CN203697272U - Silicon slice cutting machine - Google Patents
Silicon slice cutting machine Download PDFInfo
- Publication number
- CN203697272U CN203697272U CN201320883214.9U CN201320883214U CN203697272U CN 203697272 U CN203697272 U CN 203697272U CN 201320883214 U CN201320883214 U CN 201320883214U CN 203697272 U CN203697272 U CN 203697272U
- Authority
- CN
- China
- Prior art keywords
- steel wire
- protective layer
- silicon slice
- silicon chip
- slice cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Abstract
The utility model relates to a silicon slice cutting machine. The silicon slice cutting machine comprises a silicon slice cutting wire, wherein the silicon slice cutting wire comprises two wire bodies, the two wire bodies are mutually superposed to form an 8-shaped integrated structure; channels are formed in the wire bodies; the section shapes of the channels are regular hexagons; the channels are filled with hard alloy; a protection layer made from high manganese steel is coated on the outer surfaces of the wire bodies respectively; the surfaces of the protection layers are subjected to a frosting treatment; liquid storage pockets are formed in the protection layers; the liquid storage pockets are of a spherical structure respectively; the liquid storage pockets and the outer walls of the protection layers are directly provided with cylindrical channels. The capacity of adhesive tape cutting liquid grinding of the silicon slice cutting wire is improved, thus greatly increasing the production efficiency.
Description
Technical field
The utility model relates to a kind of silicon chip cutter.
Background technology
At present, silicon chip cutter is to adopt the high-tensile steel wires that show copper-plated zinc alloy in the time of cutting silicon wafer.Steel wire is under the state of high-speed cruising, and liquid is ground in adhesive tape cutting, and the in the situation that of certain effect power, the abrasive material being driven by steel wire and silicon rod mill are cut, and finally make silicon chip.The steel wire of existing cutting silicon wafer is the high-tensile steel wires of copper coating kirsite, its smooth surface, and glutinous band cuts the ability of mill liquid, affects the production efficiency of cutting silicon wafer.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of silicon chip cutter for above drawback, and the ability of the glutinous band cutting of silicon chip cutting steel wire mill liquid wherein increases, and has greatly increased production efficiency.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A kind of silicon chip cutter, comprise silicon chip cutting steel wire, wherein, described silicon chip cutting steel wire comprises two steel wire bodies, described two steel wire bodies are the integral structure that is superimposed with each other into the figure of eight, in described steel wire body, be provided with passage, the cross sectional shape of described passage is regular hexagon, in described passage, be filled with carbide alloy, the protective layer of the coated one deck of described this external surface of steel wire take potassium steel as material, described protective layer does frosted processing, in described protective layer, be provided with reservoir, described reservoir is spherical structure, described reservoir and protective layer outer wall are directly provided with cylindrical channel, the diameter of described cylindrical channel is 0.05 ± 0.01mm.
Above-mentioned a kind of silicon chip cutter, wherein, described steel wire body diameter be 0.3-0.6mm, the orthohexagonal circumscribed circle diameter that described passage forms is 0.15-0.25mm, described protective layer thickness is 0.2-0.3mm.
The beneficial effects of the utility model are:
1. in steel wire body, be provided with passage, in passage, be filled with carbide alloy, greatly increased hardness, intensity, wearability and the corrosion resistance of cutting steel wire;
2. cutting steel wire is the integral structure that is superimposed with each other into the figure of eight by two steel wire bodies, has greatly increased cutting effect and cutting dynamics;
3. the protective layer of the coated one deck of this external surface of steel wire take potassium steel as material; protective layer does frosted processing; in protective layer, be provided with reservoir; in reservoir, can store a certain amount of cutting mill liquid; both improved the cutting power to silicon chip; improve again the ability of glutinous band cutting mill liquid, greatly improved the cutting effect of silicon chip.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the utility model silicon chip cutting steel wire
The specific embodiment
Below the utility model is further described.
