CN207624729U - Overlength intelligence cob light source led lamps - Google Patents
Overlength intelligence cob light source led lamps Download PDFInfo
- Publication number
- CN207624729U CN207624729U CN201721796091.XU CN201721796091U CN207624729U CN 207624729 U CN207624729 U CN 207624729U CN 201721796091 U CN201721796091 U CN 201721796091U CN 207624729 U CN207624729 U CN 207624729U
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- Prior art keywords
- overlength
- light source
- intelligence
- fluorescent glue
- cob light
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Abstract
The utility model provides a kind of overlength intelligence cob light source led lamps, including LED module, and LED module includes metal substrate, insulating layer, copper foil layer, flip-chip and fluorescent glue, and metal substrate includes first the second plane of plane；Insulating layer is arranged on the first plane；Copper foil layer is arranged on the insulating layer comprising line areas and adhesion zone, line areas include circuit and pad；Flip-chip is fixedly connected on pad by die bond solder paste；Fluorescent glue covers flip-chip, and is adhered to copper foil layer；Fluorescent glue includes being connected to the fluorescent glue main body of adhesion zone and multiple connecting pins in fluorescent glue bottom part body surrounding being arranged, copper foil layer includes the multiple connecting holes being arranged in adhesion zone, connecting pin is inserted into connecting hole, and the bottom width of connecting hole is more than the top width of connecting hole.The utility model by by whole fluorescent glue coat flip-chip so that fluorescent glue under conditions of baking and copper foil layer be bonded one-time fix together with improve product efficiency.
Description
Technical field
The utility model is related to normal lighting equipment technical fields, more particularly to a kind of overlength intelligence cob light source leds
Lamp.
Background technology
Fluorescent tube is the important component of room lighting, especially the LED light of cob light sources, wherein COB light source be
LED chip is placed directly against the specular removal on the mirror metal substrate of high reflecting rate and integrates area source technology.
The commonly used fluorescent tube of family has the length of 1.2m in existing LED lamp tube, and in existing cob light source leds lamp
LED module it is shorter, assemble the fluorescent tube of a 1.2m, multiple LED modules needed to be spliced, and each LED module is respective
Spliced after packaged.The efficiency produced will be caused relatively low in this way, and non-uniform light.
Therefore, it is desirable to provide a kind of overlength intelligence cob light source led lamps, to solve above-mentioned technical problem.
Utility model content
The utility model embodiment provides a kind of uniform overlength intelligence cob light source led lamps that shine；It is existing super to solve
The technical issues of product efficiency of long cob light source leds lamp is low and non-uniform light.
The utility model embodiment provides a kind of overlength intelligence cob light source led lamps, and the utility model compares traditional lamp
Pipe, cob light sources have light emitting angle big, shine uniform, and the light emitting angles of cob light sources is generally at 160 ° or so, uniform in light emission.And
And cob light sources use planar package, the soft free from glare of light.
In addition the encapsulation for using flip-chip is reduced based on face-down bonding technique and on the basis of conventional LED chip encapsulates
Gold wire packaging process, saves lead frame, routing, only leaves chip collocation fluorescent glue encapsulation；Simultaneously overcome gold thread rosin joint or
It does not work, flicker caused by poor contact, the problems such as light decay is big, having compared traditional packaging process, the packaging density of the present embodiment increases
16 times are added, encapsulation volume but reduces 80%, and Design of Luminaires space bigger, performance is more stable, and thermal diffusivity is more preferable, photochromic distribution
Evenly.
The overlength intelligence cob light source led lamps of the technical program include shell and the LED module that is arranged in the shell,
The LED module includes：
Metal substrate, including the first plane and with first plane backwards to setting the second plane；
Insulating layer is arranged in first plane；
Copper foil layer is arranged on the insulating layer comprising line areas and the adhesion zone being arranged around the line areas,
The line areas includes circuit and pad；
Multiple flip-chips are fixedly connected on the pad by die bond solder paste；And
Fluorescent glue covers the flip-chip, and the copper foil layer is adhered to by way of baking；
Wherein, the fluorescent glue includes being connected to the fluorescent glue main body of the adhesion zone and being arranged in the fluorescent glue main body
Multiple connecting pins of bottom surrounding, the copper foil layer include the multiple connecting holes being arranged in the adhesion zone, and the connecting pin is inserted
Enter in the connecting hole, the bottom width of the connecting hole is more than the top width of the connecting hole.
In the present invention, the connecting hole is stepped hole, and the connecting pin is cylindric.
In the present invention, the upper hole height of the connecting hole is more than 2/3rds of connecting hole height.
In the present invention, the connecting hole penetrates through the copper foil layer, and the connecting hole prolongs along the adhesion zone
Direction is stretched to be uniformly arranged.
In the present invention, the one side that the adhesion zone is connected with the fluorescent glue main body is rough surface.
In the present invention, the linear formula of the flip-chip is uniformly arranged, and the spacing between the flip-chip is
Between 0.3-0.4cm.
In the present invention, the LED module further includes the graphene layer being arranged in second plane and setting
Radiator aluminium base plate on the graphene layer,
The graphene layer is adhered to second plane by the first mucigel, and the graphene layer passes through the second viscose
Layer is adhered to the radiator aluminium base plate.
In the present invention, the thickness of the graphene layer is 0.01-0.09mm.
In the present invention, the thickness of the metal substrate is less than the thickness of the radiator aluminium base plate.
In the present invention, the bottom surface of the radiator aluminium base plate is arranged at intervals with the recessed groove of bar shaped.
In the present invention, the sectional area of the die bond solder paste is described to being connected to from the one end for being connected to the pad
Successively decrease one end of flip-chip.
The overlength intelligence cob light source led lamps of overlength cob light source led lamps compared to the prior art, the utility model pass through
Whole fluorescent glue is coated into flip-chip so that fluorescent glue is bonded under conditions of baking with copper foil layer, to be fixed on one
It rises, completes disposable encapsulation, improve product efficiency；In addition, since flip-chip is by fluorescent glue overall package so that upside-down mounting
The luminous of chip is more uniformly distributed；Solves the low technology with non-uniform light of product efficiency of existing overlength cob light source led lamps
Problem.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below in embodiment
Required attached drawing is briefly described.The accompanying drawings in the following description is only the section Example of the utility model, for
For those of ordinary skill in the art, without creative efforts, other can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is the structural schematic diagram of the preferred embodiment of the overlength intelligence cob light source led lamps of the utility model；
Fig. 2 is the structural representation of the LED module of the preferred embodiment of the overlength intelligence cob light source led lamps of the utility model
Figure；
Fig. 3 is that the structure of the LED module of the preferred embodiment of the overlength intelligence cob light source led lamps of the utility model is overlooked
Schematic diagram；
Fig. 4 is the enlarged drawing of A in Fig. 2.
Specific implementation mode
The schema in attached drawing is please referred to, wherein identical component symbol represents identical component.The following description is to be based on
Illustrated by the utility model specific embodiment, be not construed as limitation the utility model other specific realities not detailed herein
Apply example.
Fig. 1 to Fig. 4 is please referred to, Fig. 1 is the knot of the preferred embodiment of the overlength intelligence cob light source led lamps of the utility model
Structure schematic diagram；Fig. 2 is the structural representation of the LED module of the preferred embodiment of the overlength intelligence cob light source led lamps of the utility model
Figure；Fig. 3 is that the structure of the LED module of the preferred embodiment of the overlength intelligence cob light source led lamps of the utility model overlooks signal
Figure；Fig. 4 is the enlarged drawing of A in Fig. 2.The overlength intelligence cob light source led lamps of the present embodiment, including shell 10, setting are in shell 10
Interior LED module and the encapsulation plug 20 at 10 both ends of shell is set.
LED module includes metal substrate 31, insulating layer 32, copper foil layer 33, flip-chip 34, fluorescent glue 35, graphene layer
36 and radiator aluminium base plate 37.
Specifically, metal substrate 31 includes the first plane and the second plane with the first plane backwards to setting；Insulating layer 32
Setting is on the first plane；Copper foil layer 33 is arranged on insulating layer 32 comprising line areas 331 and setting were line areas 331 weeks
The adhesion zone 332 enclosed, line areas 331 include circuit and pad；Multiple flip-chips 34 are fixedly connected by die bond solder paste 341
In pad；Fluorescent glue 35 covers flip-chip 34, and copper foil layer 33 is adhered to by way of baking；
Wherein, fluorescent glue 35 includes being connected to the fluorescent glue main body 351 of adhesion zone 332 and being arranged in fluorescent glue main body 351
Multiple connecting pins 352 of bottom surrounding, copper foil layer 33 include the multiple connecting holes 333 being arranged in adhesion zone 332, connecting pin 352
It is inserted into connecting hole 333, the bottom width of connecting hole 333 is more than the top width of connecting hole 333.
In the present embodiment, cob light sources have light emitting angle big, shine uniform, the light emitting angle of cob light sources generally exists
160 ° or so, uniform in light emission.And cob light sources use planar package, the soft free from glare of light.
In addition the encapsulation of flip-chip 34 is used to subtract based on face-down bonding technique and on the basis of conventional LED chip encapsulates
Lack gold wire packaging process, saved lead frame, routing, only leaves chip collocation fluorescent glue encapsulation；Overcome gold thread rosin joint simultaneously
Or do not work, flicker caused by poor contact, the problems such as light decay is big, compare traditional packaging process, the packaging density of the present embodiment
16 times are increased, encapsulation volume but reduces 80%, and Design of Luminaires space bigger, performance is more stable, and thermal diffusivity is more preferable, photochromic point
Cloth is evenly.
In the present embodiment, light source is used as using flip-chip 34, and pass through the circuit region of die bond solder paste 341 and copper foil layer 33
331 are electrically connected, and are avoided and are encapsulated using gold thread so that the top surface of entire flip-chip 34 is a burnishing surface；Then it adopts
The flip-chip 34 arranged with the cladding bar shaped of whole molding fluorescent glue 35, and make the fluorescent glue main body 351 of fluorescent glue 35
Surrounding is amplexiformed in the adhesion zone of copper foil layer 33 332, and connecting pin 352 is inserted into connecting hole 333；It is then toasted so that fluorescence
Glue 35 softens to bond together with adhesion zone 332 and connecting hole 333, is integrally fixedly connected to realize.
The overall package of whole fluorescent glue 35, one-time-reach-place avoid the case where multiple LED modules are spliced, to improve
The efficiency that LED module is produced, on the other hand, due to being overall time encapsulation so that the light of flip-chip 34 penetrating
When fluorescent glue 34, the uniformity of light is improved.
In addition, during baking, since fluorescent glue 35 softens so that connecting pin 352 is in connecting hole 333
Soften, since connecting pin 352 is in connecting hole 333, the softening degree of connecting pin 352 is higher than other parts, therefore even
Pin 352 is during toasting softening, it may occur that deforms and extends to the bottom surrounding of connecting hole 333.After baking,
Connecting pin 352 will be buckled in connecting hole 333, improve the stability that fluorescent glue 35 and copper foil layer 33 connect.Further,
Connecting hole 333 is stepped hole, and connecting pin 352 is cylindric.
In the present embodiment, the upper hole height of connecting hole 333 is more than 2/3rds of 333 height of connecting hole.It is such to set
It sets, it is ensured that connecting pin 352 has enough silica gel to be extended to the entire lower opening of connecting hole 333 during softening, to
Improve the stability that connecting pin 352 and connecting hole 333 connect.
In the present embodiment, connecting hole 333 penetrates through copper foil layer 33, and connecting hole 333 is equal along the extending direction of adhesion zone 332
Even setting.Connecting hole 333 penetrates through copper foil layer 33 so that connecting pin 352 can be directly bonded with insulating layer 32, due to connecting pin
352 is close with the material of insulating layer 32, therefore the stability higher of the two bonding；In addition by connecting hole 333 uniformly along viscous
Connect the extending direction setting in area 332 so that the stress equalization of connecting pin 352 further improves connecting pin 352 and copper foil layer 33
Connective stability.
In the present embodiment, the one side that 322 adhesion zones and fluorescent glue main body 351 connect is rough surface.Such setting, carries
The stability that high fluorescent glue 35 and copper foil layer 33 connect.
In the present embodiment, 34 linear formula of flip-chip is uniformly arranged, and the spacing between flip-chip 34 is 0.3-
Between 0.4cm.Due to using flip-chip 34, it is attached using die bond solder paste 341 and line areas 331, reduces upside-down mounting core
Mounting distance between piece 34 so that the space availability ratio bigger of LED module can install more flip-chips 34, to carry
High light emission luminance.
In the present embodiment, LED module further includes the graphene layer 36 being arranged in the second plane and is arranged in graphene
Radiator aluminium base plate 37 on layer 36；
Graphene layer 36 is adhered to the second plane by the first mucigel, and graphene layer 36 is adhered to by the second mucigel
Radiator aluminium base plate 37.
In the present embodiment, on the one hand it is arranged by the connection of flip-chip 34 and die bond solder paste 341 so that whole thermal resistance
It reduces, and flip-chip 34 conducts a large amount of heat to copper foil layer 33 through die bond solder paste 341, improves flip-chip 34
Heat conduction efficiency；On the other hand, the medium using graphene layer 36 as heat dissipation and heat transfer, since graphene has high dissipate
Hot and heat conductivility, therefore the setting of graphene layer 36, improve the radiating efficiency of LED module；And radiator aluminium base plate 37
With superior heat dissipation effect, the heat dissipation effect of the present embodiment is further increased, in addition, radiator aluminium base plate 37 also acts on graphene
36 protective layer of layer and the effect of carrier supported.
Further, the sectional area of die bond solder paste 341 is from one end of pad is connected to being connected to the one of flip-chip 34
Successively decrease at end.Since the electric connection point of flip-chip 34 is arranged at bottom, die bond solder paste 341 is carried out using top surface and tie point
Welding, and heat is transmitted to bottom surface (one side for being connected to pad) from top surface, the effect transmitted with the increase of sectional area, heat
Fruit is bigger, to improve the efficiency of heat transmission.
Graphene layer 36 is made of purity of the high purity graphite alkene of 99%-99.99%, and the ratio of graphene layer 10
Surface area is between 45-60m2/g, and for graphene is compared to graphite, existing not weak heat-sinking capability, and have price
The advantage of relative moderate.Also, in view of the factors such as heat dissipation film thermal diffusivity, durability and economy, under considering, graphene
The thickness of layer 36 is 0.01-0.09mm.
In the present embodiment, the thickness of metal substrate 31 is less than the thickness of radiator aluminium base plate 37.Due to radiator aluminium base plate 37
Graphene layer 36 is not only protected and be supported, also has the function of the entire LED module of support, therefore the thickness of radiator aluminium base plate 37
The thickness of metal substrate 31 should be more than.
Wherein, it can also be aluminum substrate that metal substrate 31, which can be copper base, and in material, copper base has good pressure
Ductility and heat conductivility can improve the conduction efficiency of heat；Aluminum substrate has good ductility and heat dissipation performance, can be with
Improve radiating efficiency.
In the present embodiment, the bottom surface of radiator aluminium base plate 37 is arranged at intervals with the recessed groove 371 of bar shaped.Such setting,
Radiator aluminium base plate 37 and extraneous contact area are improved, to improve radiating efficiency.
In addition, in the present embodiment, the first mucigel and the second mucigel are double faced adhesive tape, and the first mucigel and second stick
The material of glue-line can equally can be different, i.e. the first mucigel and the second mucigel can be epoxy resin, phenolic aldehyde tree
Fat, Lauxite, melamine-formaldehyde resin, acrylic resin, organic siliconresin, furane resins, unsaturated polyester (UP), polyamides are sub-
In amine, polybenzimidazoles, phenolic aldehyde-Pioloform, polyvinyl acetal, phenolic aldehyde-polyamide, phenolic aldehyde-epoxy resin or epoxy-polyamide
Any one.Preferably, the first mucigel and the second mucigel are phenolic resin, are conducive to bond between heat dissipation film secured
Property.The thickness of first mucigel and the second mucigel is between 0.05-0.1mm.
The operating process of the present embodiment is：
First, insulating layer 32 is arranged in the first plane of metal substrate 32, then the setting of copper foil layer 33 is being insulated
On layer 32；
Then, it is arranged in die bond solder paste 341 at 34 corresponding pad of the flip-chip of the line areas of copper foil layer 33, and will
Flip-chip 34 is mounted in die bond solder paste 341, after stable connection；
The fluorescent glue main body 351 that the fluorescent glue 35 of strip will be molded coats flip-chip 34, and makes fluorescent glue main body 351
Surrounding amplexiform in the adhesion zone of copper foil layer 33 332, connecting pin 352 is inserted into connecting hole 333；
Then, baking processing is carried out to above structure so that fluorescent glue 35 softens and bonding is fixed in copper foil layer 33, complete
At the encapsulation process of flip-chip 34；
Secondly, first mucigel is set in the second plane of metal substrate 31, graphene is set on the first mucigel
Layer 36, is arranged the second mucigel on graphene layer 36, and radiator aluminium base plate 37 is arranged on the second mucigel；It just completes in this way
The installation process of LED module；
Finally, LED module is fixed in shell 10, and the two of shell 10 is sealedly attached to by encapsulating plug 20
End.
The operating process of the present embodiment is just completed in this way.
The overlength intelligence cob light source led lamps of overlength cob light source led lamps compared to the prior art, the utility model pass through
Whole fluorescent glue is coated into flip-chip so that fluorescent glue is bonded under conditions of baking with copper foil layer, to be fixed on one
It rises, completes disposable encapsulation, improve product efficiency；In addition, since flip-chip is by fluorescent glue overall package so that upside-down mounting
The luminous of chip is more uniformly distributed；Solves the low technology with non-uniform light of product efficiency of existing overlength cob light source led lamps
Problem.
In conclusion although the utility model is disclosed above with preferred embodiment, above preferred embodiment is not used
To limit the utility model, those skilled in the art can make without departing from the spirit and scope of the utility model
It is various to change and retouch, therefore the scope of protection of the utility model is subject to the range that claim defines.
Claims (10)
1. a kind of overlength intelligence cob light source led lamps, including shell and the LED module that is arranged in the shell, feature exist
In the LED module includes：
Metal substrate, including the first plane and with first plane backwards to setting the second plane；
Insulating layer is arranged in first plane；
Copper foil layer is arranged on the insulating layer comprising line areas and the adhesion zone being arranged around the line areas, it is described
Line areas includes circuit and pad；
Multiple flip-chips are fixedly connected on the pad by die bond solder paste；And
Fluorescent glue covers the flip-chip, and the copper foil layer is adhered to by way of baking；
Wherein, the fluorescent glue includes being connected to the fluorescent glue main body of the adhesion zone and being arranged in the fluorescent glue bottom part body
Multiple connecting pins of surrounding, the copper foil layer include the multiple connecting holes being arranged in the adhesion zone, and the connecting pin is inserted into institute
It states in connecting hole, the bottom width of the connecting hole is more than the top width of the connecting hole.
2. overlength intelligence cob light source led lamps according to claim 1, which is characterized in that the connecting hole is stepped hole,
The connecting pin is cylindric.
3. overlength intelligence cob light source led lamps according to claim 2, which is characterized in that the upper hole height of the connecting hole
More than 2/3rds of connecting hole height.
4. overlength intelligence cob light source led lamps according to claim 1, which is characterized in that the connecting hole penetrates through the copper
Layers of foil, the connecting hole are uniformly arranged along the extending direction of the adhesion zone.
5. overlength intelligence cob light source led lamps according to claim 1, which is characterized in that the adhesion zone and the fluorescence
The one side of glue main body connection is rough surface.
6. overlength intelligence cob light source led lamps according to claim 1, which is characterized in that the linear formula of flip-chip
It uniformly arranges, the spacing between the flip-chip is between 0.3-0.4cm.
7. overlength intelligence cob light source led lamps according to claim 1, which is characterized in that the LED module further includes setting
The radiator aluminium base plate set the graphene layer in second plane and be arranged on the graphene layer,
The graphene layer is adhered to second plane by the first mucigel, and the graphene layer is viscous by the second mucigel
It is connected to the radiator aluminium base plate.
8. overlength intelligence cob light source led lamps according to claim 7, which is characterized in that the thickness of the graphene layer is
0.01-0.09mm。
9. overlength intelligence cob light source led lamps according to claim 7, which is characterized in that the thickness of the metal substrate is small
In the thickness of the radiator aluminium base plate.
10. overlength intelligence cob light source led lamps according to claim 7, which is characterized in that the bottom of the radiator aluminium base plate
Face interval is provided with the recessed groove of bar shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721796091.XU CN207624729U (en) | 2017-12-20 | 2017-12-20 | Overlength intelligence cob light source led lamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721796091.XU CN207624729U (en) | 2017-12-20 | 2017-12-20 | Overlength intelligence cob light source led lamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207624729U true CN207624729U (en) | 2018-07-17 |
Family
ID=62820714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721796091.XU Expired - Fee Related CN207624729U (en) | 2017-12-20 | 2017-12-20 | Overlength intelligence cob light source led lamps |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207624729U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112969311A (en) * | 2021-01-29 | 2021-06-15 | 广东浩轩光电有限公司 | Processing technology of CSPLED mounted planting type substrate |
-
2017
- 2017-12-20 CN CN201721796091.XU patent/CN207624729U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112969311A (en) * | 2021-01-29 | 2021-06-15 | 广东浩轩光电有限公司 | Processing technology of CSPLED mounted planting type substrate |
| CN112969311B (en) * | 2021-01-29 | 2023-04-07 | 广东浩轩光电有限公司 | Machining process of CSPLED (compact chip size distribution device) mounted planting type substrate |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180717 Termination date: 20211220 |