CN103009489B - Method and device for cutting silicon ingot - Google Patents
Method and device for cutting silicon ingot Download PDFInfo
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- CN103009489B CN103009489B CN201210530204.7A CN201210530204A CN103009489B CN 103009489 B CN103009489 B CN 103009489B CN 201210530204 A CN201210530204 A CN 201210530204A CN 103009489 B CN103009489 B CN 103009489B
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Abstract
The invention relates to a method for cutting a silicon ingot. The method comprises the following steps of: arranging a mortar tank loaded with mortar between two guide wheels, wherein a cutting line net is arranged on the two guide wheels; and slicing the silicon ingot by using the cutting line net, and enabling the cutting line net to be immersed in the mortar of the mortar tank during slicing and the quantity of the mortar in the mortar tank to be kept in dynamic balance. In addition, the invention also provides a device for cutting the silicon ingot. According to the method and device for cutting the silicon ingot, the mortar tank is arranged between the two guide wheels, the cutting line net can be immersed in the mortar of the mortar tank during slicing, the cutting line net sand discharging holes to ensure that the quantity of the mortar in the mortar tank can be kept in dynamic balance, therefore the sand carrying capacity of a steel line and a mortar cutting capacity can be remarkably improved, the proportion of defects such as line marks introduced by insufficiency of cutting capacity is reduced, the existing slicing yield can be increased by above 5 percent, and thus the production cost of a silicon wafer is lowered.
Description
Technical field
The invention belongs to photovoltaic equipment preparation field, be specifically related to a kind of method and the device that cut silicon ingot.
Background technology
When silicon ingot cuts into silicon chip, the yield rate of section is mainly determined by the cutting power of the husky ability of the band of steel wire and carborundum.In slicing processes, due to the effect of gravity, mortar on steel wire can drippage downwards, and along with the wearing and tearing of steel wire, it is with husky ability also can decline to some extent; Meanwhile, due to the pressure reduced costs, the recovery sand in current mortar and Ethylene recov usage ratio constantly raise, and this also causes sectioning capability to decline.The decline of the sectioning capability of the husky ability of steel wire band and mortar, can cause the stria of silicon chip, collapse the rising of the defective proportion such as limit and unfilled corner, this all can have a strong impact on the cutting yield of silicon chip, and this becomes one of bottleneck of restriction silicon chip cost reduction.
Summary of the invention
Based on this, be necessary to provide a kind of method of cutting silicon ingot, the section yield rate of silicon ingot can be made to promote, reduce section cost and silicon chip cost.
Cut a method for silicon ingot, comprise the following steps: the mortar pin groove that mortar is housed is set between two guide wheels being furnished with cutting gauze; Utilize described cutting gauze to cut into slices to silicon ingot, during section, make cutting gauze be immersed in the mortar of mortar pin groove, and make the mortar amount in mortar pin groove keep dynamic equilibrium.
Wherein in an embodiment, the upper edge of mortar pin groove is concordant with cutting gauze, and gauze is pressed in mortar pin groove by the line bow utilizing silicon ingot to produce during section.
Wherein in an embodiment, mortar pin groove can move up and down, and makes mortar pin groove increase during section, through gauze, thus the cut surface of cutting gauze is immersed in the mortar of mortar pin groove.
Wherein in an embodiment, during section, mortar enters mortar pin groove above gauze, from side or the bottom discharge of mortar pin groove; Or during section, mortar enters mortar pin groove from the side bottom of mortar pin groove or bottom surface, discharges from the side surface upper part of mortar pin groove.
In addition, there is a need to provide a kind of device cutting silicon ingot, comprise two guide wheels, be arranged in the cutting gauze on described two guide wheels and the mortar pin groove between described two guide wheels, described mortar pin groove is provided with sand outlet.
Wherein in an embodiment, the upper edge of described mortar pin groove is concordant with described cutting gauze.
Wherein in an embodiment, the below of described mortar pin groove is provided with lowering or hoisting gear.
