CN103009489A - Method and device for cutting silicon ingot - Google Patents
Method and device for cutting silicon ingot Download PDFInfo
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- CN103009489A CN103009489A CN2012105302047A CN201210530204A CN103009489A CN 103009489 A CN103009489 A CN 103009489A CN 2012105302047 A CN2012105302047 A CN 2012105302047A CN 201210530204 A CN201210530204 A CN 201210530204A CN 103009489 A CN103009489 A CN 103009489A
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- mortar
- pin groove
- cutting
- silicon ingot
- mortar pin
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Abstract
The invention relates to a method for cutting a silicon ingot. The method comprises the following steps of: arranging a mortar tank loaded with mortar between two guide wheels, wherein a cutting line net is arranged on the two guide wheels; and slicing the silicon ingot by using the cutting line net, and enabling the cutting line net to be immersed in the mortar of the mortar tank during slicing and the quantity of the mortar in the mortar tank to be kept in dynamic balance. In addition, the invention also provides a device for cutting the silicon ingot. According to the method and device for cutting the silicon ingot, the mortar tank is arranged between the two guide wheels, the cutting line net can be immersed in the mortar of the mortar tank during slicing, the cutting line net sand discharging holes to ensure that the quantity of the mortar in the mortar tank can be kept in dynamic balance, therefore the sand carrying capacity of a steel line and a mortar cutting capacity can be remarkably improved, the proportion of defects such as line marks introduced by insufficiency of cutting capacity is reduced, the existing slicing yield can be increased by above 5 percent, and thus the production cost of a silicon wafer is lowered.
Description
Technical field
The invention belongs to photovoltaic equipment preparation field, be specifically related to a kind of method and device that cuts silicon ingot.
Background technology
When silicon ingot cut into silicon chip, the yield rate of section mainly was to be determined by the band sand ability of steel wire and the cutting power of carborundum.In slicing processes, because action of gravitation, the mortar on the steel wire is drippage downwards, and along with the wearing and tearing of steel wire, it is with husky ability also can descend to some extent; Simultaneously, owing to the pressure that reduces cost, the at present recovery in the mortar is husky constantly to raise with recovery liquid usage ratio, and this also causes the section ability to descend.The decline of the section ability of the husky ability of steel wire band and mortar, can cause silicon chip stria, collapse the rising of the defective proportion such as limit and unfilled corner, this all can have a strong impact on the cutting yield of silicon chip, this becomes one of bottleneck of restriction silicon chip cost.
Summary of the invention
Based on this, be necessary to provide a kind of method of cutting silicon ingot, the section yield rate of silicon ingot is promoted, reduce section cost and silicon chip cost.
A kind of method of cutting silicon ingot may further comprise the steps: the mortar pin groove that mortar is housed is set between two guide wheels that are furnished with the cutting gauze; Utilize described cutting gauze that silicon ingot is cut into slices, the cutting gauze is immersed in the mortar of mortar pin groove, and make the mortar amount in the mortar pin groove keep dynamic equilibrium.
Among embodiment, the upper edge of mortar pin groove is concordant with the cutting gauze therein, and the line bow that utilizes silicon ingot to produce during section is pressed into gauze in the mortar pin groove.
Among embodiment, mortar pin groove can move up and down therein, and mortar pin groove is risen, and passes gauze, thereby the cut surface of cutting gauze is immersed in the mortar of mortar pin groove.
Among embodiment, during section, mortar enters mortar pin groove from the gauze top therein, discharges from side or the bottom of mortar pin groove; When perhaps cutting into slices, mortar enters mortar pin groove from side bottom or the bottom surface of mortar pin groove, discharges from the top, side of mortar pin groove.
In addition, also be necessary to provide a kind of device that cuts silicon ingot, comprise two guide wheels, be arranged in cutting gauze and mortar pin groove between described two guide wheels on described two guide wheels, described mortar pin groove is provided with sand outlet.
Among embodiment, the upper edge of described mortar pin groove is concordant with described cutting gauze therein.
Among embodiment, the below of described mortar pin groove is provided with lowering or hoisting gear therein.
Among embodiment, described sand outlet is arranged on bottom surface or the side bottom of described mortar pin groove therein.
Among embodiment, the bottom land of described mortar pin groove is provided with the slope therein.
Among embodiment, the top, side of described mortar pin groove also is provided with charging hole therein.
The method of above-mentioned cutting silicon ingot and device, be provided with mortar pin groove between two guide wheels, the cutting gauze can be immersed in the mortar of mortar pin groove during section, and mortar pin groove is provided with lets out husky hole and makes the mortar amount in the mortar pin groove can keep dynamic equilibrium, can obviously improve the husky ability of band of steel wire and the cutting power of mortar, reduction can improve existing section yield rate more than 5 percentage points owing to the ratio of the not enough defectives such as stria of introducing of cutting power, thus the production cost of reduction silicon chip.
Description of drawings
Fig. 1 is the device of the front cutting of section silicon ingot and the schematic diagram of silicon ingot;
Fig. 2 is the structural representation of mortar pin groove;
Fig. 3 and Fig. 4 are the working state figure of the device of cutting silicon ingot.
The specific embodiment
Please refer to Fig. 1, present embodiment provides a kind of device 100 that cuts silicon ingot, be used for silicon ingot 200 is cut into slices, it comprises two guide wheels 110, be arranged in two on the guide wheel 110 cutting gauze 120, in the mortar pin groove 130 between two guide wheels 110 and be positioned at lowering or hoisting gear 140 below the mortar pin groove 130.
Please refer to Fig. 1 and Fig. 2, mortar pin groove 130 can be rectangular structure.The top, side of mortar pin groove 130 offers charging hole 132, and side bottom offers sand outlet 134.During use, charging hole 132 is in order to the mortar of annotating in mortar pin groove 130, and sand outlet 134 is used for getting rid of mortar, makes the mortar amount in the mortar pin groove 130 can keep dynamic equilibrium, makes the cutting power of mortar maintain the standard that needs.The role who it may be noted that charging hole 132 and sand outlet 134 can exchange, and namely charging hole 132 is in order to discharging mortar, and from sand outlet 134 places filling mortar.In addition, it may be noted that charging hole 132 and sand outlet 134 can be all in order to discharge mortar, can utilize the instrument such as nozzle directly in groove, to add mortar when needing to add mortar, also can make the mortar amounts in the mortar pin groove 130 keep dynamic equilibrium.In addition, can also be in the bottom surface of mortar pin groove 130 opening to be set, for advancing sand or sediment outflow.The bottom land of mortar pin groove 130 can also arrange wedge slope, prevents the mortar precipitation, is beneficial to mortar and discharges.The groove inside dimension that is appreciated that mortar pin groove 130 is relevant with silicon ingot to be cut, need not to give unnecessary details.
Please refer to Fig. 1, the lowering or hoisting gear 140 of mortar pin groove 130 belows rises in order to drive mortar pin groove 130 when cutting into slices, and makes cutting gauze 120 be arranged in the mortar of mortar pin groove 130.About this point, will further describe hereinafter.Lowering or hoisting gear 140 can be the elevating mechanism of hydraulicefficiency elevation structure or other types.
Present embodiment has also proposed a kind of method of cutting silicon ingot, the mortar pin groove that mortar is housed at first is set between two guide wheels that are furnished with the cutting gauze, also namely be combined into the device 100 of above-mentioned cutting silicon ingot, then utilize 120 pairs of silicon ingots of above-mentioned cutting gauze to cut into slices, the cut surface of cutting gauze 120 is positioned at below the mortar liquid level in slicing processes, mortar amount in the mortar pin groove 130 keeps dynamic equilibrium simultaneously, makes mortar keep necessary cutting power.Illustrate below in conjunction with embodiment how said method is realized.
