CN103722626B - A kind of silicon chip cutting steel wire - Google Patents
A kind of silicon chip cutting steel wire Download PDFInfo
- Publication number
- CN103722626B CN103722626B CN201310745955.5A CN201310745955A CN103722626B CN 103722626 B CN103722626 B CN 103722626B CN 201310745955 A CN201310745955 A CN 201310745955A CN 103722626 B CN103722626 B CN 103722626B
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- steel wire
- protective layer
- passage
- reservoir
- silicon chip
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to a kind of silicon chip cutting steel wire of frosted, comprise two steel wire bodies, wherein, described two steel wire bodies are the integral structure being superimposed with each other into the figure of eight, passage is provided with in described steel wire body, the cross sectional shape of described passage is regular hexagon, carbide alloy is filled with in described passage, the coated one deck of described steel wire body outer surface take potassium steel as the protective layer of material, described protective layer does frosted process, reservoir is provided with in described protective layer, described reservoir is spherical structure, described reservoir and protective layer outer wall are directly provided with cylindrical channel, the diameter of described cylindrical channel is 0.05 ± 0.01mm, the ability of its glutinous band cutting mill liquid increases, considerably increase production efficiency.
Description
Technical field
The present invention relates to a kind of for the silicon chip cutting steel wire in photovoltaic industry.
Background technology
At present, cutting silicon wafer adopts the high-tensile steel wires showing copper-plated zinc alloy.Steel wire is under the state of high-speed cruising, and liquid is ground in adhesive tape cutting, and when certain effect power, the abrasive material driven by steel wire and silicon rod grind to be cut, and finally makes silicon chip.The steel wire of existing cutting silicon wafer is the high-tensile steel wires of copper coating kirsite, its smooth surface, and the ability of glutinous band cutting mill liquid, affects the production efficiency of cutting silicon wafer.
Summary of the invention
Technical problem to be solved by this invention is the silicon chip cutting steel wire providing a kind of frosted for above drawback, and the ability of its glutinous band cutting mill liquid increases, and considerably increases production efficiency.
For solving the problems of the technologies described above, technical scheme of the present invention is:
A kind of silicon chip cutting steel wire, comprise two steel wire bodies, wherein, described two steel wire bodies are the integral structure being superimposed with each other into the figure of eight, passage is provided with in described steel wire body, the cross sectional shape of described passage is regular hexagon, carbide alloy is filled with in described passage, the coated one deck of described steel wire body outer surface take potassium steel as the protective layer of material, described protective layer does frosted process, reservoir is provided with in described protective layer, described reservoir is spherical structure, described reservoir and protective layer outer wall are directly provided with cylindrical channel, the diameter of described cylindrical channel is 0.05 ± 0.01mm.
Above-mentioned a kind of silicon chip cutting steel wire, wherein, described steel wire body diameter be 0.3-0.6mm, the orthohexagonal circumscribed circle diameter that described passage is formed is 0.15-0.25mm, and described protective layer thickness is 0.2-0.3mm.
Beneficial effect of the present invention is:
1. be provided with passage in steel wire body, in passage, be filled with carbide alloy, considerably increase the hardness of cutting steel wire, intensity, wearability and corrosion resistance;
2. cutting steel wire is the integral structure being superimposed with each other into the figure of eight by two steel wire bodies, considerably increases cutting effect and cutting dynamics;
3. the coated one deck of steel wire body outer surface take potassium steel as the protective layer of material; protective layer does frosted process; reservoir is provided with in protective layer; a certain amount of cutting mill liquid can be stored in reservoir; both improve the cutting power to silicon chip; turn improve the ability of glutinous band cutting mill liquid, substantially increase the cutting effect of silicon chip.
Accompanying drawing explanation
Fig. 1 is sectional view of the present invention
Detailed description of the invention
Below the present invention is further described.
A kind of silicon chip cutting steel wire as shown in the figure, comprise two steel wire bodies 1, described steel wire body 1 diameter d 1 be 0.3-0.6mm, described two steel wire bodies 1 are for being superimposed with each other into the integral structure of the figure of eight, passage 2 is provided with in described steel wire body 1, the cross sectional shape of described passage 2 is regular hexagon, its circumscribed circle diameter d2 is 0.15-0.25mm, carbide alloy 3 is filled with in described passage 2, the coated one deck of described steel wire body 1 outer surface take potassium steel as the protective layer 4 of material, described protective layer 4 thickness h is 0.2-0.3mm, described protective layer does frosted process 5, reservoir 6 is provided with in described protective layer 4, described reservoir 6 is spherical structure, described reservoir and protective layer outer wall are directly provided with cylindrical channel 7, the diameter d 3 of described cylindrical channel is 0.05 ± 0.01mm.
Beneficial effect of the present invention is:
1. be provided with passage in steel wire body, in passage, be filled with carbide alloy, considerably increase the hardness of cutting steel wire, intensity, wearability and corrosion resistance;
2. cutting steel wire is the integral structure being superimposed with each other into the figure of eight by two steel wire bodies, considerably increases cutting effect and cutting dynamics;
3. the coated one deck of steel wire body outer surface take potassium steel as the protective layer of material; protective layer does frosted process; reservoir is provided with in protective layer; a certain amount of cutting mill liquid can be stored in reservoir; both improve the cutting power to silicon chip; turn improve the ability of glutinous band cutting mill liquid, substantially increase the cutting effect of silicon chip.
