GB1429358A - Electrical device manufacture - Google Patents

Electrical device manufacture

Info

Publication number
GB1429358A
GB1429358A GB2739373A GB2739373A GB1429358A GB 1429358 A GB1429358 A GB 1429358A GB 2739373 A GB2739373 A GB 2739373A GB 2739373 A GB2739373 A GB 2739373A GB 1429358 A GB1429358 A GB 1429358A
Authority
GB
United Kingdom
Prior art keywords
lead
leads
main
lead frame
resilient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2739373A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Components Ltd
Original Assignee
Mullard Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mullard Ltd filed Critical Mullard Ltd
Priority to GB2739373A priority Critical patent/GB1429358A/en
Publication of GB1429358A publication Critical patent/GB1429358A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

1429358 Leads for electrical devices MULLAKD Ltd 8 June 1973 27393/73 Heading H1K An electrical device body 3 is clipped against a support area of a first lead 4 of a main lead frame by a thinner resilient, cantilevered lead 10 attached to a securement area of a second lead of the main lead frame during the simultaneous attachment of both leads 4, 10 to the opposed surfaces of the body 3, e.g. by soldering or by heat-activated adhesive. The resilient lead 10 may be bonded to the securement area by ultrasonic welding, thermo-compression bonding, high temperature soldering or the like. The lead 10 may itself be cut from a secondary lead frame and further leads 11 may also be joined to it. The arrangement shown is a fullwave bridge rectifier including four PN junction semi-conductor diodes 3 clipped on to two support leads 4 by two pairs of bowed, resilient clipping leads 10, 11. After heating to solder the diodes 3 to the various leads the entire assembly is enclosed in a moulded plastics envelope and the cross-hatched portions 7, 8 of the main lead frame are removed in the conventional manner. Both main and secondary lead frames may be of Cu, or the latter may be of Ni. Other semi-conductor devices mentioned are transistors and thyristors, and resistors and capacitors are also referred to.
GB2739373A 1973-06-08 1973-06-08 Electrical device manufacture Expired GB1429358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2739373A GB1429358A (en) 1973-06-08 1973-06-08 Electrical device manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2739373A GB1429358A (en) 1973-06-08 1973-06-08 Electrical device manufacture

Publications (1)

Publication Number Publication Date
GB1429358A true GB1429358A (en) 1976-03-24

Family

ID=10258862

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2739373A Expired GB1429358A (en) 1973-06-08 1973-06-08 Electrical device manufacture

Country Status (1)

Country Link
GB (1) GB1429358A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4137546A (en) * 1977-10-14 1979-01-30 Plessey Incorporated Stamped lead frame for semiconductor packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4137546A (en) * 1977-10-14 1979-01-30 Plessey Incorporated Stamped lead frame for semiconductor packages

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee