CN204076545U - A kind of line of cut Anti-jumper device of silicon chip slicer - Google Patents
A kind of line of cut Anti-jumper device of silicon chip slicer Download PDFInfo
- Publication number
- CN204076545U CN204076545U CN201420548289.6U CN201420548289U CN204076545U CN 204076545 U CN204076545 U CN 204076545U CN 201420548289 U CN201420548289 U CN 201420548289U CN 204076545 U CN204076545 U CN 204076545U
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- China
- Prior art keywords
- cutting roller
- line
- limiting plate
- silicon chip
- jumper device
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- Expired - Lifetime
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 31
- 239000010703 silicon Substances 0.000 title claims abstract description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 238000005520 cutting process Methods 0.000 claims abstract description 82
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 21
- 239000010432 diamond Substances 0.000 claims abstract description 21
- 150000003376 silicon Chemical class 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 210000002421 cell wall Anatomy 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model provides a kind of line of cut Anti-jumper device of silicon chip slicer, belongs to solar facilities technical field.The line of cut Anti-jumper device of this silicon chip slicer comprises the limiting plate being rectangle tabular, the edge of limiting plate has some stopper slots, stopper slot is elongated, frame is provided with motor cabinet and is fixed on the motor on motor cabinet, the side of limiting plate is welded with the support bar of strip, support bar has tooth bar, and support bar also can slide by rack level relatively through frame, the output shaft of motor is fixed with and tooth bar meshed gears.The line of cut Anti-jumper device of this silicon chip slicer has the limiting plate of stopper slot, the horizontal wire jumper of restriction diamond wire, and limiting plate can transverse horizontal fine motion, and suitably adjustment is to adapt to different cutting roller.
Description
Technical field
The utility model belongs to solar silicon wafers processing technique field, relates to a kind of slicer, particularly a kind of line of cut Anti-jumper device of silicon chip slicer.
Background technology
Slicer equipment comprises frame, for the workbench of fixation workpiece, for the wire storage tube of folding and unfolding steel wire, multiple guide roller for carrying out leading for steel wire and be crossed on the relative both sides of workbench and can the cutting roller etc. of lift work, to in the actual cutting process of crystalline silicon rod, steel wire is by the guiding of tens guide rollers, the cutting roller of the relative both sides of workbench is formed a bracing cable net, when workpiece is fixed on described workbench, the cutting roller of relative for workbench both sides is lowered, and compression pump effect under, grinding agent is sprayed to the cutting position of steel wire and workpiece by the grinding agent automatic spraying device be assemblied on equipment, the reciprocal high-speed motion of grinding agent is driven by steel wire, utilize abrasive sand to produce workpiece to cut, so that workpiece is once cut into many simultaneously.In whole process, steel wire is by the guiding of tens guide rollers, main line roller is formed a bracing cable net, and workpiece to be processed realizes the feeding of workpiece by the rise and fall of workbench, the hard brittle materials such as semiconductor once can be cut into hundreds of simultaneously, multi-wire saw technology cut with traditional knife saw sheet, grinding wheel and inner circle compared with have that to have efficiency high, production capacity is high, precision advantages of higher, multi-wire saw technology adopts at present the hard brittle material cutting technique such as semiconductor the most widely.
In the prior art, be by line of cut equably around on columniform line storage tube, by guide roller, cutting roller etc. walk line mechanism formed can come and go walk wire system.Described line of cut via guide roller guide be wound to cutting roller namely use in trough, do not offset walking in line process to make described line of cut.But, in the process of actual cut workpiece, because the precision of guide roller, the rigidity of coil holder and the tension force of line of cut on line storage tube can not uniformities, add and at a high speed walk line of cut in line process and can constantly shake, and walk line process be Dragsaw type move back and forth, so just be easy to line of cut is jumped out, cabling is caused to offset, namely wire jumper, say specifically, namely line of cut is jumped in the trough for subsequent use on side with trough by original, then make described line of cut depart from origin-location, just result in the generation of wire jumper phenomenon.
As a kind of diamond cutting line slicing machine for sliced crystal silicon rod [application number: 201010286087.5] that Chinese patent is announced, it at least comprises: the frame with a work piece cut district, be separately positioned on first, second cutting roller of both sides, work piece cut district, be arranged on the 3rd cutting roller between first, second cutting roller, 3rd cutting roller is positioned at the upside of first, second cutting roller same level, and the spacing of the 3rd cutting roller to the first cutting roller or the second cutting roller is less than the spacing of the first cutting roller to the second cutting roller; And the diamond wire be wound in successively on described first, the 3rd and second cutting roller, this diamond wire between the 3rd cutting roller and the first cutting roller and and the second cutting roller between form the line of cut of two sections relatively short, when diamond wire high-speed cruising, cutting operation is carried out to two crystalline silicon rod by these two sections of lines of cut simultaneously.Normally close between the cutting area due to multi-line cutting machine, operating personnel can not be observed visually the generation of wire jumper phenomenon, and the work piece cut inaccuracy caused by wire jumper, cut surface produces the quality that the problems such as lines directly have influence on silicon chip processing, severe patient, more can cause the waste of silicon chip, not only loses time and cost, also reduce the efficiency of production, a real large problem for can not be ignored simultaneously; Moreover, in order to solve the problem of wire jumper, the dealer of association area attempts the stopping means of additional cabling, but the cabling interval required due to different cutting operation or cabling precision difference, be difficult to the design proposing a kind of general wire jumping prevention method, for this reason, many design and manufacture costs are wasted.
Summary of the invention
The purpose of this utility model there are the problems referred to above for existing technology, propose a kind of line of cut Anti-jumper device of silicon chip slicer, to solve the slicer of prior art in cutting process, easy generation wire jumper phenomenon and then have influence on the crudy of silicon chip, loses time and cost and reduce the problems such as production efficiency.
The purpose of this utility model realizes by following technical proposal: a kind of line of cut Anti-jumper device of silicon chip slicer, slicer comprises frame, be separately positioned on the first cutting roller of both sides, work piece cut district, second cutting roller, be arranged on the first cutting roller, the 3rd cutting roller between second cutting roller, and be wound in described first cutting roller successively, diamond wire on 3rd cutting roller and the second cutting roller, 3rd cutting roller is positioned at the first cutting roller, the upside of the second cutting roller same level, it is characterized in that, the line of cut Anti-jumper device of this silicon chip slicer comprises the limiting plate being rectangle tabular, the edge of described limiting plate has some stopper slots, described stopper slot is elongated, described frame is provided with motor cabinet and is fixed on the motor on motor cabinet, the side of described limiting plate is welded with the support bar of strip, described support bar has tooth bar, described support bar also can slide by rack level relatively through frame, the output shaft of described motor is fixed with and tooth bar meshed gears.
In the line of cut Anti-jumper device of above-mentioned silicon chip slicer, stopper slot on the upside of described limiting plate and the diamond wire one_to_one corresponding between the first cutting roller and the 3rd cutting roller, the stopper slot on the downside of described limiting plate and the diamond wire one_to_one corresponding between the first cutting roller and the second cutting roller.
In the line of cut Anti-jumper device of above-mentioned silicon chip slicer, the thickness of described limiting plate is 5mm ~ 10mm.
In the line of cut Anti-jumper device of above-mentioned silicon chip slicer, the width of described stopper slot is 800um ~ 1000um.The diameter of diamond wire is 100um ~ 250um, and diamond wire shake when cutting is unavoidable, so the width of stopper slot is arranged on 800um ~ 1000um, both can prevent wire jumper, and can prevent again diamond wire to rub for a long time cell wall.
In the line of cut Anti-jumper device of above-mentioned silicon chip slicer, the degree of depth of described stopper slot is 5.5mm ~ 6.5mm.
In the line of cut Anti-jumper device of above-mentioned silicon chip slicer, the width of described limiting plate is greater than the length of cutting roller.
Compared with prior art, the line of cut Anti-jumper device of this silicon chip slicer has the limiting plate of stopper slot, the horizontal wire jumper of restriction diamond wire, and limiting plate can transverse horizontal fine motion, and suitably adjustment is to adapt to different cutting roller.
Accompanying drawing explanation
Fig. 1 is the structural representation of limiting plate.
Fig. 2 is the side view of the line of cut Anti-jumper device of silicon chip slicer.
Fig. 3 is the front view of the line of cut Anti-jumper device of silicon chip slicer.
In figure, 1, frame; 2, the first cutting roller; 3, the second cutting roller; 4, the 3rd cutting roller; 5, diamond wire; 6, limiting plate; 7, stopper slot; 8, support bar; 9, tooth bar; 10, motor cabinet; 11, motor; 12, gear.
Detailed description of the invention
Be below specific embodiment of the utility model and by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiments.
As Fig. 1, Fig. 2, shown in Fig. 3, the line of cut Anti-jumper device of this silicon chip slicer, slicer comprises frame 1, be separately positioned on the first cutting roller 2 of both sides, work piece cut district, second cutting roller 3, be arranged on the first cutting roller 2, the 3rd cutting roller 4 between second cutting roller 3, and be wound in described first cutting roller 2 successively, diamond wire 5 on 3rd cutting roller 4 and the second cutting roller 3, 3rd cutting roller 4 is positioned at the first cutting roller 2, the upside of the second cutting roller 3 same level, it is characterized in that, the line of cut Anti-jumper device of this silicon chip slicer comprises the limiting plate 6 being rectangle tabular, the edge of described limiting plate 6 has some stopper slots 7, described stopper slot 7 is elongated, the motor 11 that described frame 1 is provided with motor cabinet 10 and is fixed on motor cabinet 10, the side of described limiting plate 6 is welded with the support bar 8 of strip, described support bar 8 has tooth bar 9, described support bar 8 is through frame 1 and can frame 1 horizontal slip relatively, the output shaft of described motor 11 is fixed with and tooth bar 9 meshed gears 12.
Stopper slot 7 on the upside of limiting plate 6 and diamond wire 5 one_to_one corresponding between the first cutting roller 2 and the 3rd cutting roller 4, the stopper slot 7 on the downside of described limiting plate 6 and diamond wire 5 one_to_one corresponding between the first cutting roller 2 and the second cutting roller 3.The thickness of limiting plate 6 is 5mm ~ 10mm, and the width of stopper slot 7 is 800um ~ 1000um, and the degree of depth of stopper slot 7 is 5.5mm ~ 6.5mm.The width of limiting plate 6 is greater than the length of cutting roller.
At this to the stopper slot 7 limiting plate 6 being formed many corresponding diamond wires 5; wire jumping prevention is provided to protect by stopper slot 7 to the diamond wire 5 remained running in stopper slot 7; so to avoid slicer in the operation of cut workpiece; the phenomenon of easy generation wire jumper, and then the operational efficiency improving that product percent of pass also improves equipment.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present utility model or surmount the scope that appended claims defines.
Claims (6)
1. the line of cut Anti-jumper device of a silicon chip slicer, slicer comprises frame, be separately positioned on the first cutting roller of both sides, work piece cut district, second cutting roller, be arranged on the first cutting roller, the 3rd cutting roller between second cutting roller, and be wound in described first cutting roller successively, diamond wire on 3rd cutting roller and the second cutting roller, 3rd cutting roller is positioned at the first cutting roller, the upside of the second cutting roller same level, it is characterized in that, the line of cut Anti-jumper device of this silicon chip slicer comprises the limiting plate being rectangle tabular, the edge of described limiting plate has some stopper slots, described stopper slot is elongated, described frame is provided with motor cabinet and is fixed on the motor on motor cabinet, the side of described limiting plate is welded with the support bar of strip, described support bar has tooth bar, described support bar also can slide by rack level relatively through frame, the output shaft of described motor is fixed with and tooth bar meshed gears.
2. the line of cut Anti-jumper device of silicon chip slicer according to claim 1, it is characterized in that, stopper slot on the upside of described limiting plate and the diamond wire one_to_one corresponding between the first cutting roller and the 3rd cutting roller, the stopper slot on the downside of described limiting plate and the diamond wire one_to_one corresponding between the first cutting roller and the second cutting roller.
3. the line of cut Anti-jumper device of silicon chip slicer according to claim 2, is characterized in that, the thickness of described limiting plate is 5mm ~ 10mm.
4. the line of cut Anti-jumper device of silicon chip slicer according to claim 3, is characterized in that, the width of described stopper slot is 800um ~ 1000um.
5. the line of cut Anti-jumper device of silicon chip slicer according to claim 4, is characterized in that, the degree of depth of described stopper slot is 5.5mm ~ 6.5mm.
6. the line of cut Anti-jumper device of silicon chip slicer according to claim 5, is characterized in that, the width of described limiting plate is greater than the length of cutting roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420548289.6U CN204076545U (en) | 2014-09-23 | 2014-09-23 | A kind of line of cut Anti-jumper device of silicon chip slicer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420548289.6U CN204076545U (en) | 2014-09-23 | 2014-09-23 | A kind of line of cut Anti-jumper device of silicon chip slicer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204076545U true CN204076545U (en) | 2015-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420548289.6U Expired - Lifetime CN204076545U (en) | 2014-09-23 | 2014-09-23 | A kind of line of cut Anti-jumper device of silicon chip slicer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204076545U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108407116A (en) * | 2018-03-30 | 2018-08-17 | 青岛高测科技股份有限公司 | And line detector, method and the diamond cutting line slicing machine including this and line detector |
| CN109333847A (en) * | 2018-12-06 | 2019-02-15 | 中电工业互联网有限公司 | A kind of novel spindle system of multi-wire saw |
| CN110341062A (en) * | 2019-06-24 | 2019-10-18 | 内蒙古中环光伏材料有限公司 | A method of it prevents piece from jumping doubling and generates |
| TWI835499B (en) * | 2022-10-26 | 2024-03-11 | 大陸商西安奕斯偉材料科技股份有限公司 | Devices for guiding cutting wires, wire cutting equipment and silicon wafers |
-
2014
- 2014-09-23 CN CN201420548289.6U patent/CN204076545U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108407116A (en) * | 2018-03-30 | 2018-08-17 | 青岛高测科技股份有限公司 | And line detector, method and the diamond cutting line slicing machine including this and line detector |
| CN109333847A (en) * | 2018-12-06 | 2019-02-15 | 中电工业互联网有限公司 | A kind of novel spindle system of multi-wire saw |
| CN110341062A (en) * | 2019-06-24 | 2019-10-18 | 内蒙古中环光伏材料有限公司 | A method of it prevents piece from jumping doubling and generates |
| CN110341062B (en) * | 2019-06-24 | 2020-11-13 | 内蒙古中环光伏材料有限公司 | Method for preventing splicing seam from jumping and doubling |
| TWI835499B (en) * | 2022-10-26 | 2024-03-11 | 大陸商西安奕斯偉材料科技股份有限公司 | Devices for guiding cutting wires, wire cutting equipment and silicon wafers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 314415 21 pillow Road, Huang Wan Town, Haining, Jiaxing, Zhejiang Patentee after: Zhejiang Hao Neng Au Optronics Co. Address before: 314415 21 pillow Road, Huang Wan Town, Haining, Jiaxing, Zhejiang Patentee before: ZHEJIANG HOUNEN SOLAR Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150107 |