JPS58191460A - Electronic parts - Google Patents

Electronic parts

Info

Publication number
JPS58191460A
JPS58191460A JP57074979A JP7497982A JPS58191460A JP S58191460 A JPS58191460 A JP S58191460A JP 57074979 A JP57074979 A JP 57074979A JP 7497982 A JP7497982 A JP 7497982A JP S58191460 A JPS58191460 A JP S58191460A
Authority
JP
Japan
Prior art keywords
parts
chip
terminals
capacitors
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57074979A
Other languages
Japanese (ja)
Inventor
Shugo Endo
Tatsuhiko Irie
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP57074979A priority Critical patent/JPS58191460A/en
Publication of JPS58191460A publication Critical patent/JPS58191460A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Abstract

PURPOSE:To construct a semiconductor integrated circuit assembling capacitors of large capacity to the circuit by a method wherein the chip capacitors are connected to the necessary part between the terminals of a lead frame, and are insulatingly sealed with synthetic resin leaving the terminal tip parts. CONSTITUTION:Gold plating is applied to the die attaching parts 1a at the central part and the wire bonding parts 1b of the lead frame 1. The chip 2 of the semiconductor integrated circuit is die bonded to the die attaching part 1a, and the bonding pads of the chip 2 and the terminals 1c are connected according to wire bonding 3. The chip capacitors 5 are mounted on the necessary parts between the terminals 1c to be soldered or to be connected by a conductive adhesive. The chip 2 and the chip capacitors 5 are insulatingly sealed with synthetic resin leaving the tip parts of the terminals 1c. The parts 1d provided with guide holes 1e used when the frame is put on a conveyer are cut off to produce the final product.
JP57074979A 1982-04-30 1982-04-30 Electronic parts Pending JPS58191460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57074979A JPS58191460A (en) 1982-04-30 1982-04-30 Electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57074979A JPS58191460A (en) 1982-04-30 1982-04-30 Electronic parts

Publications (1)

Publication Number Publication Date
JPS58191460A true JPS58191460A (en) 1983-11-08

Family

ID=13562912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57074979A Pending JPS58191460A (en) 1982-04-30 1982-04-30 Electronic parts

Country Status (1)

Country Link
JP (1) JPS58191460A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582697A (en) * 1991-09-20 1993-04-02 Nippondenso Co Ltd Lead frame of semiconductor device
JPH05206373A (en) * 1992-01-28 1993-08-13 Nec Kyushu Ltd Semiconductor integrated circuit device
JP2003086756A (en) * 2001-09-11 2003-03-20 Denso Corp Ic package and manufacturing method therefor
IT201700055987A1 (en) * 2017-05-23 2018-11-23 St Microelectronics Srl PROCEDURE FOR MANUFACTURING SEMICONDUCTOR AND CORRESPONDING PRODUCT DEVICES

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582697A (en) * 1991-09-20 1993-04-02 Nippondenso Co Ltd Lead frame of semiconductor device
JPH05206373A (en) * 1992-01-28 1993-08-13 Nec Kyushu Ltd Semiconductor integrated circuit device
JP2003086756A (en) * 2001-09-11 2003-03-20 Denso Corp Ic package and manufacturing method therefor
IT201700055987A1 (en) * 2017-05-23 2018-11-23 St Microelectronics Srl PROCEDURE FOR MANUFACTURING SEMICONDUCTOR AND CORRESPONDING PRODUCT DEVICES

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