CN204844530U - Cutting device of silicon chip slicer - Google Patents
Cutting device of silicon chip slicer Download PDFInfo
- Publication number
- CN204844530U CN204844530U CN201520531474.9U CN201520531474U CN204844530U CN 204844530 U CN204844530 U CN 204844530U CN 201520531474 U CN201520531474 U CN 201520531474U CN 204844530 U CN204844530 U CN 204844530U
- Authority
- CN
- China
- Prior art keywords
- steel wire
- mortar
- cutting
- cutting steel
- silicon chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model provides a cutting device of silicon chip slicer belongs to the technical field of silicon chip slicer. This cutting device of silicon chip slicer, which comprises a frame, the cylinder, elevating platform, the cutting copper wire, the guide pulley, elevating platform below joinable has the silicon bulk, the cylinder is fixed in the frame, the cylinder drive elevating platform reciprocate, the guide pulley rotate to connect in the frame and two guide pulleys between be equipped with the mortar groove, the mortar trench is under elevating platform, the mortar groove is cuboid form and upper end opening, mortar groove top edge is equipped with the wire casing excessively that supplies the cutting copper wire to pass, the elevating platform both sides are equipped with sprays the spray tube of mortar and the blowpipe of blowing towards the cutting copper wire towards the cutting copper wire, guide wheel groove has on the guide pulley, be equipped with the grouting groove along circumference on the both sides face that guide wheel groove contacted with the cutting copper wire. The utility model discloses both improve the life of cutting copper wire, reduced the fracture rate of cutting the copper wire, improved the cutting quality of silicon bulk again.
Description
Technical field
The utility model belongs to the technical field of silicon chip slicer, relates to a kind of cutter sweep of silicon chip slicer.
Background technology
Photovoltaic industry is an emerging green energy resource industry, and along with countries in the world are to the attention of green energy resource, photovoltaic industry develops rapidly, and high-quality, low cost are the keys of enterprise development.Along with country continues to increase the support dynamics of regenerative resource, China's photovoltaic industry sails policy " fast traffic lane " into, production capacity undergoes rapid expansion.For the photovoltaic cell taking silicon chip as substrate, silicon chip is part the most expensive in crystal silicon photovoltaic cell technology, so the manufacturing cost reducing this part is most important for the competitiveness of raising solar energy to traditional energy.Slicing silicon ingots is as the critical process of technique for processing silicon chip flow process, and its working (machining) efficiency and crudy are directly connected to the overall situation that whole silicon chip is produced.
The Linear cut mechanism of solar energy silicon ingot is exactly that machine guide wheel drives steel wire in running up, thus by steel wire, the mortar that polyethylene glycol and silicon carbide micro-powder mix is delivered to cutting area, in the running up of steel wire, the process of the cutting that rubbed is recurred with the workpiece be pressed on gauze.
The processing method of current silicon chip generally adopts multi-wire saw, and multi-wire saw is that the silicon-carbide particle carried in cutting mortar by the cutting steel wire of the high-speed mobile on slicer carries out polishing cutting to silicon ingot, thus silicon ingot processing is become silicon chip.According to steel wire incision principle, it is more that steel wire diameter carries more greatly mortar, the silicon-carbide particle participating in cutting is more, cutting efficiency is higher, but steel wire diameter is larger, and Cutting Drag is larger, cutting gap is larger, the utilization rate of silicon material is lower, namely silicon ingot sheet rate lower, and silicon chip obtain sheet rate height directly affects the utilization rate of silicon material and the economic benefit of enterprise.
In addition in actual cutting process, along with the carrying out of cutting, the impurity such as chip can be produced, if these impurity are attached on cutting steel wire will affect the band sand ability of cutting steel wire, after steel wire enters silico briquette, because the impact that is not enough and impurity of band sand easily makes silicon chip produce the defective products such as stria, if impurity confuses mortar and reunites and be also unfavorable for the clean of silicon chip surface at silicon chip surface simultaneously; If impurity is attached on guide roller, very easily cause the wire jumper of cutting steel wire, serious even broken string, affects silicon chip cut quality and yield rate.
Utility model content
The purpose of this utility model there are the problems referred to above for existing technology, proposes a kind of cutter sweep of silicon chip slicer.
The purpose of this utility model realizes by following technical proposal: a kind of cutter sweep of silicon chip slicer, comprise frame, cylinder, self-powered platform, cutting steel wire, guide wheel, silicon ingot can be connected with under self-powered platform, cylinder is fixed in frame, air cylinder driven self-powered platform moves up and down, guide wheel to be rotatably connected in frame and to be provided with mortar pin groove between two guide wheels, mortar pin groove is positioned at immediately below self-powered platform, mortar pin groove is rectangular-shaped and upper end open, mortar pin groove top edge is provided with the crossed beam trunking passed for cutting steel wire, self-powered platform both sides are provided with towards the jet pipe of cutting steel wire spray furnace and the blowpipe towards cutting steel wire air blowing, guide wheel has guided wheel slot, cutting steel wire is around in guided wheel slot, guided wheel slot is opened on guide wheel vertically equably, the shape of cross section of guided wheel slot is isosceles trapezoid or equilateral triangle, the two sides that guided wheel slot contacts with cutting steel wire are circumferentially provided with excessive stock tank.
Self-powered platform upper end has four cylinders, four cylinders are evenly distributed in four corners of self-powered platform, push rod and the self-powered platform of cylinder are connected, improve stationarity when air cylinder driven self-powered platform moves up and down, the crossed beam trunking quantity of mortar pin groove side is the same with the guided wheel slot quantity on guide wheel, cutting steel wire is set in the corresponding guided wheel slot on two guide wheels, and the cutting steel wire of upper end horizontal segment penetrates mortar pin groove from side crossed beam trunking and passes from the corresponding crossed beam trunking of opposite side.When cylinder promotion self-powered platform moves down, cutting steel wire can cut the silicon ingot connected below self-powered platform, can immerse in mortar pin groove when silicon ingot moves down, in mortar pin groove, mortar is to overflow, carry out cleaning cooling to passing cutting steel wire, when cutting steel wire rotates simultaneously, mortar can contact with the bottom of cutting steel wire along the excessive stock tank at guided wheel slot place, improve service life and the cutting effect of cutting steel wire, reduce the fracture rate of cutting steel wire.Jet pipe and blowpipe also have cooling and clear bits effect to cutting steel wire in addition.
Self-powered platform is embedded with the work rest of horizontal slip, and work rest lower surface is fixed with connecting plate, and connecting plate and silicon ingot are fixed by glue.
Self-powered platform lower end has T-slot, and falsework upper end has the sliding shoe mutually mated with T-slot, and T-slot two ends are also provided with and can control to swing up and down locating part in addition, when sliding shoe is embedded in T-slot, can again move by limit slippage block to lower swing locating part.
The horizontal plane of the mortar in mortar pin groove flushes with cutting steel wire.
Adopt above structure, make cutting steel wire through mortar pin groove, continuous coo1ing and the cleaning of mortar can be subject to, improve its service life and cutting effect.
Screen pack is provided with in the middle part of mortar pin groove.
Adopt above structure, the scrap collecting produced when can effectively be cut by silicon ingot, is convenient to the cleaning of staff.
Sand outlet is had bottom mortar pin groove.
Adopt above structure, be convenient to mortar excretion in mortar pin groove and change, or when stopping cutting, be convenient to mortar to collect, by the time continue during lower task to use, avoid mortar to expose for a long time not using causing its internal component to join routine offset influence effect.
Jet pipe is parallel with blowpipe.
Adopt above structure, the cooling on the every bar cutting steel wire on guarantee guide wheel and the uniformity of slagging-off, improve silicon ingot cutting effect.
Compared with prior art, the advantage of the cutter sweep of this silicon chip slicer have following some:
Adopt blowpipe and jet pipe in the cutter sweep of 1, this silicon chip slicer, improve the effect that cools of cleaning capacity and cutting steel wire further, guarantee that the chip on cutting steel wire is thoroughly blown clean, reduce the fracture rate of cutting steel wire.
