CN208773851U - A kind of high intensity silicon chip diamond fretsaw - Google Patents
A kind of high intensity silicon chip diamond fretsaw Download PDFInfo
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- CN208773851U CN208773851U CN201820508946.2U CN201820508946U CN208773851U CN 208773851 U CN208773851 U CN 208773851U CN 201820508946 U CN201820508946 U CN 201820508946U CN 208773851 U CN208773851 U CN 208773851U
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- grinding body
- diamond
- scroll saw
- rope
- silicon chip
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Abstract
The utility model relates to a kind of high-intensitive silicon chip diamond fretsaws, it includes scroll saw base rope, grinding body carrier coating, diamond grinding body, wherein, the grinding body carrier coating is coated on the scroll saw base rope outer wall, the diamond grinding body is laid in the grinding body carrier coating, the diameter of the scroll saw base rope is 100~200um, and the grinding body carrier coating is amorphous coating, and the particle diameter of the diamond grinding body is 2~8um.The every knife usage amount of this high intensity silicon chip diamond fretsaw reduces 30% or more, when using 6um diamond grinding grain, every knife usage amount more can be reduced to 90% or more, and can not have to slurry, intensity and wearability be greatly improved, substantially increase the cutting efficiency of scroll saw, four core wires are used to screw as line group, there can be higher fatigue performance in this way, on the basis of reaching required intensity, considerably increase the service life of scroll saw and adapt to quantity-produced ability.
Description
Technical field
The utility model relates to a kind of high-intensitive silicon chip diamond fretsaws.
Background technique
Photovoltaic power generation industry development in recent years is swift and violent, and silicon wafer is the substrate for manufacturing photovoltaic cell, and scroll saw first cuts silicon ingot
At square, it is then cut into very thin silicon wafer.Silicon wafer is the part of most expensive in crystal silicon photovoltaic cell technology, so reducing this portion
The manufacturing cost divided is most important to the competitiveness of traditional energy for improving solar energy.Scroll saw is under the cooperation of grinding slurry
For completing the ultra-fine high-intensitive cutting line of cutting action, it is at most wrapped in guide roller in parallel to each other up to 1000 cutting lines
One horizontal cutting gauze of upper formation.Motor driving guide roller makes entirely to cut gauze with 5~25 meters of speed per second movement.
In cutting line motion process, nozzle can continue to spray the slurry containing suspension and carbonation silicon particle to cutting line.Silicon-carbide particle
It is uniformly coated on the cutting line surface in high-speed motion, is made jointly using the rigid characteristic of itself, sharp water chestnut and cutting line
It is gradually truncated with by silicon rod.But the silicon-carbide particle in slurry is prone to wear out the cutting line in high-speed motion, changes cutting
Line line footpath, to influence to cut quality.If using diamond wire instead to be sliced and need to carry out structure of modification, simultaneously to current wire cutting machine
The diamond partial size discreteness for being fixed on steel wire surface causes greatly silicon chip surface to have irregular stria to affect large area use.
With the development of entire solar energy industry, solar power silicon sheet cutting equipment investment increased operation in recent years with tens times, wherein
Cutting steel wire is largely consumed with expanding production for board of slice, year consumes the tens of thousands of tons of steel wire rod.In solar silicon wafers wire cutting
Steel wire largely is cut using line, be unfavorable for environmental Kuznets Curves and causes the increase of entreprise cost, in order to adapt to future market demand and valence
The competition development need of lattice, how entire industry is all to improve steel wire surface abrasion resistance and usage amount and cutting efficiency and reduction
Cutting cost and does not change existing cutting equipment and technique, ceaselessly finds new approach.In addition to this, due to diamond wire
Saw is often used for the higher material of cutting hardness, so its service life is not often grown, to increase the life of solar product
Produce cost.
Utility model content
The technical problems to be solved in the utility model is how to overcome the drawbacks described above of the prior art, provides a kind of high intensity
Silicon chip diamond fretsaw.
In order to solve the above technical problems, this high intensity silicon chip diamond fretsaw includes scroll saw base rope, the painting of grinding body carrier
Layer, diamond grinding body, wherein the grinding body carrier coating is coated on the scroll saw base rope outer wall, the Buddha's warrior attendant stone mill
It cuts body to be laid in the grinding body carrier coating, the diameter of the scroll saw base rope is 100~200um, the grinding body carrier
Coating is amorphous coating, and the particle diameter of the diamond grinding body is 2~8um.It is designed in this way, amorphous alloy is again
Referred to as glassy metal, the metastable structure feature with longrange disorder, shortrange order.The three-dimensional space of its atom is in and opens up when solid-state
Flutter disorderly arranged, and this state keeps relative stability in certain temperature range.Compared with traditional crystal alloy, amorphous is closed
The standby many excellent performances of fitting, such as it is high intensity, high rigidity, wear-resisting and corrosion-resistant.Compared with common wire, line of the invention
Scroll saw intensity, the wearability of material production significantly improve.Diamond grinding grain presents solid under amorphous alloy high temperature fused state
Body state, hardness is very high, can be further improved the wearability of amorphous coating；And equally distributed diamond grinding grain
It can play the role of identical with silicon-carbide particle in grinding slurry, i.e., silicon rod gradually be truncated in high-speed motion, to reduce
The use of grinding slurry reduces abrasion of the slurry to cutting line while save the cost.
As optimization, the scroll saw base rope includes double-sided plush rope sling, four carbon steel core wires and gap filling object, wherein institute
It states double-sided plush rope sling to be wrapped in outside four carbon steel core wires, the gap filling object fills up double-sided plush rope sling and four carbon steel core wires
Between gap.
As optimization, four carbon steel core wires in pairs, are rubbed with the hands as rope made of hemp shape line group, then again by two rope made of hemp shape line groups
Rubbing with the hands is the compound rope made of hemp.
As optimization, the diamond grinding body heat is compounded on grinding body carrier coating, grinding layer is collectively formed, the mill
The weight ratio cut in layer with grinding body carrier coating and diamond grinding body is 4~2:1.
As there is data boundary, the diameter of the scroll saw base rope is 200um, and the particle diameter of the diamond grinding body is
2um；Weight ratio in the grinding layer with grinding body carrier coating and diamond grinding body is 4:1.
As there is data boundary, the diameter of the scroll saw base rope is 100um, and the particle diameter of the diamond grinding body is
8um；Weight ratio in the grinding layer with grinding body carrier coating and diamond grinding body is 2:1.
As there is optimum data, the diameter of the scroll saw base rope is 150um, and the particle diameter of the diamond grinding body is
6um；Weight ratio in the grinding layer with grinding body carrier coating and diamond grinding body is 3:1.
Compared with prior art, every knife usage amount reduces 30% to a kind of high-intensitive silicon chip diamond fretsaw of the utility model
More than, when using 6um diamond grinding grain, every knife usage amount more be can be reduced to 90% or more, and can not have to slurry, intensity
It is greatly improved with wearability, substantially increases the cutting efficiency of scroll saw, use four core wires to screw as line group, in this way can
With higher fatigue performance, on the basis of reaching required intensity, considerably increases the service life of scroll saw and adapt to continuous
The ability of production.
Detailed description of the invention
High-intensitive silicon chip diamond fretsaw a kind of to the utility model is described further with reference to the accompanying drawing:
Fig. 1 is the cross section structure schematic diagram of this high intensity silicon chip diamond fretsaw.
In figure: 1- scroll saw base rope, 2- grinding body carrier coating, 3- diamond grinding body, 101- double-sided plush rope sling, 102- carbon
Steel core wire, 103- gap filling object, 4- grinding layer
Specific embodiment
Embodiment 1: as shown in Figure 1, this high intensity silicon chip diamond fretsaw includes scroll saw base rope 1, grinding body carrier
Coating 2, diamond grinding body 3, wherein the grinding body carrier coating 2 is coated on 1 outer wall of scroll saw base rope, the gold
Hard rock grinding body 3 is laid in the grinding body carrier coating 2, and the diameter of the scroll saw base rope 1 is 100~200um, the mill
Cutting body carrier coating 2 is amorphous coating, and the particle diameter of the diamond grinding body 3 is 2~8um.Amorphous alloy
Also known as glassy metal, the metastable structure feature with longrange disorder, shortrange order.The three-dimensional space of its atom is in when solid-state
Topological disorder arrangement, and this state keeps relative stability in certain temperature range.Compared with traditional crystal alloy, amorphous
Alloy has many excellent performances, such as high intensity, high rigidity, wear-resisting and corrosion-resistant.It is of the invention compared with common wire
Scroll saw intensity, the wearability of wire rod production significantly improve.Diamond grinding grain is presented under amorphous alloy high temperature fused state
Solid state, hardness is very high, can be further improved the wearability of amorphous coating；And equally distributed diamond grinding
Grain can play the role of identical with silicon-carbide particle in grinding slurry, i.e., silicon rod is gradually truncated in high-speed motion, to subtract
The use of few grinding slurry, save the cost while, reduce abrasion of the slurry to cutting line.
