CN108437247A - A kind of high intensity silicon chip diamond fretsaw - Google Patents
A kind of high intensity silicon chip diamond fretsaw Download PDFInfo
- Publication number
- CN108437247A CN108437247A CN201810320880.9A CN201810320880A CN108437247A CN 108437247 A CN108437247 A CN 108437247A CN 201810320880 A CN201810320880 A CN 201810320880A CN 108437247 A CN108437247 A CN 108437247A
- Authority
- CN
- China
- Prior art keywords
- grinding body
- diamond
- scroll saw
- rope
- carrier coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 76
- 239000010432 diamond Substances 0.000 title claims abstract description 76
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 33
- 239000010703 silicon Substances 0.000 title claims abstract description 33
- 238000000227 grinding Methods 0.000 claims abstract description 128
- 239000011248 coating agent Substances 0.000 claims abstract description 51
- 238000000576 coating method Methods 0.000 claims abstract description 51
- 239000002245 particle Substances 0.000 claims abstract description 22
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 21
- 239000010962 carbon steel Substances 0.000 claims description 21
- 244000025254 Cannabis sativa Species 0.000 claims description 15
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 claims description 15
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 claims description 15
- 235000009120 camo Nutrition 0.000 claims description 15
- 235000005607 chanvre indien Nutrition 0.000 claims description 15
- 239000011487 hemp Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000011435 rock Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 24
- 239000002002 slurry Substances 0.000 abstract description 17
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000005300 metallic glass Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000003283 Pachira macrocarpa Nutrition 0.000 description 1
- 240000001085 Trapa natans Species 0.000 description 1
- 235000014364 Trapa natans Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 235000009165 saligot Nutrition 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention relates to a kind of high intensity silicon chip diamond fretsaws, it includes scroll saw base rope, grinding body carrier coating, diamond grinding body, wherein, the grinding body carrier coating is coated on the scroll saw base rope outer wall, the diamond grinding body is laid in the grinding body carrier coating, a diameter of 100~200um of the scroll saw base rope, the grinding body carrier coating are amorphous coating, and the particle diameter of the diamond grinding body is 2~8um.This high intensity silicon chip diamond fretsaw reduces 30% or more per knife usage amount, when using 6um diamond grinding grains, it can more be reduced to 90% or more per knife usage amount, and can not have to slurry, intensity and wearability be greatly improved, substantially increase the cutting efficiency of scroll saw, four core wires are used to screw as line group, there can be higher fatigue performance in this way, on the basis of reaching required intensity, considerably increase the service life of scroll saw and adapt to quantity-produced ability.
Description
Technical field
The present invention relates to a kind of high intensity silicon chip diamond fretsaws.
Background technology
Photovoltaic generation industry development in recent years is swift and violent, and silicon chip is the substrate for manufacturing photovoltaic cell, and scroll saw first cuts silicon ingot
At square, it is then cut into very thin silicon chip.Silicon chip is the part of most expensive in crystal silicon photovoltaic cell technology, so reducing this portion
The manufacturing cost divided is most important to the competitiveness of traditional energy for improving solar energy.Scroll saw is under the cooperation of grinding slurry
Ultra-fine high intensity cutting line for completing cutting action is at most wrapped in guide roller in parallel to each other up to 1000 cutting lines
One horizontal cutting gauze of upper formation.Motor driving guide roller makes entirely to cut gauze to be moved with 5~25 meters of speed per second.
In cutting line motion process, nozzle can continue to spray the slurry containing suspension and carbonation silicon particle to cutting line.Silicon-carbide particle
It is uniformly coated on the cutting line surface in high-speed motion, is made jointly using the rigid characteristic of itself, sharp water chestnut and cutting line
It is gradually blocked with by silicon rod.But the silicon-carbide particle in slurry is prone to wear out the cutting line in high-speed motion, changes cutting
Line line footpath, to influence to cut quality.If structure of modification, simultaneously need to be carried out to be sliced to current wire cutting machine by using diamond wire instead
The diamond grain size discreteness for being fixed on steel wire surface causes greatly silicon chip surface to have irregular stria to affect large area use.
