CN205520858U - Impurity removing mechanism that polishes of BGA soldering tin ball - Google Patents
Impurity removing mechanism that polishes of BGA soldering tin ball Download PDFInfo
- Publication number
- CN205520858U CN205520858U CN201620175190.5U CN201620175190U CN205520858U CN 205520858 U CN205520858 U CN 205520858U CN 201620175190 U CN201620175190 U CN 201620175190U CN 205520858 U CN205520858 U CN 205520858U
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- CN
- China
- Prior art keywords
- polishing
- support plate
- polished part
- solder ball
- impurity removal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses an impurity removing mechanism that polishes of BGA soldering tin ball, which comprises a frame, the frame includes the base and is located the crossbeam of base top, the movable support plate that is equipped with on the base, be equipped with first polishing mechanism on the support plate, be equipped with actuating mechanism on the support plate of first polishing mechanism one side, the top of first polishing mechanism is equipped with second polishing mechanism, be connected with impurity removing mechanism in the second polishing mechanism, impurity removing mechanism installs on the lift cylinder, the lift cylinder is installed on the crossbeam, impurity removing mechanism includes that fixed connection links to each other with the suction fan at the dust absorption pipe on the 2nd polishing member top, dust absorption pipe. The utility model discloses can solve surface quality problems such as soldering tin ball surface is vaporific, fold effectively, effectively improve the roughness of soldering tin ball, and can effectively get rid of the piece impurity that the in -process of polishing produced.
Description
Technical field:
This utility model relates to the technical field of BGA solder ball processing equipment, is specifically related to one
Plant the polishing impurity removal mechanism of BGA solder ball.
Background technology:
BGA solder ball is the pith of BGA welding, and automatic BGA solder ball feed mainly has
The cutting remelting method of forming and spray up moulding two kinds, the former is by the solder stick cutting of different-diameter
Become the unit of uniform quality, then carry out melting balling-up in glycerol；The latter is that solder is placed on spy
Fixed container (crucible) melts, then inflates in crucible, after increase pressure makes fusing
Solder spray from the specific aperture of crucible bottom, re-use the higher-order of oscillation and be allowed to balling-up.No
Pipe is that the solder ball surface using the cutting remelting method of forming or spray up moulding to be formed all exists
Surface uneven, there are the surface quality problems such as gauffer.And surface smoothness (roughness) matter
Amount is to evaluate an important indicator of BGA solder ball quality good or not, and the defect on surface can cause planting
Inhale ball failure during ball, also can affect welding performance and each transaction capabilities, therefore, BGA solder ball
Also need after molding it is carried out surface roughness process so that it is meet use requirement.
Prior art is typically to put into solder ball in the cylinder of rotation and carries out surface smoothness
Operation, the fineness operation of this mode can not be effectively improved the surface roughness of solder ball,
Effect is undesirable, it is necessary to improved.
Utility model content:
The purpose of this utility model aims to solve the problem that the problem that prior art exists, it is provided that one can
Efficiently solve the surface quality problems such as vaporific, the gauffer in solder ball surface, be effectively improved solder ball
Surface roughness, and can effectively remove the BGA scolding tin of chip impurity produced in bruting process
The polishing impurity removal mechanism of ball.
This utility model relates to the polishing impurity removal mechanism of a kind of BGA solder ball, including frame, institute
State frame include pedestal and be positioned at the crossbeam above described pedestal, pedestal be movably equipped with support plate,
Described support plate is provided with the first polishing mechanism, and the support plate of described first polishing mechanism side is provided with
Drive mechanism, the first polishing mechanism be arranged over the second polishing mechanism, described second buffing machine
Connecting on structure has impurity removal mechanism, described impurity removal mechanism to be arranged on lift cylinder, described lifting air
Cylinder is arranged on crossbeam；
First polishing mechanism include the multiple hemispheric groove that is molded on support plate upper surface and
Hemispheric first polished part being placed in described groove, outside the upper end of described first polished part
Forming the first tooth-strip part on wall, the second polishing mechanism includes multiple corresponding with the first polished part
Second polished part, described second polished part and the first polished part the most jointly enclose set formation for
The diameter of Spherical Volume of accommodating solder ball, the radius phase of the radius of described solder ball and described diameter of Spherical Volume
Deng, the lower end outer wall of the second polished part forms the second tooth coordinated with described first tooth-strip part
Bar portion, outside described second tooth-strip part, fixed engagement has a gear ring, and described gear ring is around being set in
The outside of multiple second polished parts, described drive mechanism includes being arranged on the first tooth-strip part side
Drive the driving motor that is connected with described driving gear of gear and be used for promoting described driving gear
The driving cylinder moved to the first tooth-strip part；
Impurity removal mechanism includes the sweep-up pipe being fixedly connected on the second polished part top, described sweep-up pipe
Lower end be connected with inside the hemisphere of the second polished part, upper end thereof on a top board, described
The piston rod connecting lift cylinder is fixed in the upper end of top board, and sweep-up pipe is connected with induced-draught fan.
By technique scheme, this utility model in use, first by the support plate on pedestal
Move to feeding area, the first polished part of the first polishing mechanism solder ball being placed on support plate
After Nei, then support plate is moved the lower section to the second polishing mechanism so that the first polished part is positioned at
The underface of two polished parts, then starts lift cylinder and makes to bear down on one under the piston rod of lift cylinder
Plate so that top board drives under the sweep-up pipe of impurity removal mechanism and the second polished part of the second polishing mechanism
Move, until the second tooth-strip part of the second polished part lower end and the first polished part of the first polishing mechanism
On the first tooth-strip part contact and cooperatively form a tooth-strip part entirety, now on the second tooth-strip part
To be also set in the first tooth-strip part outer and be meshed with the first tooth-strip part the lower half of gear ring, it
After, the driving cylinder action of drive mechanism, promote and drive gear to move towards gear ring until driving
Gear is meshed with the outside of gear ring, now drives driven by motor drive pinion rotation and then carry
Dynamic ring gear against rotation, owing to gear ring and the first tooth-strip part and the second tooth-strip part all engage, therefore gear ring
The first polished part is driven to rotate together with the second polished part, due to the first polished part and the second polishing
The radius of part is equal with the radius of solder ball, and therefore, the first polished part and the second polished part can
The surface of solder ball is produced friction, vaporific, the gauffer etc. on solder ball surface is polished, thus
Improve the roughness on solder ball surface；One can be produced during solder ball surface is polished
A little chips polished and impurity, now induced-draught fan action passes through sweep-up pipe to the second polished part
With first polished part composition spherical inner air draught, chip and impurity by sweep-up pipe sucking-off, thus
Effectively solder ball bruting process is carried out remove impurity.
By such scheme, polishing impurity removal mechanism of the present utility model can efficiently solve scolding tin
The surface quality problems such as ball surface is vaporific, gauffer, are effectively improved the surface roughness of solder ball,
And can effectively remove the chip impurity produced in bruting process.
One as such scheme is preferred, and the inside of described top board forms a cavity, described
The upper end thereof of sweep-up pipe connects on the bottom surface of top board and with described cavity, and described induced-draught fan sets
Putting on the end face of top board, the inlet scoop of induced-draught fan connects with cavity.
One as such scheme is preferred, the upper surface of described pedestal forms pair of parallel
Line slideway, described support plate is arranged on described line slideway, and line slideway is for being molded over base
The strip gathering sill of seat upper surface, the bottom surface of described support plate forms a pair and described guiding
The guide pad of slot fit, described guide pad is plugged in gathering sill and can move in gathering sill.
One as such scheme is preferred, and described groove is arranged in a linear and is distributed in the upper of support plate
On end face.
One as such scheme is preferred, and the top of described second polished part forms one and leads to
Hole, the lower ending opening of described sweep-up pipe is fixedly connected on described through hole.
One as such scheme is preferred, and described driving motor is arranged on a motor plate, institute
Stating motor plate to be movably arranged on support plate, motor plate connects the piston rod driving cylinder, drives gas
Cylinder is fixed on support plate.
One as such scheme is preferred, described first polished part and the inwall of the second polished part
On be coated with one layer of high-abrasive material.
Described above is only the general introduction of technical solutions of the utility model, in order to better understand
Technological means of the present utility model, and can be practiced according to the content of description, below with this
The preferred embodiment of utility model and coordinate accompanying drawing describe in detail as after.
Accompanying drawing illustrates:
The following drawings is only intended to, in schematically illustrating this utility model and explaining, not limit
Scope of the present utility model.Wherein:
Fig. 1 is structural representation of the present utility model；
Fig. 2 is Fig. 1 structural representation when removing gear ring；
Fig. 3 is the partial sectional view of Fig. 2；
Fig. 4 is another partial sectional view of Fig. 2；
Fig. 5 is working state schematic representation of the present utility model.
