GB1046949A - Bonding method - Google Patents

Bonding method

Info

Publication number
GB1046949A
GB1046949A GB4142763A GB4142763A GB1046949A GB 1046949 A GB1046949 A GB 1046949A GB 4142763 A GB4142763 A GB 4142763A GB 4142763 A GB4142763 A GB 4142763A GB 1046949 A GB1046949 A GB 1046949A
Authority
GB
United Kingdom
Prior art keywords
junction
wafer
lens
gold
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4142763A
Inventor
Cyril Hilsum
Raymond David Knight
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Development Corp UK
Original Assignee
National Research Development Corp UK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Development Corp UK filed Critical National Research Development Corp UK
Priority to GB4142763A priority Critical patent/GB1046949A/en
Publication of GB1046949A publication Critical patent/GB1046949A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
    • B23K11/20—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded of different metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Abstract

<PICT:1046949/C4-C5/1> A PN junction radiation emitting semi - conductor wafer element 10 is bonded at one optically flat face to a mating optically flat face of a radiation transmissive element, e.g. part-spherical lens 6 centred at the PN junction by pressing the parts together while heated above the eutectic temperature of the material of the lens or wafer and a bonding metal sandwiched between them. The wafer is preferably gallium arsenide and the lens an insulating alloy of 95 parts gallium arsenide and 5 parts gallium phosphide. The bonding metal is in the form of a ring of gold applied by evaporation or from a solution of gold chloride. During or after bonding gold-plated electrodes 9, 10 are attached on opposite sides of the junction, ring 9 being of cobalt-iron-nickel alloy and stub 10 of molybdenum. It is also suggested to bond several emitter diodes and light-responsive diodes to opposite faces of a common parallelsided transparent slab.
GB4142763A 1963-10-21 1963-10-21 Bonding method Expired GB1046949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4142763A GB1046949A (en) 1963-10-21 1963-10-21 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4142763A GB1046949A (en) 1963-10-21 1963-10-21 Bonding method

Publications (1)

Publication Number Publication Date
GB1046949A true GB1046949A (en) 1966-10-26

Family

ID=10419625

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4142763A Expired GB1046949A (en) 1963-10-21 1963-10-21 Bonding method

Country Status (1)

Country Link
GB (1) GB1046949A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS472070U (en) * 1971-01-27 1972-08-23
JPS5380988A (en) * 1976-12-27 1978-07-17 Nippon Telegr & Teleph Corp <Ntt> Light emitting diode
GB2138208A (en) * 1983-04-08 1984-10-17 Telecommunications Sa Photovoltaic detector in optical immersion

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS472070U (en) * 1971-01-27 1972-08-23
JPS5130930Y2 (en) * 1971-01-27 1976-08-03
JPS5380988A (en) * 1976-12-27 1978-07-17 Nippon Telegr & Teleph Corp <Ntt> Light emitting diode
GB2138208A (en) * 1983-04-08 1984-10-17 Telecommunications Sa Photovoltaic detector in optical immersion

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