CN209487481U - A kind of semiconductor chip packaging device - Google Patents
A kind of semiconductor chip packaging device Download PDFInfo
- Publication number
- CN209487481U CN209487481U CN201920628558.2U CN201920628558U CN209487481U CN 209487481 U CN209487481 U CN 209487481U CN 201920628558 U CN201920628558 U CN 201920628558U CN 209487481 U CN209487481 U CN 209487481U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- pedestal
- screw rod
- semiconductor chip
- reciprocating screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model relates to technology of semiconductor chips fields, in particular a kind of semiconductor chip packaging device, including pedestal and liquid reserve tank, liquid reserve tank is fixedly connected on the inside of the right end of the pedestal, the top inner side of the liquid reserve tank is communicated with outlet tube, fixed block is fixedly connected on the inside of the bottom end of the pedestal, the left end of the fixed block is fixedly connected with horizontally disposed electric telescopic rod, the top inner side of the pedestal is fixedly connected with horizontally disposed first motor, the main shaft end of the first motor is fixedly connected with reciprocating screw rod, the first sliding block is slidably connected on the outside of the reciprocating screw rod, and first sliding block be slidably connected with pedestal, in the utility model, pass through the reciprocating screw rod of setting, outlet tube and cleaning brush, it can be clean to the flux cleaning of work piece surface remnants by the effect of cleaning brush, to prevent the scaling powder after charing It influences circuit to work normally, improves the quality of workpiece, there are huge economic benefit and extensive market prospects, be worth of widely use.
Description
Technical field
The utility model relates to technology of semiconductor chips field, specially a kind of semiconductor chip packaging device.
Background technique
Semiconductor packages, which refers to, to process to obtain individual chips according to product type and functional requirement by the wafer tested
Process, encapsulation process are as follows: the wafer from the preceding road technique of wafer pass through scribing process after be cut into small chip, then will
The chip of well cutting is mounted with glue onto the island of corresponding frame substrate, recycles ultra-fine plain conductor or electric conductivity tree
The landing pad of chip is connected to the respective pins of substrate by rouge, and constitutes required circuit, with the development of society, half-and-half
The application of conductor chip is further extensive, and therefore, the demand to a kind of semiconductor chip packaging device is growing.
The semiconductor chip packaging device occurred currently on the market, it is different according to the process of encapsulation, slice can be used
The devices such as machine, dispenser and tin soldering machine are scattered to needing to carry out workpiece after the completion of workpiece welding especially by tin soldering machine
Heat, general is all by naturally cooling down, and heat dissipation is slow, reduces the efficiency of work, and is generally had after the completion of welding residual
The scaling powder stayed is not clean to flux cleaning on workpiece, and the scaling powder after anti-charing will affect circuit normal work, because
This, proposes a kind of semiconductor chip packaging device regarding to the issue above.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor chip packaging devices, to solve to mention in above-mentioned background technique
Out the problem of.
To achieve the above object, the utility model provides the following technical solutions:
The top downside of a kind of semiconductor chip packaging device, including pedestal and liquid reserve tank, the pedestal is fixedly connected with
The right end inside of welder, the pedestal is fixedly connected with liquid reserve tank, and the top inner side of the liquid reserve tank is communicated with outlet tube,
It is fixedly connected with fixed block on the inside of the bottom end of the pedestal, the left end of the fixed block is fixedly connected with horizontally disposed electronic stretch
Contracting bar, the top inner side of the pedestal are fixedly connected with horizontally disposed first motor, and the main shaft end of the first motor is solid
Surely it is connected with reciprocating screw rod, the first sliding block is slidably connected on the outside of the reciprocating screw rod, and the first sliding block and pedestal sliding connect
It connecing, the left end of the reciprocating screw rod is rotatably connected to the first fixed link, and the first fixed link is fixedly connected with pedestal, and described first
The bottom end of sliding block is fixedly connected with the connecting rod being vertically arranged, and the bottom end of the connecting rod is fixedly connected with cleaning brush, and clears up
Brush is fixedly connected with outlet tube, and the top inner side of the pedestal is fixedly connected with the second fixed link, before second fixed link
End is fixedly connected with the second motor, and the main shaft end of second motor is fixedly connected with turntable, and the front end face of the turntable turns
Dynamic to be connected with push rod, the right end of the push rod is rotatably connected to set casing by shaft, is fixedly connected on the inside of the set casing
There is fixed plate, the bottom end of the fixed plate is fixedly connected with blower.
Preferably, the outlet tube is made of the hose of rubber material.
Preferably, the shape of the pedestal is arranged in U-typed.
Preferably, the internal diameter of first sliding block and the outer diameter of reciprocating screw rod are equal in magnitude.
Preferably, the left end of the electric telescopic rod is fixedly connected with objective table, and objective table is slidably connected with pedestal.
Compared with prior art, the utility model has the beneficial effects that
1, in the utility model, by the turntable of setting, the second motor, set casing, blower, push rod, the second fixed link and
Third fixed link can quickly radiate to soldered workpiece by the effect of blower, be reduced in natural item
It improves the efficiency of work the cooling time under part, and can change the direction of blower by the effect of turntable;
2, in the utility model, pass through the reciprocating screw rod of setting, the first sliding block, first motor, liquid reserve tank, outlet tube and clear
Reason brush, can be clean to the flux cleaning of work piece surface remnants by the effect of cleaning brush, to prevent the scaling powder after charing
It influences circuit to work normally, improves the quality of workpiece, also improve the efficiency to workpiece cleaning, there is huge economy
Benefit and extensive market prospects, are worth of widely use.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model;
Fig. 2 is structural schematic diagram at the A of the utility model Fig. 1;
Fig. 3 is the mounting structure schematic diagram of the second motor of the utility model.
In figure: 1- pedestal, 2- liquid reserve tank, 3- outlet tube, 4- first motor, 5- reciprocating screw rod, the first sliding block of 6-, 7- first
Fixed link, the second fixed link of 8-, 9- turntable, 10- welder, 11- objective table, 12- connecting rod, 13- cleaning brush, 14- blower,
15- electric telescopic rod, 16- fixed block, 17- push rod, 18- third fixed link, 19- set casing, 20- fixed plate, the second electricity of 21-
Machine.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution:
The top downside of a kind of semiconductor chip packaging device, including pedestal 1 and liquid reserve tank 2, the pedestal 1 is fixedly connected
There is welder 10, is fixedly connected with liquid reserve tank 2 on the inside of the right end of the pedestal 1, the top inner side of the liquid reserve tank 2 is communicated with
The bottom end inside of outlet tube 3, the pedestal 1 is fixedly connected with fixed block 16, and the left end of the fixed block 16 is fixedly connected with water
The electric telescopic rod 15 of flat setting, the top inner side of the pedestal 1 are fixedly connected with horizontally disposed first motor 4, and described the
The main shaft end of one motor 4 is fixedly connected with reciprocating screw rod 5, and the outside of the reciprocating screw rod 5 slidably connects the first sliding block 6,
And first sliding block 6 be slidably connected with pedestal 1, the left end of the reciprocating screw rod 5 is rotatably connected to the first fixed link 7, and first is solid
Fixed pole 7 is fixedly connected with pedestal 1, and the bottom end of first sliding block 6 is fixedly connected with the connecting rod 12 being vertically arranged, the connection
The bottom end of bar 12 is fixedly connected with cleaning brush 13, and cleaning brush 13 is fixedly connected with outlet tube 3, the top inner side of the pedestal 1
It is fixedly connected with the second fixed link 8, the front end of second fixed link 8 is fixedly connected with the second motor 21, second motor
21 main shaft end is fixedly connected with turntable 9, and the front end face of the turntable 9 is rotatably connected to push rod 17, the right side of the push rod 17
End is rotatably connected to set casing 19 by shaft, and the inside of the set casing 19 is fixedly connected with fixed plate 20, the fixed plate
20 bottom end is fixedly connected with blower 14.
The outlet tube 3 is made of the hose of rubber material, it is ensured that outlet tube 3 not will receive shadow when moving
It rings, not will cause the damage of outlet tube 3, the shape of the pedestal 1 is arranged in U-typed, can pass through the effect present apparatus of pedestal 1
Components be fixed, guarantee the stability of the present apparatus, reduce the shaking that the present apparatus generates at work, first sliding block
The outer diameter of 6 internal diameter and reciprocating screw rod 5 is equal in magnitude, it is ensured that the first sliding block 6 on reciprocating screw rod 5 move when be not in
The phenomenon that shaking, it is ensured that the stability of work, the left end of the electric telescopic rod 15 are fixedly connected with objective table 11, and objective table
11 are slidably connected with pedestal 1, can be supported by objective table 11 to semiconductor chip, convenient to add to semiconductor chip
Work.
The first motor 4 and the model of the second motor 21 are respectively the first Y1-160M1-8 motor and the 2nd Y1-
160M1-8 motor, the model ANT-36 electric telescopic rod of electric telescopic rod 15.
Workflow: being first powered before use in the utility model, and the workpiece above objective table 11 passes through welding dress
After the completion of setting 10 welding, make electric telescopic rod 15 with dynamic object stage 11 and workpiece toward moving right, until being under blower 14
Side, is then blowed heat dissipation to soldered workpiece by blower, can when needing to change the blowing direction of blower 14
So that the second motor 21 drives the movement of push rod 17 by turntable 9, and then set casing 19 is driven to be rotated with blower 14, thus
It realizes the adjusting to 14 blowing direction of blower, after the completion of cooling, makes electric telescopic rod 15 that objective table 11 be pulled to turn right with workpiece
Move to the downside of cleaning brush 13, then make first motor 4 by reciprocating screw rod 5 and the first sliding block 6 drive connecting rod 12 with clearly
Reason brush 13 moves back and forth, while the alcohol in liquid reserve tank 2 can be sprayed on workpiece by outlet tube 3, to remove workpiece table
The scaling powder in face influences circuit to prevent the scaling powder after charing and works normally.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of semiconductor chip packaging device, including pedestal (1) and liquid reserve tank (2), it is characterised in that: the pedestal (1)
Welder (10) are fixedly connected on the downside of top, states and is fixedly connected with liquid reserve tank (2), the storage on the inside of the right end of pedestal (1)
The top inner side of liquid case (2) is communicated with outlet tube (3), is fixedly connected with fixed block (16), institute on the inside of the bottom end of the pedestal (1)
The left end for stating fixed block (16) is fixedly connected with horizontally disposed electric telescopic rod (15), and the top inner side of the pedestal (1) is solid
Surely it being connected with horizontally disposed first motor (4), the main shaft end of the first motor (4) is fixedly connected with reciprocating screw rod (5),
It is slidably connected the first sliding block (6) on the outside of the reciprocating screw rod (5), and the first sliding block (6) is slidably connected with pedestal (1), institute
The left end for stating reciprocating screw rod (5) is rotatably connected to the first fixed link (7), and the first fixed link (7) is fixedly connected with pedestal (1),
The bottom end of first sliding block (6) is fixedly connected with the connecting rod (12) being vertically arranged, and the bottom end of the connecting rod (12) is fixed
It is connected with cleaning brush (13), and cleaning brush (13) is fixedly connected with outlet tube (3), the top inner side of the pedestal (1) is fixed to be connected
It is connected to the second fixed link (8), the front end of second fixed link (8) is fixedly connected with the second motor (21), second motor
(21) main shaft end is fixedly connected with turntable (9), and the front end face of the turntable (9) is rotatably connected to push rod (17), described to push away
The right end of bar (17) is rotatably connected to set casing (19) by shaft, is fixedly connected with fixed plate on the inside of the set casing (19)
(20), the bottom end of the fixed plate (20) is fixedly connected with blower (14).
