JPS472070U - - Google Patents
Info
- Publication number
- JPS472070U JPS472070U JP1971002843U JP284371U JPS472070U JP S472070 U JPS472070 U JP S472070U JP 1971002843 U JP1971002843 U JP 1971002843U JP 284371 U JP284371 U JP 284371U JP S472070 U JPS472070 U JP S472070U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971002843U JPS5130930Y2 (en) | 1971-01-27 | 1971-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971002843U JPS5130930Y2 (en) | 1971-01-27 | 1971-01-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS472070U true JPS472070U (en) | 1972-08-23 |
| JPS5130930Y2 JPS5130930Y2 (en) | 1976-08-03 |
Family
ID=27843388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1971002843U Expired JPS5130930Y2 (en) | 1971-01-27 | 1971-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5130930Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0267769A (en) * | 1988-09-02 | 1990-03-07 | Dowa Mining Co Ltd | Led light-emitting device and manufacture of light-emitting block used in the same device |
| JP2016213364A (en) * | 2015-05-12 | 2016-12-15 | 三菱電機株式会社 | Light-emitting device and display device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1046949A (en) * | 1963-10-21 | 1966-10-26 | Nat Res Dev | Bonding method |
-
1971
- 1971-01-27 JP JP1971002843U patent/JPS5130930Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1046949A (en) * | 1963-10-21 | 1966-10-26 | Nat Res Dev | Bonding method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0267769A (en) * | 1988-09-02 | 1990-03-07 | Dowa Mining Co Ltd | Led light-emitting device and manufacture of light-emitting block used in the same device |
| JP2016213364A (en) * | 2015-05-12 | 2016-12-15 | 三菱電機株式会社 | Light-emitting device and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5130930Y2 (en) | 1976-08-03 |