Wherein in an embodiment, described sand outlet is arranged on bottom surface or the side bottom of described mortar pin groove.
Wherein in an embodiment, the bottom land of described mortar pin groove is provided with slope.
Wherein in an embodiment, the side surface upper part of described mortar pin groove is also provided with charging hole.
The method of above-mentioned cutting silicon ingot and device, mortar pin groove is provided with between two guide wheels, cut gauze during section can be immersed in the mortar of mortar pin groove, and mortar pin groove is provided with lets out husky hole and makes the mortar amount in mortar pin groove keep dynamic equilibrium, the husky ability of band of steel wire and the cutting power of mortar can be significantly improved, reduce the ratio of the defects such as the stria introduced because cutting power is not enough, existing section yield rate can be improved more than 5 percentage points, thus reduce the production cost of silicon chip.
Accompanying drawing explanation
Fig. 1 is the cutting device of silicon ingot and the schematic diagram of silicon ingot before section;
Fig. 2 is the structural representation of mortar pin groove;
Fig. 3 and Fig. 4 is the working state figure of the device of cutting silicon ingot.
Detailed description of the invention
Please refer to Fig. 1, present embodiments provide for a kind of device 100 cutting silicon ingot, for cutting into slices to silicon ingot 200, it comprises two guide wheels 110, the cutting gauze 120 be arranged on two guide wheels 110, mortar pin groove 130 between two guide wheels 110 and the lowering or hoisting gear 140 that is positioned at below mortar pin groove 130.
Please refer to Fig. 1 and Fig. 2, mortar pin groove 130 can be rectangular structure.The side surface upper part of mortar pin groove 130 offers charging hole 132, and side bottom offers sand outlet 134.During use, charging hole 132 is in order to mortar of annotating in mortar pin groove 130, and sand outlet 134, for getting rid of mortar, makes the mortar amount in mortar pin groove 130 keep dynamic equilibrium, makes the cutting power of mortar maintain the standard of needs.It may be noted that the role of charging hole 132 and sand outlet 134 can exchange, namely charging hole 132 is in order to discharge mortar, and from sand outlet 134 place filling mortar.In addition, it may be noted that charging hole 132 and sand outlet 134 can, all in order to discharge mortar, need the instruments such as nozzle can be utilized directly to adding mortar in groove when adding mortar, the mortar amount in mortar pin groove 130 also can be made to keep dynamic equilibrium.In addition, can also be that opening is set in the bottom surface of mortar pin groove 130, for entering sand or sediment outflow.The bottom land of mortar pin groove 130 can also arrange wedge slope, prevents mortar from precipitating, and is beneficial to mortar and discharges.Be appreciated that the groove inside dimension of mortar pin groove 130 is relevant with silicon ingot to be cut, without the need to repeating.
Please refer to Fig. 1, the lowering or hoisting gear 140 below mortar pin groove 130 rises in order to drive mortar pin groove 130 when cutting into slices, and makes cutting gauze 120 be arranged in the mortar of mortar pin groove 130.About this point, will further describe hereinafter.Lowering or hoisting gear 140 can be the elevating mechanism of hydraulicefficiency elevation structure or other types.
Present embodiment also proposed a kind of method of cutting silicon ingot, first the mortar pin groove that mortar is housed is set between two guide wheels being furnished with cutting gauze, also the device 100 of above-mentioned cutting silicon ingot is namely combined into, then above-mentioned cutting gauze 120 pairs of silicon ingots are utilized to cut into slices, the cut surface cutting gauze 120 in slicing processes is positioned at below mortar liquid level, mortar amount simultaneously in mortar pin groove 130 keeps dynamic equilibrium, makes the cutting power that mortar remains necessary.Illustrate how said method realizes below in conjunction with embodiment.
Embodiment 1
First the mortar pin groove 130 that mortar is housed is set between two guide wheels 110 being furnished with cutting gauze 120.In the present embodiment, mortar pin groove 130 between two guide wheels 110, and is fixed on slicer, and the little side's ingot 200 of slice is of a size of 156 × 156 × 1000mm, and the groove inside dimension of mortar pin groove 130 is 210 × 250 × 1100mm.
Next, utilize cutting gauze 120 pairs of silicon ingots to cut into slices, during section, make cutting gauze 120 be immersed in the mortar of mortar pin groove 130, and make the mortar amount in mortar pin groove 130 keep dynamic equilibrium.In the present embodiment, mortar enters mortar pin groove 130 from the cutting gauze 120 above mortar pin groove 130, discharge from the sand outlet 134 of mortar pin groove 130 side bottom, when being full of mortar in mortar pin groove 130, keep the discharge rate of mortar identical with influx, the mortar amount namely in mortar pin groove 130 keeps dynamic equilibrium.Please refer to Fig. 3, during section, utilize lowering or hoisting gear 140 mortar pin groove 130 to be promoted, make cutting gauze 120 cut mortar pin groove 130 side and be about after 10mm and stop rising.During cutting, cutting gauze 120 is immersed in the mortar of mortar pin groove 130, and the cut surface of silicon ingot is positioned at below mortar liquid level.After section, by the detection to silicon ingot, the stria of silicon chip, collapse the defective proportion summation that limit etc. causes due to cutting force and reduce by 3 percentage points, section yield improves 5.5 percentage points.
Embodiment 2
First the mortar pin groove 130 that mortar is housed is set between two guide wheels 110 being furnished with cutting gauze 120.In the present embodiment, the little side's ingot 200 of slice is of a size of 125 × 125 × 800mm, and the groove inside dimension of mortar pin groove 130 is 200 × 135 × 900mm, and the upper edge of mortar pin groove 130 is concordant with cutting gauze 120.
Next, utilize cutting gauze 120 pairs of silicon ingots to cut into slices, during section, make cutting gauze 120 be immersed in the mortar of mortar pin groove 130, and make the mortar amount in mortar pin groove 130 keep dynamic equilibrium.In the present embodiment, mortar enters mortar pin groove 130 from the charging hole 132 of the side surface upper part of mortar pin groove 130, discharge from the sand outlet 134 of mortar pin groove 130 side bottom, when being full of mortar in mortar pin groove 130, keep the discharge rate of mortar identical with influx, the mortar amount namely in mortar pin groove 130 keeps dynamic equilibrium.Please refer to Fig. 4, during section, silicon ingot Cutting Drag makes cutting gauze 120 produce downward gauze line bow, thus cutting gauze 120 is immersed in the mortar of mortar pin groove 130, and the cut surface of silicon ingot is positioned at below mortar liquid level.After section, by the detection to silicon ingot, the stria of silicon chip, collapse the defective proportion summation that limit etc. causes due to cutting force and reduce by 2.5 percentage points, section yield improves 5 percentage points.
To sum up, the method of above-mentioned cutting silicon ingot and device, cutting gauze during section is immersed in the mortar of mortar pin groove, and the mortar amount of mortar pin groove keeps dynamic equilibrium, the husky ability of band of steel wire and the cutting power of mortar can be significantly improved, reduce the ratio of the defects such as the stria introduced because cutting power is not enough, existing section yield rate can be improved more than 5 percentage points, thus reduce the production cost of silicon chip.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (7)
1. cut a method for silicon ingot, it is characterized in that, comprise the following steps:
The mortar pin groove that mortar is housed is set between two guide wheels being furnished with cutting gauze;
Described cutting gauze is utilized to cut into slices to silicon ingot, cutting gauze is made to be immersed in the mortar of mortar pin groove during section, and make the mortar amount in mortar pin groove keep dynamic equilibrium, the upper edge of mortar pin groove is concordant with cutting gauze, gauze is pressed in mortar pin groove by the line bow utilizing silicon ingot to produce during section, during section, mortar enters mortar pin groove above gauze, from side or the bottom discharge of mortar pin groove; Or during section, mortar enters mortar pin groove from the side bottom of mortar pin groove or bottom surface, discharges from the side surface upper part of mortar pin groove, make the mortar amount maintenance dynamic equilibrium in mortar pin groove.
2. the method for cutting silicon ingot according to claim 1, is characterized in that, mortar pin groove can move up and down, and makes mortar pin groove increase during section, through gauze, thus the cut surface of cutting gauze is immersed in the mortar of mortar pin groove.
3. the device that the method for a cutting silicon ingot as claimed in claim 1 is used, it is characterized in that, comprise two guide wheels, be arranged in the cutting gauze on described two guide wheels and the mortar pin groove between described two guide wheels, described mortar pin groove is provided with sand outlet, and the upper edge of described mortar pin groove is concordant with described cutting gauze.
4. the device of cutting silicon ingot according to claim 3, is characterized in that, the below of described mortar pin groove is provided with lowering or hoisting gear.
5. the device of the cutting silicon ingot according to claim arbitrary in claim 3 to 4, is characterized in that, described sand outlet is arranged on bottom surface or the side bottom of described mortar pin groove.
6. the device of cutting silicon ingot according to claim 5, is characterized in that, the bottom land of described mortar pin groove is provided with slope.
7. the device of cutting silicon ingot according to claim 5, is characterized in that, the side surface upper part of described mortar pin groove is also provided with charging hole.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210530204.7A CN103009489B (en) | 2012-12-11 | 2012-12-11 | Method and device for cutting silicon ingot |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210530204.7A CN103009489B (en) | 2012-12-11 | 2012-12-11 | Method and device for cutting silicon ingot |
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| CN103009489A CN103009489A (en) | 2013-04-03 |
| CN103009489B true CN103009489B (en) | 2015-07-01 |
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| CN114833955B (en) * | 2022-05-31 | 2024-02-02 | 青岛高测科技股份有限公司 | Wire cutting machine |
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| CN102172996A (en) * | 2011-02-14 | 2011-09-07 | 上海日进机床有限公司 | Crystal immersing and cutting method |
| CN102172997A (en) * | 2011-02-14 | 2011-09-07 | 上海日进机床有限公司 | Silicon crystal line cutting equipment |
| CN202088316U (en) * | 2011-02-14 | 2011-12-28 | 上海日进机床有限公司 | Silicon crystal wire cutting machine |
| CN202241655U (en) * | 2011-09-30 | 2012-05-30 | 浙江思博恩新材料科技有限公司 | Device for sealing cutting fluid |
| CN102544240A (en) * | 2012-03-09 | 2012-07-04 | 润峰电力有限公司 | Method and device for integrating slicing and flocking of crystalline silicon wafer |
| CN202964937U (en) * | 2012-12-11 | 2013-06-05 | 江苏协鑫硅材料科技发展有限公司 | Device for cutting silicon ingot |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006181688A (en) * | 2004-12-28 | 2006-07-13 | Allied Material Corp | Cutting method by superabrasive wire saw and superabrasive wire saw cutting device |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172996A (en) * | 2011-02-14 | 2011-09-07 | 上海日进机床有限公司 | Crystal immersing and cutting method |
| CN102172997A (en) * | 2011-02-14 | 2011-09-07 | 上海日进机床有限公司 | Silicon crystal line cutting equipment |
| CN202088316U (en) * | 2011-02-14 | 2011-12-28 | 上海日进机床有限公司 | Silicon crystal wire cutting machine |
| CN202241655U (en) * | 2011-09-30 | 2012-05-30 | 浙江思博恩新材料科技有限公司 | Device for sealing cutting fluid |
| CN102544240A (en) * | 2012-03-09 | 2012-07-04 | 润峰电力有限公司 | Method and device for integrating slicing and flocking of crystalline silicon wafer |
| CN202964937U (en) * | 2012-12-11 | 2013-06-05 | 江苏协鑫硅材料科技发展有限公司 | Device for cutting silicon ingot |
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