2. a kind of semiconductor chip packaging device according to claim 1, it is characterised in that: the outlet tube (3) be by
The hose of rubber material is made.
3. a kind of semiconductor chip packaging device according to claim 1, it is characterised in that: the shape of the pedestal (1)
It is arranged in U-typed.
4. a kind of semiconductor chip packaging device according to claim 1, it is characterised in that: first sliding block (6)
Internal diameter and the outer diameter of reciprocating screw rod (5) are equal in magnitude.
5. a kind of semiconductor chip packaging device according to claim 1, it is characterised in that: the electric telescopic rod (15)
Left end be fixedly connected with objective table (11), and objective table (11) is slidably connected with pedestal (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920628558.2U CN209487481U (en) | 2019-05-05 | 2019-05-05 | A kind of semiconductor chip packaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920628558.2U CN209487481U (en) | 2019-05-05 | 2019-05-05 | A kind of semiconductor chip packaging device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209487481U true CN209487481U (en) | 2019-10-11 |
Family
ID=68135787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920628558.2U Expired - Fee Related CN209487481U (en) | 2019-05-05 | 2019-05-05 | A kind of semiconductor chip packaging device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209487481U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113608306A (en) * | 2021-08-03 | 2021-11-05 | 安庆师范大学 | Production and assembly equipment of anti-interference communication equipment |
-
2019
- 2019-05-05 CN CN201920628558.2U patent/CN209487481U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113608306A (en) * | 2021-08-03 | 2021-11-05 | 安庆师范大学 | Production and assembly equipment of anti-interference communication equipment |
CN113608306B (en) * | 2021-08-03 | 2022-07-19 | 安庆师范大学 | Production and assembly equipment of anti-interference communication equipment |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2022052210A1 (en) | Manufacturing method for packaging structure | |
CN206911621U (en) | A kind of full-automatic chip glue spreading apparatus | |
CN107248500B (en) | Crystal taking and fixing device and crystal fixing machine adopting same | |
CN209487481U (en) | A kind of semiconductor chip packaging device | |
CN102544240B (en) | Method and device for integrating slicing and flocking of crystalline silicon wafer | |
CN203765443U (en) | Composite copper-plated grinding machine | |
CN105598800A (en) | BGA (ball grid array) solder ball surface smoothing device | |
CN209205940U (en) | A kind of blowing dust collector for semiconductor encapsulation device | |
CN209880565U (en) | Blue film supply device | |
CN103481178B (en) | Method for improving surface smoothness of solder balls | |
CN202725526U (en) | Hairbrush machine for cleaning semiconductor substrate | |
CN205629233U (en) | Cutting device for electronic component | |
CN205733848U (en) | The processing platform of semiconductor frame | |
CN203592376U (en) | Device for sanding packing material of electronic product | |
CN215771071U (en) | Automatic excessive mucilage binding that removes of encapsulated semiconductor of pressure regulating brush mill is put | |
CN212874450U (en) | Semiconductor chip makes vacuum apparatus | |
CN209232731U (en) | A kind of isolating device of chip face-down bonding | |
CN112599452A (en) | Embedded chip packaging equipment convenient to install | |
CN210778493U (en) | Semiconductor packaging manufacturing equipment | |
CN207014998U (en) | Automatic material blanking mechanism and marking machine | |
CN217888492U (en) | Full-automatic glue-pouring machine destatics | |
CN208713542U (en) | A kind of lathe coolant liquid delivery pipe | |
CN208245089U (en) | A kind of full-automatic glue-dropping machine | |
CN109290886A (en) | One kind being based on magnetic-adsorption frame side flash removing device | |
CN111739824A (en) | Semiconductor chip packaging structure and packaging component thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191011 Termination date: 20200505 |