CN201900683U - Cutting steel wire with smooth glue coating - Google Patents

Cutting steel wire with smooth glue coating Download PDF

Info

Publication number
CN201900683U
CN201900683U CN201020643972XU CN201020643972U CN201900683U CN 201900683 U CN201900683 U CN 201900683U CN 201020643972X U CN201020643972X U CN 201020643972XU CN 201020643972 U CN201020643972 U CN 201020643972U CN 201900683 U CN201900683 U CN 201900683U
Authority
CN
China
Prior art keywords
steel wire
cutting steel
cutting
glue coating
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201020643972XU
Other languages
Chinese (zh)
Inventor
王勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU DEYI NEW MATERIAL TECHNOLOGY Co Ltd
Original Assignee
CHANGZHOU DEYI NEW MATERIAL TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU DEYI NEW MATERIAL TECHNOLOGY Co Ltd filed Critical CHANGZHOU DEYI NEW MATERIAL TECHNOLOGY Co Ltd
Priority to CN201020643972XU priority Critical patent/CN201900683U/en
Application granted granted Critical
Publication of CN201900683U publication Critical patent/CN201900683U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The utility model relates to a cutting steel wire in the photovoltaic or semiconductor field, in particular to a cutting steel wire with a smooth glue coating, wherein the cross section of the cutting steel wire is round, and a glue coating is coated on the outer surface of the cutting steel wire. Compared with the prior art, the cutting steel wire has a novel and simple structure, because one glue coating is added on the surface of the cutting steel wire, the steel wire is prevented from being directly contacted with a silicon crystal, due to the improvement, check lines which are generated when the cutting steel wire cuts the silicon crystal are greatly reduced, the broken wire rate of the cutting steel wire is reduced, the yield of silicon wafers is improved, the service life of the cutting steel wire is effectively prolonged, the cost for cutting the silicon wafers is greatly reduced, the cost of photovoltaic power generation is reduced, and the cutting steel wire is worth being popularized and applied.

Description

A kind of cutting steel wire with smooth function of glue coating
[technical field]
The utility model relates to the cutting steel wire in photovoltaic or the semiconductor applications, specifically a kind of cutting steel wire with smooth function of glue coating.
[background technology]
Solar photovoltaic technology is to be the technology of electric power with conversion of solar energy, and its core is the semiconductor substance that can discharge electronics, and the most frequently used semi-conducting material is a silicon.Quick growth along with the silicon materials cost, the thickness that reduces silicon chip becomes reduce cost the most direct and effective means, thin silicon chip means less silicon materials consumption, having played important function to reducing the solar-energy photo-voltaic cell cost, is that technological progress promotes one of important example that reduces cost.In order to realize reducing the purpose of silicon wafer thickness, extensively adopted the multi-thread cutting technique of silicon crystal at present in the world, it is different from cutting modes such as traditional knife saw sheet, grinding wheel, also be different from advanced laser cutting and interior circle cutting, its principle is silicon rod to be ground attached to the cutting blade material on the steel wire by the steel wire drive of a high-speed motion, thereby reaches cutting effect.
The multi-thread cutting technique of silicon crystal is compared with other cutting techniques, has the efficient height, production capacity height, precision advantages of higher.But in the multi-thread cutting technique of silicon crystal, used cutting steel wire can not be recycled, and is expendable consumed product.Be accompanied by the fast development of photovoltaic industry and the active demand of silicon chip cutting, silicon crystal cuts required cutting steel wire and the situation that supply falls short of demand occurs, and the manufacturing technique requirent of cutting steel wire is high, only there is the Very few companies can production and selling at present in the world, becomes current very important problem so how to reduce the wire broken rate of cutting steel wire.
[summary of the invention]
The purpose of this utility model is exactly will solve above-mentioned deficiency and a kind of cutting steel wire with smooth function of glue coating is provided, and has significantly reduced the wire broken rate of cutting steel wire itself, effectively reduces cost.
Design a kind of cutting steel wire with smooth function of glue coating for achieving the above object, the cross section of described cutting steel wire is circular, scribbles glue layer on the described cutting steel wire outer surface.
The cross-sectional diameter of described cutting steel wire is 0.08-0.40mm.
The utility model is compared with prior art, novel structure, simple, because the surface of cutting steel wire increases the smooth function of glue coating of one deck, avoids steel wire to contact with the direct of silicon crystal, the stria that this improvement has produced when having significantly reduced cutting steel wire cutting silicon crystal, reduced the wire broken rate of cutting steel wire itself, improve the yield rate of silicon chip, effectively prolonged the service life of cutting steel wire, greatly reduced the cost of silicon chip cutting, reduced the cost of photovoltaic generation, be worthy of popularization.
[description of drawings]
Fig. 1 is a structural representation of the present utility model;
Among the figure: 1, cutting steel wire, 2, function of glue coating.
[specific embodiment]
Further specify below below in conjunction with accompanying drawing the utility model being done:
As shown in drawings, the utility model is circular cutting steel wire unwrapping wire with existing cross section, the cross-sectional diameter of cutting steel wire is 0.08mm, 0.10mm, 0.12mm, 0.20mm, 0.30mm or 0.40mm, carry out surface clean then, and be coated with super glue on its surface, form smooth function of glue coating, and then carry out surface clean, last take-up is with pending cutting work.During cutting, this is had the guiding of the cutting steel wire of function of glue coating by tens guide rollers, on the main line roller, form a bracing cable net, and silicon crystal to be processed carries out grinding and cutting by the feeding of the decline realization workpiece of workbench to silicon materials.Owing to increase the smooth function of glue coating of one deck in existing cutting Steel Wire Surface, avoided the cutting steel wire to contact with the direct of silicon crystal, this improvement can significantly reduce the stria that produces when existing cutting steel wire cuts silicon chip, has reduced the wire broken rate of cutting steel wire itself.
The utility model cutting steel wire purposes not only is used for the cutting of photovoltaic field silicon crystal, also can be used for the cutting of crystal, crystal glass, jewel etc.
The utility model is not subjected to the restriction of above-mentioned embodiment; other any do not deviate from change, the modification done under spiritual essence of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, be included within the protection domain of the present utility model.

