CN203888043U - Diamond wire preparing device - Google Patents

Diamond wire preparing device Download PDF

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Publication number
CN203888043U
CN203888043U CN201320817291.4U CN201320817291U CN203888043U CN 203888043 U CN203888043 U CN 203888043U CN 201320817291 U CN201320817291 U CN 201320817291U CN 203888043 U CN203888043 U CN 203888043U
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CN
China
Prior art keywords
wire
diamond
diamond wire
cutting
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201320817291.4U
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Chinese (zh)
Inventor
贺忠臣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Weixing New Building Materials Co Ltd
Original Assignee
Zhejiang Weixing New Building Materials Co Ltd
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Filing date
Publication date
Application filed by Zhejiang Weixing New Building Materials Co Ltd filed Critical Zhejiang Weixing New Building Materials Co Ltd
Priority to CN201320817291.4U priority Critical patent/CN203888043U/en
Application granted granted Critical
Publication of CN203888043U publication Critical patent/CN203888043U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The utility model discloses a diamond wire preparing device. The diamond wire preparing device comprises a wire unwinding wheel, a metallic wire machining device which is used for machining a metallic wire, a wire passing wheel I which is arranged between the wire unwinding wheel and the metallic wire machining device, an embedded or coated material grinding device which is connected with the metallic wire machining device, a tension device which is connected with the embedded or coated material grinding device, and a wire winding wheel. Since the diamond wire prepared by using the diamond wire preparing device disclosed by the utility model has gaps on the surface in contact with hard and brittle materials, fine hard and brittle materials and falling-off grinding materials do not remain between the diamond wire and the hard and brittle materials during cutting, and the diamond wire prepared by using the device has a very strong cutting capacity; since the diamond wire prepared by using the device can enable cutting cooling fluid to be more easily enter a cutting area during cutting, the cooling effect can be enabled to be very good during cutting by using the diamond wire.

Description

A kind of preparation facilities of diamond wire
Technical field
The utility model relates to a kind of preparation facilities of diamond wire.
Background technology
Diamond wire is the abbreviation of diamond cutting secant, industrial for cutting hard brittle material.Such as: the cutting of silicon materials in photovoltaic industry, cutting of diamond material etc. in semicon industry.Diamond wire is the desirable material that solves hard brittle material cutting processing.
Diamond wire is in the market all to take linear pattern wire as bus (heart yearn) matrix, coated abrasives on linear pattern wire.This linear pattern diamond wire is in the crisp materials process of cutting hard, and abrasive material and hard brittle material cutting and grinding, produce a large amount of tiny broken hard brittle materials and be accumulated between diamond wire and hard brittle material, and the abrasive material simultaneously coming off in cutting process also can remain between the two.This part tiny hard brittle material and the abrasive material lubricate in cutting process coming off, make easily to produce and relatively move between diamond wire and hard brittle material, thereby reduced the frictional force between diamond wire and hard brittle material, cause diamond wire to carry out regrind cutting to broken little hard brittle material simultaneously, and the cutting of diamond wire to the abrasive material that comes off, so greatly wasted the cutting power of diamond wire.Therefore a kind of exploitation of device of the diamond wire that has gap for the preparation of diamond wire and hard brittle material contact portion is necessary.
Utility model content
Technical problem to be solved in the utility model is to provide the diamond wire preparation facilities that a kind of and hard brittle material contact portion exist gap.
For addressing the above problem, the technical scheme that the utility model adopts is:
A preparation facilities for diamond wire, comprises actinobacillus wheel; For the wire working apparatus that wire is processed; Wire-crossing wheel between described actinobacillus wheel and wire working apparatus; What be connected with described wire working apparatus inlays or coated abrasives device; Inlay or tensioner that coated abrasives device is connected with described; And take-up pulley.
As preferably, described in inlay or coated abrasives device and tensioner between be also provided with wire-crossing wheel.
As preferably, the wire obtaining after the described wire working apparatus processing that wire is processed is that wire is provided with a plurality of and the integrated bulge-structure of wire.
As preferably, the height of described each bulge-structure is wire diameter 1.01 ~ 3.00 times, each bulge-structure length is 0.01 ~ 50.00mm.
Beneficial effect: than prior art, the diamond wire that the preparation facilities of the utility model diamond wire makes has gap due on itself and hard brittle material contact-making surface, the abrasive material of therefore can residual tiny hard brittle material between the diamond wire of cutting zone and hard brittle material and coming off, thus the diamond wire that this device makes has very strong cutting power; And the diamond wire that this device makes can make to cut cooling fluid and more easily enter cutting zone when cutting, thereby make it when cutting, can there is good cooling effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model diamond wire preparation facilities.
The specific embodiment
As shown in Figure 1, a kind of preparation facilities of diamond wire, comprises actinobacillus wheel 1; For the wire working apparatus 3 that wire 2 is processed; Wire-crossing wheel 4 between described actinobacillus wheel 1 and wire working apparatus 3; What be connected with described wire working apparatus 3 inlays or coated abrasives device 5; Inlay or tensioner 6 that coated abrasives device 5 is connected with described; And take-up pulley 7, described in inlay or coated abrasives device 5 and tensioner 6 between be provided with wire-crossing wheel 4; By wire 2 process wire working apparatus 3, obtain required (distortion) wire 8, the bus that wire 8 is diamond wire, on wire 8, there is a plurality of and integrated bulge-structure of wire, the height of each bulge-structure is 1.01 ~ 3.00 times of wire diameter, and each bulge-structure length is 0.01 ~ 50.00mm; By wire 8 by inlaying or coated abrasives device 5 obtains required diamond wire 9.
The wire that is 0.2mm by diameter 2 coilings close on actinobacillus wheel 1, by wire 2 unwrapping wire out, wire 2 is through after wire working apparatus 3, obtaining wave height is 0.35mm, wavelength is 5.0mm's (distortion) wire 8, this (distortion) wire 8, after diamond abrasive electroplating production device 5, is obtained to required diamond wire 9.
The wire that is 0.3mm by diameter 2 coilings close on actinobacillus wheel 1, by wire 2 unwrapping wire out, wire 2 is through after wire working apparatus 3, obtaining wave height is 0.50mm, wavelength is 4.0mm's (distortion) wire 8, this (distortion) wire 8, after diamond abrasive resinoid bond process units 5, is obtained to required diamond wire 9.
The utility model diamond wire preparation facilities obtains diamond wire 9, on bus (wire 8) due to diamond wire 9, there is bulge-structure, therefore in the crisp materials process of cutting hard, on diamond wire 9 and hard brittle material contact-making surface, there is gap, the abrasive material of therefore can residual tiny hard brittle material between the diamond wire 9 of cutting zone and hard brittle material and coming off, so the diamond wire 9 that this preparation facilities obtains has very strong cutting power; And the diamond wire 9 that this device makes can make to cut cooling fluid and more easily enter cutting zone when cutting, thereby make it when cutting, can there is good cooling effect.
Obviously, above-described embodiment is only for the utility model example is clearly described, and is not the restriction to embodiment of the present utility model.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all embodiments.And these belong to apparent variation that spirit of the present utility model extended out or change still among protection domain of the present utility model.

Claims (4)

1. a preparation facilities for diamond wire, is characterized in that: comprise actinobacillus wheel; For the wire working apparatus that wire is processed; Wire-crossing wheel between described actinobacillus wheel and wire working apparatus; What be connected with described wire working apparatus inlays or coated abrasives device; Inlay or tensioner that coated abrasives device is connected with described; And take-up pulley.
2. the preparation facilities of diamond wire according to claim 1, is characterized in that: described in inlay or coated abrasives device and tensioner between be also provided with wire-crossing wheel.
3. the preparation facilities of diamond wire according to claim 1, is characterized in that: the wire obtaining after the described wire working apparatus processing that wire is processed is that wire is provided with a plurality of and integrated bulge-structure of wire.
4. the preparation facilities of diamond wire according to claim 3, is characterized in that: the height of described each bulge-structure is wire diameter 1.01 ~ 3.00 times, each bulge-structure length is 0.01 ~ 50.00mm.
CN201320817291.4U 2013-12-13 2013-12-13 Diamond wire preparing device Expired - Lifetime CN203888043U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320817291.4U CN203888043U (en) 2013-12-13 2013-12-13 Diamond wire preparing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320817291.4U CN203888043U (en) 2013-12-13 2013-12-13 Diamond wire preparing device

Publications (1)

Publication Number Publication Date
CN203888043U true CN203888043U (en) 2014-10-22

Family

ID=51714489

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320817291.4U Expired - Lifetime CN203888043U (en) 2013-12-13 2013-12-13 Diamond wire preparing device

Country Status (1)

Country Link
CN (1) CN203888043U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624887A (en) * 2013-12-13 2014-03-12 镇江耐丝新型材料有限公司 Preparation device for diamond wire
CN106078376A (en) * 2016-07-29 2016-11-09 苏州誉衡兴自动化科技有限公司 A kind of tinsel automatic machining device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624887A (en) * 2013-12-13 2014-03-12 镇江耐丝新型材料有限公司 Preparation device for diamond wire
CN106078376A (en) * 2016-07-29 2016-11-09 苏州誉衡兴自动化科技有限公司 A kind of tinsel automatic machining device

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CX01 Expiry of patent term
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Granted publication date: 20141022