2, excessive stock tank is circumferentially provided with due on the two sides that contact with cutting steel wire at guided wheel slot, mortar can flow to the bottom of guided wheel slot along excessive stock tank, fully contact with the latter half of cutting steel wire, the latter half of such cutting steel wire also has mortar to cool, fricative high temperature between cutting steel wire and guided wheel slot is taken away immediately by particle loaded fluid, therefore can not affect cutting steel wire tensile strength, cutting steel wire is not easy fracture.
Can immerse in mortar completely when silicon ingot moves down in the cutter sweep of 3, this silicon chip slicer, ensure that the mortar of q.s participates in cutting, can effectively improve silicon ingot cutting power, improve silicon ingot cut quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of the cutter sweep of this silicon chip slicer.
Fig. 2 is the side view of the cutter sweep of this silicon chip slicer.
Fig. 3 is the connection layout of guide wheel and cutting steel wire.
Fig. 4 is the sectional view of guided wheel slot in the cutter sweep of this silicon chip slicer.
Fig. 5 is the partial top view of guided wheel slot.
In figure, 1, cylinder; 2, self-powered platform; 3, cutting steel wire; 4, guide wheel; 5, silicon ingot; 6, sand outlet; 7, mortar pin groove; 8, crossed beam trunking; 9, jet pipe; 10, blowpipe; 11, guided wheel slot; 12, overflow stock tank; 13, connecting plate; 14, screen pack; 15, work rest.
Detailed description of the invention
Be below specific embodiment of the utility model and by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiments.
As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4, Fig. 5, the cutter sweep of this silicon chip slicer, comprise frame, cylinder 1, self-powered platform 2, cutting steel wire 3, guide wheel 4, self-powered platform can be connected with silicon ingot 52 times, cylinder 1 is fixed in frame, cylinder 1 drives self-powered platform 2 to move up and down, guide wheel 4 to be rotatably connected in frame and to be provided with mortar pin groove 7 between two guide wheels 4, mortar pin groove 7 is positioned at immediately below self-powered platform 2, mortar pin groove 7 is rectangular-shaped and upper end open, and mortar pin groove 7 top edge is provided with the crossed beam trunking 8 passed for cutting steel wire 3.
Self-powered platform 2 is embedded with the work rest 15 of horizontal slip, and work rest 15 lower surface is fixed with connecting plate 13, and connecting plate 13 and silicon ingot 5 are fixed by glue.Self-powered platform 2 lower end has T-slot, and falsework upper end has the sliding shoe mutually mated with T-slot, and T-slot two ends are also provided with and can control to swing up and down locating part in addition, when sliding shoe is embedded in T-slot, can again move by limit slippage block to lower swing locating part.
Self-powered platform 2 both sides are provided with towards the jet pipe 9 of cutting steel wire 3 spray furnace and the blowpipe 10 towards cutting steel wire 3 air blowing, and jet pipe 9 is parallel with blowpipe 10.Cooling on every bar cutting steel wire 3 on guarantee guide wheel 4 and the uniformity of slagging-off, improve silicon ingot 5 cutting effect.
The horizontal plane of the mortar in mortar pin groove 7 flushes with cutting steel wire 3.Make cutting steel wire 3 when through mortar pin groove 7, continuous coo1ing and the cleaning of mortar can be subject to, improve its service life and cutting effect.Screen pack 14 is provided with in the middle part of mortar pin groove 7.The scrap collecting produced when can effectively be cut by silicon ingot 5, is convenient to the cleaning of staff.Sand outlet 6 is had bottom mortar pin groove 7.Be convenient to mortar excretion in mortar pin groove 7 and change, or when stopping cutting, be convenient to mortar to collect, by the time continue during lower task to use, avoid mortar to expose for a long time not using causing its internal component to join routine offset influence effect.
Guide wheel 4 has guided wheel slot 11, cutting steel wire 3 is around in guided wheel slot 11, guided wheel slot 11 is opened on guide wheel 4 vertically equably, and the shape of cross section of guided wheel slot 11 is isosceles trapezoid or equilateral triangle, and the two sides that guided wheel slot 11 contacts with cutting steel wire 3 are circumferentially provided with excessive stock tank 12.