A kind of silicon chip cutter as shown in the figure, comprise silicon chip cutting steel wire 1, described silicon chip cutting steel wire 1 comprises two steel wire bodies 11, described steel wire body 11 diameter d 1 be 0.3-0.6mm, described two steel wire bodies 11 are for being superimposed with each other into the integral structure of the figure of eight, in described steel wire body 11, be provided with passage 2, the cross sectional shape of described passage 2 is regular hexagon, its circumscribed circle diameter d2 is 0.15-0.25mm, in described passage 2, be filled with carbide alloy 3, the protective layer 4 of the coated one deck of described steel wire body 11 outer surfaces take potassium steel as material, described protective layer 4 thickness h are 0.2-0.3mm, described protective layer does frosted and processes 5, in described protective layer 4, be provided with reservoir 6, described reservoir 6 is spherical structure, described reservoir and protective layer outer wall are directly provided with cylindrical channel 7, the diameter d 3 of described cylindrical channel is 0.05 ± 0.01mm.
The beneficial effects of the utility model are:
1. in steel wire body, be provided with passage, in passage, be filled with carbide alloy, greatly increased hardness, intensity, wearability and the corrosion resistance of cutting steel wire;
2. cutting steel wire is the integral structure that is superimposed with each other into the figure of eight by two steel wire bodies, has greatly increased cutting effect and cutting dynamics;
3. the protective layer of the coated one deck of this external surface of steel wire take potassium steel as material; protective layer does frosted processing; in protective layer, be provided with reservoir; in reservoir, can store a certain amount of cutting mill liquid; both improved the cutting power to silicon chip; improve again the ability of glutinous band cutting mill liquid, greatly improved the cutting effect of silicon chip.
Here description of the present utility model and application is illustrative; not want scope of the present utility model to limit in the above-described embodiments; therefore, the utility model is not subject to the restriction of the present embodiment, and the technical scheme that any employing equivalence replacement obtains is all in the scope of the utility model protection.
Claims (2)
1. a silicon chip cutter, comprise silicon chip cutting steel wire, it is characterized by, described silicon chip cutting steel wire comprises two steel wire bodies, described two steel wire bodies are the integral structure that is superimposed with each other into the figure of eight, in described steel wire body, be provided with passage, the cross sectional shape of described passage is regular hexagon, in described passage, be filled with carbide alloy, the protective layer of the coated one deck of described this external surface of steel wire take potassium steel as material, described protective layer does frosted processing, in described protective layer, be provided with reservoir, described reservoir is spherical structure, described reservoir and protective layer outer wall are directly provided with cylindrical channel, the diameter of described cylindrical channel is 0.05 ± 0.01mm.
2. a kind of silicon chip cutter as claimed in claim 1, is characterized by, described steel wire body diameter be 0.3-0.6mm, the orthohexagonal circumscribed circle diameter that described passage forms is 0.15-0.25mm, described protective layer thickness is 0.2-0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320883214.9U CN203697272U (en) | 2013-12-30 | 2013-12-30 | Silicon slice cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320883214.9U CN203697272U (en) | 2013-12-30 | 2013-12-30 | Silicon slice cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203697272U true CN203697272U (en) | 2014-07-09 |
Family
ID=51047766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320883214.9U Withdrawn - After Issue CN203697272U (en) | 2013-12-30 | 2013-12-30 | Silicon slice cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203697272U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103707426A (en) * | 2013-12-30 | 2014-04-09 | 镇江市港南电子有限公司 | Silicon wafer cutting machine |
-
2013
- 2013-12-30 CN CN201320883214.9U patent/CN203697272U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103707426A (en) * | 2013-12-30 | 2014-04-09 | 镇江市港南电子有限公司 | Silicon wafer cutting machine |
| CN103707426B (en) * | 2013-12-30 | 2016-04-13 | 福能科技江苏有限公司 | A kind of silicon chip cutter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140709 Effective date of abandoning: 20160413 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |