CN210778493U

CN210778493U - Semiconductor packaging manufacturing equipment

Info

Publication number: CN210778493U
Application number: CN201921768700.XU
Authority: CN
Inventors: 朱道田; 黄明
Original assignee: Jiangsu Yunhonghui Electronic Technology Co ltd
Current assignee: Jiangsu Yunhonghui Electronic Technology Co ltd
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-06-16
Anticipated expiration: 2029-10-21

Abstract

The utility model belongs to the technical field of semiconductor packaging, in particular to a semiconductor packaging and manufacturing device, which comprises a base, wherein the top two ends of the base are fixedly provided with a leg supporting block, the top of the leg supporting block is fixedly connected with a supporting column, one end of the supporting column, which is far away from the leg supporting block, is fixedly connected with a top plate, the bottom middle part of the top plate is provided with a mounting plate, the bottom middle part of the mounting plate is provided with an electric push rod, the two sides of the electric push rod and the two ends of the bottom part, which are positioned on the mounting plate, are fixedly connected with fixed blocks, the outer surface of the front end of the fixed block is articulated with an expansion bracket, and one end of the expansion bracket, which is far away from the fixed block, is articulated with a mounting seat, the utility model improves the flexibility of the semiconductor packaging and manufacturing device, can, the working efficiency is improved, and the practicability is high.

Description

Semiconductor packaging manufacturing equipment

Technical Field

The utility model relates to a semiconductor package technical field specifically is a semiconductor package manufacture equipment.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips after scribing process, then the cut chips are pasted on the corresponding island of the substrate (lead frame) frame by glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate by utilizing superfine metal (gold tin copper aluminum) wires or conductive resin to form the required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out the processes of inspection, testing, packaging and the like, and finally warehousing and shipping. The plastic package has low cost, simple process and suitability for mass production, so the plastic package has strong vitality, develops more and more quickly from birth and occupies more and more shares in the package. Plastic packages currently account for over 95% of the integrated circuit market worldwide. On the day that consumer circuits and devices are essentially plastic packages; the proportion of the circuit in the industrial circuit is also large, and the packaging form is the most. The plastic package is classified into discrete device packages including a type a and a type F; integrated circuit packages include SOPs, DIPs, QFPs, BGAs, and the like. However, the conventional semiconductor package manufacturing apparatus has the following problems:

1. the packaged semiconductor chip solution is adhered to the upper part of a machine and is not easy to take out, so that more time is consumed during processing, and the working efficiency is low;

2. when the plastic packaging of the semiconductor is carried out, the injected colloid is easy to be attached to the mold and is difficult to fall off, so that the service life of the mold is short, and meanwhile, the flexibility of the existing semiconductor packaging manufacturing equipment is poor.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a semiconductor package manufacture equipment has solved the semiconductor chip solution adhesion after the encapsulation on machine upper portion, is difficult to take out, and it is more to cause the time that consumes man-hour, and work efficiency is low and when carrying out the plastic packaging of semiconductor, and the colloid of moulding plastics is stained with easily and is difficult to drop on the mould, causes the mould life weak point, the relatively poor problem of flexibility of the semiconductor package manufacture equipment that has now simultaneously.

In order to achieve the above object, the utility model provides a following technical scheme: the semiconductor packaging and manufacturing equipment comprises a base, wherein leg supporting blocks are fixedly arranged at two ends of the top of the base, a supporting column is fixedly connected to the top of each leg supporting block, a top plate is fixedly connected to one end, away from each leg supporting block, of the supporting column, a mounting plate is arranged at the middle of the bottom of the top plate, an electric push rod is arranged at the middle of the bottom of the mounting plate, fixed blocks are fixedly connected to two sides of the electric push rod and two ends of the bottom of the mounting plate, a telescopic frame is hinged to the outer surface of the front end of each fixed block, a mounting seat is hinged to one end, away from each fixed block, of each telescopic frame, the bottom of each mounting seat is rotatably connected with a rotating rod through a rotating shaft, rotating handles are symmetrically arranged on two sides of the rotating rods, fastening nuts are in threaded, the feeding inlet has been seted up to one side of colloid box, and the bottom of colloid box is provided with the boss, the below of boss and the top middle part that is located the base are provided with the mould support, the top of mould support is seted up flutedly, the bottom of recess is provided with the injection mold groove, the bottom in injection mold groove is provided with the baffle, the bottom of baffle is provided with the spring.

As an optimal technical scheme of the utility model, the bottom of base is glued through the magic power and is pasted there is the slipmat, and the material of slipmat is rubber materials.

As a preferred technical scheme of the utility model, electric putter's flexible end is fixed through the pin joint of riveting with the expansion bracket, and electric putter keeps away from the bottom fixed connection of bolt and mounting panel through the one end of flexible end.

As the utility model discloses an optimized technical scheme, the material of expansion bracket is aluminum alloy material, and the scalable length size of expansion bracket is five meters at zero point to a meter.

As a preferred technical scheme of the utility model, the clamp plate passes through the interior table wall fixed connection of bolt and colloid box, and the clamp plate rotates through pivot and dwang to be connected.

As an optimal technical scheme of the utility model, the both sides of baffle are provided with the handle, and are provided with anti-skidding line on hand.

As an optimized technical scheme of the utility model, the round hole has been seted up to the inside of boss, and the quantity of round hole is a plurality of groups.

Compared with the prior art, the utility model provides a semiconductor package manufacture equipment possesses following beneficial effect:

1. according to the semiconductor package manufacturing equipment, the lifting of the colloid box can be controlled through the arranged top plate, the electric push rod, the telescopic frame and the mounting seat, so that the flexibility of the semiconductor package manufacturing equipment is improved, the lifting of the pressing plate can be realized through rotating the handle through the arrangement of the rotating rod, the fastening nut and the pressing plate, and the colloid in the colloid box flows out of the round hole for processing;

2. this semiconductor package manufacture equipment, through setting up boss and recess, the two combines can effectually prevent that the colloid from leaking outward, and the colloid leaks outward when can preventing to mould plastics through setting up the baffle, and the baffle bottom sets up the spring, can conveniently take out the semiconductor package after the processing, has improved work efficiency, and the practicality is strong.

Drawings

Fig. 1 is a schematic view of an overall structure of a semiconductor package manufacturing apparatus according to the present invention;

FIG. 2 is an enlarged view of the semiconductor package manufacturing apparatus of the present invention at the A position;

FIG. 3 is an enlarged view of the semiconductor package manufacturing apparatus of the present invention at the position B;

fig. 4 is a schematic view of the bottom structure of the boss of the semiconductor package manufacturing apparatus of the present invention.

In the figure: 1. a base; 2. a leg supporting block; 3. a support pillar; 4. a top plate; 5. mounting a plate; 6. a fixed block; 7. an electric push rod; 8. a telescopic frame; 9. a mounting seat; 10. rotating the rod; 11. rotating the handle; 12. Fastening a nut; 13. pressing a plate; 14. a gel box; 15. a feed inlet; 16. a boss; 17. a mold holder; 18. a groove; 19. injection molding a mold groove; 20. a baffle plate; 21. a spring; 22. a circular hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, in this embodiment: a semiconductor package manufacturing device comprises a base 1, wherein supporting leg blocks 2 are fixedly installed at two ends of the top of the base 1, supporting columns 3 are fixedly connected to the tops of the supporting leg blocks 2, a top plate 4 is fixedly connected to one ends, far away from the supporting leg blocks 2, of the supporting columns 3, a mounting plate 5 is installed in the middle of the bottom of the top plate 4, an electric push rod 7 is arranged in the middle of the bottom of the mounting plate 5 and is of the type YNT-03, fixing blocks 6 are fixedly connected to two sides of the electric push rod 7 and located at two ends of the bottom of the mounting plate 5, an expansion bracket 8 is hinged to the outer surface of the front end of the fixing block 6 and can control the lifting of a colloid box 14, the flexibility of the semiconductor package manufacturing device is improved, a mounting seat 9 is hinged to one end, far away from the fixing block 6, of the expansion bracket 8 is hinged to the bottom of the mounting seat, the lifting of the pressing plate 13 can be realized by rotating the handle 11, the colloid in the colloid box 14 flows out from the round hole 22 for processing, the colloid box 14 is arranged on the fastening nut 12 and is convenient for containing the colloid for processing, the pressing plate 13 is arranged at the top end of the inner cavity of the colloid box 14, the feeding hole 15 is arranged at one side of the colloid box 14 and is convenient for supplementing the colloid, the boss 16 is arranged at the bottom of the colloid box 14 and can effectively prevent the colloid from leaking outwards, the mold support 17 is arranged below the boss 16 and in the middle of the top end of the base 1, the groove 18 is arranged at the top of the mold support 17, the injection mold groove 19 is arranged at the bottom of the groove 18 and can prevent the colloid from adhering to the injection mold groove 19, the baffle 20 is arranged at the bottom of the injection mold groove 19 and can prevent the colloid from leaking outwards during injection molding, the spring 21, the working efficiency is improved, and the practicability is high.