With the development of entire solar energy industry, solar power silicon sheet cutting equipment input increased operation with tens times in recent years, wherein
Cutting steel wire is largely consumed with expanding production for board of slice, year consumes the tens thousand of tons of steel wire rod.In solar silicon wafers wire cutting
Steel wire largely is cut using line, be unfavorable for environmental Kuznets Curves and causes the increase of entreprise cost, in order to adapt to future market demand and valence
The competition development need of lattice, how entire industry is all to improve steel wire surface abrasion resistance and usage amount and cutting efficiency and reduction
Cutting cost and does not change existing cutting equipment and technique, ceaselessly finds new approach.In addition to this, due to diamond wire
Saw is often used for the higher material of cutting hardness, so its service life is not often grown, to increase the life of solar product
Produce cost.
Invention content
The technical problem to be solved by the present invention is to how overcome the drawbacks described above of the prior art, a kind of high intensity silicon substrate is provided
Piece diamond fretsaw.
In order to solve the above technical problems, this high intensity silicon chip diamond fretsaw includes scroll saw base rope, the painting of grinding body carrier
Layer, diamond grinding body, wherein the grinding body carrier coating is coated on the scroll saw base rope outer wall, the Buddha's warrior attendant stone mill
It cuts body to be laid in the grinding body carrier coating, a diameter of 100~200um of the scroll saw base rope, the grinding body carrier
Coating is amorphous coating, and the particle diameter of the diamond grinding body is 2~8um.So design, amorphous alloy is again
Referred to as glassy metal, the metastable structure feature with longrange disorder, shortrange order.The three dimensions of its atom is in and opens up when solid-state
Flutter disorderly arranged, and this state keeps relative stability in certain temperature range.Compared with traditional crystal alloy, amorphous closes
The standby many excellent performances of gold utensil, such as it is high intensity, high rigidity, wear-resisting and corrosion-resistant.Compared with common wire, line of the invention
Scroll saw intensity, the wearability of material making significantly improve.Diamond grinding grain presents solid under amorphous alloy high temperature fused state
Body state, hardness is very high, can further increase the wearability of amorphous coating；And equally distributed diamond grinding grain
It can play the role of identical with silicon-carbide particle in grinding slurry, i.e., gradually block silicon rod in high-speed motion, to reduce
The use of grinding slurry reduces abrasion of the slurry to cutting line while cost-effective.
As an optimization, the scroll saw base rope includes double-sided plush rope sling, four carbon steel core wires and gap filling object, wherein institute
It states double-sided plush rope sling to be wrapped in outside four carbon steel core wires, the gap filling object fills up double-sided plush rope sling and four carbon steel core wires
Between gap.
As an optimization, four carbon steel core wires in pairs, are rubbed with the hands as rope made of hemp shape line group, then again by two rope made of hemp shape line groups
It is the compound rope made of hemp to rub with the hands.
As an optimization, the diamond grinding body heat is compounded on grinding body carrier coating, and grinding layer is collectively formed, the mill
The weight ratio cut in layer with grinding body carrier coating and diamond grinding body is 4~2：1.
It is as having data boundary, the particle diameter of a diameter of 200um of the scroll saw base rope, the diamond grinding body
2um；Weight ratio in the grinding layer with grinding body carrier coating and diamond grinding body is 4：1.
It is as having data boundary, the particle diameter of a diameter of 100um of the scroll saw base rope, the diamond grinding body
8um；Weight ratio in the grinding layer with grinding body carrier coating and diamond grinding body is 2：1.
It is as having optimum data, the particle diameter of a diameter of 150um of the scroll saw base rope, the diamond grinding body
6um；Weight ratio in the grinding layer with grinding body carrier coating and diamond grinding body is 3：1.
A kind of high intensity silicon chip diamond fretsaw of the present invention compared with prior art, reduced per knife usage amount 30% with
On, when using 6um diamond grinding grains, 90% or more can be more reduced to per knife usage amount, and slurry can not had to, intensity and
Wearability is greatly improved, and substantially increases the cutting efficiency of scroll saw, uses four core wires to screw as line group, can have in this way
There is higher fatigue performance, on the basis of reaching required intensity, considerably increases the service life of scroll saw and adapt to continuous raw
The ability of production.
Description of the drawings
A kind of high intensity silicon chip diamond fretsaw of the present invention is described further below in conjunction with the accompanying drawings：
Fig. 1 is the cross section structure schematic diagram of this high intensity silicon chip diamond fretsaw.
In figure：1- scroll saw bases rope, 2- grinding bodies carrier coating, 3- diamond grindings body, 101- double-sided plush rope sling, 102- carbon
Steel core wire, 103- gap fillings object, 4- grinding layers
Specific implementation mode
Embodiment 1：As shown in Figure 1, this high intensity silicon chip diamond fretsaw includes scroll saw base rope 1, grinding body carrier
Coating 2, diamond grinding body 3, wherein the grinding body carrier coating 2 is coated on 1 outer wall of scroll saw base rope, the gold
Hard rock grinding body 3 is laid in the grinding body carrier coating 2, a diameter of 100~200um of the scroll saw base rope 1, the mill
It is amorphous coating to cut body carrier coating 2, and the particle diameter of the diamond grinding body 3 is 2~8um.Amorphous alloy
Also known as glassy metal, the metastable structure feature with longrange disorder, shortrange order.The three dimensions of its atom is in when solid-state
Topological disorder arranges, and this state keeps relative stability in certain temperature range.Compared with traditional crystal alloy, amorphous
Alloy has many excellent performances, such as high intensity, high rigidity, wear-resisting and corrosion-resistant.It is of the invention compared with common wire
Scroll saw intensity, the wearability of wire rod making significantly improve.Diamond grinding grain is presented under amorphous alloy high temperature fused state
Solid state, hardness is very high, can further increase the wearability of amorphous coating；And equally distributed diamond grinding
Grain can play the role of identical with silicon-carbide particle in grinding slurry, i.e., gradually block silicon rod in high-speed motion, to subtract
The use of few grinding slurry reduces abrasion of the slurry to cutting line while cost-effective.
The scroll saw base rope 1 includes 101, four carbon steel core wires 102 of double-sided plush rope sling and gap filling object 103, wherein institute
It states double-sided plush rope sling 101 to be wrapped in outside four carbon steel core wires 102, the gap filling object 103 fills up 101 He of double-sided plush rope sling
Gap between four carbon steel core wires 102.Four carbon steel core wires 102 in pairs, are rubbed with the hands as rope made of hemp shape line group, then again will
It is the compound rope made of hemp that two rope made of hemp shape line groups, which are rubbed with the hands,.3 heat of diamond grinding body is compounded on grinding body carrier coating 2, is collectively formed
Grinding layer 4 with the weight ratio of grinding body carrier coating 2 and diamond grinding body 3 is 4~2 in the grinding layer 4：1.It is described
The particle diameter of a diameter of 200um of scroll saw base rope 1, the diamond grinding body 3 are 2um；In the grinding layer 4 with grinding body
The weight ratio of carrier coating 2 and diamond grinding body 3 is 4：1.
Embodiment 2：This high intensity silicon chip diamond fretsaw includes scroll saw base rope 1, grinding body carrier coating 2, Buddha's warrior attendant
Stone grinding body 3, wherein the grinding body carrier coating 2 is coated on 1 outer wall of scroll saw base rope, the diamond grinding body 3
It is laid in the grinding body carrier coating 2, a diameter of 100~200um of the scroll saw base rope 1, the grinding body carrier applies
Layer 2 is amorphous coating, and the particle diameter of the diamond grinding body 3 is 2~8um.Amorphous alloy is also known as metal
Glass, the metastable structure feature with longrange disorder, shortrange order.The three dimensions of its atom is arranged in topological disorder when solid-state
Row, and this state keeps relative stability in certain temperature range.Compared with traditional crystal alloy, non-crystaline amorphous metal has very
Mostly excellent performance, such as it is high intensity, high rigidity, wear-resisting and corrosion-resistant.Compared with common wire, what wire rod of the invention made
Scroll saw intensity, wearability significantly improve.Solid state is presented in diamond grinding grain under amorphous alloy high temperature fused state, firmly
Degree is very high, can further increase the wearability of amorphous coating；And equally distributed diamond grinding grain can play with
The identical effect of silicon-carbide particle in grinding slurry, i.e., gradually block silicon rod in high-speed motion, to reduce grinding slurry
Use, abrasion of the slurry to cutting line is reduced while cost-effective.
The scroll saw base rope 1 includes 101, four carbon steel core wires 102 of double-sided plush rope sling and gap filling object 103, wherein institute
It states double-sided plush rope sling 101 to be wrapped in outside four carbon steel core wires 102, the gap filling object 103 fills up 101 He of double-sided plush rope sling
Gap between four carbon steel core wires 102.Four carbon steel core wires 102 in pairs, are rubbed with the hands as rope made of hemp shape line group, then again will
It is the compound rope made of hemp that two rope made of hemp shape line groups, which are rubbed with the hands,.3 heat of diamond grinding body is compounded on grinding body carrier coating 2, is collectively formed
Grinding layer 4 with the weight ratio of grinding body carrier coating 2 and diamond grinding body 3 is 4~2 in the grinding layer 4：1.It is described
The particle diameter of a diameter of 100um of scroll saw base rope 1, the diamond grinding body 3 are 8um；In the grinding layer 4 with grinding body
The weight ratio of carrier coating 2 and diamond grinding body 3 is 2：1.
Embodiment 3：This high intensity silicon chip diamond fretsaw includes scroll saw base rope 1, grinding body carrier coating 2, Buddha's warrior attendant
Stone grinding body 3, wherein the grinding body carrier coating 2 is coated on 1 outer wall of scroll saw base rope, the diamond grinding body 3
It is laid in the grinding body carrier coating 2, a diameter of 100~200um of the scroll saw base rope 1, the grinding body carrier applies
Layer 2 is amorphous coating, and the particle diameter of the diamond grinding body 3 is 2~8um.Amorphous alloy is also known as metal
Glass, the metastable structure feature with longrange disorder, shortrange order.The three dimensions of its atom is arranged in topological disorder when solid-state
Row, and this state keeps relative stability in certain temperature range.Compared with traditional crystal alloy, non-crystaline amorphous metal has very
Mostly excellent performance, such as it is high intensity, high rigidity, wear-resisting and corrosion-resistant.Compared with common wire, what wire rod of the invention made
Scroll saw intensity, wearability significantly improve.Solid state is presented in diamond grinding grain under amorphous alloy high temperature fused state, firmly
Degree is very high, can further increase the wearability of amorphous coating；And equally distributed diamond grinding grain can play with
The identical effect of silicon-carbide particle in grinding slurry, i.e., gradually block silicon rod in high-speed motion, to reduce grinding slurry
Use, abrasion of the slurry to cutting line is reduced while cost-effective.
The scroll saw base rope 1 includes 101, four carbon steel core wires 102 of double-sided plush rope sling and gap filling object 103, wherein institute
It states double-sided plush rope sling 101 to be wrapped in outside four carbon steel core wires 102, the gap filling object 103 fills up 101 He of double-sided plush rope sling
Gap between four carbon steel core wires 102.Four carbon steel core wires 102 in pairs, are rubbed with the hands as rope made of hemp shape line group, then again will
It is the compound rope made of hemp that two rope made of hemp shape line groups, which are rubbed with the hands,.3 heat of diamond grinding body is compounded on grinding body carrier coating 2, is collectively formed
Grinding layer 4 with the weight ratio of grinding body carrier coating 2 and diamond grinding body 3 is 4~2 in the grinding layer 4：1.It is described
The particle diameter of a diameter of 200um of scroll saw base rope 1, the diamond grinding body 3 are 2um；The scroll saw base rope 1 it is a diameter of
The particle diameter of 150um, the diamond grinding body 3 are 6um；In the grinding layer 4 with grinding body carrier coating 2 and diamond
The weight ratio of grinding body 3 is 3：1.
It can be that professional and technical personnel in the field realize or use that the above embodiment, which is intended to illustrate the present invention, to above-mentioned
Embodiment, which is modified, will be apparent to those skilled in the art, therefore the present invention includes but not limited to
The above embodiment, it is any to meet the claims or specification description, meet with principles disclosed herein and novelty,
The method of inventive features, technique, product, each fall within protection scope of the present invention.