Detailed description of the invention:
Below in conjunction with the accompanying drawings and embodiment, detailed description of the invention of the present utility model is made further
Describe in detail.Following example are used for illustrating this utility model, but it is new to be not limited to this practicality
The scope of type.
See Fig. 1, the polishing impurity removal mechanism of a kind of BGA solder ball described in the utility model,
Including frame 10, described frame includes pedestal 11 and is positioned at the crossbeam 12 above described pedestal,
It is movably equipped with support plate 20 on pedestal 11, the upper surface of pedestal 11 forms pair of parallel
Line slideway 30, described support plate 20 is arranged on described line slideway 30, and line slideway is
It is molded over the strip gathering sill 30 of pedestal 11 upper surface, the bottom surface of described support plate 20 becomes
Type has a pair guide pad 21 coordinated with described gathering sill 30, and described guide pad 21 is plugged on
In gathering sill 30 and can move in gathering sill 30, support plate 20 is provided with the first polishing mechanism
40, the support plate 20 of described first polishing mechanism 40 side is provided with drive mechanism 50, and first
Polishing mechanism 40 be arranged over the second polishing mechanism 60, on described second polishing mechanism connect
Impurity removal mechanism 70, described impurity removal mechanism is had to be arranged on lift cylinder 80, described lift cylinder
It is arranged on crossbeam 12.
Seeing Fig. 1, Fig. 2, Fig. 4, the first polishing mechanism 40 includes being molded on support plate 20
Multiple hemispheric groove 41 on end face and hemispheric first be placed in described groove
Polished part 42, described groove 41 is arranged in a linear on the upper surface being distributed in support plate 20, institute
State and on the upper end outer wall of the first polished part 42, form the first tooth-strip part 43, the second polishing mechanism
60 include multiple second polished part 62 corresponding with the first polished part 40, described second polished part
62 jointly enclose with the first polished part about 42 and to set formed for accommodating solder ball 90 spherical
Space, the radius of described solder ball 90 is equal with the radius of described diameter of Spherical Volume, the second polishing
The second tooth-strip part coordinated with described first tooth-strip part 43 is formed on the lower end outer wall of part 62
63, outside described second tooth-strip part 63, fixed engagement has a gear ring 100, described gear ring cincture
Being set in the outside of multiple second polished part 63, described drive mechanism 50 includes being arranged on first
The driving motor 52 that the driving gear 51 of tooth-strip part 43 side is connected with described driving gear
With the driving cylinder 53 for promoting described driving gear 51 to move to the first tooth-strip part 43.
Seeing Fig. 1, Fig. 3, impurity removal mechanism 70 includes that being fixedly connected on the second polished part 62 pushes up
The sweep-up pipe 71 of end, the lower end of described sweep-up pipe is internal with the hemisphere of the second polished part 62 to be connected
Logical, upper end thereof is on a top board 200, and the top of the second polished part 62 forms a through hole
621, the lower ending opening of sweep-up pipe 71 is fixedly connected on described through hole 621, described top board
The piston rod connecting lift cylinder 80, sweep-up pipe 71 and induced-draught fan 72 are fixed in the upper end of 200
Being connected, the inside of top board 200 forms a cavity 201, the upper end hinge of described sweep-up pipe 71
Being connected on the bottom surface of top board 200 and connect with described cavity 201, described induced-draught fan 72 is arranged
On the end face of top board 200, the inlet scoop of induced-draught fan 72 connects with cavity 201.
Seeing Fig. 1, described driving motor 52 is arranged on a motor plate 54, described motor plate
54 are movably arranged on support plate 20, and motor plate 54 connects the piston rod driving cylinder 53, drives
Dynamic air cylinder 53 is fixed on support plate 20.
In this utility model, on the inwall of described first polished part 42 and the second polished part 62 all
It is coated with one layer of high-abrasive material (not shown).
See Fig. 5, this utility model in use, first by flat for the support plate 20 on pedestal 11
Move to feeding area, the of the first polishing mechanism 40 solder ball 90 being placed on support plate 20
After in one polished part 42, then support plate 20 is moved the lower section to the second polishing mechanism 60, make
Obtain the first polished part 42 and be positioned at the underface of the second polished part 62, then start lift cylinder
Coping 200 under 80 piston rods making lift cylinder 80 so that top board 200 drives de-burring machine
The sweep-up pipe 71 of structure 70 and the second polished part 62 of the second polishing mechanism 60 move down, until the
Second tooth-strip part 63 and the first polished part of the first polishing mechanism 40 of two polished part 62 lower ends
The first tooth-strip part 43 on 42 contacts and cooperatively forms tooth-strip part entirety, now second tooth
The lower half of the gear ring 100 in bar portion 63 be also set in the first tooth-strip part 43 outer and with the first tooth
Bar portion 43 is meshed, afterwards, driving cylinder 53 action of drive mechanism 50, promote and drive
Gear 51 moves until driving gear 51 to be meshed with the outside of gear ring 100 towards gear ring 100,
Now drive motor 52 to drive drive gear 51 to rotate and then drive gear ring 100 to rotate, by
All engage with the first tooth-strip part 43 and the second tooth-strip part 63 in gear ring 100, therefore gear ring 100
The first polished part 42 is driven to rotate together with the second polished part 62, due to the first polished part 42
Equal with the radius of solder ball 90 with the radius of the second polished part 62, therefore, the first polished part
42 and second polished part 62 surface of solder ball 90 can be produced friction, by solder ball 90
Vaporific, the gauffer etc. on surface polishes, thus improves the roughness on solder ball 90 surface；?
Solder ball 90 surface can produce some chip polished and impurity during being polished,
Now induced-draught fan 72 action passes through sweep-up pipe 71 to the second polished part 62 and the first polished part 42
The spherical inner air draught of composition, chip and impurity are by sweep-up pipe 71 sucking-off, thus the most right
Solder ball 90 bruting process carries out remove impurity.
In sum, polishing impurity removal mechanism of the present utility model can efficiently solve solder ball table
The surface quality problems such as face is vaporific, gauffer, are effectively improved the surface roughness of solder ball, and energy
Effectively remove the chip impurity produced in bruting process.
The polishing impurity removal mechanism of BGA solder ball provided by the utility model, is only this practicality new
The detailed description of the invention of type, but protection domain of the present utility model is not limited thereto, any ripe
Know those skilled in the art in the technical scope that this utility model discloses, can think easily
To change or replacement, all should contain within this utility model protection domain.Therefore, this practicality
Novel protection domain should be as the criterion with described scope of the claims.
Claims (7)
1. a polishing impurity removal mechanism for BGA solder ball, including frame (10), described frame
Including pedestal (11) be positioned at the crossbeam (12) above described pedestal, it is characterised in that:
Being movably equipped with support plate (20) on described pedestal (11), described support plate is provided with the first throwing
Light mechanism (40), the support plate (20) of described first polishing mechanism side is provided with drive mechanism
(50), the first polishing mechanism (40) be arranged over the second polishing mechanism (60), described
Connecting on two polishing mechanisms and have impurity removal mechanism (70), described impurity removal mechanism is arranged on lift cylinder
(80), on, described lift cylinder is arranged on crossbeam (12)；
First polishing mechanism (40) includes the multiple hemisphere being molded on support plate (20) upper surface
The groove (41) of shape and hemispheric first polished part (42) being placed in described groove,
The first tooth-strip part (43), the second buffing machine is formed on the upper end outer wall of described first polished part
Structure (60) includes multiple second polished part (62) corresponding with the first polished part (42), institute
State the second polished part and the first polished part (42) the most jointly encloses and sets formation for accommodating scolding tin
The diameter of Spherical Volume of ball (90), the radius of described solder ball (90) and the half of described diameter of Spherical Volume
Footpath is equal, the lower end outer wall of the second polished part (62) forms and described first tooth-strip part (43)
The second tooth-strip part (63) coordinated, outside described second tooth-strip part, fixed engagement has a gear ring
(100), described gear ring around being set in the outside of multiple second polished part (62), described in drive
Motivation structure (50) include being arranged on the first tooth-strip part (43) side driving gear (51),
The driving motor (52) that is connected with described driving gear and be used for promoting described driving gear (51)
To the driving cylinder (53) of the first tooth-strip part (43) movement；
Impurity removal mechanism (70) includes the sweep-up pipe being fixedly connected on the second polished part (62) top
(71), the lower end of described sweep-up pipe be connected with inside the hemisphere of the second polished part (62),
Upper end thereof is on a top board (200), and the upper end of described top board is fixing connects lift cylinder (80)
Piston rod, sweep-up pipe (71) is connected with induced-draught fan (72).
The polishing impurity removal mechanism of BGA solder ball the most according to claim 1, its feature
It is: the inside of described top board (200) forms a cavity (201), described sweep-up pipe (71)
Upper end thereof connect on the bottom surface of top board (200) and with described cavity (201), described
Induced-draught fan (72) is arranged on the end face of top board (200), the inlet scoop of induced-draught fan (72)
Connect with cavity (201).
The polishing impurity removal mechanism of BGA solder ball the most according to claim 1, its feature
It is: on the upper surface of described pedestal (11), form pair of parallel line slideway (30),
Described support plate (20) is arranged on described line slideway (30), and line slideway is for being molded over base
The strip gathering sill (30) of seat (11) upper surface, the bottom surface of described support plate (20) becomes
Type has a pair guide pad (21) coordinated with described gathering sill (30), described guide pad grafting
In gathering sill (30) and can move in gathering sill (30).
The polishing impurity removal mechanism of BGA solder ball the most according to claim 1, its feature
It is: described groove (41) is arranged in a linear on the upper surface being distributed in support plate (20).
The polishing impurity removal mechanism of BGA solder ball the most according to claim 1, its feature
It is: the top of described second polished part (62) forms a through hole (621), described dust suction
The lower ending opening of pipe (71) is fixedly connected on described through hole (621).
The polishing impurity removal mechanism of BGA solder ball the most according to claim 1, its feature
Being: described driving motor (52) is arranged on a motor plate (54), described motor plate is lived
Moving and be arranged on support plate (20), motor plate (54) connects the piston rod driving cylinder (53),
Cylinder (53) is driven to be fixed on support plate (20).
The polishing impurity removal mechanism of BGA solder ball the most according to claim 1, its feature
It is: be coated with on the inwall of described first polished part (42) and the second polished part (62)
One layer of high-abrasive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620175190.5U CN205520858U (en) | 2016-03-08 | 2016-03-08 | Impurity removing mechanism that polishes of BGA soldering tin ball |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620175190.5U CN205520858U (en) | 2016-03-08 | 2016-03-08 | Impurity removing mechanism that polishes of BGA soldering tin ball |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205520858U true CN205520858U (en) | 2016-08-31 |
Family
ID=56779878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620175190.5U Expired - Fee Related CN205520858U (en) | 2016-03-08 | 2016-03-08 | Impurity removing mechanism that polishes of BGA soldering tin ball |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205520858U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105690217A (en) * | 2016-03-08 | 2016-06-22 | 浙江乔兴建设集团湖州智能科技有限公司 | Polishing and impurity removal mechanism for BGA solder balls |
| CN106564002A (en) * | 2016-11-09 | 2017-04-19 | 北京时代民芯科技有限公司 | Tool and method for controlling coplanarity, position tolerance and perpendicularity of CCGA device welding columns |
| CN108890512A (en) * | 2018-06-28 | 2018-11-27 | 马鞍山市益丰实业集团有限公司 | A kind of abrasion-proof steel ball surface impurity removal device and its minimizing technology |
| CN109623541A (en) * | 2018-10-16 | 2019-04-16 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Bga device soldered ball eliminating equipment and its method |
-
2016
- 2016-03-08 CN CN201620175190.5U patent/CN205520858U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105690217A (en) * | 2016-03-08 | 2016-06-22 | 浙江乔兴建设集团湖州智能科技有限公司 | Polishing and impurity removal mechanism for BGA solder balls |
| CN105690217B (en) * | 2016-03-08 | 2018-11-09 | 泉州台商投资区集瑞科技有限公司 | A kind of polishing impurity removal mechanism of BGA solder balls |
| CN106564002A (en) * | 2016-11-09 | 2017-04-19 | 北京时代民芯科技有限公司 | Tool and method for controlling coplanarity, position tolerance and perpendicularity of CCGA device welding columns |
| CN108890512A (en) * | 2018-06-28 | 2018-11-27 | 马鞍山市益丰实业集团有限公司 | A kind of abrasion-proof steel ball surface impurity removal device and its minimizing technology |
| CN108890512B (en) * | 2018-06-28 | 2024-02-02 | 马鞍山市益丰实业集团有限公司 | Wear-resistant steel ball surface impurity removing device and method |
| CN109623541A (en) * | 2018-10-16 | 2019-04-16 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Bga device soldered ball eliminating equipment and its method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170815 Address after: 550029, Guizhou province Guiyang city Huaxi District, stone town, Peng village steel market CBa-2F-102 Patentee after: Guiyang Xin Xin metal car technology Co., Ltd. Address before: Yang Shu Lu Wuxing District 313000 Zhejiang city of Huzhou province No. 18 Patentee before: ZHEJIANG QIAOXING CONSTRUCTION GROUP HUZHOU INTELLIGENT TECHNOLOGY CO., LTD. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160831 Termination date: 20180308 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |