CN103817812B - The evolution method of silicon ingot, brilliant holder - Google Patents
The evolution method of silicon ingot, brilliant holder Download PDFInfo
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- CN103817812B CN103817812B CN201410107923.7A CN201410107923A CN103817812B CN 103817812 B CN103817812 B CN 103817812B CN 201410107923 A CN201410107923 A CN 201410107923A CN 103817812 B CN103817812 B CN 103817812B
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- silicon ingot
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- gauze
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 110
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 110
- 239000010703 silicon Substances 0.000 title claims abstract description 110
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000005520 cutting process Methods 0.000 claims abstract description 43
- 239000000126 substance Substances 0.000 claims abstract description 37
- 238000009412 basement excavation Methods 0.000 claims abstract description 12
- 230000033001 locomotion Effects 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000149 penetrating effect Effects 0.000 description 9
- 239000004484 Briquette Substances 0.000 description 8
- 238000004804 winding Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000002085 persistent effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000013082 photovoltaic technology Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Abstract
The invention provides a kind of evolution method of silicon ingot, brilliant holder, wherein said method comprises: the invariant position keeping the guider in excavation machine cutting chamber, many lines of cut are walked around guider, and pass from the multiple tracks groove of crystalline substance holder one to one, form below gauze, below gauze comprises first group of line of cut along first direction and second group of line of cut along second direction, and first direction and second direction are mutually vertical; Below gauze is moved from the bottom to top, silicon ingot is cut.In the evolution method of silicon ingot provided by the present invention, saw blade cutting can be utilized after disconnecting to complete evolution from the bottom of silicon ingot, the line of cut changed after avoiding broken string cannot penetrate the problem in silicon ingot again by the gap cut open before, make operating personnel without the need to manually breaking the uncut part of silicon ingot into two with one's hands, thus also just avoid silicon ingot and manually break the underproof problem of portion size into two with one's hands, save production cost.
Description
Technical field
The present invention relates to field of photovoltaic technology, more particularly, relate to a kind of evolution method of silicon ingot.
Background technology
Along with the reach of science, the progress of technology, countries in the world are more and more paid attention to energy-saving and emission-reduction and environmental protection aspect.Photovoltaic industry, as the important component part in energy-saving and emission-reduction project, obtains swift and violent development.The industrial chain that photovoltaic industry is complete is: between silicon material → pouring hall → silicon chip workshop → battery car → and assembly workshop → application system → energy-storage system.
Silicon chip is as one of requisite raw material of making solar battery sheet, its manufacturing process is roughly: the silicon material after purification and processing is carried out long crystalline substance and casts silicon ingot, again silicon ingot is cut into the silico briquette be of the required size, then silico briquette is cut into slices, then obtain silicon chip after a series of processing.Wherein, process silicon ingot being cut into the silico briquette be of the required size is called evolution operation.
First need during evolution silicon ingot foamed glue to be bonded in brilliant holder, then the crystalline substance holder being stained with silicon ingot is placed in the cutting chamber of excavation machine.In cutting chamber, have the guider for controlling line of cut position, many lines of cut are walked around guider and are divided into two groups, two groups of lines of cut respectively along two orthogonal directions, above silicon ingot formed above gauze.Cutting head in cutting chamber drives gauze above this to move from top to bottom, and every bar line of cut all moves along its length direction simultaneously, thus silicon ingot is cut into the silico briquette be of the required size by the mode of scroll saw.Wherein, brilliant holder has the position multiple tracks groove one to one with every bar line of cut of above-mentioned gauze in the one side of bonding silicon ingot, line of cut be cut to (namely will complete cutting) bottom silicon ingot time, can form a very large line bow (height not cut in the middle of silicon ingot is greater than the height that surrounding is not cut), the groove in brilliant holder is in order to avoid designed by the brilliant holder of line of cut cutting.
Broken string situation may be there is in above-mentioned evolution process, need the line of cut of fracture to change.But, after broken string usually occurs in that silicon ingot is cut and opens a part, now above silicon ingot, the cut part held can because the gap cut open presses together by the gravity of silico briquette self, when causing changing line of cut, line of cut can only be extracted out from silicon ingot, and cannot intact line of cut be penetrated in silicon ingot by cut gap of opening again, and then cause cutting silicon ingot below again, can only manually uncut part be broken into two with one's hands.And the size of the part manually broken into two with one's hands is undesirable certainly, this will cause the loss on cost.