Claims (7)
1. a kind of high intensity silicon chip diamond fretsaw, it is characterized in that：Including scroll saw base rope (1), grinding body carrier coating (2),
Diamond grinding body (3), wherein the grinding body carrier coating (2) is coated on scroll saw base rope (1) outer wall, the gold
Hard rock grinding body (3) is laid in the grinding body carrier coating (2), a diameter of 100~200um of the scroll saw base rope (1),
The grinding body carrier coating (2) is amorphous coating, and the particle diameter of the diamond grinding body (3) is 2~8um.
2. high intensity silicon chip diamond fretsaw according to claim 1, it is characterized in that：The scroll saw base rope (1) includes
Double-sided plush rope sling (101), four carbon steel core wires (102) and gap filling object (103), wherein double-sided plush rope sling (101) packet
It is external to be sleeved on four carbon steel core wires (102), the gap filling object (103) fills up double-sided plush rope sling (101) and four carbon steel cores
Gap between line (102).
3. high intensity silicon chip diamond fretsaw according to claim 2, it is characterized in that：Four carbon steel core wires
(102) in pairs, it rubs with the hands as rope made of hemp shape line group, it is the compound rope made of hemp then again to rub two rope made of hemp shape line groups with the hands.
4. high intensity silicon chip diamond fretsaw according to claim 3, it is characterized in that：The diamond grinding body (3)
Heat is compounded on grinding body carrier coating (2), and grinding layer (4) is collectively formed, in the grinding layer (4) with grinding body carrier coating
(2) it is 4~2 with the weight ratio of diamond grinding body (3)：1.
5. high intensity silicon chip diamond fretsaw according to claim 4, it is characterized in that：The scroll saw base rope (1) it is straight
Diameter is 200um, and the particle diameter of the diamond grinding body (3) is 2um；In the grinding layer (4) with grinding body carrier coating
(2) it is 4 with the weight ratio of diamond grinding body (3)：1.
6. high intensity silicon chip diamond fretsaw according to claim 4, it is characterized in that：The scroll saw base rope (1) it is straight
Diameter is 100um, and the particle diameter of the diamond grinding body (3) is 8um；In the grinding layer (4) with grinding body carrier coating
(2) it is 2 with the weight ratio of diamond grinding body (3)：1.
7. high intensity silicon chip diamond fretsaw according to claim 4, it is characterized in that：The scroll saw base rope (1) it is straight
Diameter is 150um, and the particle diameter of the diamond grinding body (3) is 6um；In the grinding layer (4) with grinding body carrier coating
(2) it is 3 with the weight ratio of diamond grinding body (3)：1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810320880.9A CN108437247A (en) | 2018-04-11 | 2018-04-11 | A kind of high intensity silicon chip diamond fretsaw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810320880.9A CN108437247A (en) | 2018-04-11 | 2018-04-11 | A kind of high intensity silicon chip diamond fretsaw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108437247A true CN108437247A (en) | 2018-08-24 |
Family
ID=63199297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810320880.9A Pending CN108437247A (en) | 2018-04-11 | 2018-04-11 | A kind of high intensity silicon chip diamond fretsaw |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108437247A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100175677A1 (en) * | 2009-01-15 | 2010-07-15 | Huei-Chen Chiang | Diamond wire saw |
| JP2010201541A (en) * | 2009-03-02 | 2010-09-16 | Sumitomo Electric Ind Ltd | Diamond wire saw, and method of manufacturing the same |
| CN102172999A (en) * | 2011-03-04 | 2011-09-07 | 郑州人造金刚石及制品工程技术研究中心有限公司 | Aramid fiber core wire saw and preparation method thereof |
| CN102225596A (en) * | 2011-06-03 | 2011-10-26 | 蒙特集团（香港）有限公司 | Solar silicon wafer wire cutting steel wire and manufacturing method thereof |
