CN202640588U - Precisely-positioning cutting device of solar battery silicon wafer - Google Patents
Precisely-positioning cutting device of solar battery silicon wafer Download PDFInfo
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- CN202640588U CN202640588U CN 201220314620 CN201220314620U CN202640588U CN 202640588 U CN202640588 U CN 202640588U CN 201220314620 CN201220314620 CN 201220314620 CN 201220314620 U CN201220314620 U CN 201220314620U CN 202640588 U CN202640588 U CN 202640588U
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Abstract
The utility model discloses a precisely-positioning cutting device of a solar battery silicon wafer, and the precisely-positioning cutting device comprises a tray, a bonding plate, glass and a silicon block, wherein the tray is installed on a working table and can make linear reciprocating movement along the working table, the bonding plate, the glass and the silicon block are sequentially bonded onto the tray, at least one of the tray, the bonding plate and the glass is provided with a wedge structure, so that an included angle between the axis of the silicon block and the movement direction of the working table is an acute angle. According to the precisely-positioning cutting device of the solar battery silicon wafer, the multi-line plane cutter feeding cutting process in the prior art can be broken through, the angular cutter feeding and precise positioning of fret saw cutting can be realized, the procedure for bonding a resin guide bar can be reduced, not only is the working efficiency improved and the production cost reduced, but also the quality problems such as cutter feeding oblique cutting, edge breaking of the silicon wafer, line breaking, and wafer dropping can be solved, the qualification rate of the silicon wafer cut finished product can be improved, the broken silicon wafer can be recycled, the process for clearing away the resin guide bar can be simplified, and the recycling and processing cost can be reduced.
Description
Technical field
The utility model relates to solar cell crystal silicon chip cutting technique field, the particularly accurate positioning-cutting device of a kind of silicon chip of solar cell.
Background technology
The wire cutting machine reason of solar silicon wafers is exactly that the machine guide wheel is at the middle drive steel wire that runs up, thereby by steel wire the mortar that polyethylene glycol and silicon carbide micro-powder mix is delivered to cutting area, in the running up of steel wire, recur the process that cutting is finished in friction with the workpiece that is pressed on the gauze.
In whole cutting process, what the quality of silicon chip and yield rate were played a major role is the grain type of viscosity, silicon carbide micro-powder of cutting liquid and granularity, the viscosity of mortar, the flow of mortar, the speed of steel wire, the tension force of steel wire, feed speed that enters cutter mode and workpiece of cutting etc.
At present, what the cutting of silicon chip of solar cell was all adopted is that the plane enters the cutter plunge method, and its cutting tool and technique are as shown in Figure 1.That is: with the silico briquette 15 of square, (156*156*210 or 125*125*210MM) silico briquette 15 levels are bonded on glass 14, adhesive sheet 13 and the pallet 12, then be installed on the workbench 11 of scroll saw, steel wire 16 by a high-speed motion drives the cutting blade material that is attached on the steel wire silico briquette 15 is rubbed, thereby reaches cutting effect.In whole process, steel wire 16 forms a bracing cable net by the guiding of tens guide rollers 17 at the main line roller, and silico briquette 15 to be processed is realized the feeding of workpiece by the decline of workbench 11.The Multi-wire wafer cutting technique has been compared with other technologies: efficient is high, and production capacity is high, the precision advantages of higher.To adopt at present the most widely silicon chip cutting technique.
The plane that existing technology is taked enters cutter scroll saw plunge method, the AB group silica gel 18 that needs a large amount of resin gib block 19 of consumption and bonding these resin gib blocks 19 to need.Not only take a lot of work, time-consuming, waste material, bring very big difficulty also can for the recycling of broken silicon wafers.Simultaneously, also there is the silica gel contaminated environment, the healthy harm of injury employee.Main is recycling cutting broken silicon wafers, cleans and separates silicon chip, silica gel gib block difficulty, has increased production cost, has reduced operating efficiency.
Therefore, how to break through existing traditional multi-thread plane and enter the cutter cutting technique, adhering resin gib block no longer, solve the difficult problem of broken silicon wafers recycling, wire jumper when avoiding the steel wire incision improves silicon chip cutting product qualified rate, raises labour efficiency, reduce production costs, become the important technological problems that those skilled in the art need to be resolved hurrily.
The utility model content
In view of this, the utility model provides a kind of silicon chip of solar cell accurate positioning-cutting device, no longer the adhering resin gib block, solve the difficult problem of broken silicon wafers recycling, wire jumper when avoiding the steel wire incision improves silicon chip cutting product qualified rate, raise labour efficiency, reduce production costs.
