CN204955160U - Diamond coping saw of brazing - Google Patents
Diamond coping saw of brazing Download PDFInfo
- Publication number
- CN204955160U CN204955160U CN201520702620.XU CN201520702620U CN204955160U CN 204955160 U CN204955160 U CN 204955160U CN 201520702620 U CN201520702620 U CN 201520702620U CN 204955160 U CN204955160 U CN 204955160U
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- heart yearn
- brazing
- diamond
- coping saw
- little
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model provides a diamond coping saw of brazing, it relates to cutter technical field, and it contains first heart yearn, second heart yearn, borer alloy junction mixture, diamond granule, the transposition of first heart yearn and second heart yearn form, first heart yearn and the surface coating of second heart yearn have diamond granule and borer alloy junction mixture, the borer alloy junction mixture by heating brazing metal that forms of brazing. A diamond coping saw of brazing because the heart yearn has adopted the stranded wire, the more traditional coping saw of coping saw sectional area is little, the breaking load descends, the cutting efficiency of transposition coping saw can reach 2 times of left and right sides of traditional coping saw, surface damage is little, the flexural deflection is little, section is thin, slice favor the uniformity good, can cut the jumbo size silicon bulk, province's material, high efficiency, output are big, efficient, the utility model has the advantages of simple structure, set up reasonable, the cost of manufacture low.
Description
Technical field
The utility model relates to cutting-tool engineering field, is specifically related to a kind of diamond brazing scroll saw.
Background technology
At present, hard brittle material cutting technique mainly contains cylindrical cutting, inner circle cutting and saw blade cutting.Although cylindrical cutting is easy and simple to handle, rigidity of saw blade is poor, and the easy sideslip of saw blade in cutting process, causes the depth of parallelism of cut workpiece poor; And inner circle cutting can only carry out straight cuts, surface incising cannot be carried out.Wire sawing technology has that joint-cutting is narrow, efficiency is high, chipping qualities is good, the advantage such as march Linear cut can become the cutting technique extensively adopted at present.During inner circle cutting, wafer surface damage layer is large, brings very large grinding-polishing workload to CMP; Cutting edge is wide, and material unaccounted-for (MUF) is large, and it is low that wafer goes out rate; Cost is high, and productivity ratio is low; A slice can only be cut at every turn.When diameter wafer reaches 300mm, interior circular knife external diameter will reach 1.18m, and internal diameter is 410mm, and manufacture, installation and debugging bring a lot of difficulty, therefore later stage main development Linear cut is main wafer cutting technique.
Diamond fretsaw uses diamond as abrasive material, and its typical abrasive grains is of a size of dozens of micron, can carry out precision, the cutting of narrow saw kerf, and can realize formed machining to hard brittle material.Along with the application & development in large scale semiconductor and the cutting of photocell thin slice, diamond fretsaw shows a series of superiority gradually, as little in surface damage, deflection deformation is little, it is thin to cut into slices, the thick uniformity of sheet is good, can cutting large size silicon ingot, material saving, high efficiency, output is large, efficiency is high.
Up to the present, the main free abrasive line cutting technology that adopts of the semiconductor hard brittle material cuttings such as silicon crystal, but this technology exists significantly not enough, scroll saw wire travelling speed is low, saw silk is short for service life, during cutting large size blank, abrasive material is difficult to enter into long and dark joint-cutting, and process and the cost recovery of defibrination are higher.
Utility model content
The purpose of this utility model is defect for prior art and deficiency, provides the diamond brazing scroll saw that a kind of structure is simple, reasonable in design, easy to use.
For achieving the above object, the technical solution adopted in the utility model is: it comprises the first heart yearn, the second heart yearn, pricker alloy bonding agent, diamond particles; The first described heart yearn and the second heart yearn is stranded forms; The first described heart yearn and the surface of the second heart yearn are coated with diamond particles and pricker alloy bonding agent; Described pricker alloy bonding agent forms brazing alloy by heating soldering.
As preferably, described pricker alloy bonding agent is Ni-Cr-B-Si solder alloy.
