CN201900683U - Cutting steel wire with smooth glue coating - Google Patents
Cutting steel wire with smooth glue coating Download PDFInfo
- Publication number
- CN201900683U CN201900683U CN201020643972XU CN201020643972U CN201900683U CN 201900683 U CN201900683 U CN 201900683U CN 201020643972X U CN201020643972X U CN 201020643972XU CN 201020643972 U CN201020643972 U CN 201020643972U CN 201900683 U CN201900683 U CN 201900683U
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- Prior art keywords
- steel wire
- cutting steel
- cutting
- glue coating
- silicon
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Abstract
The utility model relates to a cutting steel wire in the photovoltaic or semiconductor field, in particular to a cutting steel wire with a smooth glue coating, wherein the cross section of the cutting steel wire is round, and a glue coating is coated on the outer surface of the cutting steel wire. Compared with the prior art, the cutting steel wire has a novel and simple structure, because one glue coating is added on the surface of the cutting steel wire, the steel wire is prevented from being directly contacted with a silicon crystal, due to the improvement, check lines which are generated when the cutting steel wire cuts the silicon crystal are greatly reduced, the broken wire rate of the cutting steel wire is reduced, the yield of silicon wafers is improved, the service life of the cutting steel wire is effectively prolonged, the cost for cutting the silicon wafers is greatly reduced, the cost of photovoltaic power generation is reduced, and the cutting steel wire is worth being popularized and applied.
Description
[technical field]
The utility model relates to the cutting steel wire in photovoltaic or the semiconductor applications, specifically a kind of cutting steel wire with smooth function of glue coating.
[background technology]
Solar photovoltaic technology is to be the technology of electric power with conversion of solar energy, and its core is the semiconductor substance that can discharge electronics, and the most frequently used semi-conducting material is a silicon.Quick growth along with the silicon materials cost, the thickness that reduces silicon chip becomes reduce cost the most direct and effective means, thin silicon chip means less silicon materials consumption, having played important function to reducing the solar-energy photo-voltaic cell cost, is that technological progress promotes one of important example that reduces cost.In order to realize reducing the purpose of silicon wafer thickness, extensively adopted the multi-thread cutting technique of silicon crystal at present in the world, it is different from cutting modes such as traditional knife saw sheet, grinding wheel, also be different from advanced laser cutting and interior circle cutting, its principle is silicon rod to be ground attached to the cutting blade material on the steel wire by the steel wire drive of a high-speed motion, thereby reaches cutting effect.
The multi-thread cutting technique of silicon crystal is compared with other cutting techniques, has the efficient height, production capacity height, precision advantages of higher.But in the multi-thread cutting technique of silicon crystal, used cutting steel wire can not be recycled, and is expendable consumed product.Be accompanied by the fast development of photovoltaic industry and the active demand of silicon chip cutting, silicon crystal cuts required cutting steel wire and the situation that supply falls short of demand occurs, and the manufacturing technique requirent of cutting steel wire is high, only there is the Very few companies can production and selling at present in the world, becomes current very important problem so how to reduce the wire broken rate of cutting steel wire.
[summary of the invention]
The purpose of this utility model is exactly will solve above-mentioned deficiency and a kind of cutting steel wire with smooth function of glue coating is provided, and has significantly reduced the wire broken rate of cutting steel wire itself, effectively reduces cost.
Design a kind of cutting steel wire with smooth function of glue coating for achieving the above object, the cross section of described cutting steel wire is circular, scribbles glue layer on the described cutting steel wire outer surface.
The cross-sectional diameter of described cutting steel wire is 0.08-0.40mm.
The utility model is compared with prior art, novel structure, simple, because the surface of cutting steel wire increases the smooth function of glue coating of one deck, avoids steel wire to contact with the direct of silicon crystal, the stria that this improvement has produced when having significantly reduced cutting steel wire cutting silicon crystal, reduced the wire broken rate of cutting steel wire itself, improve the yield rate of silicon chip, effectively prolonged the service life of cutting steel wire, greatly reduced the cost of silicon chip cutting, reduced the cost of photovoltaic generation, be worthy of popularization.
[description of drawings]
Fig. 1 is a structural representation of the present utility model;
Among the figure: 1, cutting steel wire, 2, function of glue coating.
[specific embodiment]
Further specify below below in conjunction with accompanying drawing the utility model being done:
As shown in drawings, the utility model is circular cutting steel wire unwrapping wire with existing cross section, the cross-sectional diameter of cutting steel wire is 0.08mm, 0.10mm, 0.12mm, 0.20mm, 0.30mm or 0.40mm, carry out surface clean then, and be coated with super glue on its surface, form smooth function of glue coating, and then carry out surface clean, last take-up is with pending cutting work.During cutting, this is had the guiding of the cutting steel wire of function of glue coating by tens guide rollers, on the main line roller, form a bracing cable net, and silicon crystal to be processed carries out grinding and cutting by the feeding of the decline realization workpiece of workbench to silicon materials.Owing to increase the smooth function of glue coating of one deck in existing cutting Steel Wire Surface, avoided the cutting steel wire to contact with the direct of silicon crystal, this improvement can significantly reduce the stria that produces when existing cutting steel wire cuts silicon chip, has reduced the wire broken rate of cutting steel wire itself.
The utility model cutting steel wire purposes not only is used for the cutting of photovoltaic field silicon crystal, also can be used for the cutting of crystal, crystal glass, jewel etc.
The utility model is not subjected to the restriction of above-mentioned embodiment; other any do not deviate from change, the modification done under spiritual essence of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, be included within the protection domain of the present utility model.
Claims (2)
1. cutting steel wire with smooth function of glue coating, the cross section of described cutting steel wire are circular, it is characterized in that: scribble glue layer on the described cutting steel wire outer surface.
2. the cutting steel wire with smooth function of glue coating as claimed in claim 1 is characterized in that: the cross-sectional diameter of described cutting steel wire is 0.08-0.40mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020643972XU CN201900683U (en) | 2010-12-06 | 2010-12-06 | Cutting steel wire with smooth glue coating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201020643972XU CN201900683U (en) | 2010-12-06 | 2010-12-06 | Cutting steel wire with smooth glue coating |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201900683U true CN201900683U (en) | 2011-07-20 |
Family
ID=44271287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201020643972XU Expired - Fee Related CN201900683U (en) | 2010-12-06 | 2010-12-06 | Cutting steel wire with smooth glue coating |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201900683U (en) |
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2010
- 2010-12-06 CN CN201020643972XU patent/CN201900683U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110720 Termination date: 20141206 |
|
EXPY | Termination of patent right or utility model |