CN201900684U - Wavy cutting steel wire with glue coating layer - Google Patents
Wavy cutting steel wire with glue coating layer Download PDFInfo
- Publication number
- CN201900684U CN201900684U CN2010206442633U CN201020644263U CN201900684U CN 201900684 U CN201900684 U CN 201900684U CN 2010206442633 U CN2010206442633 U CN 2010206442633U CN 201020644263 U CN201020644263 U CN 201020644263U CN 201900684 U CN201900684 U CN 201900684U
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- CN
- China
- Prior art keywords
- steel wire
- cutting steel
- cutting
- glue coating
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to cutting steel wires in the field of photovoltaics or semiconductors, in particular to a wavy cutting steel wire with a glue coating layer. The cross section of the cutting steel wire is circular or similar to be circular, the outer surface of the cutting steel wire is wavy, the distance between each two wave crests ranges from 0.08mm to 0.15mm, the depth of the wave trough ranges from 0.01mm to 0.05mm, and the glue coating layer is coated on the outer surface of the cutting steel wire. Compared with the prior art, the wavy cutting steel wire with the glue coating layer has the advantages that due to the fact that the outer surface of the cutting steel wire is wavy, the quantity of mortar carried by the steel wire during grinding is increased greatly, cutting is accelerated, and cutting efficiency is increased; since the glue coating layer is added on the surface of the cutting steel wire, the steel wire does not contact with a silicon crystal directly, linear marks generated when the silicon crystal is cut by the cutting steel wire are reduced, breakage rate of the steel wire is reduced, yield of silicon wafers is increased, service life of the cutting steel wire is prolonged effectively, and costs for cutting the silicon wafers and photovoltaic power generation are both decreased.
Description
[technical field]
The utility model relates to the cutting steel wire in photovoltaic or the semiconductor applications, specifically a kind of wavy cutting steel wire with function of glue coating.
[background technology]
At present, the multi-thread cutting technique of domestic silicon crystal mostly is to adopt the cutting steel wire to carry mortar to grind silicon rod to realize the silicon chip cutting, its shortcoming is: because the entrained mortar quantity of uncontrollable cutting steel wire, thereby limited the cutting speed of cutting steel wire, cutting efficiency is also lower, particularly some are harder or more during difficult to machine material, then more not competent in cutting, have brought very big inconvenience for cutting work.
[summary of the invention]
The purpose of this utility model is exactly will solve above-mentioned deficiency and a kind of wavy cutting steel wire with function of glue coating is provided, and has improved cutting efficiency greatly.
Design a kind of wavy cutting steel wire for achieving the above object with function of glue coating, the cross section of described cutting steel wire is circle or sub-circular, described cutting steel wire outer surface waviness, distance between described adjacent two crests is 0.08-0.15mm, the degree of depth of described trough is 0.01-0.05mm, scribbles glue layer on the described cutting steel wire outer surface.
The cross-sectional diameter of described cutting steel wire is 0.10-0.40mm.
The utility model is compared with prior art, and novel structure, simple because cutting steel wire outer surface is wavy, has then improved mortar quantity entrained when steel wire grinds greatly, has accelerated cutting speed, has improved cutting efficiency.Surface at the cutting steel wire increases one deck function of glue coating, avoid steel wire to contact with the direct of silicon crystal, significantly reduced the stria that produces when the cutting steel wire cuts silicon crystal, reduced the wire broken rate of cutting steel wire itself, improved the yield rate of silicon chip, effectively prolong the service life of cutting steel wire, greatly reduced the cost of silicon chip cutting, reduced the cost of photovoltaic generation.Particularly when some harder or difficult material processed of cutting, the utility model has brought very big convenience for cutting work, be worthy of popularization, and industrialization.
[description of drawings]
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the cross sectional representation of Fig. 1;
Among the figure: 1, cutting steel wire, 2 is that crest, 3 is trough, 4 glue layers.
[specific embodiment]
Further specify below below in conjunction with accompanying drawing the utility model being done:
As shown in drawings, the utility model is handled existing cutting steel wire through mould, forming outer surface is corrugated cutting steel wire, distance between adjacent two crests is 0.08mm, 0.10mm, 0.12mm or 0.15mm, the degree of depth of trough is 0.01mm, 0.02mm, 0.04mm or 0.05mm, the cross section of cutting steel wire is circle or approximate circle, cross-sectional diameter is 0.10mm, 0.12mm, 0.20mm, 0.30mm or 0.40mm, should cut the steel wire unwrapping wire then, and carry out surface clean, and be coated with super glue on its surface afterwards, form smooth glue layer 4, and then carry out surface clean, last take-up.During cutting, with of the guiding of this waveform cutting steel wire by tens guide rollers, on the main line roller, form a bracing cable net, and silicon crystal to be processed is realized the feeding of workpiece by the decline of workbench, the mortar that the cutting Steel Wire Surface is carried is along with the high-speed motion of steel wire, directly obtain movement velocity and certain pressure, thereby silicon materials are carried out grinding and cutting.
The utility model cutting steel wire purposes not only is used for the cutting of photovoltaic field silicon crystal, also can be used for the cutting of crystal, crystal glass, jewel etc.
The utility model is not subjected to the restriction of above-mentioned embodiment; other any do not deviate from change, the modification done under spiritual essence of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, be included within the protection domain of the present utility model.
Claims (2)
1. wavy cutting steel wire with function of glue coating, the cross section of described cutting steel wire is circle or sub-circular, described cutting steel wire outer surface is a waveform, distance between described adjacent two crests is 0.08-0.15mm, the degree of depth of described trough is 0.01-0.05mm, it is characterized in that: scribble glue layer on the described cutting steel wire outer surface.
2. a kind of wavy cutting steel wire with function of glue coating as claimed in claim 1, it is characterized in that: the cross-sectional diameter of described cutting steel wire is 0.10-0.40mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206442633U CN201900684U (en) | 2010-12-06 | 2010-12-06 | Wavy cutting steel wire with glue coating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206442633U CN201900684U (en) | 2010-12-06 | 2010-12-06 | Wavy cutting steel wire with glue coating layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201900684U true CN201900684U (en) | 2011-07-20 |
Family
ID=44271288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206442633U Expired - Fee Related CN201900684U (en) | 2010-12-06 | 2010-12-06 | Wavy cutting steel wire with glue coating layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201900684U (en) |
-
2010
- 2010-12-06 CN CN2010206442633U patent/CN201900684U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110720 Termination date: 20141206 |
|
| EXPY | Termination of patent right or utility model |