CN202045766U - Multi-wire cutting machine - Google Patents
Multi-wire cutting machine Download PDFInfo
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- CN202045766U CN202045766U CN2011200954558U CN201120095455U CN202045766U CN 202045766 U CN202045766 U CN 202045766U CN 2011200954558 U CN2011200954558 U CN 2011200954558U CN 201120095455 U CN201120095455 U CN 201120095455U CN 202045766 U CN202045766 U CN 202045766U
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Abstract
The utility model relates to a multi-wire cutting machine, which is used for cutting two workpieces side by side and comprises a shell and a cutting chamber arranged in the shell. A workpiece table (1) is arranged on the upper portion of the cutting chamber, wire guide wheels (3) arranged below the workpiece table include a driving wire guide wheel and a driven wire guide wheel, and cutting wires are coiled in from the inner side of the driving wire guide wheel and are coiled out from the outer side of the driving wire guide wheel after encircling the driven wire guide wheel so that a netted cutting surface (5) is formed. The workpieces (2) to be cut are adhered on a glass plate through an adhesive layer, and then the glass plate is adhered to workpiece plates (4) which are in two rows, adhered with the workpieces (2) and connected to the workpiece table side by side. The multi-wire cutting machine is characterized in that before the workpieces are cut, the inclined angle ranging from 1 degree to 15 degrees is formed between a surface to be cut (21) of each workpiece (2) mounted on the workpiece table (1) and the netted cutting surface (5), when the multi-wire cutting machine is used for cutting, the inner sides of the surfaces to be cut (21) of the workpieces (2) in two rows contact with the netted cutting surface firstly, and when the multi-wire cutting machine is used for cutting silicon bars or silicon blocks which are arranged side by side, broken edge rate is decreased.
Description
Technical field
The utility model relates to a kind of multi-line cutting machine, particularly relate to and be suitable for the multi-line cutting machine that two row's workpiece (as silicon rod or silico briquette) cut side by side, wherein, the face to be cut of workpiece to be cut becomes certain inclination angle with netted cut surface before the cutting, thereby the inboard of the face to be cut of workpiece contacts with netted cut surface earlier when beginning to cut.
Background technology
At present the solar level cell silicon chip be by multi-line cutting machine with silicon single crystal rod, or the polysilicon block cutting forms.
Existing multi-line cutting machine mainly comprises: casing, be arranged on cutting chamber, bus cable device and transmission device etc. in the casing.The top of cutting chamber is provided with work stage, the below of work stage is provided with guide roller, rigid bearing, live bearing, and guide roller is divided into the main traverse line wheel and from guide roller, line of cut is from the inboard inlet wire of main traverse line wheel, outside outlet around taking turns from main traverse line behind guide roller forms netted cut surface.The mortar nozzle is arranged on work stage both sides and netted cut surface top.On the work plate that silicon rod sticks on work stage is connected, the work plate portability silicon rod or the netted relatively cut surface lifting of silico briquette, mortar nozzle ejection cutting liquid is evenly distributed on the netted cut surface, and cutting liquid parcel line of cut is that silicon rod or silico briquette cut to workpiece.
The operation principle of multi-line cutting machine is that the steel wire by a high-speed motion drives and attached to the cutting slurry on the steel wire silicon rod or silico briquette rubbed, thereby reaches cutting effect.In whole process, steel wire form a bracing cable net on the main line roller, and silico briquette to be processed or silicon rod is realized the feeding of workpiece by the decline of workbench by the guiding of a plurality of guide rollers.
Steel wire runs up under the drive of guide wheel, and steel wire carries mortar usually silico briquette is cut.In the cutting process, silico briquette down moves.The inventor finds that in the existing wire cutting machine, silico briquette to be cut and the steel wire of installation are vertical, owing to silico briquette or silicon rod in cutting process to gauze press down formation " line bow ", it is at silico briquette chamfering place that steel wire cuts outlet, is easy to generate and collapses the limit phenomenon.Generally collapse the limit rate about 2.3%, even, have a strong impact on the product quality of cutting back silicon chip more than 2.3%.
The utility model content
In order to address the above problem, the purpose of this utility model is to provide a kind of multi-line cutting machine that collapses the limit rate when reducing silicon rod or silico briquette cutting.