Self-powered platform 2 upper end has four cylinders 1, four cylinders 1 are evenly distributed in four corners of self-powered platform 2, push rod and the self-powered platform 2 of cylinder 1 are connected, improve stationarity when cylinder 1 drives self-powered platform 2 to move up and down, crossed beam trunking 8 quantity of mortar pin groove 7 side is the same with guided wheel slot 11 quantity on guide wheel 4, cutting steel wire 3 is set in the corresponding guided wheel slot 11 on two guide wheels 4, and the cutting steel wire 3 of upper end horizontal segment penetrates mortar pin groove 7 from side crossed beam trunking 8 and passes from the corresponding crossed beam trunking 8 of opposite side.Cylinder 1 promotes self-powered platform 2 when moving down, cutting steel wire 3 can cut the silicon ingot 5 connected below self-powered platform 2, can immerse when silicon ingot 5 moves down in mortar pin groove 7, in mortar pin groove 7, mortar is to overflow, carry out cleaning cooling to passing cutting steel wire 3, when cutting steel wire 3 rotates simultaneously, mortar can contact with the bottom of cutting steel wire 3 along the excessive stock tank 12 at guided wheel slot 11 place, improve service life and the cutting effect of cutting steel wire 3, reduce the fracture rate of cutting steel wire 3.Jet pipe 9 and blowpipe 10 pairs of cutting steel wires 3 also have cooling and clear bits effect in addition.
Basic functional principle: inject a certain amount of mortar in mortar pin groove 7, by glue, silicon ingot 5 is fixed on connecting plate 13 lower end, is embedded the T-slot on self-powered platform 2 by the sliding shoe of station frame upper end, is fixed by locating part.Recycling cylinder 1 promotes self-powered platform 2 and moves down, cutting steel wire 3 pairs of silicon ingots 5 cut, when silicon ingot 5 immerses mortar pin groove 7, mortar upwards overflows and is cooled by the cutting steel wire 3 through mortar pin groove 7, jet pipe 9 and blowpipe 10 carry out cooling and clear bits towards cutting steel wire 3 to the cutting steel wire 3 in work, make cutting steel wire 3 not easy fracture, improve cutting effect.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present utility model or surmount the scope that appended claims defines.
Although more employ cylinder 1, self-powered platform 2, cutting steel wire 3, guide wheel 4, silicon ingot 5, sand outlet 6, mortar pin groove 7, crossed beam trunking 8, jet pipe 9, blowpipe 10, guided wheel slot 11 herein, overflow the terms such as stock tank 12, connecting plate 13, screen pack 14, work rest 15, do not get rid of the possibility using other term.These terms are used to be only used to describe and explain essence of the present utility model more easily; The restriction that they are construed to any one additional is all contrary with the utility model spirit.
Claims (6)
1. the cutter sweep of a silicon chip slicer, comprise frame, cylinder (1), self-powered platform (2), cutting steel wire (3), guide wheel (4), silicon ingot (5) can be connected with under self-powered platform (2), cylinder (1) is fixed in frame, cylinder (1) drives self-powered platform (2) to move up and down, guide wheel (4) to be rotatably connected in frame and to be provided with mortar pin groove (7) between two guide wheels (4), mortar pin groove (7) is positioned at immediately below self-powered platform (2), mortar pin groove (7) is in rectangular-shaped and upper end open, mortar pin groove (7) top edge is provided with the crossed beam trunking (8) passed for cutting steel wire (3), self-powered platform (2) both sides are provided with towards the jet pipe (9) of cutting steel wire (3) spray furnace and the blowpipe (10) of blowing towards cutting steel wire (3), guide wheel (4) has guided wheel slot (11), cutting steel wire (3) is around in guided wheel slot (11), guided wheel slot (11) is opened on guide wheel (4) vertically equably, the shape of cross section of guided wheel slot (11) is isosceles trapezoid or equilateral triangle, the two sides that guided wheel slot (11) contacts with cutting steel wire (3) are circumferentially provided with excessive stock tank (12).
2. the cutter sweep of a kind of silicon chip slicer according to claim 1, it is characterized in that, self-powered platform (2) is embedded with the work rest (15) of horizontal slip, and work rest (15) lower surface is fixed with connecting plate (13), and connecting plate (13) and silicon ingot (5) are fixed by glue.
3. the cutter sweep of a kind of silicon chip slicer according to claim 2, is characterized in that, the horizontal plane of the mortar in mortar pin groove (7) flushes with cutting steel wire (3).
4. the cutter sweep of a kind of silicon chip slicer according to claim 3, is characterized in that, mortar pin groove (7) middle part is provided with screen pack (14).
5. the cutter sweep of a kind of silicon chip slicer according to claim 4, is characterized in that, mortar pin groove (7) bottom has sand outlet (6).
6. the cutter sweep of a kind of silicon chip slicer according to claim 1, is characterized in that, jet pipe (9) is parallel with blowpipe (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520531474.9U CN204844530U (en) | 2015-07-21 | 2015-07-21 | Cutting device of silicon chip slicer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520531474.9U CN204844530U (en) | 2015-07-21 | 2015-07-21 | Cutting device of silicon chip slicer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204844530U true CN204844530U (en) | 2015-12-09 |
Family
ID=54735123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520531474.9U Active CN204844530U (en) | 2015-07-21 | 2015-07-21 | Cutting device of silicon chip slicer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204844530U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106976167A (en) * | 2017-03-17 | 2017-07-25 | 浙江好亚能源股份有限公司 | Diamond cutting line slicing machine |
-
2015
- 2015-07-21 CN CN201520531474.9U patent/CN204844530U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106976167A (en) * | 2017-03-17 | 2017-07-25 | 浙江好亚能源股份有限公司 | Diamond cutting line slicing machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205167279U (en) | Silicon wafer cutting device | |
| CN203391130U (en) | Silicon chip cutting device | |
| CN102528955A (en) | Cutting cooling device of diamond wire | |
| CN103786274B (en) | Polycrystal silicon ingot evolution diamond wire saw device | |
| CN108214952A (en) | A kind of full-automatic distributed polysilicon excavation machine and evolution method | |
| CN103072211A (en) | Fretsaw cutting method | |
| CN104502826A (en) | Polycrystalline silicon ingot casting rapid test method | |
| CN102172997B (en) | Silicon crystal line cutting equipment | |
| CN204844530U (en) | Cutting device of silicon chip slicer | |
| CN203331253U (en) | Device utilizing diamond saw blade to achieve polycrystalline silicon ingot squaring cutting | |
| CN204278268U (en) | Pv600 slicer tilting gauze cutter sweep | |
| CN202640588U (en) | Precisely-positioning cutting device of solar battery silicon wafer | |
| CN211465783U (en) | Glass guiding device for linear glass edge grinding machine | |
| CN201150982Y (en) | Wedge-shaped casting blank online cutting equipment | |
| CN201808158U (en) | Solar silicon chip cutting directing bar | |
| CN203401612U (en) | Cutting device of cement fiber plate | |
| CN206230340U (en) | A kind of edge polisher with membrane removal function | |
| CN201970408U (en) | Cutting clamp for crystal silicon block | |
| CN207874598U (en) | A kind of full-automatic distributed polysilicon excavation machine | |
| CN203527671U (en) | Silicon ingot cutting device | |
| CN205416040U (en) | High -speed accurate cutting machine of ultra -thin slabstone | |
| CN105365062A (en) | Method for cutting off heads and tails for squarer | |
| CN203712893U (en) | Slurry baffle for silicon wafer multi-wire sawing machine | |
| CN207840050U (en) | Continuous grid casting automatic flattening press | |
| CN208148219U (en) | The lateral 45 degree of cutter devices of stone material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 314415 21 pillow Road, Huang Wan Town, Haining, Jiaxing, Zhejiang Patentee after: Zhejiang Hao Neng Au Optronics Co Address before: 314415 21 pillow Road, Huang Wan Town, Haining, Jiaxing, Zhejiang Patentee before: ZHEJIANG HOUNEN SOLAR CO., LTD. |