CN105598800A - BGA (ball grid array) solder ball surface smoothing device - Google Patents
BGA (ball grid array) solder ball surface smoothing device Download PDFInfo
- Publication number
- CN105598800A CN105598800A CN201610122296.3A CN201610122296A CN105598800A CN 105598800 A CN105598800 A CN 105598800A CN 201610122296 A CN201610122296 A CN 201610122296A CN 105598800 A CN105598800 A CN 105598800A
- Authority
- CN
- China
- Prior art keywords
- solder ball
- polished
- polishing mechanism
- polished part
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0092—Grinding attachments for lathes or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a BGA (ball grid array) solder ball surface smoothing device, comprising a frame. The frame comprises a base and a cross beam located above the base, a pair of parallel linear guide rails are formed on the upper end surface of the base, a carrier plate is disposed on the linear guide rails, a first polishing mechanism is disposed on the carrier plate, and a second polishing mechanism is disposed on the first polishing mechanism; the first polishing mechanism comprises a plurality of semispherical first polishing members, a rotary shaft fixedly connected to the bottom ends of the first polishing members, a gear sleeving the rotary shaft and a drive motor driving the gear to rotate; the second polishing mechanism comprises a plurality of semispherical second polishing members, a connecting shaft fixedly connected to the top ends of the second polishing members, a connecting plate connected to the upper end of the connecting shaft, and a drive cylinder, and a piston rod of the drive cylinder is fixedly connected to the middle of the upper end surface of the connecting plate. The invention can effectively solve the surface quality problems such as solder ball surface mist and wrinkle and effectively improve surface coarseness of a solder ball, and the device is simple in structure and convenient to use.
Description
Technical field:
The present invention relates to the technical field of BGA solder ball treatment facility, specifically relate to oneThe device for grinding on BGA solder ball surface.
Background technology:
BGA solder ball is the pith of BGA welding, and BGA solder ball feed mainly contains automaticallyTwo kinds of the cutting remelting method of forming and spray up mouldings, the former is by the solder stick cutting of different-diameterBecome the unit of uniform quality, then in glycerine, melt balling-up; Scolder is placed on spy by the latterIn fixed container (crucible), melt, then in crucible, inflate, increase pressure and make after fusingScolder from the specific aperture of crucible bottom, spray, re-use the higher-order of oscillation and make it balling-up. NoPipe is that the solder ball surface that adopts the cutting remelting method of forming or spray up moulding to form all existsSurface uneven, have the surface quality problems such as gauffer. And surface smoothness (roughness) matterAmount is to evaluate an important indicator of BGA solder ball quality good or not, and the defect on surface can cause plantingWhen ball, inhale ball failure, also can affect welding performance and each transaction capabilities, therefore, BGA solder ballAfter moulding, also need it to carry out surface roughness processing, make it meet instructions for use.
The cylinder that prior art is normally put into solder ball rotation carries out surface smoothnessOperation, the fineness operation of this mode can not effectively improve the surface roughness of solder ball,Effect is undesirable, is necessary to be improved.
Summary of the invention:
Object of the present invention is intended to solve the problem that prior art exists, and provides the one can be effectiveGround solves the surface quality problems such as solder ball surface is vaporific, gauffer, effectively improves the table of solder ballSurface roughness, simple in structure, the device for grinding on BGA solder ball surface easy to use.