To achieve these goals, the technical solution of the utility model is after forming certain angle of inclination by face to be cut that makes the preceding workpiece of cutting and netted cut surface, just changed a phenomenon that face contacts with the cutting gauze of workpiece when going into cutter (as silicon rod or silico briquette), but an angle or the situation that point contacts with netted cut surface, strengthen stability, gauze is difficult for beating, and skids, and reduces the generation of defective products.The adjustment of angle has been arranged, also can control line have bent when cutter and do not cut out, and certain on mucilage glue surface cuts out neatly, reduces the appearance of collapsing the limit phenomenon at silico briquette chamfering place from the silico briquette chamfering.
A kind of multi-line cutting machine of the present invention, being used for two row's workpiece cuts side by side, it comprises: casing, be arranged on the cutting chamber in the casing, the top of cutting chamber is provided with work stage, the below of work stage is provided with guide roller, guide roller is divided into main traverse line wheel and from guide roller, line of cut is from the inboard inlet wire of main traverse line wheel, around the outside outlet of behind guide roller, taking turns from main traverse line, form netted cut surface, workpiece to be cut is by glass plate and glue-line and work plate bonding, and two work plates that are pasted with workpiece are connected to work stage side by side, it is characterized in that, before the cutting, the face to be cut that is installed in two row's workpiece of work stage becomes certain inclination angle with netted cut surface respectively, and described inclination angle is the 1-15 degree, make when beginning to cut that the inboard of the face to be cut of two row's workpiece contacts with netted cut surface earlier.
In the utility model, " two row " are meant two workpiece or the two row's workpiece of installing side by side, and every row's workpiece can be that a workpiece or a plurality of workpiece are arranged in a row.
Before the cutting described in the utility model, the face to be cut that is installed in two row's workpiece of work stage becomes certain inclination angle with netted cut surface respectively, be meant before cutting, the face to be cut that is installed in two row's workpiece of work stage tilts with respect to netted cut surface, make that when beginning to cut the inboard of face to be cut contacts with netted cut surface earlier.Here " inboard " is meant two row's workpiece close side mutually.
According to a kind of preferred implementation of the present utility model, before the cutting, the face to be cut that is installed in two row's workpiece of work stage becomes the 1-15 degree with netted cut surface respectively, and under this angle of inclination, after cutting, collapsing the limit rate can drop to less than 1.4%.
According to another kind of preferred implementation of the present utility model, before the cutting, the face to be cut that is installed in two row's workpiece of work stage becomes the 1-10 degree with netted cut surface respectively, and under this angle of inclination, after cutting, collapsing the limit rate can drop to less than 1.2%.
According to another preferred implementation of the present utility model, before the cutting, the face to be cut that is installed in two row's workpiece of work stage becomes the 1-5 degree with netted cut surface respectively, and under this angle of inclination, after cutting, collapsing the limit rate can drop to less than 0.9%.
According to preferred embodiment of the present utility model, before the cutting, the face to be cut that is installed in two row's workpiece of work stage becomes the 1-1.6 degree with netted cut surface respectively, and under this angle of inclination, after cutting, collapsing the limit rate can drop to less than 0.7%.
According to other preferred implementations of the present utility model, the angle of inclination implementation of workpiece is a lot, be processed as the angle of inclination that needs as at least one face with work plate, also work stage can be processed as the angle of inclination that needs, some pads of suitable thickness can also be set between two work plates, so that workpiece is before cutting, the angle of inclination that becomes to be scheduled between its face to be cut and the netted cut surface, make that when beginning to cut the inboard of the face to be cut of two workpiece contacts with netted cut surface earlier.
The utility model is by changing the angle of work plate etc., workpiece is had a certain degree with respect to the gauze plane, thereby can change the position that steel wire cuts the silico briquette outlet, avoid in the place's outlet of silico briquette chamfering, thereby reduce and collapse the limit phenomenon, the silicon chip product quality after guaranteeing to cut.
Description of drawings
Fig. 1 is the formation schematic diagram of cutting chamber of the multi-line cutting machine of prior art.
Fig. 2 is the partial view that carries the work plate of workpiece in the multi-line cutting machine of prior art.
Fig. 3 is the partial view that carries the tilted workpiece plate of workpiece of the present utility model.
Description of reference numerals
1 work stage
2 workpiece (silicon rod or silico briquette)
The face to be cut of 21 workpiece
3 guide rollers
4 work plates
5 gauzes
6 mortar nozzles
7 glass plates
8 glue-lines
The specific embodiment
Below by the specific embodiment and in conjunction with the accompanying drawings formation of the present utility model and effect are carried out more detailed description, but it will be understood by a person skilled in the art that, these accompanying drawings and description are exemplary, without departing from the inventive concept of the premise, other embodiments that more improvement or variation can also be arranged, and these improvement and variation all should belong to scope of the present utility model.
As shown in Figure 1, the cutting chamber of general multi-line cutting machine mainly comprises: the casing (not shown) that forms cutting chamber, the top of cutting chamber is provided with work stage 1, the below of work stage 1 is provided with that guide roller 3, guide roller 3 are divided into the main traverse line wheel and from guide roller, line of cut is from the inboard inlet wire of main traverse line wheel, outside outlet around taking turns from main traverse line behind guide roller forms netted cut surface 5.Mortar nozzle 6 is arranged on work stage 1 both sides and netted cut surface 5 tops.
Silicon rod to be cut or silico briquette 2 stick on the glass plate 7 by glue-line, glass plate sticks on the work plate 4 by glue-line, work plate removably is connected with work stage, but work stage 1 oscilaltion, the work plate portability silicon rod or silico briquette along with the lifting of work stage is moved perpendicular to netted cut surface 5, mortar nozzle 6 ejection cutting liquid are evenly distributed on the netted cut surface, and cutting liquid parcel line of cut is that silicon rod or silico briquette 2 cut to workpiece.
Fig. 2 is the partial view that carries the work plate of workpiece in the multi-line cutting machine of prior art.
As shown in Figure 2, because is vertical with glass plate and the coherent silico briquette 2 of work plate with gauze (also being netted cut surface), when finishing cutting outlet (shown in the II among the figure), cause at silico briquette chamfering place (shown in the III among the figure) easily and collapse the limit, generally collapse the limit rate about 2.3%, even, have a strong impact on the product quality of cutting back silicon chip more than 2.3%.
Fig. 3 is the partial view according to the tilted workpiece plate that carries workpiece of a kind of preferred implementation of the present utility model.
As shown in Figure 3, work plate 4 is a tilted workpiece plate, and the plane that itself and glass plate bond is a clinoplain.The inboard of this work plate is thicker, and the outside is thinner, forms to have the 1-15 degree, preferred 1-10 degree, more preferably 1-5 degree, the most preferably clinoplain at 1-1.6 degree inclination angle.When workpiece 2 bonds by glue-line and glass plate 7, glass plate 7 bonds with this work plate 4 again, and the work plate 4 that will carry workpiece is when being affixed on the work stage 1, has the 1-15 degree between the face to be cut 21 of workpiece 2 and the netted cut surface 5, preferred 1-10 degree, more preferably 1-5 degree, most preferably 1-1.6 degree inclination angle.When beginning to cut, the inboard of the face to be cut 21 of two workpiece 2 contacts with netted cut surface 5 in advance.In this way, can change the position that steel wire cuts the silico briquette outlet, avoid, collapse the limit phenomenon thereby reduce in the place's outlet of silico briquette chamfering.
According to a kind of preferred implementation of the present utility model, before the cutting, be installed in work stage 1 two workpiece 2 face to be cut 21 respectively with 5 one-tenth 1-15 degree of netted cut surface, under this angle of inclination, after cutting, collapsing the limit rate can drop to less than 1.4%.
According to another kind of preferred implementation of the present utility model, before the cutting, be installed in work stage 1 two workpiece 2 face to be cut 21 respectively with 5 one-tenth 1-10 degree of netted cut surface, under this angle of inclination, after cutting, collapsing the limit rate can drop to less than 1.2%.
According to another preferred implementation of the present utility model, before the cutting, be installed in work stage 1 two workpiece 2 face to be cut 21 respectively with 5 one-tenth 1-5 degree of netted cut surface, under this angle of inclination, after cutting, collapsing the limit rate can drop to less than 0.9%.
According to preferred embodiment of the present utility model, before the cutting, be installed in work stage 1 two workpiece 2 face to be cut 21 respectively with 5 one-tenth 1-1.6 degree of netted cut surface, under this angle of inclination, after cutting, collapsing the limit rate can drop to less than 0.7%.
According to the utility model, between the face to be cut of realizing workpiece by the work plate that adopts and netted cut surface, have the inclination angle, also can realize by other any suitable modes.For example, also can realize the inclination of workpiece by the mode of some pads of pad between two work plates.As pad itself is to tilt, and perhaps adopts two work plates, and between work plate an end shell tool in the inner part, and outside pad not, thus make the work plate of stack tilt to realize.Here " inboard " is meant when the work plate that carries workpiece is installed on the work stage side by side, a side adjacent to each other, and away from a side be " outside ".
The utility model is by changing the angle of work plate etc., workpiece is had a certain degree with respect to the gauze plane, thereby can change the position that steel wire cuts the silico briquette outlet, avoid in the place's outlet of silico briquette chamfering, thereby reduce and collapse the limit phenomenon, the silicon chip product quality after guaranteeing to cut.
Claims (7)
1. multi-line cutting machine, being used for two row's workpiece cuts side by side, it comprises: casing, be arranged on the cutting chamber in the casing, the top of cutting chamber is provided with work stage (1), the below of work stage (1) is provided with guide roller (3), guide roller is divided into main traverse line wheel and from guide roller, line of cut is from the inboard inlet wire of main traverse line wheel, around the outside outlet of behind guide roller, taking turns from main traverse line, form netted cut surface (5), workpiece to be cut (2) is by glass plate (7) and glue-line (8) and work plate (4) bonding, the work plate (4) that two rows are pasted with workpiece (2) is connected to work stage (1) side by side, it is characterized in that, before the cutting, the face to be cut (21) that is installed in two row's workpiece (2) of work stage becomes 1-15 degree inclination angle with netted cut surface (5), makes when beginning to cut, and the inboard of two row's workpiece (2) faces to be cut (21) contacts with netted cut surface earlier.
2. multi-line cutting machine as claimed in claim 1 is characterized in that, described inclination angle is the 1-10 degree.
3. multi-line cutting machine as claimed in claim 2 is characterized in that, described inclination angle is the 1-5 degree.
4. multi-line cutting machine as claimed in claim 3 is characterized in that, described inclination angle is the 1-1.6 degree.
5. as the arbitrary described multi-line cutting machine of claim 1-4, it is characterized in that at least one plane of described work plate (4) is the inclined plane, make that the face to be cut (21) of two row's workpiece (2) becomes described inclination angle with netted cut surface (5) respectively before the cutting.
6. as the arbitrary described multi-line cutting machine of claim 1-4, it is characterized in that described work plate (4) is at least two, and adds at least one pad between described work plate, make that the face to be cut (21) of two row's workpiece (2) becomes described inclination angle with netted cut surface (5) respectively before the cutting.
7. as the arbitrary described multi-line cutting machine of claim 1-4, it is characterized in that described workpiece (2) is silicon rod or silico briquette.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200954558U CN202045766U (en) | 2011-04-02 | 2011-04-02 | Multi-wire cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200954558U CN202045766U (en) | 2011-04-02 | 2011-04-02 | Multi-wire cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202045766U true CN202045766U (en) | 2011-11-23 |
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ID=44986089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200954558U Expired - Fee Related CN202045766U (en) | 2011-04-02 | 2011-04-02 | Multi-wire cutting machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN202045766U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555092A (en) * | 2012-03-23 | 2012-07-11 | 内蒙古中环光伏材料有限公司 | Method for linearly cutting silicon wafers |
| CN103192462A (en) * | 2013-04-16 | 2013-07-10 | 天津英利新能源有限公司 | Multi-line silicon wafer cutting method |
| CN103386522A (en) * | 2012-05-08 | 2013-11-13 | 无锡奥特维科技有限公司 | Solar silicon rod double-wire cutting method and device |
| CN112157831A (en) * | 2020-07-30 | 2021-01-01 | 长治高测新材料科技有限公司 | Semiconductor silicon slicing diamond wire cutting process for power device |
| CN113601741A (en) * | 2021-08-09 | 2021-11-05 | 西安奕斯伟硅片技术有限公司 | Device for supplying mortar to a plurality of cutting lines for cutting silicon rods and silicon rod cutting apparatus |
-
2011
- 2011-04-02 CN CN2011200954558U patent/CN202045766U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102555092A (en) * | 2012-03-23 | 2012-07-11 | 内蒙古中环光伏材料有限公司 | Method for linearly cutting silicon wafers |
| CN103386522A (en) * | 2012-05-08 | 2013-11-13 | 无锡奥特维科技有限公司 | Solar silicon rod double-wire cutting method and device |
| CN103192462A (en) * | 2013-04-16 | 2013-07-10 | 天津英利新能源有限公司 | Multi-line silicon wafer cutting method |
| CN112157831A (en) * | 2020-07-30 | 2021-01-01 | 长治高测新材料科技有限公司 | Semiconductor silicon slicing diamond wire cutting process for power device |
| CN113601741A (en) * | 2021-08-09 | 2021-11-05 | 西安奕斯伟硅片技术有限公司 | Device for supplying mortar to a plurality of cutting lines for cutting silicon rods and silicon rod cutting apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111123 Termination date: 20200402 |