In the embodiment, the bottom of the base 1 is adhered with the non-slip mat through the magic glue, and the non-slip mat is made of rubber materials, so that the stability of the equipment is improved; the telescopic end of the electric push rod 7 is fixed with a hinged point of the telescopic frame 8 through riveting, one end, far away from the telescopic end, of the electric push rod 7 is fixedly connected with the bottom of the mounting plate 5 through a bolt, the telescopic frame 8 is made of an aluminum alloy material, the telescopic length of the telescopic frame 8 is from zero point five meters to one meter, the lifting of the colloid box 14 can be controlled, and the flexibility of semiconductor packaging and manufacturing equipment is improved; the pressing plate 13 is fixedly connected with the inner surface wall of the colloid box 14 through bolts, the pressing plate 13 is rotatably connected with the rotating rod 10 through a rotating shaft, the lifting of the pressing plate 13 can be realized through rotating the handle 11, and the colloid in the colloid box 14 flows out of the round hole 22 for processing; handles are arranged on two sides of the baffle 20, and anti-skidding lines are arranged on the handles to prevent the phenomenon of hand skidding; the boss 16 is provided with a plurality of circular holes 22 therein, and the number of the circular holes 22 is several.

The utility model discloses a theory of operation and use flow: when the device is used, a worker firstly opens a switch of the electric push rod 7, the electric push rod 7 pushes the expansion bracket 8 to expand and contract, the boss 16 is pushed into the injection mold groove 19 to package a semiconductor therein, the rotating rod 10 is connected through the rotating shaft in a rotating way, the rotating handles 11 are symmetrically arranged on two sides of the rotating rod 10, the fastening nut 12 is connected on the rotating handle 11 through threads, the lifting of the pressing plate 13 can be realized through rotating the handle 11, the colloid in the colloid box 14 flows out of the round hole 22 to be processed, the top of the mold bracket 17 is provided with the groove 18, the injection mold groove 19 is arranged at the bottom of the groove 18, the colloid can be prevented from being adhered to the injection mold groove 19, the baffle 20 is arranged at the bottom of the injection mold groove 19, the colloid is prevented from leaking out during injection, the spring 21 is arranged at the bottom of the baffle 20, the working efficiency is improved, and the practicability is high.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor package manufacturing apparatus comprising a base (1), characterized in that: the supporting leg device is characterized in that supporting leg blocks (2) are fixedly mounted at the two ends of the top of the base (1), supporting legs (2) are fixedly connected with supporting columns (3) at the tops of the supporting leg blocks (3), one end of each supporting leg block (2) is far away from the corresponding supporting column (3) and is fixedly connected with a top plate (4), a mounting plate (5) is mounted at the middle of the bottom of each top plate (4), an electric push rod (7) is arranged at the middle of the bottom of each mounting plate (5), fixing blocks (6) are fixedly connected with the two ends of the two sides of each electric push rod (7) and are located on the corresponding mounting plate (5), a telescopic frame (8) is hinged to the outer surface of the front end of each fixing block (6), a mounting seat (9) is hinged to one end, far away from the corresponding fixing block (6), of each telescopic frame (8), rotate handle (11) and go up threaded connection and have fastening nut (12), be provided with colloid box (14) on fastening nut (12), the inner chamber top of colloid box (14) is provided with clamp plate (13), feed inlet (15) have been seted up to one side of colloid box (14), and the bottom of colloid box (14) is provided with boss (16), the below of boss (16) and the top middle part that is located base (1) are provided with mould support (17), the top of mould support (17) is seted up flutedly (18), the bottom of recess (18) is provided with injection mold groove (19), the bottom of injection mold groove (19) is provided with baffle (20), the bottom of baffle (20) is provided with spring (21).

2. The semiconductor package manufacturing apparatus according to claim 1, wherein: the bottom of the base (1) is pasted with a non-slip mat through magic glue, and the non-slip mat is made of rubber materials.

3. The semiconductor package manufacturing apparatus according to claim 1, wherein: the telescopic end of the electric push rod (7) is fixed with a hinged point of the telescopic frame (8) through riveting, and one end, far away from the telescopic end, of the electric push rod (7) is fixedly connected with the bottom of the mounting plate (5) through a bolt.

4. The semiconductor package manufacturing apparatus according to claim 1, wherein: the telescopic frame (8) is made of aluminum alloy materials, and the telescopic length of the telescopic frame (8) is from zero five meters to one meter.

5. The semiconductor package manufacturing apparatus according to claim 1, wherein: the pressing plate (13) is fixedly connected with the inner surface wall of the colloid box (14) through a bolt, and the pressing plate (13) is rotatably connected with the rotating rod (10) through a rotating shaft.

6. The semiconductor package manufacturing apparatus according to claim 1, wherein: handles are arranged on two sides of the baffle (20), and anti-skid grains are arranged on the handles.

7. The semiconductor package manufacturing apparatus according to claim 1, wherein: round holes (22) are formed in the bosses (16), and the number of the round holes (22) is a plurality of groups.