The scroll saw base rope 1 includes 101, four carbon steel core wires 102 of double-sided plush rope sling and gap filling object 103, wherein institute
It states double-sided plush rope sling 101 to be wrapped in outside four carbon steel core wires 102, the gap filling object 103 fills up 101 He of double-sided plush rope sling
Gap between four carbon steel core wires 102.Four carbon steel core wires 102 in pairs, are rubbed with the hands as rope made of hemp shape line group, then again will
It is the compound rope made of hemp that two rope made of hemp shape line groups, which are rubbed with the hands,.3 heat of diamond grinding body is compounded on grinding body carrier coating 2, is collectively formed
Grinding layer 4 with the weight ratio of grinding body carrier coating 2 and diamond grinding body 3 is 4~2:1 in the grinding layer 4.It is described
The diameter of scroll saw base rope 1 is 200um, and the particle diameter of the diamond grinding body 3 is 2um；In the grinding layer 4 with grinding body
The weight ratio of carrier coating 2 and diamond grinding body 3 is 4:1.
Embodiment 2: this high intensity silicon chip diamond fretsaw includes scroll saw base rope 1, grinding body carrier coating 2, Buddha's warrior attendant
Stone grinding body 3, wherein the grinding body carrier coating 2 is coated on 1 outer wall of scroll saw base rope, the diamond grinding body 3
It is laid in the grinding body carrier coating 2, the diameter of the scroll saw base rope 1 is 100~200um, and the grinding body carrier applies
Layer 2 is amorphous coating, and the particle diameter of the diamond grinding body 3 is 2~8um.Amorphous alloy is also known as metal
Glass, the metastable structure feature with longrange disorder, shortrange order.The three-dimensional space of its atom is arranged in topological disorder when solid-state
Column, and this state keeps relative stability in certain temperature range.Compared with traditional crystal alloy, amorphous alloy has very
Mostly excellent performance, such as it is high intensity, high rigidity, wear-resisting and corrosion-resistant.Compared with common wire, wire rod production of the invention
Scroll saw intensity, wearability significantly improve.Solid state is presented in diamond grinding grain under amorphous alloy high temperature fused state, firmly
Degree is very high, can be further improved the wearability of amorphous coating；And equally distributed diamond grinding grain can play with
The identical effect of silicon-carbide particle in grinding slurry, i.e., silicon rod is gradually truncated in high-speed motion, to reduce grinding slurry
Use, abrasion of the slurry to cutting line is reduced while save the cost.
The scroll saw base rope 1 includes 101, four carbon steel core wires 102 of double-sided plush rope sling and gap filling object 103, wherein institute
It states double-sided plush rope sling 101 to be wrapped in outside four carbon steel core wires 102, the gap filling object 103 fills up 101 He of double-sided plush rope sling
Gap between four carbon steel core wires 102.Four carbon steel core wires 102 in pairs, are rubbed with the hands as rope made of hemp shape line group, then again will
It is the compound rope made of hemp that two rope made of hemp shape line groups, which are rubbed with the hands,.3 heat of diamond grinding body is compounded on grinding body carrier coating 2, is collectively formed
Grinding layer 4 with the weight ratio of grinding body carrier coating 2 and diamond grinding body 3 is 4~2:1 in the grinding layer 4.It is described
The diameter of scroll saw base rope 1 is 100um, and the particle diameter of the diamond grinding body 3 is 8um；In the grinding layer 4 with grinding body
The weight ratio of carrier coating 2 and diamond grinding body 3 is 2:1.
Embodiment 3: this high intensity silicon chip diamond fretsaw includes scroll saw base rope 1, grinding body carrier coating 2, Buddha's warrior attendant
Stone grinding body 3, wherein the grinding body carrier coating 2 is coated on 1 outer wall of scroll saw base rope, the diamond grinding body 3
It is laid in the grinding body carrier coating 2, the diameter of the scroll saw base rope 1 is 100~200um, and the grinding body carrier applies
Layer 2 is amorphous coating, and the particle diameter of the diamond grinding body 3 is 2~8um.Amorphous alloy is also known as metal
Glass, the metastable structure feature with longrange disorder, shortrange order.The three-dimensional space of its atom is arranged in topological disorder when solid-state
Column, and this state keeps relative stability in certain temperature range.Compared with traditional crystal alloy, amorphous alloy has very
Mostly excellent performance, such as it is high intensity, high rigidity, wear-resisting and corrosion-resistant.Compared with common wire, wire rod production of the invention
Scroll saw intensity, wearability significantly improve.Solid state is presented in diamond grinding grain under amorphous alloy high temperature fused state, firmly
Degree is very high, can be further improved the wearability of amorphous coating；And equally distributed diamond grinding grain can play with
The identical effect of silicon-carbide particle in grinding slurry, i.e., silicon rod is gradually truncated in high-speed motion, to reduce grinding slurry
Use, abrasion of the slurry to cutting line is reduced while save the cost.