As preferably, the first described heart yearn and the twisting pitch of the second heart yearn are D, and the value of D is 2-10mm.
After adopting said structure, the beneficial effect that the utility model produces is: a kind of diamond brazing scroll saw described in the utility model, because heart yearn have employed twisted wire, scroll saw sectional area is little compared with traditional scroll saw, breaking load declines, maximum about 2 times of reaching traditional scroll saw of the cutting efficiency of stranded scroll saw, surface damage is little, deflection deformation is little, it is thin to cut into slices, the thick uniformity of sheet is good, energy cutting large size silicon ingot, material saving, high efficiency, output is large, efficiency is high, the utility model have structure simple, arrange rationally, the advantage such as cost of manufacture is low.
Accompanying drawing explanation
Fig. 1 is the utility model structure chart;
Fig. 2 is A-A sectional view in Fig. 1.
Description of reference numerals:
1, the first heart yearn; 2, the second heart yearn; 3, pricker alloy bonding agent; 4, diamond particles.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is further described.
Referring to such as Fig. 1---shown in Fig. 2, this detailed description of the invention adopts following technical scheme: it comprises the first heart yearn 1, second heart yearn 2, pricker alloy bonding agent 3, diamond particles 4; The first described heart yearn 1 and the second heart yearn 2 is stranded forms; The first described heart yearn 1 and the surface of the second heart yearn 2 are coated with diamond particles 4 and pricker alloy bonding agent 3; Described pricker alloy bonding agent 3 forms brazing alloy by heating soldering.
As preferably, described pricker alloy bonding agent 3 is Ni-Cr-B-Si solder alloy.
As preferably, the first described heart yearn 1 and the twisting pitch of the second heart yearn 2 are D, and the value of D is 2-10mm.
Adopt after said structure, the beneficial effect that this detailed description of the invention produces for: a kind of diamond brazing scroll saw described in this detailed description of the invention, because heart yearn have employed twisted wire, scroll saw sectional area is little compared with traditional scroll saw, and breaking load declines.Maximum about 2 times of reaching traditional scroll saw of the cutting efficiency of stranded scroll saw, surface damage is little, deflection deformation is little, it is thin to cut into slices, the thick uniformity of sheet is good, energy cutting large size silicon ingot, material saving, high efficiency, output is large, efficiency is high, this detailed description of the invention have structure simple, arrange rationally, the advantage such as cost of manufacture is low.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (3)
1. a diamond brazing scroll saw, is characterized in that: it comprises the first heart yearn, the second heart yearn, pricker alloy bonding agent, diamond particles; The first described heart yearn and the second heart yearn is stranded forms; The first described heart yearn and the surface of the second heart yearn are coated with diamond particles and pricker alloy bonding agent; Described pricker alloy bonding agent forms brazing alloy by heating soldering.
2. a kind of diamond brazing scroll saw according to claim 1, is characterized in that: described pricker alloy bonding agent is Ni-Cr-B-Si solder alloy.
3. a kind of diamond brazing scroll saw according to claim 1, is characterized in that: the first described heart yearn and the twisting pitch of the second heart yearn are D, and the value of D is 2-10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520702620.XU CN204955160U (en) | 2015-09-11 | 2015-09-11 | Diamond coping saw of brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520702620.XU CN204955160U (en) | 2015-09-11 | 2015-09-11 | Diamond coping saw of brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204955160U true CN204955160U (en) | 2016-01-13 |
Family
ID=55050251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520702620.XU Active CN204955160U (en) | 2015-09-11 | 2015-09-11 | Diamond coping saw of brazing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204955160U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107364022A (en) * | 2017-06-27 | 2017-11-21 | 盛利维尔（中国）新材料技术股份有限公司 | A kind of strong carrier fluid antifriction cutting steel wire and its production method |
-
2015
- 2015-09-11 CN CN201520702620.XU patent/CN204955160U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107364022A (en) * | 2017-06-27 | 2017-11-21 | 盛利维尔（中国）新材料技术股份有限公司 | A kind of strong carrier fluid antifriction cutting steel wire and its production method |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |