CN201900687U - Improved cutting steel wire - Google Patents
Improved cutting steel wire Download PDFInfo
- Publication number
- CN201900687U CN201900687U CN201020644408XU CN201020644408U CN201900687U CN 201900687 U CN201900687 U CN 201900687U CN 201020644408X U CN201020644408X U CN 201020644408XU CN 201020644408 U CN201020644408 U CN 201020644408U CN 201900687 U CN201900687 U CN 201900687U
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- steel wire
- cutting
- cutting steel
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Abstract
The utility model relates to cutting wires in the field of photovoltaics or semiconductors, in particular to an improved cutting wire. A plurality of microgrooves are uniformly distributed on the outer surface of the cutting steel wire. Compared with the prior art, the improved cutting steel wire is novel and simple in structure. Due to the fact that the microgrooves are arranged on the outer surface of the cutting steel wire, the quantity of mortar carried by the steel wire during grinding is increased greatly, cutting is accelerated, and cutting efficiency is increased. Particularly when used for cutting harder materials or materials difficult to be processed, the improved cutting steel wire brings great convenience to cutting and is worthy of being popularized and applied.
Description
[technical field]
The utility model relates to the cutting steel wire in photovoltaic or the semiconductor applications, specifically a kind of modified cutting steel wire.
[background technology]
Solar photovoltaic technology is to be the technology of electric power with conversion of solar energy, and its core is the semiconductor substance that can discharge electronics, and the most frequently used semi-conducting material is a silicon.Quick growth along with the silicon materials cost, the thickness that reduces silicon chip becomes reduce cost the most direct and effective means, thin silicon chip means less silicon materials consumption, having played important function to reducing the solar-energy photo-voltaic cell cost, is that technological progress promotes one of important example that reduces cost.In order to realize reducing the purpose of silicon wafer thickness, extensively adopted the multi-thread cutting technique of silicon crystal at present in the world, it is different from cutting modes such as traditional knife saw sheet, grinding wheel, also be different from advanced laser cutting and interior circle cutting, its principle is that the steel wire by a high-speed motion drives and attached to the cutting blade material on the steel wire silicon rod rubbed, thereby reaches cutting effect.
The multi-thread cutting technique of silicon crystal is compared with other cutting techniques, has efficient height, production capacity height, precision advantages of higher.The domestic multi-thread cutting technique of silicon crystal mostly is to adopt the cutting steel wire to carry mortar to grind silicon rod to realize the silicon chip cutting at present, its shortcoming is, because the entrained mortar quantity of uncontrollable cutting steel wire, thereby limited the cutting speed of cutting steel wire, cutting efficiency is also lower, particularly some are harder or more during difficult to machine material, then more not competent in cutting, have brought very big inconvenience for cutting work.
[summary of the invention]
The purpose of this utility model is exactly will solve above-mentioned deficiency and a kind of modified cutting steel wire is provided, and has improved cutting efficiency greatly.
Design a kind of modified cutting steel wire for achieving the above object, it is characterized in that: described cutting steel wire outer surface is provided with several little connected in stars, and described groove is evenly distributed on the described cutting steel wire outer surface.
The bore of described groove is the 20-100 micron, and the degree of depth of described groove is the 10-50 micron.
The cross-sectional diameter of described cutting steel wire is 0.12-0.5mm.
The cross section of described cutting steel wire is circle, ellipse or polygon.
Scribble glue layer on the described cutting steel wire outer surface.
The utility model is compared with prior art, and novel structure, simple because cutting steel wire outer surface is provided with several little connected in stars, has then improved mortar quantity entrained when the cutting steel wire grinds greatly, has accelerated cutting speed, has improved cutting efficiency.Particularly when some harder or difficult material processed of cutting, the utility model has brought very big convenience for cutting work, is worthy of popularization.
[description of drawings]
Fig. 1 is a structural representation of the present utility model;
Among the figure: 1, cutting steel wire, 2, groove.
[specific embodiment]
Further specify below below in conjunction with accompanying drawing the utility model being done:
As shown in drawings, the utility model is with existing cutting steel wire process Mould Machining, make its outer surface be provided with several little connected in stars, groove is evenly distributed on the cutting steel wire outer surface, the cross-sectional diameter of cutting steel wire is 0.12mm, 0.20mm, 0.30mm, 0.40mm or 0.5mm, the bore of groove is 20 microns, 25 microns, 35 microns, 50 microns 80 microns or 100 microns, and the degree of depth of groove is 10 microns, 20 microns, 30 microns 40 microns or 50 microns.During cutting, this outer surface is provided with the guiding of the cutting steel wire of little connected in star by tens guide rollers, on the main line roller, form a bracing cable net, and silicon crystal to be processed is realized the feeding of workpiece by the decline of workbench, the mortar that the cutting Steel Wire Surface is carried is along with the high-speed motion of steel wire, directly obtain movement velocity and certain pressure, thereby directly silicon materials are carried out grinding and cutting.
The utility model can also scribble glue layer on cutting steel wire outer surface, avoid steel wire to contact with the direct of silicon crystal, the stria that this improvement has produced when having significantly reduced cutting steel wire cutting silicon crystal, reduced the wire broken rate of cutting steel wire itself, improve the yield rate of silicon chip, effectively prolonged the service life of cutting steel wire.
The utility model cutting steel wire purposes not only is used for the cutting of photovoltaic field silicon crystal, also can be used for the cutting of crystal, crystal glass, jewel etc.
The utility model is not subjected to the restriction of above-mentioned embodiment; other any do not deviate from change, the modification done under spiritual essence of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, be included within the protection domain of the present utility model.
Claims (5)
1. a modified cuts steel wire, and it is characterized in that: described cutting steel wire outer surface is provided with several little connected in stars, and described groove is evenly distributed on the described cutting steel wire outer surface.
2. a kind of modified cutting steel wire as claimed in claim 1, it is characterized in that: the bore of described groove is the 20-100 micron, the degree of depth of described groove is the 10-50 micron.
3. a kind of modified cutting steel wire as claimed in claim 1 or 2, it is characterized in that: the cross-sectional diameter of described cutting steel wire is 0.12-0.5mm.
4. a kind of modified cutting steel wire as claimed in claim 3, it is characterized in that: the cross section of described cutting steel wire is circle, ellipse or polygon.
5. a kind of modified cutting steel wire as claimed in claim 4 is characterized in that: scribble glue layer on the described cutting steel wire outer surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020644408XU CN201900687U (en) | 2010-12-06 | 2010-12-06 | Improved cutting steel wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020644408XU CN201900687U (en) | 2010-12-06 | 2010-12-06 | Improved cutting steel wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201900687U true CN201900687U (en) | 2011-07-20 |
Family
ID=44271291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020644408XU Expired - Fee Related CN201900687U (en) | 2010-12-06 | 2010-12-06 | Improved cutting steel wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201900687U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103286867A (en) * | 2013-06-04 | 2013-09-11 | 衡水英利新能源有限公司 | Steel wire for cutting silicon slices and production method of steel wire |
| CN103707426A (en) * | 2013-12-30 | 2014-04-09 | 镇江市港南电子有限公司 | Silicon wafer cutting machine |
| CN103722626A (en) * | 2013-12-30 | 2014-04-16 | 镇江市港南电子有限公司 | Silicon wafer cutting steel wire |
| CN103909583A (en) * | 2014-04-24 | 2014-07-09 | 王金生 | Abrasive grain saw blade and saw machine for dissociating abrasive cutting |
| CN104070610A (en) * | 2013-03-26 | 2014-10-01 | 蒙特集团（香港）有限公司 | High-efficiency cutting wire saw with abrasive |
| CN104526893A (en) * | 2014-12-29 | 2015-04-22 | 盛利维尔（中国）新材料技术有限公司 | Stored liquid circulating cooling type torsion-increasing diamond wire with polygonal cross section |
-
2010
- 2010-12-06 CN CN201020644408XU patent/CN201900687U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104070610A (en) * | 2013-03-26 | 2014-10-01 | 蒙特集团（香港）有限公司 | High-efficiency cutting wire saw with abrasive |
| CN103286867A (en) * | 2013-06-04 | 2013-09-11 | 衡水英利新能源有限公司 | Steel wire for cutting silicon slices and production method of steel wire |
| CN103286867B (en) * | 2013-06-04 | 2015-08-19 | 衡水英利新能源有限公司 | Silicon chip cutting steel wire and preparation method thereof |
| CN103707426A (en) * | 2013-12-30 | 2014-04-09 | 镇江市港南电子有限公司 | Silicon wafer cutting machine |
| CN103722626A (en) * | 2013-12-30 | 2014-04-16 | 镇江市港南电子有限公司 | Silicon wafer cutting steel wire |
| CN103707426B (en) * | 2013-12-30 | 2016-04-13 | 福能科技江苏有限公司 | A kind of silicon chip cutter |
| CN103722626B (en) * | 2013-12-30 | 2016-04-13 | 福能科技江苏有限公司 | A kind of silicon chip cutting steel wire |
| CN103909583A (en) * | 2014-04-24 | 2014-07-09 | 王金生 | Abrasive grain saw blade and saw machine for dissociating abrasive cutting |
| CN104526893A (en) * | 2014-12-29 | 2015-04-22 | 盛利维尔（中国）新材料技术有限公司 | Stored liquid circulating cooling type torsion-increasing diamond wire with polygonal cross section |
| CN104526893B (en) * | 2014-12-29 | 2016-02-17 | 盛利维尔（中国）新材料技术有限公司 | A kind of liquid storage circulating cooling type adds turns round polygonal crosssection diamond wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110720 Termination date: 20141206 |
|
| EXPY | Termination of patent right or utility model |