The scroll saw base rope 1 includes 101, four carbon steel core wires 102 of double-sided plush rope sling and gap filling object 103, wherein institute
It states double-sided plush rope sling 101 to be wrapped in outside four carbon steel core wires 102, the gap filling object 103 fills up 101 He of double-sided plush rope sling
Gap between four carbon steel core wires 102.Four carbon steel core wires 102 in pairs, are rubbed with the hands as rope made of hemp shape line group, then again will
It is the compound rope made of hemp that two rope made of hemp shape line groups, which are rubbed with the hands,.3 heat of diamond grinding body is compounded on grinding body carrier coating 2, is collectively formed
Grinding layer 4 with the weight ratio of grinding body carrier coating 2 and diamond grinding body 3 is 4~2:1 in the grinding layer 4.It is described
The diameter of scroll saw base rope 1 is 200um, and the particle diameter of the diamond grinding body 3 is 2um；The diameter of the scroll saw base rope 1 is
150um, the particle diameter of the diamond grinding body 3 are 6um；In the grinding layer 4 with grinding body carrier coating 2 and diamond
The weight ratio of grinding body 3 is 3:1.
Above embodiment is intended to illustrate the utility model and can realize or use for professional and technical personnel in the field, right
Above embodiment, which is modified, will be readily apparent to those skilled in the art, therefore the utility model includes
But it is not limited to above embodiment, it is any to meet the claims or specification description, meet and principles disclosed herein
With novelty, the method for inventive features, technique, product, each fall within the protection scope of the utility model.
Claims (7)
1. a kind of high intensity silicon chip diamond fretsaw, it is characterized in that: include scroll saw base rope (1), grinding body carrier coating (2),
Diamond grinding body (3), wherein the grinding body carrier coating (2) is coated on scroll saw base rope (1) outer wall, the gold
Hard rock grinding body (3) is laid in the grinding body carrier coating (2), and the diameter of the scroll saw base rope (1) is 100~200um,
The grinding body carrier coating (2) is amorphous coating, and the particle diameter of the diamond grinding body (3) is 2~8um.
2. high intensity silicon chip diamond fretsaw according to claim 1, it is characterized in that: the scroll saw base rope (1) includes
Double-sided plush rope sling (101), four carbon steel core wires (102) and gap filling object (103), wherein double-sided plush rope sling (101) packet
It covers four carbon steel core wires (102) outsides, the gap filling object (103) fills up double-sided plush rope sling (101) He Sigen carbon steel core
Gap between line (102).
3. high intensity silicon chip diamond fretsaw according to claim 2, it is characterized in that: four carbon steel core wires
(102) in pairs, it rubs with the hands as rope made of hemp shape line group, then again rubs two rope made of hemp shape line groups for the compound rope made of hemp with the hands.
4. high intensity silicon chip diamond fretsaw according to claim 3, it is characterized in that: the diamond grinding body (3)
Heat is compounded on grinding body carrier coating (2), and grinding layer (4) are collectively formed.
5. high intensity silicon chip diamond fretsaw according to claim 3, it is characterized in that: the scroll saw base rope (1) is straight
Diameter is 200um, and the particle diameter of the diamond grinding body (3) is 2um.
6. high intensity silicon chip diamond fretsaw according to claim 3, it is characterized in that: the scroll saw base rope (1) is straight
Diameter is 100um, and the particle diameter of the diamond grinding body (3) is 8um.
7. high intensity silicon chip diamond fretsaw according to claim 3, it is characterized in that: the scroll saw base rope (1) is straight
Diameter is 150um, and the particle diameter of the diamond grinding body (3) is 6um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820508946.2U CN208773851U (en) | 2018-04-11 | 2018-04-11 | A kind of high intensity silicon chip diamond fretsaw |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820508946.2U CN208773851U (en) | 2018-04-11 | 2018-04-11 | A kind of high intensity silicon chip diamond fretsaw |
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| Publication Number | Publication Date |
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| CN208773851U true CN208773851U (en) | 2019-04-23 |
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| CN201820508946.2U Expired - Fee Related CN208773851U (en) | 2018-04-11 | 2018-04-11 | A kind of high intensity silicon chip diamond fretsaw |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108437247A (en) * | 2018-04-11 | 2018-08-24 | 张家港国龙光伏科技有限公司 | A kind of high intensity silicon chip diamond fretsaw |
| CN110202706A (en) * | 2019-04-25 | 2019-09-06 | 南京大学连云港高新技术研究院 | A kind of staggeredly embedded diamond wire and preparation method thereof |
-
2018
- 2018-04-11 CN CN201820508946.2U patent/CN208773851U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108437247A (en) * | 2018-04-11 | 2018-08-24 | 张家港国龙光伏科技有限公司 | A kind of high intensity silicon chip diamond fretsaw |
| CN110202706A (en) * | 2019-04-25 | 2019-09-06 | 南京大学连云港高新技术研究院 | A kind of staggeredly embedded diamond wire and preparation method thereof |
| CN110202706B (en) * | 2019-04-25 | 2021-08-03 | 南京大学连云港高新技术研究院 | Staggered embedded diamond wire and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190423 Termination date: 20200411 |