CN2386534Y - Enclosing device for light-emitting diode - Google Patents
Enclosing device for light-emitting diode Download PDFInfo
- Publication number
- CN2386534Y CN2386534Y CN99217178U CN99217178U CN2386534Y CN 2386534 Y CN2386534 Y CN 2386534Y CN 99217178 U CN99217178 U CN 99217178U CN 99217178 U CN99217178 U CN 99217178U CN 2386534 Y CN2386534 Y CN 2386534Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- tellite
- light emitting
- potted element
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an enclosing device for light-emitting diodes. A circuit connection part is arranged on a printed circuit base board; an embankment wall part is stuck on the periphery of the printed circuit base board by adhesive; enclosing elements are contained in a groove in the periphery of the printed circuit base board; connection wires on the enclosing elements are connected with the circuit connection part on the printed circuit base board. The utility model can reduce cost and enhance the quality and the reliability of products.
Description
The utility model relates to the packaging system of light-emitting diode, is meant a kind of encapsulation device of light emitting diode that can reduce cost and improve the quality especially.
In recent years, encapsulation (packaging) becomes more and more important the role of microelectronics industry, whether fine or notly encapsulating usually is the factor whether element efficiency can normally be brought into play, for encapsulation, the factor that must consider has the time of delay between size, weight, cost, pin requirement number, the power that can bear and the chip of packing entity etc.Therefore a good encapsulation will be done comprehensive consideration to material, structure, the opering characteristic of electric apparatus, reaches required requirement and has high reliability to use least cost.
As shown in Figure 1, be an encapsulating structure of general light-emitting diode 10, as shown in the figure, this encapsulating structure comprises a carrier unit 100, is positioned at the pedestal 102 on the carrier unit 100 and is positioned at one on the pedestal 102 to be bowl-shape recess 108.Light-emitting diode chip for backlight unit 106 can be installed in recess 108, and the lead-in wire on economy-combat line technology (wire bonding) and the carrier unit 100 (figure does not show) is connected, and fulfils assignment through encapsulating, baking, clubfoot, finished product test, packaging and other steps again.
Yet in this known package structure for LED, because pedestal 102 is provided with recess 108, shape is comparatively complicated, therefore can increase the cost of die sinking; Moreover in this kind package structure for LED, owing to use metal support (leadframe), so support usually has pressurized and the phenomenon of displacement, causes the reliability decrease of this package structure for LED.
Therefore the purpose of this utility model is to provide a kind of encapsulation device of light emitting diode of the reliability that can reduce cost and improve the quality of products, to improve the shortcoming of known encapsulating structure.
The purpose of this utility model is achieved in that a kind of encapsulation device of light emitting diode, and tellite is provided with circuit connection partly; Embankment wall holds potted element in the groove in around the tellite partly around viscose glue is bonded at tellite; Wiring on the potted element partly links to each other with circuit connection on the tellite.
Wherein on potted element, set up the transparent upper cover of this element of protection.
Wherein on potted element, set up transparent sealing.
The utility model is because embankment wall simple shape partly, so mould is simple and can develop rapidly, and utilizes viscose glue to be bonded at around the tellite, reaches required adaptation; Owing to do not use metallic support, therefore the reliability of encapsulation also improves, and therefore has the practical value on the industry.
Understand for your auditor can be done further the purpose of this utility model, shape, structure, feature and effect thereof, the conjunction with figs. that gives an actual example now is described in detail as follows:
Fig. 1 is a known encapsulation device of light emitting diode schematic diagram;
Fig. 2 is an encapsulation device of light emitting diode schematic diagram of the present utility model;
Fig. 3 is an encapsulation device of light emitting diode end view of the present utility model;
Fig. 4 is an encapsulation device of light emitting diode vertical view of the present utility model.
Shown in Fig. 2,3,4, of the present utility model being characterized as: use tellite 200 and embankment wall 210 replace pedestal 102 and the support 100 in the known techniques.
This tellite has circuit connection therein partly (schemes not show), so that help the electric connection of potted element and external circuit; It around tellite 200 embankment wall part 210, can be by FR4 or sealing resin (molding compound) through mould mold moulding, and around viscose glue 212 sticks at tellite 200, on potted element 20, there is wiring 206 partly to be connected, is beneficial to the electric connection of potted element and external circuit with circuit connection; On potted element 20, can set up loam cake 214 or transparent sealing 216 to protect this potted element 20 and wiring 206.
Because embankment wall is the simple shape of 212 parts partly, therefore mould can be developed rapidly, and utilize viscose glue 214 to be bonded at around the tellite 200, reach the required adaptation of consumer products, and the more known again encapsulating structure that fully forms groove shape base material by plastic cement there is more easy mould.Moreover owing to do not use metallic support, therefore the reliability of encapsulation also improves, and therefore has the practical value on the industry.
Claims (3)
1. encapsulation device of light emitting diode is characterized in that: tellite is provided with circuit connection partly; Embankment wall holds potted element in the groove in around the tellite partly around viscose glue is bonded at tellite; Wiring on the potted element partly links to each other with circuit connection on the tellite.
2. encapsulation device of light emitting diode as claimed in claim 1 is characterized in that: the transparent upper cover of wherein setting up this element of protection on potted element.
3. encapsulation device of light emitting diode as claimed in claim 1 is characterized in that: wherein set up transparent sealing on potted element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99217178U CN2386534Y (en) | 1999-07-23 | 1999-07-23 | Enclosing device for light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99217178U CN2386534Y (en) | 1999-07-23 | 1999-07-23 | Enclosing device for light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2386534Y true CN2386534Y (en) | 2000-07-05 |
Family
ID=34008671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99217178U Expired - Fee Related CN2386534Y (en) | 1999-07-23 | 1999-07-23 | Enclosing device for light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2386534Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100438098C (en) * | 2005-07-13 | 2008-11-26 | 财团法人工业技术研究院 | Light-emitting diodes diodes packing structure and its production |
| CN100461475C (en) * | 2005-03-31 | 2009-02-11 | 丰田合成株式会社 | Method of forming a low temperature-grown buffer layer, light emitting element, method of making same, and light emitting device |
| CN103050603A (en) * | 2011-10-17 | 2013-04-17 | 展晶科技(深圳)有限公司 | Manufacturing method of LED (Light Emitting Diode) packaging structure |
| CN103077931A (en) * | 2011-10-26 | 2013-05-01 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
-
1999
- 1999-07-23 CN CN99217178U patent/CN2386534Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100461475C (en) * | 2005-03-31 | 2009-02-11 | 丰田合成株式会社 | Method of forming a low temperature-grown buffer layer, light emitting element, method of making same, and light emitting device |
| US7524741B2 (en) | 2005-03-31 | 2009-04-28 | Toyoda Gosei Co., Ltd. | Method of forming a low temperature-grown buffer layer, a light emitting element and method of making same, and light emitting device |
| CN100438098C (en) * | 2005-07-13 | 2008-11-26 | 财团法人工业技术研究院 | Light-emitting diodes diodes packing structure and its production |
| CN103050603A (en) * | 2011-10-17 | 2013-04-17 | 展晶科技(深圳)有限公司 | Manufacturing method of LED (Light Emitting Diode) packaging structure |
| CN103050603B (en) * | 2011-10-17 | 2016-03-23 | 展晶科技(深圳)有限公司 | The manufacture method of LED encapsulation structure |
| CN103077931A (en) * | 2011-10-26 | 2013-05-01 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |