CN203712893U - Slurry baffle for silicon wafer multi-wire sawing machine - Google Patents
Slurry baffle for silicon wafer multi-wire sawing machine Download PDFInfo
- Publication number
- CN203712893U CN203712893U CN201320896489.6U CN201320896489U CN203712893U CN 203712893 U CN203712893 U CN 203712893U CN 201320896489 U CN201320896489 U CN 201320896489U CN 203712893 U CN203712893 U CN 203712893U
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- Prior art keywords
- baffle plate
- slurry
- cutting machine
- silicon wafer
- wire cutting
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a slurry baffle for a silicon wafer multi-wire sawing machine. The slurry baffle is arranged above the portion where a wire net (6) of the sawing machine drives slurry to enter a silicon block (3), a baffle body shields the contact portion of the wire net (6) and the silicon block (3), and the included angle between the surface of the baffle (7) and the plane where the wire net (6) is located is 40-50 degrees. The baffle can prevent the slurry from being splashed outside a machine tool when the multi-wire sawing machine rotates at a high speed so that the purpose of maintaining the production environment on site can be achieved, and convenience is brought to operation by staff.
Description
Technical field
The utility model relates to the slurry baffle plate of solar silicon wafers technical field of processing equipment, particularly multi-wire cutting machine for silicon wafer.
Background technology
Silicon chip is the main production material in semiconductor and photovoltaic field, it is formed by silico briquette cutting, Multi-wire wafer cutting technique is current more advanced silicon chip process technology in the world, it is different from the cutting modes such as traditional knife saw sheet, grinding wheel, also be different from advanced laser cutting and inner circle cutting, its principle is that the steel wire by a high-speed motion drives the cutting blade material being attached on steel wire to rub to silicon rod, thereby reaches cutting effect.
Please refer to Fig. 1, the operation principle schematic diagram that Fig. 1 is existing multi-wire cutting machine for silicon wafer.
As shown in the figure, in whole cutting process, steel wire 1 is by the guiding of tens guide rollers, on main line roller 2, form a bracing cable net, and silico briquette 3 to be processed is realized the feeding of workpiece by the rise and fall of workbench, steel wire 1 moves back and forth by high speed, the machining area of abrasive material being brought into silico briquette 3 grinds, silico briquette 3 is once cut into hundreds of thin slices simultaneously, compare with other technologies, there is efficiency high, production capacity is high, precision advantages of higher, replaced gradually traditional knife saw sheet, grinding wheel and inner circle cutting, to adopt at present the most widely the hard brittle material cutting techniques such as semiconductor.
Known according to the operation principle of multi-line cutting machine, during cutting, slurry sprays above steel wire gauze by nozzle, then by steel wire, brought into cutting seam, thereby complete cutting, slurry is muddy liquid, when machine tool high speed moves, have part slurry and be thrown out of, while therefore how to block machine tool running, throw away the slurry coming, for maintaining in-situ production environment, seem particularly important.
At present, on multi-line cutting machine, generally all carry slurry baffle plate, in case grouting material splashes on lathe outside and ground, slurry baffle plate mainly contains two, one is arranged on the slurry (see figure 2) that throws away while being used for blocking guide wheel 5 high speed rotating on slurry mouth 4, one is arranged on (not shown) on lathe base, is used for blocking slurry, prevents that it from splashing on machine tool door.Although be provided with two slurry baffle plates, in the middle of actual production, still have slurry and be thrown on machine tool door, and splash lathe outside and ground from lathe crack between a door and its frame, block pulp effect is not satisfactory.
Therefore, how effectively preventing that slurry from splashing on lathe outside and ground, is those skilled in the art's technical issues that need to address.
Utility model content
The purpose of this utility model is to provide a kind of multi-wire cutting machine for silicon wafer slurry baffle plate.This baffle plate can be stopped multi-line cutting machine slurry in high speed rotating process and splash lathe outside, thereby reaches the object that maintains in-situ production environment, facilitates employee to operate.
To achieve these goals, the utility model provides a kind of multi-wire cutting machine for silicon wafer slurry baffle plate, and the gauze of being located at described cutting machine drives slurry to enter the oblique upper of silico briquette position, and its plate body blocks the contact site of described gauze and silico briquette.
Preferably, the angle of the plate face of described baffle plate and gauze place plane is 40 °～50 °.
Preferably, the angle of the plate face of described baffle plate and gauze place plane is 45 °.
Preferably, the plate face of described baffle plate is perpendicular to the slurry mouth of described cutting machine.
Preferably, the lower edge of described baffle plate is connected with the root of the guide wheel slurry baffle plate of described cutting machine.
Preferably, described baffle plate is provided with slurry mouth installing hole in centre position, and described installing hole both sides are provided with locating hole.
Preferably, described installing hole and locating hole are for falling " U " shape open pore.
Preferably, the guide wheel slurry baffle plate of described baffle plate and described cutting machine is integral type structure.
Preferably, described baffle plate is rectangle.
Preferably, the length of described baffle plate is 480mm～540mm, and width is 100mm～140mm.
The gauze that slurry baffle plate provided by the utility model is located at multi-line cutting machine drives slurry to enter the oblique upper of silico briquette position, its plate body blocks the contact site of gauze and silico briquette, thereby can block gauze because can not all bringing the slurry that in silico briquette, participation cutting throws away into, and make it turn back to continuation participation cutting on gauze, stopped the phenomenon that multi-line cutting machine slurry in high speed rotating process splashes lathe outside, to maintaining in-situ production environment, there is very large effect, greatly facilitate employee's operation.
In addition, it is simple in structure, be easy to install, and because occlusion effect is remarkable, can save the slurry baffle plate on foundation of incision machine, thereby cutting machine structure is further simplified.
Accompanying drawing explanation
Fig. 1 is the operation principle schematic diagram of existing multi-wire cutting machine for silicon wafer;
Fig. 2 is that the slurry of existing multi-wire cutting machine for silicon wafer guide wheel place and gauze and silico briquette contact site gets rid of and spatters schematic diagram;
Fig. 3 provides the structural representation of a kind of specific embodiment of multi-wire cutting machine for silicon wafer slurry baffle plate for the utility model;
Fig. 4 is that the A of Fig. 3 is to view;
Fig. 5 is the structural representation of baffle plate shown in Fig. 4;
Fig. 6 provides the structural representation of the another kind of specific embodiment of multi-wire cutting machine for silicon wafer slurry baffle plate for the utility model.
In figure:
1. steel wire 2. main line roller 3. silico briquette 4. slurry mouth 5. guide wheel 6. gauze 7. baffle plate 7-1. installing hole 7-2. locating hole 8. guide wheel slurry baffle plates
The specific embodiment
In order to make those skilled in the art person understand better the utility model scheme, below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Please refer to Fig. 3, Fig. 4, Fig. 3 provides the structural representation of a kind of specific embodiment of multi-wire cutting machine for silicon wafer slurry baffle plate for the utility model; Fig. 4 is that the A of Fig. 3 is to view.
In a kind of specific embodiment, the multi-wire cutting machine for silicon wafer slurry baffle plate that the utility model provides, the gauze 6 of being located at cutting machine drives slurry to enter the oblique upper of silico briquette 3 positions, and its plate body blocks the contact site of gauze 6 and silico briquette 3.
The angle of the plate face of baffle plate 7 and gauze 6 place planes is 45 °, and substantially perpendicular to the slurry mouth 4 of cutting machine, the lower edge of baffle plate 7 is connected with the root of the guide wheel slurry baffle plate 8 of cutting machine, the upper edge of baffle plate 7 approaches the side of silico briquette 3 to be cut, and keep with it a determining deviation, to block as much as possible the slurry that throws away from here, the course feed that can not affect again silico briquette 3 is advisable.
Certainly, baffle plate 7 can be also integral type structure with guide wheel slurry baffle plate 8.Like this, only need carry out once mounting, just both can be fixed on cutting machine simultaneously.
Please refer to Fig. 5, Fig. 5 is the structural representation of baffle plate shown in Fig. 4.
As shown in the figure, baffle plate 7 is rectangle, and the gauze width of its length and cutting machine is suitable, and suitably exceeds gauze certain distance, its length is 510mm, width is 120mm, and centre position is provided with slurry mouth installing hole 7-1, and installing hole both sides are provided with locating hole 7-2, installing hole 7-1 and locating hole 7-2 are down " U " shape open pore, wherein the width of installing hole 7-1 be 50mm, highly for 90mm, the width of locating hole 7-2 is 20mm, highly is 40mm, the spacing of a side corresponding to baffle plate 7 is 125mm.
Please refer to Fig. 6, Fig. 6 provides the structural representation of the another kind of specific embodiment of multi-wire cutting machine for silicon wafer slurry baffle plate for the utility model.
As shown in the figure, baffle plate 7, except being the form of straight plate, can also be designed to arc, can realize the utility model object equally, and all the other structures and above-described embodiment are basic identical, please refer to description above.
Certainly, above-mentioned multi-wire cutting machine for silicon wafer slurry baffle plate is only preferred version, is specifically not limited to this, can make according to actual needs pointed adjustment on this basis, thereby obtains different embodiments.For example baffle plate 7 adopts other modes to install, or baffle plate 7 is designed to other shapes etc.Because mode in the cards is more, just illustrate no longer one by one here.
Above multi-wire cutting machine for silicon wafer slurry baffle plate provided by the utility model is described in detail.Applied specific case herein principle of the present utility model and embodiment are set forth, the explanation of above embodiment is just for helping to understand core concept of the present utility model.Should be understood that; for those skilled in the art; do not departing under the prerequisite of the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection domain of the utility model claim.
Claims (10)
1. a multi-wire cutting machine for silicon wafer slurry baffle plate, is characterized in that, the gauze (6) of being located at described cutting machine drives slurry to enter the oblique upper of silico briquette (3) position, and its plate body blocks the contact site of described gauze (6) and silico briquette (3).
2. multi-wire cutting machine for silicon wafer slurry baffle plate according to claim 1, is characterized in that, the angle of the plate face of described baffle plate (7) and gauze (6) place plane is 40 °～50 °.
3. multi-wire cutting machine for silicon wafer slurry baffle plate according to claim 2, is characterized in that, the angle of the plate face of described baffle plate (7) and gauze (6) place plane is 45 °.
4. multi-wire cutting machine for silicon wafer slurry baffle plate according to claim 1, is characterized in that, the plate face of described baffle plate (7) is perpendicular to the slurry mouth (4) of described cutting machine.
5. multi-wire cutting machine for silicon wafer slurry baffle plate according to claim 1, is characterized in that, the lower edge of described baffle plate (7) is connected with the root of the guide wheel slurry baffle plate (8) of described cutting machine.
6. multi-wire cutting machine for silicon wafer slurry baffle plate according to claim 5, is characterized in that, described baffle plate (7) is provided with slurry mouth installing hole (7-1) in centre position, and described installing hole (7-1) both sides are provided with locating hole (7-2).
7. multi-wire cutting machine for silicon wafer slurry baffle plate according to claim 6, is characterized in that, described installing hole (7-1) and locating hole (7-2) are for falling " U " shape open pore.
8. multi-wire cutting machine for silicon wafer slurry baffle plate according to claim 1, is characterized in that, described baffle plate (7) is integral type structure with the guide wheel slurry baffle plate (8) of described cutting machine.
9. according to the multi-wire cutting machine for silicon wafer slurry baffle plate described in claim 1 to 8 any one, it is characterized in that, described baffle plate (7) is rectangle.
10. multi-wire cutting machine for silicon wafer slurry baffle plate according to claim 9, is characterized in that, the length of described baffle plate (7) is that 480mm～540mm, width are 100mm～140mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320896489.6U CN203712893U (en) | 2013-12-31 | 2013-12-31 | Slurry baffle for silicon wafer multi-wire sawing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320896489.6U CN203712893U (en) | 2013-12-31 | 2013-12-31 | Slurry baffle for silicon wafer multi-wire sawing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203712893U true CN203712893U (en) | 2014-07-16 |
Family
ID=51152087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320896489.6U Expired - Fee Related CN203712893U (en) | 2013-12-31 | 2013-12-31 | Slurry baffle for silicon wafer multi-wire sawing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203712893U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107206628A (en) * | 2015-01-26 | 2017-09-26 | Lg矽得荣株式会社 | Saw blade cutting equipment |
| CN110962248A (en) * | 2018-09-28 | 2020-04-07 | 胜高股份有限公司 | Machining liquid supply nozzle for wire saw and method for supplying machining liquid to wire saw |
-
2013
- 2013-12-31 CN CN201320896489.6U patent/CN203712893U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107206628A (en) * | 2015-01-26 | 2017-09-26 | Lg矽得荣株式会社 | Saw blade cutting equipment |
| US10391673B2 (en) | 2015-01-26 | 2019-08-27 | Sk Siltron Co., Ltd. | Wire sawing apparatus |
| CN107206628B (en) * | 2015-01-26 | 2019-11-01 | 爱思开矽得荣株式会社 | Saw blade cutting equipment |
| CN110962248A (en) * | 2018-09-28 | 2020-04-07 | 胜高股份有限公司 | Machining liquid supply nozzle for wire saw and method for supplying machining liquid to wire saw |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140716 Termination date: 20211231 |