The device for grinding that the present invention relates to a kind of BGA solder ball surface, comprises frame, described machineFrame comprises pedestal and is positioned at the crossbeam of described pedestal top, on the upper surface of described pedestal, formsThe line slideway of pair of parallel, described line slideway is provided with support plate, and described support plate is provided withOne polishing mechanism, described the first polishing mechanism is provided with the second polishing mechanism;
Described the first polishing mechanism comprises multiple hemispheric the first polished parts, is fixedly connected on instituteState the first polished part bottom rotating shaft, be set in the gear in described rotating shaft and drive described gearThe drive motors rotating, forms multiple for settling the first polished part on the upper surface of support plateGroove, the bottom of described groove forms through hole, and the lower end of rotating shaft passes described through hole, multipleMultiple gears of the first polished part below are directly or indirectly engagement each other;
Described the second polishing mechanism comprises multiple hemispheric the second polished parts, is fixedly connected on instituteState the second polished part top connecting axle, be connected to connecting plate and the piston of described connecting axle upper endBar is fixedly connected on the driving cylinder at middle part, described connecting plate upper surface, and the upper end of connecting axle is hingedOn connecting plate, described driving cylinder is fixed on the bottom surface of described crossbeam, described the second polishingPart and the first polished part enclose the diameter of Spherical Volume forming for accommodating solder ball, institute up and down jointlyState the radius of solder ball and the radius of described diameter of Spherical Volume equates, on the upper surface of the first polished partForm multiple stopper slots, on the lower surface of the second polished part, form multiple and described stopper slotThe positive stop strip coordinating, described positive stop strip can holding in stopper slot.
By technique scheme, the present invention in use, first by line slideway by support plateMove to feeding area, solder ball is placed on to the first polished part of the first polishing mechanism on support plateIn after, then by line slideway, support plate is moved to the below of the second polishing mechanism, make firstPolished part be positioned at the second polished part under, then start and drive cylinder to make to drive the work of cylinderStopper rod presses down connecting plate, makes connecting plate drive connecting axle and the second polished part to decline, until thePositive stop strip on two polished part lower surfaces is plugged in the stopper slot on the first polished part upper surface,Meanwhile, the drive motors of the first polishing mechanism starts driven gear and rotates, and multiple first throwsThe intermeshing rotation of gear of light part below, a part of gear forward rotation, a part of gear is anti-To rotation, but all drive connected rotating shaft to rotate, rotating shaft drive is fixedly connected with itThe first polished part rotates, and the first polished part is spacing by the stopper slot on it and the second polished partThe holding effect of bar drives the second polished part to rotate together, due to the first polished part and the second polishingThe radius of part equates with the radius of solder ball, and therefore, the first polished part and the second polished part canThe surface of solder ball is produced to friction,, vaporific, the gauffer on solder ball surface etc. is polished, fromAnd improve the roughness on solder ball surface.
By such scheme, device for grinding of the present invention can solve solder ball surface mist effectivelyThe surface quality problems such as shape, gauffer, effectively improves the surface roughness of solder ball, simple in structure,Easy to use.
One as such scheme is preferred, and described groove is arranged in a linear and is distributed in the upper of support plateOn end face, support plate inside forms the cavity for accommodating rotating shaft, gear and drive motors,The output shaft of described drive motors is fixedly connected with the center of one of them gear, and drive motors is solidSurely be arranged on the inwall of described cavity.
One as such scheme is preferred, and it is one hinged that the end, upper end of described connecting axle is arranged withFlange, connecting axle can rotate in described hinged flange, hinged flange be fixed on connecting plate underOn end face.
One as such scheme is preferred, and described line slideway is to be molded over pedestal upper surfaceStrip gathering sill, forms leading that a pair of and described gathering sill coordinates on the bottom surface of described support plateTo piece, described guide pad is plugged in gathering sill and can in gathering sill, moves.
One as such scheme is preferred, and the middle part of described support plate offers a strip spiral shellHole, is bolted with screw rod in described screw, and the end of described screw rod forms a swing handle.
One as such scheme is preferred, the inwall of described the first polished part and the second polished partOn be coated with one deck high-abrasive material.
One as such scheme is preferred, and described driving cylinder is fixed in the bottom surface of crossbeamPortion, described pedestal is arranged on the below, middle part of crossbeam.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand thisBright technological means, and can being implemented according to the content of description, below with of the present inventionGood embodiment also coordinates accompanying drawing to be described in detail as follows.
Brief description of the drawings:
The following drawings is only intended to the present invention to schematically illustrate and explain, does not limit thisBright scope. Wherein:
Fig. 1 is structural representation of the present invention;
Fig. 2 is the partial sectional view of Fig. 1;
Fig. 3 is the structure for amplifying schematic diagram at A place in Fig. 2;
Fig. 4 is another partial sectional view of Fig. 1;
Fig. 5 is the structural representation between support plate and screw rod in the present invention;
Fig. 6 is working state schematic representation of the present invention.
Detailed description of the invention:
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is done further in detailDescribe. Following examples are used for illustrating the present invention, but are not used for limiting the scope of the invention.
Referring to Fig. 1, Fig. 2, the device for grinding on a kind of BGA solder ball of the present invention surface,Comprise frame 1, described frame comprises pedestal 11 and the crossbeam 12 that is positioned at described pedestal top,Pedestal 11 is arranged on the below, middle part of crossbeam 12, on the upper surface of described pedestal 11, formsThe line slideway 2 of pair of parallel, described line slideway is provided with support plate 3, on described support plate, establishesHave the first polishing mechanism 4, described the first polishing mechanism is provided with the second polishing mechanism 5;
Referring to Fig. 2, Fig. 3, described the first polishing mechanism 4 comprises that multiple hemispheric first throwsLight part 41, be fixedly connected on the rotating shaft 42 of described the first polished part bottom, turn described in being set inGear 43 on axle and the drive motors 44 that drives described gear to rotate, the upper surface of support plate 3On form multiple for settling the groove 31 of the first polished part, the bottom moulding of described grooveHave through hole 32, the lower end of rotating shaft 42 passes described through hole 32, multiple the first polished parts 41 timesMultiple gears 43 of side are directly or indirectly engagement each other;
Referring to Fig. 1, described the second polishing mechanism 5 comprise multiple hemispheric the second polished parts 51,Be fixedly connected on described the second polished part top connecting axle 52, be connected on described connecting axleThe connecting plate 53 of end and piston rod are fixedly connected on the driving at described connecting plate 53 middle parts, upper surfaceCylinder 54, the upper end of connecting axle 52 is hinged on connecting plate 53, the upper end of described connecting axleEnd is arranged with a hinged flange 55, and connecting axle 52 can rotate in described hinged flange 55,Hinged flange 55 is fixed on the lower surface of connecting plate 53, and described driving cylinder 54 is fixed onThe middle part, bottom surface of crossbeam 12, described the second polished part 51 and the first polished part 41 are common up and downEnclose the diameter of Spherical Volume forming for accommodating solder ball 6, the radius of described solder ball 6 and instituteThe radius of stating diameter of Spherical Volume equates, equal on the inwall of the first polished part 41 and the second polished part 51Be coated with one deck high-abrasive material (not shown), on the upper surface of the first polished part 41, form manyOn the lower surface of individual stopper slot 411, the second polished parts 51, form multiple and described stopper slotThe positive stop strip 511 coordinating, described positive stop strip 511 can holding in stopper slot 411.
Referring to Fig. 2, described groove 31 is arranged in a linear and is distributed on the upper surface of support plate 3,Support plate 3 inside form the cavity 33 for accommodating rotating shaft, gear and drive motors, instituteThe output shaft of stating drive motors 44 is fixedly connected with one of them gear 43 center, drives electricityMachine 44 is fixedly installed on the inwall of described cavity 33.
Referring to Fig. 4, Fig. 5, described line slideway 2 is for being molded over the rectangular of pedestal 11 upper surfacesShape gathering sill 2, forms on the bottom surface of described support plate 3 that a pair of and described gathering sill 2 coordinatesGuide pad 34, described guide pad 34 is plugged in gathering sill 2 and can in gathering sill 2, moves;The middle part of described support plate 3 offers a strip screw 35, is bolted with screw rod 7 in described screw,The end of described screw rod 7 forms a swing handle 71.
Referring to Fig. 6, the present invention in use, first passes through line slideway 2 by support plate 3 translationsTo feeding area, solder ball 6 is placed on to the first polishing of the first polishing mechanism 4 on support plate 3After part 41 is interior, then by line slideway 2 by support plate 3 move to the second polishing mechanism 5 underSide, make the first polished part 41 be positioned at the second polished part 51 under, then start driveCylinder makes to drive the piston rod of cylinder 54 to press down connecting plate 53, makes connecting plate 53 companies of driveSpindle 52 and the second polished part 51 decline, until spacing on the second polished part 51 lower surfacesBar 511 is plugged in the stopper slot 411 on the first polished part 41 upper surfaces, meanwhile,The drive motors 44 of the first polishing mechanism 4 starts driven gear 43 and rotates, multiple the first polishingsThe intermeshing rotation of gear 43 of part 41 belows, a part of gear 43 forward rotation, oneDivide gear 43 to rotate backward, but all drive connected rotating shaft 42 to rotate, rotating shaft 42Drive the first polished part 41 being fixedly connected with it to rotate, the first polished part 41 passes through on itThe holding effect of the positive stop strip 511 of stopper slot 411 and the second polished part 51 drives the second polishingPart 51 rotates together, due to radius and the scolding tin of the first polished part 41 and the second polished part 51The radius of ball 6 is equal, and therefore, the first polished part 41 and the second polished part 51 can be to scolding tinThe surface of ball 6 produces friction,, vaporific, the gauffer on solder ball 6 surfaces etc. is polished, therebyImprove the roughness on solder ball 6 surfaces.
In sum, device for grinding of the present invention can effectively solve solder ball surface vaporific,The surface quality problems such as gauffer, effectively improve the surface roughness of solder ball, simple in structure, makeWith convenient.
The device for grinding on BGA solder ball provided by the present invention surface is only of the present invention concreteEmbodiment, but protection scope of the present invention is not limited to this, is anyly familiar with the artTechnical staff the present invention disclose technical scope in, can expect easily change or replace, allWithin should being encompassed in protection domain of the present invention. Therefore, protection scope of the present invention should be with described powerThe protection domain that profit requires is as the criterion.
Claims (7)
1. the device for grinding on BGA solder ball surface, comprises frame (1), described frameComprise pedestal (11) and be positioned at the crossbeam (12) of described pedestal top, it is characterized in that:
On the upper surface of described pedestal (11), form the line slideway (2) of pair of parallel, instituteState line slideway and be provided with support plate (3), described support plate is provided with the first polishing mechanism (4), instituteState the first polishing mechanism and be provided with the second polishing mechanism (5);
Described the first polishing mechanism (4) comprises multiple hemispheric the first polished parts (41), solidSurely be connected to described the first polished part bottom rotating shaft (42), be set in the tooth in described rotating shaftWheel (43) and the drive motors (44) that drives described gear to rotate, the upper surface of support plate (3)On form multiplely for settling the groove (31) of the first polished part, the bottom of described groove becomesType has through hole (32), and the lower end of rotating shaft (42) passes described through hole (32), and multiple first throwsMultiple gears (43) of light part (41) below are directly or indirectly engagement each other;
Described the second polishing mechanism (5) comprises multiple hemispheric the second polished parts (51), solidSurely be connected to described the second polished part top connecting axle (52), be connected on described connecting axleThe connecting plate (53) of end and piston rod are fixedly connected on the driving at middle part, described connecting plate upper surfaceCylinder (54), it is upper that the upper end of connecting axle (52) is hinged on connecting plate (53), described drivingCylinder (54) is fixed on the bottom surface of described crossbeam (12), described the second polished part (51)Jointly enclose up and down with the first polished part (41) ball forming for accommodating solder ball (6)Shape space, the radius of described solder ball (6) equates with the radius of described diameter of Spherical Volume, firstOn the upper surface of polished part (41), form multiple stopper slots (411), the second polished part (51)Lower surface on form the positive stop strip (511) that multiple and described stopper slot (411) coordinates,Described positive stop strip can holding in stopper slot (411).
2. the device for grinding on BGA solder ball according to claim 1 surface, its featureBe: described groove (32) is arranged in a linear and is distributed on the upper surface of support plate (3), carryPlate (3) inside forms for accommodating rotating shaft (42), gear (43) and drive motors (44)Cavity (33), the output shaft of described drive motors (44) and one of them gear (43)Center be fixedly connected with, drive motors (44) be fixedly installed on described cavity (33) inOn wall.
3. the device for grinding on BGA solder ball according to claim 1 surface, its featureBe: the end, upper end of described connecting axle (52) is arranged with a hinged flange (55), connectAxle (52) can rotate in described hinged flange (55), hinged flange (55) company of being fixed onOn the lower surface of fishplate bar (53).
4. the device for grinding on BGA solder ball according to claim 1 surface, its featureBe: described line slideway (2) is for being molded over the strip guiding of pedestal (11) upper surfaceGroove (2), forms a pair of and described gathering sill (2) and coordinates on the bottom surface of described support plate (3)Guide pad (34), described guide pad is plugged in gathering sill (2) and can in gathering sill, movesMoving.
5. according to the device for grinding on the BGA solder ball surface described in claim 1 or 4, itsBe characterised in that: the middle part of described support plate (3) offers a strip screw (35), described spiral shellIn hole, be bolted with screw rod (7), the end of described screw rod forms a swing handle (71).
6. according to the dress that polishes on the BGA solder ball surface described in claim 1-4 any onePut, it is characterized in that: the inwall of described the first polished part (41) and the second polished part (51)On be coated with one deck high-abrasive material.
7. the device for grinding on BGA solder ball according to claim 1 surface, its featureBe: described driving cylinder (54) is fixed on the middle part, bottom surface of crossbeam (12), described pedestal(11) be arranged on below the middle part of crossbeam (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610122296.3A CN105598800B (en) | 2016-03-03 | 2016-03-03 | A kind of device for grinding of BGA scolding tin ball surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610122296.3A CN105598800B (en) | 2016-03-03 | 2016-03-03 | A kind of device for grinding of BGA scolding tin ball surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105598800A true CN105598800A (en) | 2016-05-25 |
| CN105598800B CN105598800B (en) | 2018-11-27 |
Family
ID=55979413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610122296.3A Active CN105598800B (en) | 2016-03-03 | 2016-03-03 | A kind of device for grinding of BGA scolding tin ball surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105598800B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106938428A (en) * | 2017-04-27 | 2017-07-11 | 盐城文治机械有限公司 | A kind of wearing piece surface processing equipment |
| CN108908015A (en) * | 2018-06-15 | 2018-11-30 | 盐城市力铖汽车配件有限公司 | A kind of quick grinding device of automotive brake pads production |
| CN111993181A (en) * | 2020-09-22 | 2020-11-27 | 黄荣生 | Boiler hood casting post-processing equipment |
| CN112873033A (en) * | 2021-01-13 | 2021-06-01 | 陶全国 | Novel efficient grinding device for piston |
| CN113386023A (en) * | 2021-08-17 | 2021-09-14 | 江苏优霸五金工具有限公司 | Finish machining device for forming of hardware wrench |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4122059A1 (en) * | 1991-07-03 | 1993-01-14 | Wolfgang Ebner | Cleaning-polishing device for billiard balls or bowls - consists of plate with felt replaceable surface, drive unit, holder with ball containers, and opening |
| JPH10130027A (en) * | 1996-10-25 | 1998-05-19 | Sony Corp | Production of glass preform material and apparatus therefor |
| CN102085637A (en) * | 2010-11-05 | 2011-06-08 | 云南锡业微电子材料有限公司 | BGA (ball grid array) solder ball surface finish processing method and device |
| CN105352469A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | BGA tin ball surface circularity detection device |
| CN105345618A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Processing unit for BGA solder ball surface roughness |
| CN205703644U (en) * | 2016-03-03 | 2016-11-23 | 浙江乔兴建设集团湖州智能科技有限公司 | A kind of device for grinding on BGA solder ball surface |
-
2016
- 2016-03-03 CN CN201610122296.3A patent/CN105598800B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4122059A1 (en) * | 1991-07-03 | 1993-01-14 | Wolfgang Ebner | Cleaning-polishing device for billiard balls or bowls - consists of plate with felt replaceable surface, drive unit, holder with ball containers, and opening |
| JPH10130027A (en) * | 1996-10-25 | 1998-05-19 | Sony Corp | Production of glass preform material and apparatus therefor |
| CN102085637A (en) * | 2010-11-05 | 2011-06-08 | 云南锡业微电子材料有限公司 | BGA (ball grid array) solder ball surface finish processing method and device |
| CN105352469A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | BGA tin ball surface circularity detection device |
| CN105345618A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | Processing unit for BGA solder ball surface roughness |
| CN205703644U (en) * | 2016-03-03 | 2016-11-23 | 浙江乔兴建设集团湖州智能科技有限公司 | A kind of device for grinding on BGA solder ball surface |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106938428A (en) * | 2017-04-27 | 2017-07-11 | 盐城文治机械有限公司 | A kind of wearing piece surface processing equipment |
| CN108908015A (en) * | 2018-06-15 | 2018-11-30 | 盐城市力铖汽车配件有限公司 | A kind of quick grinding device of automotive brake pads production |
| CN111993181A (en) * | 2020-09-22 | 2020-11-27 | 黄荣生 | Boiler hood casting post-processing equipment |
| CN111993181B (en) * | 2020-09-22 | 2022-05-31 | 济宁市天众机械有限公司 | Boiler hood casting post-processing equipment |
| CN112873033A (en) * | 2021-01-13 | 2021-06-01 | 陶全国 | Novel efficient grinding device for piston |
| CN112873033B (en) * | 2021-01-13 | 2023-10-24 | 佛山市顺德区启金机械有限公司 | Novel piston high efficiency grinds device |
| CN113386023A (en) * | 2021-08-17 | 2021-09-14 | 江苏优霸五金工具有限公司 | Finish machining device for forming of hardware wrench |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105598800B (en) | 2018-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105598800A (en) | BGA (ball grid array) solder ball surface smoothing device | |
| CN112207691A (en) | Metal pipe section deburring device for electro-mechanical machining | |
| CN107370306A (en) | A kind of iron-shell motor cast-aluminum rotor end face deburred device | |
| CN103659568B (en) | A kind of bearing outer ring Superfinishing machine | |
| CN106695485A (en) | Automatic deburring device capable of realizing compensation | |
| CN103481149A (en) | Deburring lathe for powder metallurgy products | |
| CN213561476U (en) | Cylindrical grinding machine for belt pulley production | |
| CN107234543A (en) | A kind of upper dish structure of grinder or polishing machine | |
| CN205520858U (en) | Impurity removing mechanism that polishes of BGA soldering tin ball | |
| CN105690217A (en) | Polishing and impurity removal mechanism for BGA solder balls | |
| CN111496603A (en) | Automatic grinding machanism of horizontal roof beam of surface fabric support frame | |
| CN108000345A (en) | A kind of polishing roller with vee-cut for the pressure burnishing device that linearly surges | |
| CN211193196U (en) | Manual surface grinding machine | |
| CN209036212U (en) | Special-shaped small precision part grinding device | |
| CN103786084A (en) | Deburring machine | |
| CN205703644U (en) | A kind of device for grinding on BGA solder ball surface | |
| CN204108789U (en) | A kind of novel bruting machine | |
| CN213164631U (en) | Jewelry silver material burnishing and polishing machine | |
| CN211760375U (en) | Valve gap injection base burr remove device | |
| CN110549195B (en) | Metal plate trimming machine tool equipment | |
| CN208438077U (en) | A kind of Double End grinding machine | |
| CN206839788U (en) | A kind of optical disk substrate sanding apparatus | |
| CN206748147U (en) | A kind of numerical control abrasive belt grinding machine | |
| CN205968611U (en) | Glass emery wheel loss automatic compensating device | |
| CN209754753U (en) | Be used for kitchen knife blank grinding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20181017 Address after: 225400 west side of Dai Wang Road, Chengdong high tech Industrial Park, Taixing, Taizhou, Jiangsu, China Applicant after: Taixing science and technology incubator center Address before: 313000 Yang Shu Road, Wuxing District, Huzhou, Zhejiang Province, No. 18 Applicant before: ZHEJIANG QIAOXING CONSTRUCTION GROUP HUZHOU INTELLIGENT TECHNOLOGY CO., LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |