CN102544240B - Method and device for integrating slicing and flocking of crystalline silicon wafer - Google Patents
Method and device for integrating slicing and flocking of crystalline silicon wafer Download PDFInfo
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- CN102544240B CN102544240B CN201210062228.4A CN201210062228A CN102544240B CN 102544240 B CN102544240 B CN 102544240B CN 201210062228 A CN201210062228 A CN 201210062228A CN 102544240 B CN102544240 B CN 102544240B
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- diamond cutting
- wool
- wheels
- making herbs
- cutting secant
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 65
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 50
- 239000010432 diamond Substances 0.000 claims abstract description 50
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 210000002268 wool Anatomy 0.000 claims description 33
- 235000008216 herbs Nutrition 0.000 claims description 32
- 239000002173 cutting fluid Substances 0.000 claims description 20
- 239000004484 Briquette Substances 0.000 claims description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 235000021355 Stearic acid Nutrition 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- BEGBSFPALGFMJI-UHFFFAOYSA-N ethene;sodium Chemical group [Na].C=C BEGBSFPALGFMJI-UHFFFAOYSA-N 0.000 claims description 5
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 5
- 239000008117 stearic acid Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- -1 isopropyl alcohols Chemical class 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052710 silicon Inorganic materials 0.000 abstract description 16
- 239000010703 silicon Substances 0.000 abstract description 16
- 239000000126 substance Substances 0.000 abstract description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- PHOQVHQSTUBQQK-SQOUGZDYSA-N D-glucono-1,5-lactone Chemical compound OC[C@H]1OC(=O)[C@H](O)[C@@H](O)[C@@H]1O PHOQVHQSTUBQQK-SQOUGZDYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to a method and a device for integrating slicing and flocking of a crystalline silicon wafer. The device comprises an outlet wheel, two tension wheels, a plurality of guide wheels, two roller wheels, an inlet wheel and a cutting line movement system, wherein the cutting line movement system consists of diamond cutting lines wound on the outlet wheel, the tension wheels, the guide wheels, the roller wheels and the inlet wheel; the roller wheels are connected with a motor to drive the diamond cutting lines to move; the tension wheels control the tension of the diamond cutting lines; a fixing device is arranged above the corresponding diamond cutting line between the two roller wheels; a silicon block is fixedly arranged on the fixing device; and the roller wheels, the guide wheels and the diamond cutting lines wound on the guide wheels are arranged in a liquid groove accommodating flocking and cutting liquid. The flocking and cutting liquid is injected into the liquid groove of a slicing machine to soak the diamond cutting lines and the silicon block; and the roller wheels are rotated, and the silicon block is gradually and slowly pressed downwards to be contacted with the diamond cutting lines to slice. The problem of stress caused in a slicing process can be effectively solved by the method and the device, so slicing and flocking can be performed simultaneously, the utilization of chemicals and technical equipment is reduced, and the process flow is shortened.
Description
Technical field:
The present invention relates to a kind of section making herbs into wool integral method and device of crystalline silicon wafer.
Background technology:
At present, solar energy crystalline silicon silicon is generally by wire cutting method, silico briquette cutting to be formed, and the principle of cutting is to utilize wire to drive the abrasive micro-powder being dispersed in cutting fluid to cut silico briquette.In the cutting process of silicon chip, the Main Function of cutting fluid is the lubricant effect that improves cutting, reduces frictional force, reduces stress and fine fisssure; Shift the heat that cutting produces, clean the abrasive dust producing in working angles.Traditional silicon wafer cutting fluid consumed resource is very large, and cyclic utilization rate is low, and environmental pollution is serious, and the silicon abrasive dust cutting is not easy to reclaim.
On the other hand, crystal silicon battery manufacturing enterprise, in the production process of processing crystal silicon solar batteries, all can carry out making herbs into wool processing to silicon chip, and object is in order to increase the absorption of silicon chip to light, reduces reflection of light.In general, the cutting of silicon chip and making herbs into wool are all carried out separately, need two kinds of independently equipment and process, relatively waste time and energy.
Summary of the invention:
The object of the present invention is to provide a kind of section making herbs into wool integral method and device of crystalline silicon wafer, the section of crystal silicon and making herbs into wool are carried out simultaneously, to reduce the use of chemicals and process equipment, while shortened process.
The technical scheme that the present invention takes is:
The section making herbs into wool integrated apparatus of crystalline silicon wafer, comprise by an outlet wheel, two straining pulleys, a plurality of guide wheel, two running rollers, take-up pulleies and be wrapped in the line of cut kinematic system that the diamond cutting secant above them forms, running roller is connected with motor and drives the motion of diamond cutting secant, straining pulley is controlled the tension force of diamond cutting secant, diamond cutting secant top corresponding between two running rollers is provided with fixture, in fixture, be fixed with silico briquette, running roller, guide wheel and the diamond cutting secant being wound around are thereon placed in the liquid bath that fills making herbs into wool cutting fluid.
Described diamond cutting secant has many and parallel equidistant from arrangement.
Described running roller is provided with guide groove.
Described fixture comprises fixed head and fixture.
In described line of cut kinematic system, diamond cutting secant is taken turns outlet by outlet, through guide wheel and straining pulley on two running rollers, and from running roller out through guide wheel and straining pulley take-up to take-up pulley.
The section making herbs into wool integral method of crystalline silicon wafer, comprises that step is as follows:
(1) by the close guide groove that is arranged in running roller of the equidistant winding of diamond cutting secant;
(2) silico briquette of slice is placed in directly over diamond cutting secant;
(3) alkaline making herbs into wool cutting fluid is injected in the liquid bath of slicing machine to submergence diamond cutting secant and silico briquette;
(4) rotate running roller, slowly press down gradually silico briquette contact diamond cutting secant and cut into slices.
The mass percent of described alkaline making herbs into wool cutting fluid consists of: 0.1～0.5% NaOH, 2～6% isopropyl alcohols (IPA), 2～4% glucolactones, 10～20% stearic acid imidazolines, 0.5～1% sodium ethylene diamine tetracetate and surplus deionized water.
The invention has the beneficial effects as follows by utilizing diamond cutting secant to cut silico briquette in alkaline making herbs into wool cutting fluid, avoided the use of abrasive material, the damage of abrasive material to silicon chip in the process of having avoided cutting; Making herbs into wool cutting fluid as Woolen-making liquid time also as cutting coolant, can and the making herbs into wool of silicon chip generation self-stopping technology react; The corrosiveness of making herbs into wool cutting fluid can effectively solve the stress problem producing in slicing processes, and the silica flour cutting can also be recycled.Make like this section and making herbs into wool to carry out simultaneously, reduced the use of chemicals and process equipment, shortened technological process.
Accompanying drawing explanation
Fig. 1 is the section making herbs into wool integrated apparatus structural representation of crystalline silicon wafer of the present invention;
Fig. 2 is diamond cutting secant artwork;
Fig. 3 is the scanning electron microscope (SEM) photograph after embodiment 2 silicon chip section making herbs into wool;
Fig. 4 is the scanning electron microscope (SEM) photograph after conventional silicon wafer wool making;
Wherein: 1, outlet wheel; 2, take-up pulley; 3, straining pulley; 4, guide wheel; 5, liquid bath; 6, fixed head; 7, fixture; 8, silico briquette; 9, diamond cutting secant; 10, running roller; 11, making herbs into wool cutting fluid.
Embodiment:
Below in conjunction with embodiment and embodiment, further illustrate.
The section making herbs into wool integrated apparatus of crystalline silicon wafer, comprise by an outlet wheel 1, two straining pulleys 3, a plurality of guide wheels 4, two running rollers 10, a take-up pulley 2 and be wrapped in the line of cut kinematic system that diamond cutting secant above them 9 forms, running roller 10 is connected with motor and drives 1 motion of diamond cutting secant, straining pulley 3 is controlled the tension force of diamond cutting secant 9, diamond cutting secant 1 top corresponding between two running rollers 10 is provided with fixture (fixed head 6 and fixture 7), in fixture, be fixed with silico briquette 8, running roller 10, guide wheel 4 and the diamond cutting secant 1 being wound around are thereon placed in the liquid bath 5 that fills making herbs into wool cutting fluid 11.
As shown in Figure 1, first by the close running roller 10 being arranged in guide groove of the equidistant winding of diamond cutting secant 9, the silico briquette of slice 8 is placed in directly over the diamond cutting secant of solid matter cloth, again alkaline making herbs into wool cutting fluid 11 is injected in slicing machine liquid bath, submergence diamond cutting secant 9, the mass percent of making herbs into wool cutting fluid consists of 0.1% NaOH (NaOH), 6% isopropyl alcohol (IPA), 2% glucolactone, 10% stearic acid imidazoline, 1% sodium ethylene diamine tetracetate and surplus deionized water; Rotate running roller and drive diamond cutting secant, slowly press down gradually, silico briquette 8 contact diamond cutting secants 9 are cut into slices.
Embodiment 2
First by the close running roller 10 being arranged in guide groove of the equidistant winding of diamond cutting secant 9, the silico briquette of slice 8 is placed in directly over the diamond cutting secant of solid matter cloth, again alkaline making herbs into wool cutting fluid 11 is injected in slicing machine liquid bath, submergence diamond cutting secant 9, the mass percent of making herbs into wool cutting fluid consists of 0.5% NaOH, 3% isopropyl alcohol (IPA), 3% glucolactone, 15% stearic acid imidazoline, 0.8% sodium ethylene diamine tetracetate and surplus deionized water; Rotate running roller and drive diamond cutting secant, slowly press down gradually silico briquette 8 contact diamond cutting secants 9 and cut into slices.
Embodiment 3
First by the close running roller 10 being arranged in guide groove of the equidistant winding of diamond cutting secant 9, the silico briquette of slice 8 is placed in directly over the diamond cutting secant of solid matter cloth, again alkaline making herbs into wool cutting fluid 11 is injected in slicing machine liquid bath, submergence diamond cutting secant 9, the mass percent of making herbs into wool cutting fluid consists of 0.5% NaOH, 2% isopropyl alcohol (IPA), 4% glucolactone, 20% stearic acid imidazoline, 1% sodium ethylene diamine tetracetate and surplus deionized water; Rotate running roller and drive diamond cutting secant, slowly press down gradually silico briquette 8 contact diamond cutting secants 9 and cut into slices.
Claims (1)
1. a section making herbs into wool integrated apparatus that utilizes crystalline silicon wafer carries out the section making herbs into wool integral method of crystalline silicon wafer, it is characterized in that, device comprises by an outlet takes turns, two straining pulleys, a plurality of guide wheels, two running rollers, a take-up pulley and be wrapped in the line of cut kinematic system that diamond cutting secant above them forms, running roller is connected with motor and drives the motion of diamond cutting secant, straining pulley is controlled the tension force of diamond cutting secant, diamond cutting secant top corresponding between two running rollers is provided with fixture, in fixture, be fixed with silico briquette, running roller, guide wheel and the diamond cutting secant being wound around are thereon placed in the liquid bath that fills making herbs into wool cutting fluid,
Comprise that step is as follows:
(1) by the close guide groove that is arranged in running roller of the equidistant winding of diamond cutting secant;
(2) silico briquette of slice is placed in directly over diamond cutting secant;
(3) alkaline making herbs into wool cutting fluid is injected in liquid bath to submergence diamond cutting secant and silico briquette; The mass percent of described alkaline making herbs into wool cutting fluid consists of: 0.1～0.5% NaOH, 2～6% isopropyl alcohols, 2～4% glucolactones, 10～20% stearic acid imidazolines, 0.5～1% sodium ethylene diamine tetracetate and surplus deionized water;
(4) rotate running roller, slowly press down gradually silico briquette contact diamond cutting secant and cut into slices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210062228.4A CN102544240B (en) | 2012-03-09 | 2012-03-09 | Method and device for integrating slicing and flocking of crystalline silicon wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210062228.4A CN102544240B (en) | 2012-03-09 | 2012-03-09 | Method and device for integrating slicing and flocking of crystalline silicon wafer |
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| CN102544240A CN102544240A (en) | 2012-07-04 |
| CN102544240B true CN102544240B (en) | 2014-04-09 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103009489B (en) * | 2012-12-11 | 2015-07-01 | 江苏协鑫硅材料科技发展有限公司 | Method and device for cutting silicon ingot |
| CN103643304A (en) * | 2013-12-18 | 2014-03-19 | 上饶光电高科技有限公司 | Method for activating polysilicon texturing liquid medicine |
| CN107195705A (en) * | 2017-06-16 | 2017-09-22 | 苏州阿特斯阳光电力科技有限公司 | A kind of preparation method of solar cell |
| CN108858840A (en) * | 2018-06-27 | 2018-11-23 | 阜宁协鑫光伏科技有限公司 | The method for cutting silicon wafer |
| CN109291268A (en) * | 2018-11-08 | 2019-02-01 | 上海申和热磁电子有限公司 | A kind of three axis changes the slicer cutting method of two axis |
| CN109664423B (en) * | 2018-12-19 | 2023-08-18 | 南京工程学院 | Tension control system for cutting solar cell silicon wafer |
| CN111775353B (en) * | 2020-06-10 | 2022-05-31 | 浙江浦江中星有限公司 | High-efficient solar cell silicon chip cutterbar |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000334653A (en) * | 1999-05-28 | 2000-12-05 | Hitachi Cable Ltd | Band saw type cutting method and device |
| CN1182945C (en) * | 2002-07-03 | 2005-01-05 | 沈阳科晶设备制造有限公司 | Automatically controlled high-precision crystal wire electrode cutting machine |
| CN100466304C (en) * | 2007-05-11 | 2009-03-04 | 上海明兴开城超音波科技有限公司 | Chemical etching, cleaning and drying method of single-crystal silicon solar battery and integrated processing machine |
| CN100433376C (en) * | 2007-08-07 | 2008-11-12 | 南京航空航天大学 | Integrated processing method for cotton cutting of solar silicon and its device |
| CN101138869A (en) * | 2007-10-12 | 2008-03-12 | 南京航空航天大学 | Monocrystalline silicon high-efficient composite cutting method and cutting system thereof |
| CN202053389U (en) * | 2011-03-07 | 2011-11-30 | 镇江耐丝新型材料有限公司 | Wire cutting device |
| CN202462662U (en) * | 2012-03-09 | 2012-10-03 | 润峰电力有限公司 | Slicing and texturing integrated device of crystalline silicon chip |
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Effective date of registration: 20231206 Address after: Room 104, No. 169 Kuiwen East Road, Xiazhen Street, Weishan County, Jining City, Shandong Province, 277600 Patentee after: Weishan County Shunyang Trading Co.,Ltd. Address before: 277600 Runfeng Industrial Park, Weishan Economic Development Zone, Weishan County, Jining City, Shandong Province Patentee before: REALFORCE POWER Co.,Ltd. |
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