JP2016213364A - Light-emitting device and display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device which has a wide viewing angle with high contrast, and to provide a display device including the same.SOLUTION: The light-emitting device 100 is constituted of LED chips 1r to 1b each emitting a beam of light; an element base plate 2; and an encapsulation member 3 formed of a material which is translucent to the beam of light emitted from the LED chips 1r to 1b and encapsulates the LED chips 1r to 1b. The periphery of the LED chips 1r to 1b is formed lower than a position of a virtual plane, which extends in contact with the apexes of the LED chips 1r to 1b and is parallel to the surface of the element base plate 2, and surface of the element base plate 2 is formed in a dark color.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device and a display device.

  Display devices including light-emitting devices are used in various places, indoors and outdoors. The display device generally constitutes a display screen by arranging a plurality of light emitting devices in a matrix. The display device displays characters, figures, and other images on the display screen by changing the luminance and emission color of each light emitting device in accordance with an externally input signal.

  In the light emitting device, three LED (Light Emitting Diode) chips corresponding to the three primary colors are mounted on the bottom surface of the concave portion formed in the package, and the concave portion is made transparent to the emitted light from the LED chip. What is sealed with a sealing member is used.

  As disclosed in Patent Document 1, conventionally, a molded body made of a white resin has been used for a package of each light emitting device. Accordingly, the entire inner surface including the bottom and side surfaces of the package recess is white.

JP 2014-7340 A

  In recent years, there has been a demand for higher definition display devices. Since the package is white, when a large number of light emitting devices are arranged on the circuit board at a high density, the proportion of the white portion in the display area of the display device increases. Since the white portion has a high reflectance with respect to external light such as sunlight and illumination light, reflection or scattering of external light is likely to occur, and a display device with high contrast cannot be realized.

  As a measure for suppressing the decrease in contrast, it is conceivable to make the inner surface of the package recess black. However, when the inner surface of the package recess is made black, the loss of light emitted from the LED chip in the recess increases, and the light emission efficiency of the light emitting device decreases.

  As a measure for suppressing the decrease in contrast while using a white package without making the inner surface of the package recess black, it is conceivable to increase the aspect ratio of the package recess (the depth of the recess / the width of the recess bottom). This is because the higher the aspect ratio of the package recess, the more easily the external light incident on the package recess is attenuated in the recess, and therefore, reflection and scattering are less likely to occur. However, when the aspect ratio is increased, the amount of light incident on the side surface of the concave portion of the emitted light from the LED chip increases. Although the side surface of the recess is white, the light reflectivity is not 100%, so it is inevitable that the emitted light from the LED chip is attenuated on the side surface of the recess. For this reason, while the contrast can be improved, the loss of the emitted light from the LED chip tends to occur in the recess, and only a narrow viewing angle can be realized.

  An object of the present invention is to provide a light emitting device having a high contrast and a wide viewing angle, and a display device including the light emitting device.

  Another object of the present invention is to provide a light emitting device with high contrast and less loss of radiated light from the light emitting element, and a display device including the same.

  In order to achieve the above object, a light-emitting device according to the present invention includes at least one light-emitting element that emits light, and an element substrate on which the light-emitting element is disposed, the light-emitting element disposed on the element substrate. The periphery is formed lower than the position of a virtual plane passing through the top of the light emitting element and parallel to the surface of the element substrate, and the surface is formed in a dark color, and the light emitted from the light emitting element is transparent. And a sealing member that seals the light emitting element.

  Since the element substrate is formed so that the periphery of the light emitting element is lower than the position of the virtual plane passing through the top of the light emitting element and parallel to the surface of the element substrate, loss of light emitted from the light emitting element is unlikely to occur, and the wide field of view A corner can be secured.

  In addition, since the surface of the element substrate is formed in a dark color, even if external light such as sunlight or illumination light enters the element substrate, the external light is attenuated on the surface of the element substrate. For this reason, reflection or scattering of external light hardly occurs, and high contrast can be realized.

(A) is a top view of the light-emitting device according to Embodiment 1, (B) is a front view of the light-emitting device, and (C) is a right side view of the light-emitting device. It is sectional drawing of a LED chip. 1 is a schematic perspective view of a display device according to Embodiment 1. FIG. 2A and 2B are cross-sectional views of the display device according to Embodiment 1, where FIG. 3A is a cross-sectional view parallel to the yz plane, and FIG. 3B is a cross-sectional view parallel to the xz plane. 7 is a cross-sectional view parallel to the yz plane of a display device according to Embodiment 2. (A) is a top view of the light-emitting device according to Embodiment 3, (B) is a front view of the light-emitting device, and (C) is a right side view of the light-emitting device. (A) is a top view of the light-emitting device according to Embodiment 4, (B) is a front view of the light-emitting device, and (C) is a right side view of the light-emitting device. (A) is a right side view of the light emitting device according to the first embodiment, and (B) is a right side view of the light emitting device according to the fourth embodiment. (A) is a top view of the light-emitting device according to Embodiment 5, (B) is a front view of the light-emitting device, and (C) is a right side view of the light-emitting device. (A) is a top view of the light-emitting device according to Embodiment 6, (B) is a front view of the light-emitting device, and (C) is a right side view of the light-emitting device. (A) is a top view of the light-emitting device according to Embodiment 7, (B) is a front view of the light-emitting device, and (C) is a right side view of the light-emitting device. (A) is a top view of the light-emitting device according to Embodiment 8, (B) is a front view of the light-emitting device, and (C) is a right side view of the light-emitting device.

  Embodiments of a light emitting device and a display device according to the present invention will be described below with reference to the drawings. In the drawings, the same or equivalent parts are denoted by the same reference numerals.

(Embodiment 1)
As shown in FIG. 1, the light emitting device 100 includes three LED chips 1r, 1g, and 1b that emit red light, green light, and blue light, respectively, and a flat element in which these LED chips 1r to 1b are arranged on the surface. A substrate 2 and a sealing member 3 for sealing the LED chips 1r to 1b are provided.

  A red LED chip 1r that emits red light, a green LED chip 1g that emits green light, and a blue LED chip 1b that emits blue light are arranged in a row under the condition that the green LED chip 1g is arranged in the center, It is disposed on the element substrate 2. The arrangement positions of the LED chips 1r, 1g, and 1b are not particularly limited. For example, the LED chips 1r, 1g, and 1b may be arranged at the positions of the apexes of the triangle.

  As shown in FIG. 2, each of the LED chips 1 r to 1 b includes a reflective layer 12, an n-type GaN layer 13, an active layer 14 as a light emitting layer, and a p-type GaN layer 15 in this order on a sapphire substrate 11. It has a stacked semiconductor stacked structure. The back surface of the sapphire substrate 11 and the top surface of the p-type GaN layer 15 are both flat, and both are formed substantially in parallel.

  An anode electrode 16 a is formed on the p-type GaN layer 15. A part of the surface of the n-type GaN layer 13 is exposed without being covered with the active layer 14 and the p-type GaN layer 15, and a cathode electrode 16 c is formed in the exposed region. By supplying power to the LED chips 1r to 1b through the anode electrode 16a and the cathode electrode 16c, the active layer 14 emits light.

  As shown in FIG. 1, the element substrate 2 includes a substrate 22 having an insulating property and a plurality of electrodes 21ra, 21ga,..., 21bc formed on the substrate 22.

  The electrodes 21ra, 21ga, and 21ba are anode electrodes, and the electrodes 21rc, 21gc, and 21bc are cathode electrodes. The anode electrodes 21ra-21bc are electrically connected to the anode electrodes 16a (see FIG. 2) of the corresponding LED chips 1r-1b by wire bonding. The cathode electrodes 21rc-21bc are electrically connected to the cathode electrodes 16c (see FIG. 2) of the corresponding LED chips 1r-1b by wire bonding.

  The board | substrate 22 is comprised with the printed circuit board which used the black thing for the soldering resist. For this reason, the entire surface of the substrate 22 is black.

  The portions of the electrodes 21ra to 21bc exposed on the surface of the element substrate 2 are also processed so as to exhibit a black color. Specifically, the process which apply | coats a black coating material is given to the electroconductive member made from Cu which comprises electrode 21ra-21bc.

  The sealing member 3 is provided to protect the LED chips 1r to 1b, the electrodes 21ra to 21bc, and the like from moisture, dust, and the like, and is transparent to light emitted from the LED chips 1r to 1b. The material which has, specifically, a silicone resin.

  The light emitting device 100 is manufactured by the following process. First, an element substrate 2 configured by cutting a mother substrate with high flatness is prepared. Next, the LED chips 1r, 1g, and 1b are disposed on the element substrate 2. Next, the electrodes 21ra and 21rc are electrically connected to the anode electrode 16a and the cathode electrode 16c of the LED chip 1r by wire bonding. Similarly, electrodes 21ga and 21gc are connected to anode electrode 16a and cathode electrode 16c of LED chip 1g, and electrodes 21ba and 21bc are connected to anode electrode 16a and cathode electrode 16c of LED chip 1b. Next, a black paint is applied to the surfaces of the electrodes 21ra to 21bc. Next, the element substrate 2 is arranged so that the LED chips 1r to 1b are accommodated in the concave portions of the mold in which the concave portions corresponding to the shape of the sealing member 3 are formed. Next, when a liquid resin is injected into the recess of the mold and the resin is cured, the sealing member 3 is formed on the element substrate 2.

  According to the light emitting device 100 described above, since the surface of the element substrate 2 is formed in black, even when external light is incident on the element substrate 2, the external light is attenuated on the surface of the element substrate 2. For this reason, reflection or scattering of outside light hardly occurs, and thus high contrast is realized. Here, external light refers to light incident on the display device 200 from the outside of the light emitting device 100, and specifically corresponds to sunlight, illumination light, or the like.

  Note that each of the LED chips 1r to 1b has the reflective layer 12 below the active layer 14, that is, on the element substrate 2 side, so that the emitted light from the LED chips 1r to 1b is formed on the black surface of the element substrate 2. Hardly enters. For this reason, it is avoided that the brightness is sacrificed even though the surface of the element substrate 2 is black and high contrast is realized.

  Next, a display device 200 including the light emitting device 100 described above will be described with reference to FIGS.

  As shown in FIG. 3, the display device 200 includes a plurality of light emitting devices 100, a circuit board 101, and a louver 102.

  The plurality of light emitting devices 100 are arranged in a matrix on a flat circuit board 101 having a substantially rectangular shape in plan view. Although not shown, anode wiring and cathode wiring are formed on the circuit board 101, and the corresponding anode electrodes 21ra to 21ba and cathode electrodes 21rc to 21bc in FIG. 1 are mechanically connected by a method such as soldering. And electrically connected.

  Here, as shown in FIG. 3, consider an xyz orthogonal coordinate system in which the direction parallel to one side of the display device 200 is the x-axis direction and the thickness direction is the z-axis direction. 4A is a cross-sectional view parallel to the yz plane of the display device 200, and FIG. 4B is a cross-sectional view parallel to the xz plane of the display device 200. Hereinafter, the configuration of the display device 200 will be described in detail with reference to these drawings.

  The louver 102 is provided on the flat circuit board 101 together with the light emitting device 100. The louver 102 includes a base end portion 102a disposed between the light emitting devices 100 adjacent to each other in the x direction and the y direction, and a projecting portion 102b that projects from the base end portion 102a in a z-direction. As shown in FIG. 4A, the protruding portion 102b extends in the x-axis direction.

  The base end portion 102a and the protruding portion 102b of the louver 102 have a black color, which is, for example, a molded body obtained by adding a colorant such as carbon black to a resin such as polycarbonate resin, or black on the surface of the resin or metal. This is realized by applying or filming the above material.

  According to this display device 200, when the y-axis direction is arranged in the vertical direction (top and bottom direction) and the x-axis direction is the left-right direction, for example, when used outdoors, the sunlight is in the yz plane. Incident light from the direction into the light emitting device 100 is prevented by the protruding portion 102b of the louver 102, and as a result, reflected or scattered light of sunlight from the light emitting device 100 is reduced. For this reason, it is possible to reduce the dependency of contrast on the viewing angle with respect to the yz in-plane direction (vertical direction).

  Moreover, since the surface of the element substrate 2 in the light emitting device 100 is formed in black, even if sunlight is incident on the element substrate 2 of the light emitting device 100, reflection or scattering hardly occurs in the element substrate 2. For this reason, high contrast can be realized. As a result, a clear color image can be obtained.

  Further, as described above, the element substrate 2 is formed by cutting a mother substrate with high flatness, and the LED chips 1r to 1b are also formed flat so that the upper surface and the lower surface thereof are parallel to each other. Similarly, since the element substrate 2 is mounted on the flat circuit board 101, the positions of the upper surfaces of the LED chips 1r to 1b are aligned between the light emitting devices 100, and variations in the inclination of the upper surfaces of the LED chips 1r to 1b are small. For this reason, the display device 200 does not show uneven brightness even when viewed obliquely, and a uniform image quality can be obtained.

  By the way, the base end part 102a of the louver 102 is on the circuit board 101 side from the position of the virtual plane S1 passing through the tops of the LED chips 1r to 1b in each light emitting device 100 and parallel to the circuit board 101. For this reason, the emitted light from the LED chips 1r to 1b is not blocked by the base end portion 102a. Further, the viewing angle of the display device 200 is not narrowed by the base end portion 102a. In the present display device 200, the viewing angle in the yz plane (θ in FIG. 4A) is determined by the interval in the y direction of the protruding portions 102b of the louver 102 and the protruding height of the protruding portions 102b in the z direction.

  In this regard, in the present embodiment, as illustrated in FIG. 1, the light emitting device 100 has a configuration in which no member that blocks light emitted from the LED chips 1 r to 1 b exists around the LED chips 1 r to 1 b. Therefore, even if the distance between the protrusions 102b in the y direction and the protrusion height in the z direction are the same, a wider viewing angle θ can be realized as compared with the case where a package having a recess is formed as in the prior art.

  4B, the louver 102 does not block the light emitted from the light emitting device 100 in the xz in-plane direction (left-right direction). For this reason, the display device 200 can realize a viewing angle wider than the viewing angle θ in the yz plane in the xz plane. Since the base end portion 102a of the louver 102 is black, it plays a role of absorbing outside light even in the xz plane.

(Embodiment 2)
In FIG. 5, the position of the tip of the louver 102 ′ in the protruding direction (z direction) is arranged at a position lower than the position of the virtual plane S 1 that passes through the tops of the LED chips 1 r to 1 b in each light emitting device 100 and is parallel to the circuit board 101. An embodiment is shown. According to this configuration, also in the yz plane, a wider viewing angle can be realized than in the configuration example of FIG.

  Here, the top part of the LED chip refers to a part of the LED chip having the highest height from the surface of the element substrate 2. Moreover, when the height of each top part of a some LED chip differs, the top part of a LED chip points out the lowest top part among them.

(Embodiment 3)
FIG. 6 shows an embodiment in which a wall portion 22 a rising from the substrate 22 so as to have an inner surface facing the LED chips 1 r to 1 b is provided on the peripheral portion of the substrate 22 constituting the element substrate 2.

  However, the height of the wall 22a is lower than the position of the virtual plane S2 that passes through the tops of the LED chips 1r to 1b and is parallel to the surface of the element substrate 2. For this reason, loss of light emitted from the LED chips 1r to 1b is unlikely to occur, and a wide viewing angle can be secured. In order to obtain such an effect, in short, the element substrate 2 only needs to have a configuration in which the periphery of the LED chips 1r to 1b is formed lower than the position of the virtual plane S2.

(Embodiment 4)
FIG. 7 shows an embodiment in which the sealing member 50 constitutes a convex lens whose lens optical axis is parallel to the normal to the surface of the element substrate 2. When the sealing member 50 constitutes a convex lens, a phenomenon that the radiated light from the LED chip is reflected on the surface of the sealing member 50 toward the element substrate 2 (hereinafter referred to as interface reflection) is less likely to occur.

  This point will be described with reference to FIG. As shown in FIG. 8A, when the surface of the sealing member 50 is flat, for example, in the peripheral end portion of the surface of the sealing member 50, the emitted light from the LED chip is incident at a shallow incident angle. Return light R due to interface reflection is likely to occur. When the return light R is generated, the light emission efficiency of the light emitting device 100 is lowered. On the other hand, as shown in FIG. 8B, when the sealing member 50 constitutes a convex lens, the incident angle at which the emitted light from the LED chip is large also to the peripheral end portion of the surface of the sealing member 50 Therefore, the return light R due to the interface reflection is hardly generated. For this reason, high luminous efficiency is realized. The sealing member 50 may constitute a Fresnel lens.

(Embodiment 5)
FIG. 9 shows an embodiment in which the sealing member 51 is formed in a cylindrical lens shape in which the lens optical axis is parallel to the normal to the surface of the element substrate 2. The extending direction (the left-right direction in FIG. 8) of the cylindrical surface of the cylindrical lens of the cylindrical lens constituted by the sealing member 51 is parallel to one side of the element substrate 2 having a substantially square shape in plan view.

  According to the light emitting device 100, when the display device 200 is configured by arranging the cylindrical lens so that the cylindrical surface of the cylindrical lens faces the x direction in FIG. 4, the light emitting device 100 does not collect light in the x axis direction (left and right direction). Therefore, it is possible to suppress the spread of light generated in the LED chips 1r to 1b in the yz plane while maintaining a wide viewing angle.

  The display device 200 may be configured by arranging the light emitting device 100 such that the cylindrical generatrix of the cylindrical lens faces the y direction in FIG. 4. In this case, the viewing angle in the yz plane is good. Assured, in the xz plane, the spread of light generated in the LED chips 1r to 1b can be suppressed.

(Embodiment 6)
FIG. 10 shows an embodiment in which the sealing member 52 constituting the cylindrical lens has a chamfered corner portion 52c where the cylindrical surface 52a of the cylindrical lens intersects with both end surfaces 52b in the generatrix direction of the cylindrical surface 52a.

  By chamfering the corner 52c, the directivity of the light emitted from the LED chips 1r to 1b is parallel to both the generatrix of the cylindrical surface 52a and the lens optical axis (the front surface of FIG. It is possible to reduce the dependence on the angle in the (parallel cross section).

(Embodiment 7)
FIG. 11 shows an embodiment in which a diffusion layer 53 for diffusing the light emitted from the LED chips 1r to 1b is formed over the entire surface of the sealing member 52 constituting the cylindrical lens. The diffusion layer 53 is, for example, a base material such as a transparent resin that is transparent to the light emitted from the LED chips 1r to 1b, and the base material for the light emitted from the LED chips 1r to 1b. It is configured by dispersing particles such as glass beads having different refractive indexes.

  By forming the diffusion layer 53, for example, the dependency of the directivity of light emitted from the LED chips 1r to 1b on the angle in any in-plane direction can be further reduced. In addition, you may form the diffusion layer 53 only in a part of surface of the sealing member 52, for example, only in the area | region just above LED chip 1r-1b.

(Embodiment 8)
FIG. 12 shows an embodiment in which a light shielding layer 54 is formed on a part of the periphery of the sealing member 3. The light shielding layer 54 is formed so as to cover the side surface of the sealing member 3 corresponding to the position of one side of the substantially square-shaped element substrate 2 in plan view.

  The light shielding layer 54 is configured to prevent external light such as sunlight or indoor illumination light from entering the element substrate 2 through the sealing member 3, and can be configured by, for example, a black film or coating. The black film or coating can be realized by, for example, applying or forming a film in which a coloring material for obtaining black or dark color is dissolved in a solvent. Examples of the colorant include amorphous carbon such as carbon black, or inorganic oxides such as chromium oxide, manganese oxide, and iron oxide.

  In addition, since the light shielding layer 54 is provided only in a part of the periphery of the sealing member 3, the height of the light shielding layer 54 may be higher than the tops of the LED chips 1r to 1b. Although FIG. 12 shows an example in which the height of the light shielding layer 54 is higher than the tops of the LED chips 1r to 1b, the height of the light shielding layer 54 may be lower than the tops of the LED chips 1r to 1b.

  According to the light emitting device 100, when the display device 200 is configured by arranging the light shielding layer 54 in the direction extending in the x-axis direction in FIG. 4A, not only the louver 102 but also the light shielding layer 54. Since reflection or scattering of external light in the yz plane direction is prevented, even better contrast can be obtained with respect to the yz plane direction (vertical direction).

  When the display device is configured by arranging the light shielding layer 54 in the direction extending in the y-axis direction of FIG. 4B, the louver 102 ensures the contrast in the yz in-plane direction (vertical direction). Therefore, the contrast in the xz in-plane direction (left-right direction) is also ensured by the light shielding layer 54.

  In addition, it is preferable to form a reflection layer that reflects the light emitted from the LED chips 1 r to 1 b on the inner surface of the light shielding layer 54, that is, the surface of the light shielding layer 54 that contacts the sealing member 3. Thereby, the loss absorbed by the light shielding layer 54 among the light radiated from the LED chips 1r to 1b can be reduced. Such a reflective layer can be made of, for example, a white material or a mirror surface material.

  As mentioned above, although embodiment was described, this invention is not limited to this.

  In the above-described embodiment, the surface of the element substrate 2 is formed in black. However, the surface of the element substrate 2 is not necessarily black but may be dark (including black). The dark color refers to a color obtained by performing a process for reducing reflectance (hereinafter simply referred to as reflectance) and lightness to sunlight. For example, a material containing a colorant having a reflectance and brightness lower than that of the base is formed on the base, or a base material containing a colorant having a reflectance and brightness lower than that of the base material. By forming the element substrate, a dark surface can be realized. Specifically, examples of the dark color include, in addition to black, gray, dark blue, dark brown, dark purple, dark blue, dark green, and the like. The dark color may be an achromatic color or a chromatic color. As a result of the visual test, the dark color is preferably a color with a brightness of 4 or less in the Munsell color system, and more preferably 2 or less. As a result of the visual test, the dark color reflectance is preferably 30% or less, and more preferably 20% or less.

  Here, examples of the colorant for realizing a dark color include amorphous carbon such as carbon black, or inorganic oxides such as chromium oxide, manganese oxide, and iron oxide. Examples of the base material or film containing the coloring material include resins such as epoxy resin, phenol resin, polyimide resin, and polyphthalamide, and ceramics such as aluminum oxide and aluminum nitride.

  In the above embodiment, an example in which one light-emitting device includes three light-emitting elements has been described. However, one light-emitting device may include only one light-emitting element, or four or more light-emitting elements. Also good. The shape of the element substrate is not limited to a quadrangle, and may be a polygon, a circle, or an ellipse. The sealing member 3 may include a phosphor or a filler. Of course, the display device of the present invention is not limited to an outdoor use, and can be used indoors.

  1r, 1g, 1b LED chip (light emitting element), 2 element substrate, 21 electrode, 22 substrate, 22a wall part, 3 sealing member, 11 sapphire substrate, 12 reflective layer, 13 n-type GaN layer, 14 active layer (light emission) Layer), 15 p-type GaN layer, 16a anode electrode, 16c cathode electrode, 50 to 52 sealing member, 52a cylindrical surface, 52b end surface, 52c corner, 53 diffusion layer, 54 light shielding layer, 100 light emitting device, 101 circuit board , 102 louver, 102a proximal end portion, 102b protruding portion, 102 ′ louver, 200 display device.

Claims (11)

At least one light emitting element that emits light;
An element substrate on which the light emitting element is disposed, wherein the periphery of the light emitting element disposed on the element substrate is formed lower than a position of a virtual plane passing through the top of the light emitting element and parallel to the surface of the element substrate. And an element substrate having the surface formed in a dark color;
A light emitting device comprising: a sealing member that is formed of a material that transmits light emitted from the light emitting element and seals the light emitting element.   The light emitting device according to claim 1, wherein the sealing member constitutes a lens having an optical axis parallel to a normal to the surface of the element substrate. The shape of the element substrate is substantially square in plan view,
The light emitting device according to claim 1, wherein the sealing member constitutes a cylindrical lens in which a generatrix of a cylindrical surface is parallel to one side of the quadrangle.   The light emitting device according to claim 3, wherein a corner portion of the cylindrical lens configured by the sealing member is chamfered at a corner where the cylindrical surface intersects with both end surfaces in the generatrix direction of the cylindrical surface.   5. The light emitting device according to claim 1, wherein a diffusion layer that diffuses light emitted from the light emitting element is formed on at least a part of a surface of the sealing member.   6. The light-emitting device according to claim 1, wherein a light-shielding layer that suppresses external light from entering the element substrate through the sealing member is formed at a peripheral edge of the sealing member.   The light-emitting element has a semiconductor stacked structure including a light-emitting layer that emits light and a reflective layer that reflects light generated in the light-emitting layer, and the direction of the stack is substantially perpendicular to the surface of the element substrate. The light emitting device according to any one of claims 1 to 6, wherein the light emitting device is in a direction and the reflective layer is disposed on the surface side of the light emitting layer.   The light emitting device according to claim 1, wherein the dark color is black.   The light emitting device according to claim 1, comprising a red light emitting element that emits red light, a green light emitting element that emits green light, and a blue light emitting element that emits blue light as the light emitting elements. .   A plurality of light emitting devices according to any one of claims 1 to 9 are disposed on a circuit board, and the circuit board includes a base end portion disposed between the adjacent light emitting devices, and the base A louver having a projecting portion projecting in an eave shape from an end portion, and the base end portion of the louver passes through the top of the light emitting element in each light emitting device and is parallel to the circuit board The display device located on the side of the circuit board from the position of   A plurality of light emitting devices according to any one of claims 1 to 9 are arranged on a circuit board, and the circuit board is arranged between adjacent light emitting devices so as to form an eave from the circuit board. A protruding louver is provided, and the position of the protruding end of the louver in the protruding direction is closer to the circuit board than the position of a virtual plane passing through the top of the light emitting element in each light emitting device and parallel to the circuit board. Display device.