CN108437248A - A kind of multi-wire saw vibration auxiliary device - Google Patents
A kind of multi-wire saw vibration auxiliary device Download PDFInfo
- Publication number
- CN108437248A CN108437248A CN201810538646.3A CN201810538646A CN108437248A CN 108437248 A CN108437248 A CN 108437248A CN 201810538646 A CN201810538646 A CN 201810538646A CN 108437248 A CN108437248 A CN 108437248A
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- Prior art keywords
- cutting line
- vibration
- auxiliary body
- cutting
- roller
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to a kind of multi-wire saws to vibrate auxiliary device, belongs to wire sawing technology field.A kind of multi-wire saw vibration auxiliary body is devised in the present invention, it include mainly alignment apartment, vibrate auxiliary body and broken string arrestment mechanism, the indifferent of mortar is carried in traditional multi-thread saw cutting device, so cutting efficiency is not high, vibration auxiliary body is provided in some improved cutter devices below workbench, the high-frequency vibration by a narrow margin of required cutting material is driven by vibrating auxiliary body, so that band slurry ability of the cutting line in cutting process enhances to promote cutting efficiency, and it is used in the present invention and cutting line is vibrated, by the way that vibration auxiliary body is arranged on cutting line, ultrasonic wave is generated to cutting line using supersonic generator, to make cutting line carry out high-frequency vibration by a narrow margin, effectively improve the band slurry ability of cutting line, chip is avoided to generate warpage, the phenomenon that chipping, improve cut quality.
Description
Technical field
The present invention relates to a kind of multi-wire saws to vibrate auxiliary device, belongs to wire sawing technology field.
Background technology
More stringent requirements are proposed for processing of the rapid development of electronics industry to silicon chip, on the one hand in order to increase integrated circuit
With the yield of photovoltaic, manufacturing cost is reduced, silicon chip tends to ever-larger diameters；On the other hand, in order to improve the integrated of chip
Degree, the groove of silicon chip is more and more thinner, and line width reduces to 0.13 μm from 0.18 μm, and most low energy reaches 0.10 μm.It is high-precision
The processing of degree requires slice to have high flatness and minimum surface roughness, these new requirements greatly improve silicon chip
The difficulty of processing.Silicon materials have the characteristics that hard, crisp, and buckling deformation easily occurs for processing large-diameter silicon wafer, it is difficult to reach required
Machining accuracy, while to improve the utilization ratio of material, it is desirable that cutting thickness is thinning, therefore active demand find it is a kind of more
Advanced, efficient silicon chip cutting technique.
Multi-wire cutting technology is the mainstream processing technology of current work sheet, polysilicon, and it is hard which can process major diameter
Crisp material, and it is uniform to process thickness, is quickly grown in hard brittle material secondary industry.But it is easy production with the chip that multi-wire saw is processed
Phenomena such as raw warpage, chipping, steel wire is also easy broken string, and free abrasive multi-wire saw is limited by Trace speed and with slurry ability
System, processing efficiency are difficult to be promoted, and are badly in need of developing the new existing processing technology of processing technology optimization.
Silicon chip cutting is the critical process of silicon chip processing, and processing method and used processing technology, which will directly affect, to be added
Work efficiency rate and processing quality.Principles and requirements for slice process technology are：（1）Cutting accuracy and surface depth of parallelism height, warpage
Degree and thickness deviation are small.（2）Section integrality is good, no tool marks, wire drawing and micro-crack.（3）High yield rate, joint-cutting school, raw material
It is lost low.（4）Cutting efficiency is high, realizes automation cutting.Hard and brittle material cutting technology presses its technical characteristic, can substantially be divided into three
A Main Stage：Outer circle cutting technique, inner circle cutting technology and line cutting technology.
Multi-wire saw lathe belongs to extraordinary Special precision numerically-controlled machine tool, high precision machining, control system complexity, parts
It is various, manufacture difficulty is big, only a small number of heavy mechanical equipment manufacturers have grasped this key manufacture.Currently, global
Production multi-line cutting machine producer mainly have be Switzerland HCT companies, MeyerBurger companies, Japanese NTC（Day puts down outer mountain
Company）, Gao Niao companies, Tokyo Zhi Gang companies, the GMN companies of the LLC companies in the U.S. and Germany.
Tokyo Zhi Gang companies were proposed newly developed T-8253B types diamond multi-line cutting machine in 2011, should
Multi-line cutting machine integrated level is higher, and equipment volume is small, light-weight, and linear velocity realizes the height of fragile material up to 1000m/min
Speed cutting, production capacity specific ionization saw silk cutting machine improves 2 times or more in silicon chip cutting, realizes the high-precision of yield rate 98%
Processing, TTV<10 μm, annual production capacity is up to 4.7 ten thousand.
The cutting line that New Generation of Overseas multi-wire saw equipment uses is thinner, and the silicon chip cut out is thinner, greatly reduces silicon original
The consumption of material；Trace speed and feed speed are improved, and then greatly increase the production efficiency；Has advanced technique control
System, cutting tension force and monitoring system, can be detected regulation and control to process in real time.
