FR1599198A - - Google Patents

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Publication number
FR1599198A
FR1599198A FR1599198DA FR1599198A FR 1599198 A FR1599198 A FR 1599198A FR 1599198D A FR1599198D A FR 1599198DA FR 1599198 A FR1599198 A FR 1599198A
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FR
France
Prior art keywords
fingers
frame member
bonded
aligned
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
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French (fr)
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Filing date
Publication date
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Publication of FR1599198A publication Critical patent/FR1599198A/fr
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Abstract

1,199,849. Integrated circuit assembly. MOTOROLA Inc. 26 Nov., 1968 [15 Dec., 1967], No. 56014/68. Heading H1K. [Also in Division B3] The electrodes of a multielectrode semiconductor integrated circuit wafer are first aligned with and bonded to fingers extending inwardly from a flat frame member as by Soldering, brazing, resistance welding or ultrasonic bonding, after which fingers extending inwards from a second more massive flat frame member are aligned with and bonded to portions of the first frame fingers and excess portions of the frame member removed. Most of the subject matter of the specification is included in Specification 1,199,848. However, clearance may be provided between the fingers of the first frame member and the edge of the wafer by making the fingers of thinner section 36 of this point (see Fig. 3a) thus dispensing with the need to use the recessed anvil (Fig. 3, not shown).
FR1599198D 1967-12-15 1968-12-10 Expired FR1599198A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69104167A 1967-12-15 1967-12-15

Publications (1)

Publication Number Publication Date
FR1599198A true FR1599198A (en) 1970-07-15

Family

ID=24774934

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1599198D Expired FR1599198A (en) 1967-12-15 1968-12-10

Country Status (6)

Country Link
BE (1) BE725467A (en)
DE (1) DE1813164B2 (en)
FR (1) FR1599198A (en)
GB (1) GB1199849A (en)
IE (1) IE32531B1 (en)
NL (1) NL163899C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
DE2840973A1 (en) * 1978-09-20 1980-03-27 Siemens Ag METHOD FOR PRODUCING TESTABLE SEMICONDUCTOR MINIATURE HOUSING IN TAPE SHAPE
US4721992A (en) * 1986-06-26 1988-01-26 National Semiconductor Corporation Hinge tape
KR102152906B1 (en) * 2018-11-20 2020-09-09 세메스 주식회사 Bonding apparatus and bonding method

Also Published As

Publication number Publication date
DE1813164B2 (en) 1971-12-23
NL163899C (en) 1980-10-15
NL6817050A (en) 1969-06-17
NL163899B (en) 1980-05-16
DE1813164A1 (en) 1969-07-03
IE32531L (en) 1969-06-15
GB1199849A (en) 1970-07-22
BE725467A (en) 1969-06-13
IE32531B1 (en) 1973-09-05

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