Embodiment 1
The mortar pin groove 130 that mortar is housed at first is set between two guide wheels 110 that are furnished with cutting gauze 120.In the present embodiment, mortar pin groove 130 and is fixed on the slicer between two guide wheels 110, and the little side's ingot 200 of slice is of a size of 156 * 156 * 1000mm, and the groove inside dimension of mortar pin groove 130 is 210 * 250 * 1100mm.
Next, utilize 120 pairs of silicon ingots of cutting gauze to cut into slices, cutting gauze 120 is immersed in the mortar of mortar pin groove 130, and make the mortar amount in the mortar pin groove 130 keep dynamic equilibrium.In the present embodiment, the cutting gauze 120 of mortar above mortar pin groove 130 enters the mortar pin groove 130, discharge from the sand outlet 134 of mortar pin groove 130 side bottom, when being full of mortar in the mortar pin groove 130, keep the discharge rate of mortar identical with influx, namely the mortar amount in the mortar pin groove 130 keeps dynamic equilibrium.Please refer to Fig. 3, during section, utilize lowering or hoisting gear 140 that mortar pin groove 130 is promoted, so that stop to rise behind the cutting gauze 120 cutting mortar pin groove about 10mm in 130 sides.During cutting, cutting gauze 120 is immersed in the mortar of mortar pin groove 130, and the cut surface of silicon ingot is positioned at below the mortar liquid level.After the section, by the detection to silicon ingot, the stria of silicon chip, collapse limit etc. because the defective proportion summation that cutting force causes reduces by 3 percentage points, the section yield has improved 5.5 percentage points.
Embodiment 2
The mortar pin groove 130 that mortar is housed at first is set between two guide wheels 110 that are furnished with cutting gauze 120.In the present embodiment, the little side's ingot 200 of slice is of a size of 125 * 125 * 800mm, and the groove inside dimension of mortar pin groove 130 is 200 * 135 * 900mm, and the upper edge of mortar pin groove 130 is concordant with cutting gauze 120.
Next, utilize 120 pairs of silicon ingots of cutting gauze to cut into slices, cutting gauze 120 is immersed in the mortar of mortar pin groove 130, and make the mortar amount in the mortar pin groove 130 keep dynamic equilibrium.In the present embodiment, mortar enters the mortar pin groove 130 from the charging hole 132 on the top, side of mortar pin groove 130, discharge from the sand outlet 134 of mortar pin groove 130 side bottom, when being full of mortar in the mortar pin groove 130, keep the discharge rate of mortar identical with influx, namely the mortar amount in the mortar pin groove 130 keeps dynamic equilibrium.Please refer to Fig. 4, during section, the silicon ingot Cutting Drag makes cutting gauze 120 produce downward gauze line bow, thereby cutting gauze 120 is immersed in the mortar of mortar pin groove 130, and the cut surface of silicon ingot is positioned at below the mortar liquid level.After the section, by the detection to silicon ingot, the stria of silicon chip, collapse limit etc. because the defective proportion summation that cutting force causes reduces by 2.5 percentage points, the section yield has improved 5 percentage points.
To sum up, the method of above-mentioned cutting silicon ingot and device, the cutting gauze is immersed in the mortar of mortar pin groove during section, and the mortar amount of mortar pin groove keeps dynamic equilibrium, can obviously improve the husky ability of band of steel wire and the cutting power of mortar, reduction can improve existing section yield rate more than 5 percentage points owing to the ratio of the not enough defectives such as stria of introducing of cutting power, thus the production cost of reduction silicon chip.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a method of cutting silicon ingot is characterized in that, may further comprise the steps:
The mortar pin groove that mortar is housed is set between two guide wheels that are furnished with the cutting gauze;
Utilize described cutting gauze that silicon ingot is cut into slices, the cutting gauze is immersed in the mortar of mortar pin groove, and make the mortar amount in the mortar pin groove keep dynamic equilibrium.
2. the method for cutting silicon ingot according to claim 1 is characterized in that, the upper edge of mortar pin groove is concordant with the cutting gauze, and the line bow that utilizes silicon ingot to produce during section is pressed into gauze in the mortar pin groove.
3. the method for cutting silicon ingot according to claim 1 is characterized in that, mortar pin groove can move up and down, and mortar pin groove is risen, and passes gauze, thereby the cut surface of cutting gauze is immersed in the mortar of mortar pin groove.
4. the method for the described cutting silicon ingot of arbitrary claim in 3 according to claim 1 is characterized in that during section, mortar enters mortar pin groove from the gauze top, discharges from side or the bottom of mortar pin groove; When perhaps cutting into slices, mortar enters mortar pin groove from side bottom or the bottom surface of mortar pin groove, discharges from the top, side of mortar pin groove.
5. a device that cuts silicon ingot is characterized in that, comprises two guide wheels, is arranged in cutting gauze and mortar pin groove between described two guide wheels on described two guide wheels, and described mortar pin groove is provided with sand outlet.
6. the device of cutting silicon ingot according to claim 5 is characterized in that, the upper edge of described mortar pin groove is concordant with described cutting gauze.
7. the device of cutting silicon ingot according to claim 5 is characterized in that, the below of described mortar pin groove is provided with lowering or hoisting gear.
8. the device of the described cutting silicon ingot of arbitrary claim in 7 according to claim 5 is characterized in that described sand outlet is arranged on bottom surface or the side bottom of described mortar pin groove.
9. the device of cutting silicon ingot according to claim 8 is characterized in that, the bottom land of described mortar pin groove is provided with the slope.
10. the device of cutting silicon ingot according to claim 8 is characterized in that, the top, side of described mortar pin groove also is provided with charging hole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210530204.7A CN103009489B (en) | 2012-12-11 | 2012-12-11 | Method and device for cutting silicon ingot |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210530204.7A CN103009489B (en) | 2012-12-11 | 2012-12-11 | Method and device for cutting silicon ingot |
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| CN103009489A true CN103009489A (en) | 2013-04-03 |
| CN103009489B CN103009489B (en) | 2015-07-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833955A (en) * | 2022-05-31 | 2022-08-02 | 青岛高测科技股份有限公司 | Wire cutting machine |
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| JP2006181688A (en) * | 2004-12-28 | 2006-07-13 | Allied Material Corp | Cutting method by superabrasive wire saw and superabrasive wire saw cutting device |
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| CN202088316U (en) * | 2011-02-14 | 2011-12-28 | 上海日进机床有限公司 | Silicon crystal wire cutting machine |
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| CN202964937U (en) * | 2012-12-11 | 2013-06-05 | 江苏协鑫硅材料科技发展有限公司 | Device for cutting silicon ingot |
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2012
- 2012-12-11 CN CN201210530204.7A patent/CN103009489B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2006181688A (en) * | 2004-12-28 | 2006-07-13 | Allied Material Corp | Cutting method by superabrasive wire saw and superabrasive wire saw cutting device |
| CN102172997A (en) * | 2011-02-14 | 2011-09-07 | 上海日进机床有限公司 | Silicon crystal line cutting equipment |
| CN102172996A (en) * | 2011-02-14 | 2011-09-07 | 上海日进机床有限公司 | Crystal immersing and cutting method |
| CN202088316U (en) * | 2011-02-14 | 2011-12-28 | 上海日进机床有限公司 | Silicon crystal wire cutting machine |
| CN202241655U (en) * | 2011-09-30 | 2012-05-30 | 浙江思博恩新材料科技有限公司 | Device for sealing cutting fluid |
| CN102544240A (en) * | 2012-03-09 | 2012-07-04 | 润峰电力有限公司 | Method and device for integrating slicing and flocking of crystalline silicon wafer |
| CN202964937U (en) * | 2012-12-11 | 2013-06-05 | 江苏协鑫硅材料科技发展有限公司 | Device for cutting silicon ingot |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833955A (en) * | 2022-05-31 | 2022-08-02 | 青岛高测科技股份有限公司 | Wire cutting machine |
| CN114833955B (en) * | 2022-05-31 | 2024-02-02 | 青岛高测科技股份有限公司 | Wire cutting machine |
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| CN103009489B (en) | 2015-07-01 |
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