For achieving the above object, the utility model provides following technical scheme:
The accurate positioning-cutting device of a kind of silicon chip of solar cell, comprise the pallet that is installed on the workbench and can does with described workbench straight reciprocating motion, and be bonded in successively adhesive sheet, glass and silico briquette on the described pallet, in described pallet, described adhesive sheet and the described glass at least one has wedge structure, makes the angle between the direction of motion of the axis of described silico briquette and described workbench be acute angle.
Preferably, described adhesive sheet is the bonding swash plate with wedge structure.
Preferably, the cross section of described bonding swash plate is specially trapezoidal.
Preferably, the angle of inclination size of described bonding swash plate is specially 3 °-7 °.
Can find out from above-mentioned technical scheme, the accurate positioning-cutting device of the silicon chip of solar cell that the utility model provides, pallet, in adhesive sheet and the glass at least one has wedge structure, make the angle between the direction of motion of the axis of silico briquette and workbench be acute angle, break through multi-thread plane of the prior art and entered the cutter cutting technique, the corner angle of having realized the scroll saw cutting enter cutter and accurate location, reduced the process links of adhering resin gib block, not only improved operating efficiency, reduced production cost, also having solved cutter cuts tiltedly, silicon chip collapses the limit, broken string, fall the quality problems such as sheet, improved silicon chip cutting product qualified rate, and be the recycling recycling of broken silicon wafers, simplified removing resin gib block technique, reduced the recycling cost.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the schematic diagram of crystalline silicon blocks cutting mode in the prior art;
The structural representation of the silicon chip of solar cell cutter sweep that Fig. 2 provides for the utility model embodiment;
The structural representation that the crystalline silicon blocks that Fig. 3 provides for the utility model embodiment is bonding.
Wherein, 11-19 all belongs to prior art, and is concrete, and 11 is workbench, and 12 is pallet, and 13 is adhesive sheet, and 14 is glass, and 15 is silico briquette, and 16 is steel wire, and 17 is guide wheel, and 18 are AB group silica gel, and 19 is the fat gib block;
21-28 all belongs to the silicon chip of solar cell cutter sweep that the utility model embodiment provides, and is concrete, and 21 is workbench, and 22 is pallet, and 23 is bonding swash plate, and 24 is glass, and 25 is silico briquette, and 26 is steel wire, and 27 is guide wheel, and 28 are AB group silica gel.
The specific embodiment
The utility model discloses the accurate positioning-cutting device of a kind of silicon chip of solar cell, no longer the adhering resin gib block solves the difficult problem of broken silicon wafers recycling, wire jumper when avoiding the steel wire incision, improve silicon chip cutting product qualified rate, raise labour efficiency, reduce production costs.
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the utility model protection.
See also Fig. 2 and Fig. 3, the structural representation of the silicon chip of solar cell cutter sweep that Fig. 2 provides for the utility model embodiment; The structural representation that the crystalline silicon blocks that Fig. 3 provides for the utility model embodiment is bonding.
The accurate positioning-cutting device of the silicon chip of solar cell that the utility model embodiment provides, comprise the pallet 22 that is installed on the workbench 21 and can does with workbench 21 straight reciprocating motion, and be bonded in successively adhesive sheet 23, glass 24 and silico briquette 25 on the pallet 22, its core improvement is, in pallet 22, adhesive sheet 23 and the glass 24 at least one has wedge structure, makes the angle between the direction of motion of the axis of silico briquette 25 and workbench 21 be acute angle.
Can find out from above-mentioned technical scheme, the accurate positioning-cutting device of the silicon chip of solar cell that the utility model embodiment provides, pallet 22, in adhesive sheet 23 and the glass 24 at least one has wedge structure, make the angle between the direction of motion of the axis of silico briquette 25 and workbench 21 be acute angle, break through multi-thread plane of the prior art and entered the cutter cutting technique, the corner angle of having realized the scroll saw cutting enter cutter and accurate location, reduced the process links of adhering resin gib block 19, not only improved operating efficiency, reduced production cost, also having solved cutter cuts tiltedly, silicon chip collapses the limit, broken string, fall the quality problems such as sheet, improved silicon chip cutting product qualified rate, and be the recycling recycling of broken silicon wafers, simplified removing resin gib block technique, reduced the recycling cost.
Than the metal structure of pallet 22 and the special substance of glass 24, the material of adhesive sheet 23 relatively firmly and be easy to be processed into various shapes.Therefore, in preferred the present embodiment, select adhesive sheet 23 is transformed, namely adhesive sheet 23 is for having the bonding swash plate of wedge structure.
In order further to optimize above-mentioned technical scheme, the cross section of bonding swash plate 23 is specially trapezoidal.See also 2 and Fig. 3, the two ends, the left and right sides of bonding swash plate 23 are parallel surface, its upper surface is the plane that cooperates with pallet 22, lower surface is the plane that cooperates with glass 24, such structure has realized the strong bond with pallet 22 and glass 24, can not ftracture in the cutting process, the junction excess smoothness has been avoided the damage to other parts.
As preferably, the angle of inclination size of bonding swash plate 23 is specially 3 °-7 °.As shown in Figure 2, the inclination angle A of bonding swash plate 23 is the angle between the direction of motion of the axis of silico briquette 25 and workbench 21, and suitable angle of inclination has guaranteed good cutting effect.
Below in conjunction with concrete operations, introduce the method that the accurate positioning-cutting device of the silicon chip of solar cell that utilizes the utility model to provide carries out the silicon chip cutting:
1, bonding swash plate 23 usefulness bolts is fixedly mounted on the pallet 22;
2, spread AB group silica gel 28, adhering glass 24 at pallet 22;
3, after glass 24 and pallet 22 curing firmly, spread again AB group silica gel 28 on glass 24 surfaces;
4, then silico briquette 25 is placed on glassly, glass 24 and silico briquette 25 are bonded together;
5, after pallet 22, glass 24, silico briquette 25 bonding curing are firm, it is installed on the workbench 21, carries out the scroll saw cutting.
The order that silico briquette 25 is bonded on the pallet 22 is successively: pallet 22; Bonding swash plate 23; AB organizes silica gel 28; Glass 24; AB organizes silica gel 28; Silico briquette 25.
In sum, the accurate positioning-cutting device of the silicon chip of solar cell that the utility model provides, wire jumper in the time of mainly avoiding the steel wire incision, prevent the thin and thick sheet, cut tiltedly, fall sheet, broken string, can improve silicon chip cutting product qualified rate, raise labour efficiency, reduce production costs.Adhering resin gib block no longer during more mainly due to this device cutting silicon wafer has solved the broken silicon wafers recycling difficult, has reduced the recycling cost, has reduced discharge of wastewater, for protection of the environment has been made contribution.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can be in the situation that do not break away from spirit or scope of the present utility model, in other embodiments realization.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (4)
1. accurate positioning-cutting device of silicon chip of solar cell, comprise the pallet (22) that is installed in workbench (21) upward and can does with described workbench (21) straight reciprocating motion, and be bonded in successively adhesive sheet (23), glass (24) and silico briquette (25) on the described pallet (22), it is characterized in that, in described pallet (22), described adhesive sheet (23) and the described glass (24) at least one has wedge structure, makes the angle between the direction of motion of the axis of described silico briquette (25) and described workbench (21) be acute angle.
2. the accurate positioning-cutting device of silicon chip of solar cell according to claim 1 is characterized in that, described adhesive sheet (23) is for having the bonding swash plate of wedge structure.
3. the accurate positioning-cutting device of silicon chip of solar cell according to claim 2 is characterized in that, the cross section of described bonding swash plate (23) is specially trapezoidal.
4. the accurate positioning-cutting device of silicon chip of solar cell according to claim 3 is characterized in that, the angle of inclination size of described bonding swash plate (23) is specially 3 °-7 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220314620 CN202640588U (en) | 2012-06-27 | 2012-06-27 | Precisely-positioning cutting device of solar battery silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220314620 CN202640588U (en) | 2012-06-27 | 2012-06-27 | Precisely-positioning cutting device of solar battery silicon wafer |
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| CN202640588U true CN202640588U (en) | 2013-01-02 |
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| CN 201220314620 Expired - Fee Related CN202640588U (en) | 2012-06-27 | 2012-06-27 | Precisely-positioning cutting device of solar battery silicon wafer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192462A (en) * | 2013-04-16 | 2013-07-10 | 天津英利新能源有限公司 | Multi-line silicon wafer cutting method |
| CN103341919A (en) * | 2013-07-29 | 2013-10-09 | 山东大海新能源发展有限公司 | Pretreatment process capable of increasing slicing rate of polycrystalline silicon rod |
| CN107457924A (en) * | 2017-08-30 | 2017-12-12 | 宁晋松宫电子材料有限公司 | A kind of polysilicon dicing method |
-
2012
- 2012-06-27 CN CN 201220314620 patent/CN202640588U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192462A (en) * | 2013-04-16 | 2013-07-10 | 天津英利新能源有限公司 | Multi-line silicon wafer cutting method |
| CN103341919A (en) * | 2013-07-29 | 2013-10-09 | 山东大海新能源发展有限公司 | Pretreatment process capable of increasing slicing rate of polycrystalline silicon rod |
| CN107457924A (en) * | 2017-08-30 | 2017-12-12 | 宁晋松宫电子材料有限公司 | A kind of polysilicon dicing method |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130102 Termination date: 20150627 |
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| EXPY | Termination of patent right or utility model |