| CN102241082A (en) * | 2011-06-30 | 2011-11-16 | 蒙特集团（香港）有限公司 | Nickel-based amorphous alloy modified cutting steel wire |
| CN102489781A (en) * | 2011-11-15 | 2012-06-13 | 李园 | Diamond wire saw with stranded core and manufacturing process thereof |
| CN204869288U (en) * | 2015-07-31 | 2015-12-16 | 车国志 | Glass fiber cutting wire |
| CN206644168U (en) * | 2017-04-11 | 2017-11-17 | 中山市思考电子科技有限公司 | A kind of diamond fretsaw for solar product cutting |
| CN208773851U (en) * | 2018-04-11 | 2019-04-23 | 张家港国龙光伏科技有限公司 | A kind of high intensity silicon chip diamond fretsaw |
-
2018
- 2018-04-11 CN CN201810320880.9A patent/CN108437247A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100175677A1 (en) * | 2009-01-15 | 2010-07-15 | Huei-Chen Chiang | Diamond wire saw |
| JP2010201541A (en) * | 2009-03-02 | 2010-09-16 | Sumitomo Electric Ind Ltd | Diamond wire saw, and method of manufacturing the same |
| CN102172999A (en) * | 2011-03-04 | 2011-09-07 | 郑州人造金刚石及制品工程技术研究中心有限公司 | Aramid fiber core wire saw and preparation method thereof |
| CN102225596A (en) * | 2011-06-03 | 2011-10-26 | 蒙特集团（香港）有限公司 | Solar silicon wafer wire cutting steel wire and manufacturing method thereof |
| CN102241082A (en) * | 2011-06-30 | 2011-11-16 | 蒙特集团（香港）有限公司 | Nickel-based amorphous alloy modified cutting steel wire |
| CN102489781A (en) * | 2011-11-15 | 2012-06-13 | 李园 | Diamond wire saw with stranded core and manufacturing process thereof |
| CN204869288U (en) * | 2015-07-31 | 2015-12-16 | 车国志 | Glass fiber cutting wire |
| CN206644168U (en) * | 2017-04-11 | 2017-11-17 | 中山市思考电子科技有限公司 | A kind of diamond fretsaw for solar product cutting |
| CN208773851U (en) * | 2018-04-11 | 2019-04-23 | 张家港国龙光伏科技有限公司 | A kind of high intensity silicon chip diamond fretsaw |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107116712B (en) | A method of plating silicon wafer cut by diamond wire | |
| CN102225593B (en) | Diamond wire saw device | |
| CN107160576B (en) | A method of plating diamond wire fly-cutting silicon chip | |
| WO2011024910A1 (en) | Silicon wafer for solar cells and production method therefor | |
| CN208773851U (en) | A kind of high intensity silicon chip diamond fretsaw | |
| CN102350741A (en) | Silicon block cutting method | |
| CN109545680A (en) | A kind of fast preparation method of high-flatness, low damage single crystal silicon carbide substrate | |
| JP5127209B2 (en) | Manufacturing method of semiconductor substrate | |
| CN104907895A (en) | Method for quickly processing doubly polished sapphire wafers | |
| CN105818284B (en) | The method for cutting SiC single crystal simultaneously using diamond wire and diamond mortar | |
| CN103897607A (en) | Mechanical polishing liquid for silicon carbide and mechanical polishing method adopting same | |
| CN110052975A (en) | A kind of coated abrasive tool and preparation method thereof and application method | |
| CN201900687U (en) | Improved cutting steel wire | |
| Tsai et al. | Investigation of increased removal rate during polishing of single-crystal silicon carbide | |
| CN207630298U (en) | A kind of ultra high efficiency multi-wire saw diamond wire | |
| CN109321980A (en) | A kind of high-flatness, low damage major diameter single crystal silicon carbide substrates | |
| CN108437247A (en) | A kind of high intensity silicon chip diamond fretsaw | |
| CN201960674U (en) | Multi-strand cutting steel wire with abrasive coating | |
| CN102225596B (en) | Solar silicon wafer wire cutting steel wire and manufacturing method thereof | |
| CN203228320U (en) | Diamond saw blade tool bit for cutting stone | |
| CN207578758U (en) | A kind of diamond wire for multi-wire saw | |
| CN101927533B (en) | Method for cubing single crystal bar | |
| CN207900943U (en) | A kind of diamond roller that can improve heat dissipation performance | |
| CN205112119U (en) | Monocrystalline silicon piece cutting equipment | |
| CN105599155A (en) | Chip accumulation-preventing spiral diamond wire |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |