy. Can be aligned. In addition, since each LED element has a pair of LED chips arranged along the longitudinal direction of the substantially semi-elliptical spherical lens cap portion, it has excellent light distribution characteristics in the lateral direction and enhances visibility from the left and right. be able to.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係るLED表示器の表示面を示す正面
図である。
FIG. 1 is a front view showing a display surface of an LED display according to the present invention.

【図2】上記LED表示器の断面図である。FIG. 2 is a cross-sectional view of the LED display.

【図3】上記LED表示器の凹部周辺を示す拡大断面図
である。
FIG. 3 is an enlarged sectional view showing the periphery of a concave portion of the LED display.

【図4】LEDチップの接続状態を示す回路図である。FIG. 4 is a circuit diagram showing a connection state of an LED chip.

【図5】カバー部材を示す斜視図である。FIG. 5 is a perspective view showing a cover member.

【図6】図5のA−A断面図である。6 is a sectional view taken along line AA of FIG.

【図7】図5のB−B断面図である。FIG. 7 is a sectional view taken along line BB of FIG. 5;

【図8】LEDモジュールとカバー部材との係合過程を
示す分解図である。
FIG. 8 is an exploded view showing an engagement process between the LED module and the cover member.

【図9】LED表示器をケース内に収納した状態を示す
側面図である。
FIG. 9 is a side view showing a state where the LED display is housed in a case.

【図10】4個のケースを集合させた例を示す背面図で
ある。
FIG. 10 is a rear view showing an example in which four cases are assembled.

【図11】従来のLED表示器を示す部分断面図であ
る。
FIG. 11 is a partial sectional view showing a conventional LED display.

【図12】従来のLED素子を示す側面図である。FIG. 12 is a side view showing a conventional LED element.

【符号の説明】[Explanation of symbols]

10 LED表示器 14 LED素子 16 基板 18 凹部 20a LEDチップ 20b LEDチップ 22 LEDモジュール 24 レンズキャップ部 26 カバー部材 28 樹脂 38 反射部材 40 ボンディングワイヤ 42 配線パターン 46 楕円状開口部 X 長径側中心軸 10 LED display 14 LED element 16 Substrate 18 Recess 20a LED chip 20b LED chip 22 LED module 24 Lens cap 26 Cover member 28 Resin 38 Reflective member 40 Bonding wire 42 Wiring pattern 46 Oval opening X Central axis on major axis

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 表面に所定の配線パターンが形成された
基板と、該基板の表面に形成された複数の凹部と、各凹
部内壁面に配置され上記配線パターンに接続された金属
製の複数の反射部材と、各凹部内に配置され一端が上記
反射部材と接続された一対のLEDチップと、各LED
チップの他端と上記配線パターンとを接続するボンディ
ングワイヤとを有するLEDモジュールと、 略半楕円球状のレンズキャップ部を複数形成した透光性
材料よりなるカバー部材とを備え、 該カバー部材の各レンズキャップ部によって上記LED
モジュールの各凹部が覆われると共に、各凹部内のLE
Dチップの配列方向と各レンズキャップ部の略楕円状開
口部の長径側中心軸の方向とが略一致するように、カバ
ー部材とLEDモジュールとが位置決めされ、 上記カバー部材の内面とLEDモジュール表面との間に
樹脂材が充填されることによって、各レンズキャップ部
と上記凹部との間にそれぞれLED素子が形成されてい
ることを特徴とするLED表示器。
1. A substrate having a predetermined wiring pattern formed on a surface thereof, a plurality of recesses formed on the surface of the substrate, and a plurality of metal members arranged on the inner wall surface of each recess and connected to the wiring pattern. A reflecting member, a pair of LED chips disposed in each recess and having one end connected to the reflecting member,
An LED module having a bonding wire connecting the other end of the chip and the wiring pattern; and a cover member made of a light-transmitting material formed with a plurality of substantially semi-elliptical spherical lens cap portions. LED above by lens cap
Each recess of the module is covered and the LE in each recess
The cover member and the LED module are positioned so that the arrangement direction of the D chips and the direction of the central axis on the major diameter side of the substantially elliptical opening of each lens cap portion substantially coincide with each other, and the inner surface of the cover member and the LED module surface An LED display is characterized in that an LED element is formed between each of the lens cap portions and the concave portion by filling a resin material between the two.
【請求項2】 基板の表面に、所定の配線パターンを形
成すると共に、該配線パターンと接続された金属製の反
射パターンを複数形成しておき、該反射パターン形成箇
所に対して絞り加工を施すことにより、上記基板表面に
複数の凹部を形成すると同時に複数の反射部材を形成
し、該基板の各凹部内に一対のLEDチップを配置させ
て、各LEDチップの一端と上記反射部材とを接続し、
また各LEDチップの他端と上記配線パターンとをボン
ディングワイヤを介して接続することによってLEDモ
ジュールを形成し、 略半楕円球状のレンズキャップ部が複数形成された透光
性材料よりなるカバー部材の内側に所定の樹脂材を充填
させ、 上記LEDモジュールのLEDチップ配置面を下に向け
て、各凹部内のLEDチップの配列方向と各レンズキャ
ップ部の略楕円状開口部の長径側中心軸の方向とが略一
致するようにカバー部材とLEDモジュールとを位置決
めし、該LEDモジュールを上記カバー部材内に挿入さ
せた後に上記樹脂材を硬化させることにより、各レンズ
キャップ部と凹部との間にそれぞれLED素子を形成す
ることを特徴とするLED表示器の製造方法。
2. A predetermined wiring pattern is formed on the surface of the substrate, a plurality of metal reflection patterns connected to the wiring pattern are formed, and a drawing process is performed on the reflection pattern forming portion. By forming a plurality of recesses on the surface of the substrate and simultaneously forming a plurality of reflection members, a pair of LED chips are arranged in each recess of the substrate, and one end of each LED chip is connected to the reflection member. And
The other end of each LED chip is connected to the wiring pattern via a bonding wire to form an LED module, and a cover member made of a translucent material having a plurality of substantially semi-elliptical spherical lens cap portions formed thereon. The inside is filled with a predetermined resin material, and the LED chip arrangement surface of the LED module is directed downward, and the arrangement direction of the LED chips in each recess and the major axis side central axis of the substantially elliptical opening of each lens cap portion. By positioning the cover member and the LED module so that the directions substantially coincide with each other, and curing the resin material after inserting the LED module into the cover member, the space between each lens cap portion and the concave portion is obtained. A method for manufacturing an LED display, comprising forming an LED element.
JP9110414A 1997-04-11 1997-04-11 Led display unit and its driving method Pending JPH10288966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9110414A JPH10288966A (en) 1997-04-11 1997-04-11 Led display unit and its driving method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9110414A JPH10288966A (en) 1997-04-11 1997-04-11 Led display unit and its driving method

Publications (1)

Publication Number Publication Date
JPH10288966A true JPH10288966A (en) 1998-10-27

Family

ID=14535184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9110414A Pending JPH10288966A (en) 1997-04-11 1997-04-11 Led display unit and its driving method

Country Status (1)

Country Link
JP (1) JPH10288966A (en)

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WO2004023570A1 (en) * 2002-09-09 2004-03-18 Applied Innovative Technologies, Inc. Led light collection and uniform transmission system
US7868332B2 (en) * 2005-11-10 2011-01-11 Samsung Electronics Co., Ltd. High luminance light emitting diode and liquid crystal display device using the same
WO2011045904A1 (en) * 2009-10-15 2011-04-21 パナソニック株式会社 Display panel device, display device, and method for manufacturing display panel device
JP2011254008A (en) * 2010-06-03 2011-12-15 Sharp Corp Display device and method of manufacturing the same
GB2473185B (en) * 2009-08-28 2012-05-30 Ocean Led Ltd Luminaire
US8357950B2 (en) * 2005-12-27 2013-01-22 Sharp Kabushiki Kaisha Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device
US8558456B2 (en) 2011-04-27 2013-10-15 Panasonic Corporation Light emitting device and illumination apparatus including same
JP2016012070A (en) * 2014-06-30 2016-01-21 三菱電機株式会社 Display apparatus

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004023570A1 (en) * 2002-09-09 2004-03-18 Applied Innovative Technologies, Inc. Led light collection and uniform transmission system
US6827475B2 (en) 2002-09-09 2004-12-07 Steven Robert Vetorino LED light collection and uniform transmission system
US7868332B2 (en) * 2005-11-10 2011-01-11 Samsung Electronics Co., Ltd. High luminance light emitting diode and liquid crystal display device using the same
US8357950B2 (en) * 2005-12-27 2013-01-22 Sharp Kabushiki Kaisha Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device
GB2473185B (en) * 2009-08-28 2012-05-30 Ocean Led Ltd Luminaire
WO2011045904A1 (en) * 2009-10-15 2011-04-21 パナソニック株式会社 Display panel device, display device, and method for manufacturing display panel device
JP5208282B2 (en) * 2009-10-15 2013-06-12 パナソニック株式会社 Display panel device, display device, and method of manufacturing display panel device
US9088008B2 (en) 2009-10-15 2015-07-21 Joled Inc. Display panel device, display device, and method of manufacturing display panel device
JP2011254008A (en) * 2010-06-03 2011-12-15 Sharp Corp Display device and method of manufacturing the same
US8558456B2 (en) 2011-04-27 2013-10-15 Panasonic Corporation Light emitting device and illumination apparatus including same
JP2016012070A (en) * 2014-06-30 2016-01-21 三菱電機株式会社 Display apparatus

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