CN202088316U - Silicon crystal wire cutting machine - Google Patents
Silicon crystal wire cutting machine Download PDFInfo
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- CN202088316U CN202088316U CN201120037901XU CN201120037901U CN202088316U CN 202088316 U CN202088316 U CN 202088316U CN 201120037901X U CN201120037901X U CN 201120037901XU CN 201120037901 U CN201120037901 U CN 201120037901U CN 202088316 U CN202088316 U CN 202088316U
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- cutting machine
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Abstract
The utility model provides a silicon crystal wire cutting machine, which is used in wire cutting operation for crystalline silicon ingot to be cut. The wire cutting machine comprises a solution tank for soaking the crystalline silicon ingot to be cut into cutting fluid and a multi-wire cutting device forming a cutting net. The cutting net presses the solution tank and the crystalline silicon ingot to be cut soaked in the cutting fluid when the cutting net falls, therefore the cutting wire cuts the lateral board of the solution tank and simultaneously cuts the crystalline silicon ingot to be cut soaked in the cutting fluid. During a cutting process, the cutting fluid flows out from a breach of the cut lateral board of the solution tank to be recycled. By means of the machine, a problem that the cutting fluid is led to a cutting area and becomes insufficient during the cutting process is solved, thereby greatly improving cutting efficiency and solving problems of low productivity and the like caused by incomplete contact of the cutting wires, workpieces and the cutting fluid.
Description
Technical field
The utility model relates to a kind of line cutting technology, particularly relates to a kind of in order to improve the silicon crystal wire cutting machine of utilization rate to reduce production costs of cutting liquid.
Background technology
Multi-thread cutting technique is present more advanced in the world crystalline silicon process technology, and its principle is that the steel wire by a high-speed motion drives attached to the cutting blade material on the steel wire hard brittle materials such as semiconductor to be rubbed and reaches cutting effect.Multi-thread cutting technique and traditional knife saw sheet, grinding wheel and in the circle cutting compared and had the efficient height, the production capacity height, the precision advantages of higher, multi-thread cutting technique is to adopt the most widely hard brittle material cutting technique such as semiconductor at present.
Existing multi-thread cutting equipment for example crystal silicon ingot cutting machine etc. includes usually at least: frame, be arranged at the workbench that is used to carry the crystal silicon ingot on the described frame, the wire storage tube that is used for wrapping wire, a plurality of guide rollers and liftable cutting roller etc., in cutting process to the crystal silicon ingot, pass through the guiding of tens guide rollers as the steel wire of line of cut, on between a plurality of cutting rollers, form a bracing cable net, and crystal silicon ingot to be processed is when being fixed on the described workbench, cutting roller is lowered, and compression pump effect under, the cutting liquid automatic spraying device that is assemblied on the equipment will cut the cutting position that liquid (cutting agent) is sprayed to steel wire and crystal silicon ingot, drive cutting liquid by steel wire and move back and forth, utilize the abrasive sand in the cutting liquid that workpiece is produced cutting, so that the crystal silicon ingot once is cut into several sections simultaneously.In this course, the cutting liquid that is sprayed to the cutting position only accounts for about 20% ratio of total sprinkling amount, in other words, the cutting liquid nearly 80% of the actual sprinkling of described cutting liquid automatic spraying device all has been wasted, and the cutting liquid that this part is wasted is difficult for reclaiming, and is unfavorable for cutting down finished cost; Moreover, because the line of cut of high-speed cruising is a superfine cutting slit workpiece wound cutting formation, guarantee that the cutting liquid that above-mentioned cutting liquid automatic spraying device sprays falls into the also non-easy thing in this slit fully, so in actual cutting process, in time, has and do not carry the cutting liquid situation of cutting on the line of cut and take place, and then is unfavorable for guaranteeing the cutting quality of workpiece.
For this reason, in some multi-thread cutting equipments, adopted the Buddha's warrior attendant line as line of cut, because described Buddha's warrior attendant line is the Buddha's warrior attendant line that the top layer has diamond dust, select for use this kind Buddha's warrior attendant line in process, to cut the liquid use amount to reduce, but, in the cutting process of reality, find, on described Buddha's warrior attendant line, do not obtain utilizing with the diamond dust of workpiece contact portion above it, moreover Buddha's warrior attendant line quilt wearing and tearing back efficient in the later stage cutting process repeatedly can progressively reduce.Thereby, still fail thoroughly to solve the problem that efficient improves.
So, how a kind of silicon crystal wire cutting machine is provided, to solve that cutting liquid is not fully utilized in cutting process and the low inferior problem of production efficiency that causes, real is the present problem demanding prompt solution of dealer of association area.
The utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of silicon crystal wire cutting machine, cut liquid is brought into the cutting area rareness in cutting process problem with solving, and line of cut, workpiece and cutting liquid do not contact fully and bring production capacity to hang down inferior problem.
Reach other relevant purposes for achieving the above object, the utility model provides a kind of silicon crystal wire cutting machine, be used to treat the sliced crystal silicon ingot and carry out the line cutting operation, it is characterized in that, described silicon crystal wire cutting machine comprises at least: hold liquid bath, comprise that one has the base plate of many grooves and four and is around in the fixing side plate of lateral margin around the described base plate respectively, described appearance liquid bath is used for splendid attire cutting liquid and places described crystal silicon ingot to be cut, and described crystal silicon ingot to be cut is immersed in the described cutting liquid; Multi-thread cutter sweep, be positioned at described appearance liquid bath upside, it has frame at least, be arranged at the described frame cutting roller of four groups of liftings simultaneously of side all around respectively, a plurality of guide rollers, and many undercuts secant, described many undercuts secant passes through respectively, and the guiding of this guide roller forms a cutting net between described four groups of cutting rollers, described cutting net is oppressed described appearance liquid bath and is immersed in crystal silicon ingot to be cut in the described cutting liquid when descending, so that described line of cut cuts the crystal silicon ingot to be cut that is arranged in described cutting liquid when cutting the side plate of described appearance liquid bath in the lump, and in cutting process, described cutting liquid flows out from the opening position of the appearance liquid bath side plate that is cut, so that recycle and reuse.
In silicon crystal wire cutting machine of the present utility model, the base plate of described appearance liquid bath is the cutting bed panel, the grid of the corresponding described cutting net formation of the groove on the described base plate.
In silicon crystal wire cutting machine of the present utility model, the side plate of described appearance liquid bath is the liquid islocation plate material.Described liquid islocation plate material can be the easy cuts sheet material of single material; Also can combine for the hard plate material and the described easy cuts sheet material of multi-disc longitudinal separation setting, wherein, respectively this easy cuts sheet material is distinguished each groove on the corresponding described base plate.In concrete embodiment, described easy cuts sheet material is glass plate, organic plastic plate, resin plate, slabstone; Described hard plate material is a metallic plate.Form on the described hard plate material in order to install the longitudinal channel of described easy cuts sheet material, described hard plate material is bonding in the described longitudinal channel with easy cuts sheet material.
In silicon crystal wire cutting machine of the present utility model, the side plate all around with described appearance liquid bath when described crystal silicon ingot to be cut is positioned in the described appearance liquid bath is reserved with the gap.
In silicon crystal wire cutting machine of the present utility model, described line of cut is steel wire or Buddha's warrior attendant line.
As mentioned above, silicon crystal wire cutting machine of the present utility model holds liquid bath by being provided with one, make crystal silicon ingot to be cut be immersed in the cutting liquid and carry out cutting operation, so to guarantee to cut the higher utilization rate of having of liquid, so that recycle and reuse, simultaneously, also realized line of cut fully, fully contact between workpiece and the cutting liquid, and then guaranteed the cutting quality of workpiece, compared with prior art, the utility model has solved that cutting liquid is not fully utilized in cutting process and the low inferior problem of production efficiency that causes has also solved cutting liquid and crossed problems such as height by the production cost of wasting in a large number and causing in cutting process.
Description of drawings
Fig. 1 is shown as silicon crystal wire cutting machine simplified structure schematic diagram of the present utility model.
Fig. 2 A is shown as the structural representation that holds liquid bath in the utility model.
Fig. 2 B is shown as A place enlarged diagram among Fig. 2 A.