Here description of the invention and application is illustrative, not wants by scope restriction of the present invention in the above-described embodiments, and therefore, the present invention is not by the restriction of the present embodiment, and the technical scheme that any employing equivalence replacement obtains is all in the scope of protection of the invention.
Claims (2)
1. a silicon chip cutting steel wire, comprise two steel wire bodies, it is characterized by, described two steel wire bodies are the integral structure being superimposed with each other into the figure of eight, passage is provided with in described steel wire body, the cross sectional shape of described passage is regular hexagon, carbide alloy is filled with in described passage, the coated one deck of described steel wire body outer surface take potassium steel as the protective layer of material, described protective layer does frosted process, reservoir is provided with in described protective layer, described reservoir is spherical structure, cylindrical channel is provided with between described reservoir and protective layer outer wall, the diameter of described cylindrical channel is 0.05 ± 0.01mm.
2. a kind of silicon chip cutting steel wire as claimed in claim 1, is characterized by, and described steel wire body diameter is 0.3-0.6mm, and the orthohexagonal circumscribed circle diameter that described passage is formed is 0.15-0.25mm, and described protective layer thickness is 0.2-0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310745955.5A CN103722626B (en) | 2013-12-30 | 2013-12-30 | A kind of silicon chip cutting steel wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310745955.5A CN103722626B (en) | 2013-12-30 | 2013-12-30 | A kind of silicon chip cutting steel wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103722626A CN103722626A (en) | 2014-04-16 |
| CN103722626B true CN103722626B (en) | 2016-04-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310745955.5A Expired - Fee Related CN103722626B (en) | 2013-12-30 | 2013-12-30 | A kind of silicon chip cutting steel wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103722626B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526893B (en) * | 2014-12-29 | 2016-02-17 | 盛利维尔（中国）新材料技术有限公司 | A kind of liquid storage circulating cooling type adds turns round polygonal crosssection diamond wire |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098015A (en) * | 1996-09-24 | 1998-04-14 | Komatsu Ltd | Method of endless jointing for wire saw |
| CN101704276A (en) * | 2009-11-09 | 2010-05-12 | 南京航空航天大学 | Brazing diamond fret saw with grinding materials being arranged in order in spiral shape and manufacturing process thereof |
| CN101905491A (en) * | 2010-07-19 | 2010-12-08 | 厦门致力金刚石工具有限公司 | Diamond wire saw and manufacturing method thereof |
| CN201900687U (en) * | 2010-12-06 | 2011-07-20 | 常州得一新材料科技有限公司 | Improved cutting steel wire |
| CN201960674U (en) * | 2010-12-06 | 2011-09-07 | 常州得一新材料科技有限公司 | Multi-strand cutting steel wire with abrasive coating |
| CN202428048U (en) * | 2011-11-15 | 2012-09-12 | 李园 | Diamond fretsaw with stranded core wire |
| CN203697273U (en) * | 2013-12-30 | 2014-07-09 | 镇江市港南电子有限公司 | Silicon slice cutting wire |
-
2013
- 2013-12-30 CN CN201310745955.5A patent/CN103722626B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098015A (en) * | 1996-09-24 | 1998-04-14 | Komatsu Ltd | Method of endless jointing for wire saw |
| CN101704276A (en) * | 2009-11-09 | 2010-05-12 | 南京航空航天大学 | Brazing diamond fret saw with grinding materials being arranged in order in spiral shape and manufacturing process thereof |
| CN101905491A (en) * | 2010-07-19 | 2010-12-08 | 厦门致力金刚石工具有限公司 | Diamond wire saw and manufacturing method thereof |
| CN201900687U (en) * | 2010-12-06 | 2011-07-20 | 常州得一新材料科技有限公司 | Improved cutting steel wire |
| CN201960674U (en) * | 2010-12-06 | 2011-09-07 | 常州得一新材料科技有限公司 | Multi-strand cutting steel wire with abrasive coating |
| CN202428048U (en) * | 2011-11-15 | 2012-09-12 | 李园 | Diamond fretsaw with stranded core wire |
| CN203697273U (en) * | 2013-12-30 | 2014-07-09 | 镇江市港南电子有限公司 | Silicon slice cutting wire |
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| Publication number | Publication date |
|---|---|
| CN103722626A (en) | 2014-04-16 |
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Effective date of registration: 20160321 Address after: On the south side of the 223600 Suqian city of Jiangsu province in Shuyang County risound Road on the eastern side of Cixi Road Applicant after: ZHENJIANG GANGNAN ELECTRONICS CO., LTD. Address before: 212132 Dongfang Road, Dagang mechanical and Electrical Industrial Park, Dagang District, Zhenjiang, Jiangsu Applicant before: Zhenjiang Gangnan Electric Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 Termination date: 20191230 |
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| CF01 | Termination of patent right due to non-payment of annual fee |