Domestic cutting equipment is started in the beginning of the seventies, and semiconductor technology will be developed, and be unable to do without advanced silicon chip processing
Equipment and processing technology, and domestic numerical control multi-wire saw lathe market is monopolized by offshore company, the annual import multi-wire cutting in China
The quantity of cutting mill equipment is at 200 or more.In order to meet the fast-developing demand of semiconductor industry, in recent years in national policy
Guiding under, the semiconductor device technology critical equipment research in China and manufacturing capacity realize great-leap-forward development, the relevant technologies
Equipment research, achieves good achievement.If Shanghai day is into, the auspicious moral in Lanzhou, the 45th research institute of electronics, Hunan space crystalline substance machine
Industrial Co., Ltd., Beijing Jing Yujing Science and Technology Ltd.s, Zhejiang Dacheng Electric Co., Ltd. all independent researches are multi-thread
Cut numerically-controlled machine tool.The development of China's slice processing industry and semicon industry is played in the successful development of multi-wire saw equipment
Huge impetus, but these cutting machines also have certain gap that can not fully meet domestic demand with external.
Invention content
Present invention mainly solves the technical issues of：Warpage, chipping, steel wire are easy tod produce for the chip of multi-wire saw processing
The problem of phenomena such as being easy broken string, processing efficiency is difficult to be promoted, the present invention provides a kind of multi-wire saws to vibrate auxiliary device.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention：
A kind of multi-wire saw vibration auxiliary device, including cutting line alignment apartment, vibration auxiliary body and broken string arrestment mechanism, institute
The cutting line alignment apartment stated includes working roll, is strainer on the right side of working roll, unwrapping wire roller, unwrapping wire are connected on the right side of strainer
It is folding and unfolding roller on the right side of roller, connects tension-detecting mechanism above folding and unfolding roller, broken string is provided between folding and unfolding roller and tension-detecting mechanism
Arrestment mechanism, working roll top connect directive wheel, are workbench on the right side of directive wheel, and vibration auxiliary body setting is working
Platform both sides, vibration auxiliary body includes supersonic generator and directive wheel.
A kind of application process of multi-wire saw vibration auxiliary device is：Cutting line is involved from unwrapping wire roller, connection strainer,
Working roll, directive wheel are then return to folding and unfolding roller, and the setting of vibration auxiliary body is in workbench both sides, and cutting line is from vibration auxiliary body
Inside passes through, and when carrying out cutting operation, unwrapping wire roller unwrapping wire, folding and unfolding roller take-up, cutting line moves in alignment apartment, vibration auxiliary
In-house supersonic generator generates ultrasonic wave, by the effect of ultrasonic wave so that the cutting line above workbench is done by a narrow margin
Then high-frequency vibration cuts material using the cutting line of vibration, tension-detecting mechanism is when device works to cutting line
Tensile force be detected, if breaking, tensile force disappearance break arrestment mechanism can emergency braking, stop cutter device
Work, protects entire cutter device and material.
The vibration auxiliary body is provided with two groups.
On the other hand the directive wheel is used to smooth vibration on the one hand for being oriented to cutting line.
The beneficial effects of the invention are as follows：
A kind of multi-wire saw vibration auxiliary body is devised in the present invention, is included mainly alignment apartment, is vibrated auxiliary body and break
Line arrestment mechanism carries the indifferent of mortar in traditional multi-thread saw cutting device, so cutting efficiency is not high, some improvement
Vibration auxiliary body is provided in cutter device afterwards below workbench, required cutting material is driven by vibrating auxiliary body
High-frequency vibration by a narrow margin so that band slurry ability of the cutting line in cutting process enhances to promote cutting efficiency, and of the invention
Middle use vibrates cutting line, by the way that vibration auxiliary body is arranged on cutting line, using supersonic generator to cutting
Line generates ultrasonic wave, to make cutting line carry out high-frequency vibration by a narrow margin, effectively improves the band slurry ability of cutting line, chip is avoided to produce
The phenomenon that raw warpage, chipping, improve cut quality.
Description of the drawings
Fig. 1 is the organigram that multi-wire saw of the present invention vibrates auxiliary device.
Wherein, 1, directive wheel；2, auxiliary body is vibrated；3, workbench；4, supersonic generator；5, directive wheel；6, tension
Testing agency；7, break arrestment mechanism；8, working roll；9, strainer；10, unwrapping wire roller；11, folding and unfolding roller.
Specific implementation mode
A kind of multi-wire saw vibration auxiliary device, including cutting line alignment apartment, vibration auxiliary body 2 and broken string brake
Structure 7, the cutting line alignment apartment include working roll 8, and 8 right side of working roll is strainer 9,9 right side connection of strainer
Unwrapping wire roller 10,10 right side of unwrapping wire roller are folding and unfolding roller 11, and 11 top of folding and unfolding roller connects tension-detecting mechanism 6, folding and unfolding roller 11 and tension
Broken string arrestment mechanism 7 is provided between testing agency 6,8 top of working roll connects directive wheel 1, and 1 right side of directive wheel is workbench 3,
The setting of vibration auxiliary body 2 includes supersonic generator 4 and directive wheel in workbench both sides, vibration auxiliary body 2
5.A kind of application process of multi-wire saw vibration auxiliary device is：Cutting line is involved from unwrapping wire roller 10, connection strainer 9, work
Make roller 8, directive wheel 1 is then return to folding and unfolding roller 11, in workbench both sides, cutting line assists the setting of vibration auxiliary body 2 from vibration
The inside of mechanism 2 passes through, and when carrying out cutting operation, 10 unwrapping wire of unwrapping wire roller, 11 take-up of folding and unfolding roller, cutting line transports in alignment apartment
It is dynamic, it vibrates the supersonic generator 4 inside auxiliary body 2 and generates ultrasonic wave, 3 top of workbench is made by the effect of ultrasonic wave
Cutting line do high-frequency vibration by a narrow margin, then material is cut using the cutting line of vibration, tension-detecting mechanism 6 is in device
The tensile force of cutting line is detected when work, if breaking, the tensile force disappearance arrestment mechanism 7 that breaks can promptly be made
It is dynamic, stop the work of cutter device, protects entire cutter device and material.The vibration auxiliary body 2 is provided with two groups.
On the other hand 5 one side of directive wheel is used to smooth vibration for being oriented to cutting line.
Claims (4)
1. a kind of multi-wire saw vibrates auxiliary device, including cutting line alignment apartment, vibration auxiliary body（2）And broken string brake
Structure（7）, the cutting line alignment apartment includes working roll（8）, working roll（8）Right side is strainer（9）, strainer
（9）Right side connects unwrapping wire roller（10）, unwrapping wire roller（10）Right side is folding and unfolding roller（11）, folding and unfolding roller（11）Top connects tension detection machine
Structure（6）, folding and unfolding roller（11）With tension-detecting mechanism（6）Between be provided with broken string arrestment mechanism（7）, working roll（8）Top connects
Directive wheel（1）, directive wheel（1）Right side is workbench（3）, the vibration auxiliary body（2）Setting is in workbench both sides, vibration
Auxiliary body（2）Including supersonic generator（4）And directive wheel（5）.
2. a kind of application process of multi-wire saw vibration auxiliary device according to claim 1 is：Cutting line is from unwrapping wire roller
（10）In involve, connect strainer（9）, working roll（8）, directive wheel（1）It is then return to folding and unfolding roller（11）, vibrate auxiliary body
（2）Setting is in workbench both sides, and cutting line is from vibration auxiliary body（2）Inside passes through, when carrying out cutting operation, unwrapping wire roller（10）
Unwrapping wire, folding and unfolding roller（11）Take-up, cutting line move in alignment apartment, vibrate auxiliary body（2）Internal supersonic generator
（4）Ultrasonic wave is generated, workbench is made by the effect of ultrasonic wave（3）The cutting line of top does high-frequency vibration by a narrow margin, then sharp
Material is cut with the cutting line of vibration, tension-detecting mechanism（6）The tensile force of cutting line is carried out when device works
Detection, if breaking, tensile force, which disappears, to break arrestment mechanism（7）Meeting emergency braking, stops the work of cutter device, protects
Entire cutter device and material.
3. a kind of multi-wire saw according to claim 1 vibrates auxiliary device, it is characterised in that：The vibration auxiliary body
（2）It is provided with two groups.
4. a kind of multi-wire saw according to claim 1 vibrates auxiliary device, it is characterised in that：The directive wheel（5）One
On the other hand aspect is used to smooth vibration for being oriented to cutting line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810538646.3A CN108437248A (en) | 2018-05-30 | 2018-05-30 | A kind of multi-wire saw vibration auxiliary device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810538646.3A CN108437248A (en) | 2018-05-30 | 2018-05-30 | A kind of multi-wire saw vibration auxiliary device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108437248A true CN108437248A (en) | 2018-08-24 |
Family
ID=63205749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810538646.3A Withdrawn CN108437248A (en) | 2018-05-30 | 2018-05-30 | A kind of multi-wire saw vibration auxiliary device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108437248A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109664424A (en) * | 2019-01-23 | 2019-04-23 | 福建北电新材料科技有限公司 | Multi-line cutting method, Multi-wire cutting device and application thereof, semiconductor material and power device |
| CN114179229A (en) * | 2021-12-13 | 2022-03-15 | 中铁建工集团有限公司 | Diamond wire saw chain cutting process |
-
2018
- 2018-05-30 CN CN201810538646.3A patent/CN108437248A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109664424A (en) * | 2019-01-23 | 2019-04-23 | 福建北电新材料科技有限公司 | Multi-line cutting method, Multi-wire cutting device and application thereof, semiconductor material and power device |
| CN114179229A (en) * | 2021-12-13 | 2022-03-15 | 中铁建工集团有限公司 | Diamond wire saw chain cutting process |
| CN114179229B (en) * | 2021-12-13 | 2023-11-14 | 中铁建工集团有限公司 | Diamond rope saw chain cutting process |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180824 |