Claims (2)

1. cutting steel wire with smooth function of glue coating, the cross section of described cutting steel wire are circular, it is characterized in that: scribble glue layer on the described cutting steel wire outer surface.
2. the cutting steel wire with smooth function of glue coating as claimed in claim 1 is characterized in that: the cross-sectional diameter of described cutting steel wire is 0.08-0.40mm.
CN201020643972XU 2010-12-06 2010-12-06 Cutting steel wire with smooth glue coating Expired - Fee Related CN201900683U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201020643972XU CN201900683U (en) 2010-12-06 2010-12-06 Cutting steel wire with smooth glue coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020643972XU CN201900683U (en) 2010-12-06 2010-12-06 Cutting steel wire with smooth glue coating

Publications (1)

Publication Number Publication Date
CN201900683U true CN201900683U (en) 2011-07-20

Family

ID=44271287

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201020643972XU Expired - Fee Related CN201900683U (en) 2010-12-06 2010-12-06 Cutting steel wire with smooth glue coating

Country Status (1)

Country Link
CN (1) CN201900683U (en)

Similar Documents

Publication Publication Date Title
CN201900687U (en) Improved cutting steel wire
US8747625B2 (en) Grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers
CN103710705B (en) A kind of additive of polycrystalline silicon wafer acidity texture preparation liquid and application thereof
JP2012230929A (en) Solar cell silicon wafer and manufacturing method thereof
JP2007180527A (en) Method of manufacturing semiconductor substrate, and device of manufacturing the semiconductor substrate
CN202037741U (en) A cutting wire possessing an abrasive coating
CN102544240B (en) Method and device for integrating slicing and flocking of crystalline silicon wafer
CN102107465A (en) Method and device for reducing cutting line mark of solar silicon slice
CN201960674U (en) Multi-strand cutting steel wire with abrasive coating
CN201900683U (en) Cutting steel wire with smooth glue coating
CN201900686U (en) Special-shaped cutting steel wire with glue coating layer
CN103341919A (en) Pretreatment process capable of increasing slicing rate of polycrystalline silicon rod
CN208773851U (en) A kind of high intensity silicon chip diamond fretsaw
CN201808158U (en) Solar silicon chip cutting directing bar
CN201900688U (en) Multi-strand sawing wire
CN102700012A (en) Method for reducing silicon chip damaged layers during multi-wire cutting
CN201900685U (en) Wavy special-shaped cutting steel wire
CN205112119U (en) Monocrystalline silicon piece cutting equipment
CN201900681U (en) Special-shaped cutting steel wire
CN206568356U (en) Three stranded diamond fretsaws
CN104175409B (en) A kind of charged multi-line cutting method of silicon chip and charged Multi-wire cutting device
CN201998336U (en) Wavy cutting steel wire
CN203888043U (en) Diamond wire preparing device
Jiang et al. Hybrid process for texturization of diamond wire sawn multicrystalline silicon solar cell
CN201900684U (en) Wavy cutting steel wire with glue coating layer

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110720

Termination date: 20141206

EXPY Termination of patent right or utility model