Summary of the invention
The invention provides a kind of evolution method of silicon ingot, brilliant holder, break during to solve evolution and cannot cause the problem of cost allowance to uncut part cutting.
For achieving the above object, the invention provides following technical scheme:
A kind of evolution method of silicon ingot, comprise: the invariant position keeping the guider in excavation machine cutting chamber, many lines of cut are walked around described guider, and pass from the multiple tracks groove of crystalline substance holder one to one, form below gauze, described below gauze comprises first group of line of cut along first direction and second group of line of cut along second direction, and described first direction and second direction are mutually vertical; Described below gauze is moved from the bottom to top, silicon ingot is cut.
Preferably, the described described below gauze that makes moves from the bottom to top, carry out cutting to described silicon ingot to be specially: described below gauze is connected with the cutting head in described cutting chamber, utilize described cutting head to drive described below gauze to move from the bottom to top, described silicon ingot is cut.
Preferably, described silicon ingot asks the one side with described multiple tracks groove bonding by foamed glue with described crystalline substance.
Preferably, described first group of line of cut and second group of line of cut spaced in the direction of motion of described gauze.
Present invention also offers a kind of brilliant holder, be applied to the evolution method of the silicon ingot described in above any one, described crystalline substance holder has multiple tracks groove in the one side bonding with described silicon ingot, described multiple tracks groove includes: the channel part being used for the one side bonding with described silicon ingot perpendicular to described crystalline substance holder, and described line of cut arrives the one side of described silicon ingot towards described crystalline substance holder by described channel part; Be positioned at described channel part deviate from described crystalline substance holder for the one side bonding with described silicon ingot end penetrate part, described in penetrate part be interconnected with described channel part, penetrate described in described line of cut passes through part pass from described groove.
Preferably, the part that penetrates of groove described at least one is square structure or spherical structure.
Preferably, the part that penetrates of groove described at least one is positioned at the side of described channel part.
Compared with prior art, technical scheme provided by the present invention at least has the following advantages:
In the evolution method of silicon ingot provided by the present invention, from top to bottom silicon ingot is cut in employing evolution method of the prior art, after line of cut fracture, keep the invariant position of excavation machine guider, many lines of cut are walked around guider, and passes from the multiple tracks groove of crystalline substance holder one to one, below silicon ingot, form below gauze, then make below gauze cut the part that silicon ingot is not cut from the bottom to top, thus complete evolution process.In said method, saw blade cutting can be utilized after disconnecting to complete evolution from the bottom of silicon ingot, the line of cut changed after avoiding broken string cannot penetrate the problem in silicon ingot again by the gap cut open before, make operating personnel without the need to manually breaking the uncut part of silicon ingot into two with one's hands, thus also just avoid silicon ingot and manually break the underproof problem of portion size into two with one's hands, save production cost.
Crystalline substance holder provided by the present invention can coordinate the evolution method of above-mentioned silicon ingot to use, its groove comprises the channel part that is interconnected and penetrates part, line of cut partially passes through groove formation below gauze by penetrating, arrive the one side of silicon ingot towards crystalline substance holder by channel part, thus realize silicon ingot cutting from the bottom to top.Wherein, the setting penetrating part can effectively avoid groove all by foamed glue shutoff, causes the problem that line of cut cannot pass from groove.Visible, the crystalline substance holder that the present embodiment provides makes the evolution method of above-mentioned silicon ingot be more convenient for implementing, and enhances the feasibility of said method.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is form when ideally silicon ingot is cut out a part;
Fig. 2 is form when silicon ingot is cut out a part under actual conditions;
The top view of the below gauze formed in the evolution method of the silicon ingot that Fig. 3 provides for the embodiment of the present invention one;
The structure chart of the crystalline substance holder that Fig. 4 provides for the embodiment of the present invention two.
Detailed description of the invention
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.
Set forth a lot of detail in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar popularization when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when describing the embodiment of the present invention in detail; for ease of explanation; the profile of indication device structure can be disobeyed general ratio and be made partial enlargement, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.In addition, the three-dimensional space of length, width and the degree of depth should be comprised in actual fabrication.
Embodiment one
Present embodiments provide a kind of evolution method of silicon ingot, when the method is applied to evolution after line of cut fracture, specifically comprise the following steps:
Step S1: the invariant position keeping the guider in excavation machine cutting chamber, many lines of cut are walked around guider, and pass from the multiple tracks groove of crystalline substance holder one to one, form below gauze, below gauze comprises first group of line of cut along first direction and second group of line of cut along second direction, and first direction and second direction are mutually vertical;
Excavation machine is used to the equipment cut silicon ingot, silicon ingot can be cut into the silico briquette be of the required size.Preferably, excavation machine mainly comprises: cutting chamber and winding chamber.
Wherein, there is lowering or hoisting gear, cutting head and guider in cutting chamber: lowering or hoisting gear can carry out rising or descending motion, cutting head has four faces of formation one shaped as frame, is fixed on lowering or hoisting gear, is moved by the rise and fall campaign of lowering or hoisting gear, guider comprises the multiple pulley be positioned at above cutting head and the multiple wheel discs be positioned at below pulley, pulley and wheel disc are divided into four groups, lay respectively on four faces, the position one_to_one corresponding of pulley and wheel disc and being parallel to each other, the two all has guide effect to the line of cut walking around guider, the trend of line of cut can be changed into other direction by a direction, as: from the top view of excavation machine, guider is by changing the position of self pulley and/or wheel disc, line of cut can be made to be become perpendicular to from the limit favouring silicon ingot or be parallel to this limit of silicon ingot.
Have Wire winding shaft and paying out reel in winding chamber, two axles rotate simultaneously, and while paying out reel releases line of cut, Wire winding shaft packs up line of cut, makes line of cut moving along himself length direction.
Line of cut, from paying out reel, walks around guider, is divided into two groups of lines of cut along orthogonal both direction, and from the direction overlooking excavation machine, two groups of lines of cut are staggered to form a gauze.Owing to rotating while Wire winding shaft and paying out reel, therefore gauze is actual is formed by the line of cut of many persistent movements.
When carrying out evolution to silicon ingot, first silicon ingot being adhered in brilliant holder, being placed in the cutting chamber of excavation machine.First gauze is made to be formed at the top (i.e. top gauze) of silicon ingot to be cut, cutting head is utilized to drive top gauze to move from top to bottom, line of cut is along himself direction persistent movement to the rubbing action of silicon ingot simultaneously, carries out cutting (i.e. saw blade cutting).
After silicon ingot is cut and opens a part, ideally as shown in Figure 1, between the part that silicon ingot 101 is cut open, should should have gap 102.
But in actual cutting process, due to silicon ingot self gravitation reason, the gap between the part cut open then presses together.As shown in Figure 2, the cut part opened of silicon ingot 201 is due to Action of Gravity Field run-off the straight, and the gap 202 between the cut part opened is above silicon ingot 201, and the degree pressed together is larger, to the top of silicon ingot 201, the face of both sides, gap 202 almost fits together.
When in above-mentioned cutting process from top to bottom, after line of cut ruptures, the line of cut of fracture is extracted out from gap 202, because the gap 202 on silicon ingot top presses together, therefore changed intact line of cut cannot penetrate from the top in silicon ingot gap 202, and arrive the bottom (i.e. the position that cuts to during broken string) in gap 202.
Owing to forming line bow from top to bottom when the groove in crystalline substance holder is for preventing line of cut to be cut to bottom silicon ingot, and then the holder of cutting damage crystalline substance, the groove therefore in brilliant holder and the position of many lines of cut are one to one.In this step, when broken string occurs, cancel top gauze, many intact lines of cut are walked around guider, penetrates from the multiple tracks groove crystalline substance holder one to one respectively, thus form a gauze (namely gauze) in the below of silicon ingot.
As shown in Figure 3, first group of line of cut 301 along first direction aa` interlocks with the second group of line of cut 302 along second direction bb`, on the cephalomotor direction of cutting, between first group of line of cut 301 and second group of line of cut 302, there is certain spacing, observe these lines of cut along the cephalomotor direction of cutting, namely obtain the form of gauze.
In the present embodiment, number to the line of cut that first group of line of cut 301 of the aa` along first direction comprises all specifically does not limit with the number of the line of cut that second group of line of cut 302 along second direction bb` comprises, in actual production, the number of the line of cut of the aa` along first direction and the number along the line of cut of second direction bb` can be determined respectively according to the size of the size of silicon ingot to be cut and the silico briquette that will obtain.For the most much higher crystal silicon solar batteries of current industrialization level, the number along the line of cut of the aa` of first direction preferably can be 7 with the number of the line of cut along second direction bb`.
It should be noted that, " top " and " below " of described silicon ingot specifically can refer to: the plane of placing with excavation machine is datum level, and silicon ingot is " top " near the side of this datum level, and the side away from this datum level is " below ".
Step S2: below gauze is moved from the bottom to top, silicon ingot is cut.
In this step, cutting head is placed in silicon ingot bottom, lowering or hoisting gear is utilized to move from the bottom to top, drive cutting head to move from the bottom to top, and then drive the below gauze formed in above-mentioned steps S1 to arrive the surface of silicon ingot towards crystalline substance holder by groove, and start to move from the bottom to top, in addition rotate while paying out reel and Wire winding shaft, make line of cut along himself length direction persistent movement, thus line of cut constantly rubs below silicon ingot, thus not cut for the silicon ingot part opened is separated from the bottom to top.
During owing to forming below gauze, do not change the position of guider, therefore the position of each line of cut of below gauze is identical with the position of each line of cut of top gauze, namely along the cutting head direction of motion, each line of cut of below gauze overlaps completely with each line of cut of the top gauze from top to bottom moved before, thus ensure that the gap that cutting is from the bottom to top formed and cut the gap accurate contraposition formed from top to bottom, the evolution of silicon ingot is completed smoothly, obtains the silico briquette be of the required size.
The evolution method of the silicon ingot that the present embodiment provides, after line of cut fracture, line of cut is passed from the groove of crystalline substance holder, to form gauze in the below of silicon ingot, and formed gauze is moved from the bottom to top, thus achieve and utilize the mode of saw blade cutting to complete the separation to non-cutting part from silicon ingot below.And in prior art, the part that after broken string, silicon ingot is cut out presses together due to self gravitation, intact line of cut cannot penetrate from the gap between the cut part opened, also just the evolution completing silicon ingot from top to bottom cannot be continued, manually uncut part can only be broken into two with one's hands, cause that to break portion size into two with one's hands defective, and then cause the loss of cost.Contrast known, manually break the underproof problem of portion size that silicon ingot causes after the evolution method of the regulation that the present embodiment provides avoids broken string into two with one's hands, saved production cost.
Embodiment two
Present embodiments provide a kind of brilliant holder, described crystalline substance holder is applied to the evolution method of the silicon ingot described in embodiment one, its structure as shown in Figure 4, described crystalline substance holder 401 has multiple tracks groove 402 in the one side bonding with silicon ingot 404, described multiple tracks groove 402 includes: perpendicular to the channel part 4021 of crystalline substance holder 401 for the one side bonding with silicon ingot 404, line of cut arrives the one side of silicon ingot 404 towards crystalline substance holder 404 by channel part 4021; Be positioned at channel part 4021 deviate from brilliant holder 401 for the one side bonding with silicon ingot 404 end penetrate part 4022, penetrate part 4022 and be interconnected with channel part 4021, line of cut passes from groove 402 by penetrating part 4022.
To be different from prior art the structure of the groove of brilliant holder, the crystalline substance holder that the present embodiment provides, its groove 402 original perpendicular on the basis of crystalline substance holder 401 for the structure of the one side bonding with silicon ingot 404, add be convenient to penetrate line of cut penetrate part 4022.
Owing to penetrating line of cut in the trench, may use threader, the size of threader is larger, only has channel part 4021 possibly threader cannot be made to pass groove, by penetrating the setting of part 4022, threader can be made smoothly from penetrating part 4022 by groove 402; On the other hand, because silicon ingot 404 can be bonded in brilliant holder 401 by foamed glue 403 usually, the setting penetrating part 4022 can effectively avoid foamed glue to be blocked by whole groove 402 in foaming process.In a word, the evolution method of the silicon ingot that the crystalline substance holder that the present embodiment provides can make embodiment one provide is more convenient for implementing, and improves the feasibility making described method.
It should be noted that, based on the above-mentioned effect penetrating part 4022, the present embodiment does not limit the concrete structure penetrating part 4022.Such as, the part 4022 that penetrates of at least one groove 402 preferably can be square structure or spherical structure, or other structure that line of cut can be made arbitrarily to pass; At least one groove 402 penetrate the side that part 4022 preferably can be positioned at channel part 4021, multiplely penetrate the side that part 4022 is positioned at channel part 4021 if exist, then multiplely penetrate the same side that part 4022 preferably can be positioned at channel part 4021.
In addition, although it is pointed out that crystalline substance holder that the present embodiment provides more is conducive to the enforcement of method in embodiment one, the method in embodiment one also can not select the crystalline substance holder in the present embodiment in the application.
Although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention.Any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the Method and Technology content of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (7)
1. an evolution method for silicon ingot, when being applied to evolution after line of cut fracture, is characterized in that, comprising:
Keep the invariant position of the guider in excavation machine cutting chamber, many lines of cut are walked around described guider, and pass from the multiple tracks groove of crystalline substance holder one to one, form below gauze, described below gauze comprises first group of line of cut along first direction and second group of line of cut along second direction, and described first direction and second direction are mutually vertical;
Described below gauze is moved from the bottom to top, silicon ingot is cut.
2. the evolution method of silicon ingot according to claim 1, is characterized in that, described in described below gauze is moved from the bottom to top, cutting is carried out to described silicon ingot and is specially:
Described below gauze is connected with the cutting head in described cutting chamber, utilizes described cutting head to drive described below gauze to move from the bottom to top, described silicon ingot is cut.
3. the evolution method of silicon ingot according to claim 1, is characterized in that, described silicon ingot asks the one side with described multiple tracks groove bonding by foamed glue with described crystalline substance.
4. the evolution method of silicon ingot according to claim 1, is characterized in that, described first group of line of cut and second group of line of cut spaced in the direction of motion of described gauze.
5. a brilliant holder, is characterized in that, be applied to the evolution method of the silicon ingot described in any one of Claims 1 to 4, and described crystalline substance holder has multiple tracks groove in the one side bonding with described silicon ingot, and described multiple tracks groove includes:
Be used for the channel part of the one side bonding with described silicon ingot perpendicular to described crystalline substance holder, described line of cut arrives the one side of described silicon ingot towards described crystalline substance holder by described channel part;
Be positioned at described channel part deviate from described crystalline substance holder for the one side bonding with described silicon ingot end penetrate part, described in penetrate part be interconnected with described channel part, penetrate described in described line of cut passes through part pass from described groove.
6. crystalline substance holder according to claim 5, is characterized in that, the part that penetrates of groove described at least one is square structure or spherical structure.
7. crystalline substance holder according to claim 5, is characterized in that, the part that penetrates of groove described at least one is positioned at the side of described channel part.
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| CN201410107923.7A CN103817812B (en) | 2014-03-21 | 2014-03-21 | The evolution method of silicon ingot, brilliant holder |
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| CN201410107923.7A CN103817812B (en) | 2014-03-21 | 2014-03-21 | The evolution method of silicon ingot, brilliant holder |
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| WO2016141521A1 (en) * | 2015-03-07 | 2016-09-15 | 国电兆晶光电科技江苏有限公司 | Adjustable positioning and bonding device for correct bonding of polycrystalline master ingot squaring and application method thereof |
| CN112553687B (en) * | 2019-09-10 | 2022-03-11 | 苏州阿特斯阳光电力科技有限公司 | Silicon ingot, crucible, silicon ingot casting method and solar cell silicon wafer manufacturing method |
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| JPH03281309A (en) * | 1990-03-30 | 1991-12-12 | Osaka Titanium Co Ltd | Machining method by multiwire saw |
| JPH09272122A (en) * | 1996-04-05 | 1997-10-21 | Sumitomo Metal Ind Ltd | Cutting method with multi-wire saw |
| JPH11198017A (en) * | 1998-01-14 | 1999-07-27 | Tokyo Seiko Co Ltd | Wafer gap maintaining device and method for wire type cutting device |
| JP4578637B2 (en) * | 2000-07-24 | 2010-11-10 | サムコ オレゴン コーポレーション | Interval holder and cutting method using the same |
| US20120048255A1 (en) * | 2009-05-04 | 2012-03-01 | Daniel Fricker | Wire saw |
| US20120272944A1 (en) * | 2009-09-18 | 2012-11-01 | Applied Materials, Inc. | Wire saw work piece support device, support spacer and method of sawing using same |
| CN102756433B (en) * | 2011-04-29 | 2015-07-15 | 苏州协鑫光伏科技有限公司 | Method for rescuing broken wire during silicon wafer linear cutting |
| CN203485318U (en) * | 2013-09-27 | 2014-03-19 | 无锡荣能半导体材料有限公司 | Crystal holder of squaring machine |
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