Fig. 3 A is shown as crystalline silicon to be cut and is placed on the view of holding liquid bath.
Fig. 3 B is shown as crystal silicon ingot to be cut and is immersed in the view of cutting in the liquid.
The correspondence position that Fig. 3 C is shown as between line of cut in the cutting process, appearance liquid bath and the crystal silicon ingot to be cut concerns schematic diagram.
Fig. 4 is shown as and uses the cutaway view of silicon crystal wire cutting machine of the present utility model in cutting process.
Fig. 5 is shown as and holds liquid bath application state schematic diagram in another embodiment in the utility model.
The specific embodiment
Below by specific instantiation embodiment of the present utility model is described, those skilled in the art can understand other advantages of the present utility model and effect easily by the content that this specification disclosed.The utility model can also be implemented or be used by the other different specific embodiment, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications or change under the spirit of the present utility model not deviating from.
See also Fig. 1 to Fig. 4, Fig. 1 is shown as silicon crystal wire cutting machine simplified structure schematic diagram of the present utility model; Fig. 2 A is shown as the structural representation that holds liquid bath in the utility model; Fig. 2 B is shown as A place enlarged diagram among Fig. 2 A; Fig. 3 A is shown as crystalline silicon to be cut and is placed on the view of holding liquid bath; Fig. 3 B is shown as crystal silicon ingot to be cut and is immersed in the view of cutting in the liquid; The correspondence position that Fig. 3 C is shown as between line of cut in the cutting process, appearance liquid bath and the crystal silicon ingot to be cut concerns schematic diagram; Fig. 4 is shown as and uses the cutaway view of silicon crystal wire cutting machine of the present utility model in cutting process.
Need to prove, the appended graphic structure that illustrates of this specification, ratio, size etc., all only in order to cooperate the content that specification disclosed, understanding and reading for person skilled in the art scholar, be not in order to limit the enforceable qualifications of the utility model, thereby the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not influencing under effect that the utility model can produce and the purpose that can reach, the technology contents that all should still drop on the utility model and disclosed gets in the scope that can contain.Simultaneously, in this specification quote as " on ", D score, " preceding ", " back ", " left side " reach the term on " right side " etc., also only be understanding for ease of narration, but not in order to limit the enforceable scope of the utility model, change or adjustment that it closes relatively, under no essence change technology contents, when also being considered as the enforceable category of the utility model.
As shown in the figure, the utility model provides a kind of silicon crystal wire cutting machine 1, be used to treat sliced crystal silicon ingot 2 and carry out the line cutting operation, in the present embodiment, described crystal silicon ingot is monocrystal silicon, polycrystal silicon ingot or sapphire silicon ingot, in the present embodiment, described silicon crystal wire cutting machine 1 comprises at least: the multi-thread cutter sweep 12 that holds liquid bath 11 and be positioned at described appearance liquid bath 11 upsides.
Described appearance liquid bath 11 comprises that a base plate 111 with many grooves 1111 and four are around in the fixing side plate 112 of lateral margin around the described base plate 111 respectively, described appearance liquid bath 11 is used for splendid attire cutting liquid 3 and places described crystal silicon ingot 2 to be cut, and described crystal silicon ingot 2 to be cut is immersed in the described cutting liquid 3.
In the present embodiment, the base plate 111 of described appearance liquid bath 11 is the cutting bed panel, the grid of the groove 1111 corresponding described cutting nets on the described base plate 111 (not indicating) formation.
See also Fig. 2 A and Fig. 2 B, the side plate 112 of described appearance liquid bath 11 is the liquid islocation plate material, particularly, the side plate 112 of described appearance liquid bath 11 is combined with described easy cuts sheet material 1122 by the hard plate material 1121 of multi-disc longitudinal separation setting, wherein, this easy cuts sheet material 1122 each groove 1111 on the corresponding described base plate 111 respectively respectively, form longitudinal channel 1123 on the described hard plate material 1121 in order to install described easy cuts sheet material 1122, described hard plate material 1121 is bonding in the described longitudinal channel 1123 with easy cuts sheet material 1122, in concrete embodiment, described hard plate material 1121 is chosen as metallic plate, and described easy cuts sheet material 1122 is chosen as glass plate, organic plastic plate, resin plate, slabstone etc.
Described multi-thread cutter sweep 12 has frame 121 at least, be arranged at described frame 121 cutting roller 122 of four groups of liftings simultaneously of side all around respectively, a plurality of guide rollers 123, and many undercuts secant 124, described many undercuts secant 124 passes through respectively, and the guiding of this guide roller 123 forms a cutting net between described four groups of cutting rollers 122, described cutting net is oppressed described appearance liquid bath 11 and is immersed in crystal silicon ingot 2 to be cut in the described cutting liquid 3 when descending, so that cut the crystal silicon ingot 2 to be cut that is arranged in described cutting liquid 3 side plate 112 of the described appearance liquid bath 11 of described line of cut 124 cuttings the time in the lump, and in cutting process, described cutting liquid 3 flows out from the opening position of appearance liquid bath 11 side plates 112 that are cut, so that recycle and reuse.
In the present embodiment, the described line of cut of selecting for use 124 can be steel wire, also can have the Buddha's warrior attendant line of diamond dust for the top layer, and the speed of service of described line of cut 124 is 1000m/min.
In addition, in the present embodiment, also should be provided with the wire storage tube that is used for wrapping wire (twine and store line of cut 124) on the described frame 121 and be used to drive described wire storage tube to realize the servomotor of high-speed cruising line of cut 124, because above-mentioned wire storage tube and servomotor are the technology of knowing that is applied on the described multi-thread cutter sweep 12, thereby in the present embodiment, be clear and definite know-why of the present utility model, do not illustrate, state clearly hereby for its concrete structure.
In the cutting operation of reality, at first described crystal silicon ingot 2 to be cut is placed in the described appearance liquid bath 11, particularly, be described crystal silicon ingot 2 to be cut to be fixed on by the mode of binding on the base plate 111 of described appearance liquid bath 11 guaranteeing in cutting process, can not be shifted, and the side plate 112 all around with described appearance liquid bath 11 when making described crystal silicon ingot 2 to be cut be positioned in the described appearance liquid bath 11 is reserved with the gap, is state as shown in Figure 3A; Then, in described appearance liquid bath 11, inject cutting liquid 3 and make described crystal silicon ingot 2 to be cut be immersed in described cutting liquid 3, be the state shown in Fig. 3 B; Can start described multi-thread cutter sweep 12 with that, so that described line of cut 124 high-speed cruisings, and make the described line of cut 124 described appearance liquid baths 11 of compressing and be immersed in crystal silicon ingot 2 to be cut in the described cutting liquid 3, be the state shown in Fig. 3 C; When described line of cut 124 high-speed cruisings, and along with four groups of cutting rollers 122 on the frame 121 descend gradually, described line of cut 124 begins cutting by the top of described appearance liquid bath 11 side plates 112 (specifically being meant the easy cuts sheet material 1122 on the side plate 112), the depth of cut of crystal silicon ingot increases gradually, in this process, described line of cut 124 will cut the crystal silicon ingot 2 to be cut that is arranged in described cutting liquid 3 in the lump, and in cutting process, described cutting liquid 3 flows out from the gap (indicating) of appearance liquid bath 11 side plates 112 (specifically being meant the easy cuts sheet material 1122 on the side plate 112) that are cut, its liquid level also descends thereupon, and the cutting liquid 3 that the opening position of calm liquid bath 11 side plates 112 flows out also can be easily in addition recycle and reuse, be state as shown in Figure 4.
When described line of cut 124 is cut to the bottom of described appearance liquid bath 11 side plates 112 by the top of described appearance liquid bath 11 side plates 112, that is to say, when described line of cut 124 is cut in the groove 1111 on the described base plate 111 (being the cutting bed panel), described crystal silicon ingot 2 to be cut is also cut fully, at this moment, the cutting liquid 3 that was injected into originally in the described appearance liquid bath 11 also is discharged from fully.This moment, just extensible described appearance liquid bath 11 took off the crystal silicon ingot that cutting is finished.
In another embodiment, see also Fig. 5, Fig. 5 is shown as and holds liquid bath 11 application state schematic diagram in another embodiment in the utility model, as shown in the figure, the side plate 112 of described appearance liquid bath 11 is the liquid islocation plate material, in the present embodiment, described liquid islocation plate material can be the easy cuts sheet material 1122 of single material, for example is glass plate, organic plastic plate, resin plate, slabstone etc.Compared to last a kind of embodiment, though structure is more simple.Need to prove, relate to liquid islocation plate material described in the utility model, change or adjustment that it closes relatively are under no essence change technology contents, when also being considered as the enforceable category of the utility model.
In sum, silicon crystal wire cutting machine of the present utility model holds liquid bath by being provided with one, make crystal silicon ingot to be cut be immersed in the cutting liquid and carry out cutting operation, so to guarantee to cut the higher utilization rate of having of liquid, so that recycle and reuse, simultaneously, also realized line of cut fully, fully contact between workpiece and the cutting liquid, and then guaranteed the cutting quality of workpiece, compared with prior art, the utility model has solved that cutting liquid is not fully utilized in cutting process and the low inferior problem of production efficiency that causes has also solved cutting liquid and crossed problems such as height by the production cost of wasting in a large number and causing in cutting process.So the utility model has effectively overcome various shortcoming of the prior art and the tool high industrial utilization.
The foregoing description is illustrative principle of the present utility model and effect thereof only, but not is used to limit the utility model.Any personage who has the knack of this technology all can be under spirit of the present utility model and category, and the foregoing description is modified or changed.Therefore, have in the technical field under such as and know that usually the knowledgeable modifies or changes not breaking away from all equivalences of being finished under spirit that the utility model discloses and the technological thought, must be contained by claim of the present utility model.
Claims (10)
1. a silicon crystal wire cutting machine is used to treat the sliced crystal silicon ingot and carries out the line cutting operation, it is characterized in that, described silicon crystal wire cutting machine comprises at least:
Hold liquid bath, comprise that one has the base plate of many grooves and four and is around in the fixing side plate of lateral margin around the described base plate respectively, described appearance liquid bath is used for splendid attire cutting liquid and places described crystal silicon ingot to be cut, and described crystal silicon ingot to be cut is immersed in the described cutting liquid;
Multi-thread cutter sweep, be positioned at described appearance liquid bath upside, it has frame at least, be arranged at the described frame cutting roller of four groups of liftings simultaneously of side all around respectively, a plurality of guide rollers, and many undercuts secant, described many undercuts secant passes through respectively, and the guiding of this guide roller forms a cutting net between described four groups of cutting rollers, described cutting net is oppressed described appearance liquid bath and is immersed in crystal silicon ingot to be cut in the described cutting liquid when descending, so that described line of cut cuts the crystal silicon ingot to be cut that is arranged in described cutting liquid when cutting the side plate of described appearance liquid bath in the lump, and in cutting process, described cutting liquid flows out from the opening position of the appearance liquid bath side plate that is cut, so that recycle and reuse.
2. silicon crystal wire cutting machine according to claim 1 is characterized in that: the base plate of described appearance liquid bath is the cutting bed panel.
3. silicon crystal wire cutting machine according to claim 2 is characterized in that: the grid of the corresponding described cutting net formation of the groove on the described base plate.
4. silicon crystal wire cutting machine according to claim 1 is characterized in that: the side plate of described appearance liquid bath is the liquid islocation plate material.
5. silicon crystal wire cutting machine according to claim 4 is characterized in that: described liquid islocation plate material can be the easy cuts sheet material of single material; Perhaps combine for the hard plate material of multi-disc longitudinal separation setting and described easy cuts sheet material, wherein, this easy cuts sheet material each groove on the corresponding described base plate respectively respectively.
6. silicon crystal wire cutting machine according to claim 5 is characterized in that: described easy cuts sheet material is glass plate, organic plastic plate, resin plate, slabstone; Described hard plate material is a metallic plate.
7. silicon crystal wire cutting machine according to claim 6 is characterized in that: form in order to install the longitudinal channel of described easy cuts sheet material on the described hard plate material.
8. silicon crystal wire cutting machine according to claim 7 is characterized in that: described hard plate material is bonding in the described longitudinal channel with easy cuts sheet material.
9. silicon crystal wire cutting machine according to claim 1 is characterized in that: the side plate all around with described appearance liquid bath when described crystal silicon ingot to be cut is positioned in the described appearance liquid bath is reserved with the gap.
10. silicon crystal wire cutting machine according to claim 1 is characterized in that: described line of cut is steel wire or Buddha's warrior attendant line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120037901XU CN202088316U (en) | 2011-02-14 | 2011-02-14 | Silicon crystal wire cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120037901XU CN202088316U (en) | 2011-02-14 | 2011-02-14 | Silicon crystal wire cutting machine |
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| Publication Number | Publication Date |
|---|---|
| CN202088316U true CN202088316U (en) | 2011-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120037901XU Expired - Lifetime CN202088316U (en) | 2011-02-14 | 2011-02-14 | Silicon crystal wire cutting machine |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172997A (en) * | 2011-02-14 | 2011-09-07 | 上海日进机床有限公司 | Silicon crystal line cutting equipment |
| CN103009489A (en) * | 2012-12-11 | 2013-04-03 | 江苏协鑫硅材料科技发展有限公司 | Method and device for cutting silicon ingot |
| CN105216127A (en) * | 2015-08-28 | 2016-01-06 | 厦门钨业股份有限公司 | Multi-line cutting method and multi-line cutting machine |
| CN112549331A (en) * | 2019-09-10 | 2021-03-26 | 苏州阿特斯阳光电力科技有限公司 | Square silicon ingot and preparation method thereof, and silicon wafer and preparation method thereof |
| CN113733379A (en) * | 2021-08-24 | 2021-12-03 | 宜昌南玻硅材料有限公司 | Polycrystalline silicon ingot squaring size adjustable ingot table and use method |
-
2011
- 2011-02-14 CN CN201120037901XU patent/CN202088316U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172997A (en) * | 2011-02-14 | 2011-09-07 | 上海日进机床有限公司 | Silicon crystal line cutting equipment |
| CN102172997B (en) * | 2011-02-14 | 2014-09-24 | 上海日进机床有限公司 | Silicon crystal line cutting equipment |
| CN103009489A (en) * | 2012-12-11 | 2013-04-03 | 江苏协鑫硅材料科技发展有限公司 | Method and device for cutting silicon ingot |
| CN103009489B (en) * | 2012-12-11 | 2015-07-01 | 江苏协鑫硅材料科技发展有限公司 | Method and device for cutting silicon ingot |
| CN105216127A (en) * | 2015-08-28 | 2016-01-06 | 厦门钨业股份有限公司 | Multi-line cutting method and multi-line cutting machine |
| CN105216127B (en) * | 2015-08-28 | 2017-07-07 | 厦门钨业股份有限公司 | Multi-line cutting method and multi-line cutting machine |
| CN112549331A (en) * | 2019-09-10 | 2021-03-26 | 苏州阿特斯阳光电力科技有限公司 | Square silicon ingot and preparation method thereof, and silicon wafer and preparation method thereof |
| CN112549331B (en) * | 2019-09-10 | 2024-03-15 | 苏州阿特斯阳光电力科技有限公司 | Square silicon ingot and preparation method thereof, silicon wafer and preparation method thereof |
| CN113733379A (en) * | 2021-08-24 | 2021-12-03 | 宜昌南玻硅材料有限公司 | Polycrystalline silicon ingot squaring size adjustable ingot table and use method |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20180525 Address after: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Patentee after: Haining Dijin science and Technology Co., Ltd. Address before: No. 1358, nine dry road, Si Jing Town, Songjiang District, Shanghai Patentee before: Shanghai Nissin Machine Tool Co., Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180809 Address after: 314400 6 Building 128, Shuang Lian Road, Haining Economic Development Zone, Jiaxing, Zhejiang Patentee after: Zhejiang Ji Ying Precision Machinery Co., Ltd. Address before: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Patentee before: Haining Dijin science and Technology Co., Ltd. |
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| CX01 | Expiry of patent term | ||
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Granted publication date: 20111228 |