CN202216026U - Heat dissipation structure body of LED (light-emitting diode) lamp with ball bulb - Google Patents
Heat dissipation structure body of LED (light-emitting diode) lamp with ball bulb Download PDFInfo
- Publication number
- CN202216026U CN202216026U CN2011203274433U CN201120327443U CN202216026U CN 202216026 U CN202216026 U CN 202216026U CN 2011203274433 U CN2011203274433 U CN 2011203274433U CN 201120327443 U CN201120327443 U CN 201120327443U CN 202216026 U CN202216026 U CN 202216026U
- Authority
- CN
- China
- Prior art keywords
- bulb lamp
- lamp body
- led
- lamp
- ball bulb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a heat dissipation structure body of an LED (light-emitting diode) lamp with a ball bulb, which comprises a lamp cap, a lamp body with the ball bulb, an aluminium substrate with an LED, and a lamp shield. The lamp cap is fixedly connected with one end of the lamp body with the ball bulb through an insulated plastic housing, and the lamp shield is fixedly connected with the other end of the lamp body with the ball bulb. The aluminium substrate is connected with the lamp body with the ball bulb, which is a heat dissipation structure made of an aluminium material. A layer of metallic film is uniformly coated on the surface of the aluminium substrate connected with the lamp body with the ball bulb, and a layer of metallic film is also uniformly coated on the surface where the lamp body with the ball bulb is connected with the aluminium substrate. The metallic films of the aluminium substrate and the lamp body with the ball bulb are combined together through a hot linkage in a vacuum environment. The LED lamp with the ball bulb adopting the heat dissipation structure body does not adopt thermal compound, thereby reducing thermal resistance of a heat dissipation system and increasing heat dissipation performance of the LED lamp with the ball bulb greatly.
Description
Technical field
The present technique scheme relates to a kind of LED heat radiation field, particularly relates to a kind of LED bulb lamp heat-radiating structure.
Background technology
The basic structure of LED is a semi-conductive P-N knot.Generally be defined as the temperature in P-N interface the junction temperature of LED.The height of junction temperature directly has influence on LED light extraction efficiency, parameters such as life-span.Because led chip generally adopts epoxy glue to be packaged on the aluminium base, but the epoxide-resin glue heat conductivility is relatively poor.In traditional LED technology; Between the bulb lamp body and its circuit board of LED lamp; The general heat-conducting cream that adopts is affixed, but because the composition of heat-conducting cream is a macromolecular material, thermal conductivity factor is lower; Though wherein added the recipe ingredient of Heat Conduction Material, the heat-conducting effect of heat-conducting cream can not show a candle to the good heat conduction effect of metal.For this reason, the present technique scheme is devoted to study between a kind of bulb lamp body that can make the LED lamp and the aluminium base and is realized the incorporate draw bail of complete metal, thereby improves the radiating effect of LED greatly.Because the solderability of aluminium is very poor, generally adopt Copper Foil or copper coin to replace, improve its solderability with this.Yet because the cost of Copper Foil is higher, therefore, this way of prior art is unfavorable for applying.
Summary of the invention
The purpose of present technique scheme is to overcome the deficiency of prior art; A kind of LED bulb lamp heat-radiating structure is provided; The mode that adopts vacuum coating bonding one deck tin or indium is to carrying out bonding between bulb lamp body and the aluminium base; Thereby realized that the LED bulb lamp radiating effect that has overcome prior art is not good near incorporate radiator structure, service life is than shortcomings such as weak points.
The present technique scheme solves the technical scheme that its technical problem adopted: a kind of LED bulb lamp heat-radiating structure comprises lamp holder, bulb lamp body, the aluminium base that LED is housed and lampshade; Lamp holder is moulded an end Joint of shell and bulb lamp body through insulation; The other end Joint of lampshade and bulb lamp body; Aluminium base is connected on the bulb lamp body; This bulb lamp body is the radiator structure that aluminum is made; It is characterized in that: evenly plate layer of metal film with the joining one side of bulb lamp body in the aluminium base; The joining one side of bulb lamp body and aluminium base also evenly plates layer of metal film, and the metal film heating and pressurizing with aluminium base and bulb lamp body in vacuum environment is bonded together.
Described metallic diaphragm thickness is 20-200nm.
Said rete bonding temperature is 200-300 degree centigrade.
Said rete is bonded under the vacuum condition and carries out.
The said metallic diaphragm material that is coated with can be tin, indium.
Said rete bonding pressure is 10-35Kg/cm
3
Description of drawings
Fig. 1 is the described LED bulb lamp of a present technique scheme heat-radiating structure sketch map.
The specific embodiment
Embodiment one: the lampshade buckle closure at bulb lamp body one end, is fixed on the other end of bulb lamp body with lamp holder through the insulation plastic cement, and led light source is welded on the aluminium base one side; Under vacuum condition, be coated with the indium film of one deck 300nm at the aluminium base another side, the one side that links to each other with aluminium base at the bulb lamp body is coated with the indium film of one deck 300nm equally; Under vacuum condition; Bulb lamp body and aluminium base heating and pressurizing are bonded together, and heating-up temperature is 300 degrees centigrade, and pressure is 30Kg/cm
3
Claims (6)
1. a LED bulb lamp heat-radiating structure comprises lamp holder, bulb lamp body, the aluminium base that LED is housed and lampshade; Lamp holder is moulded an end Joint of shell and bulb lamp body through insulation; The other end Joint of lampshade and bulb lamp body; Aluminium base is connected on the bulb lamp body; Said bulb lamp body is the radiator structure that aluminum is made; It is characterized in that: evenly plate layer of metal film with the joining one side of bulb lamp body in the aluminium base; The joining one side of bulb lamp body and aluminium base also evenly plates layer of metal film, and the metal film heating and pressurizing with aluminium base and bulb lamp body in vacuum environment is bonded together.
2. according to the described a kind of LED bulb lamp heat-radiating structure of claim 1, it is characterized in that: described metallic diaphragm thickness is 20-200nm.
3. according to the described a kind of LED bulb lamp heat-radiating structure of claim 1, it is characterized in that: said rete bonding temperature is 200-300 degree centigrade.
4. according to the described a kind of LED bulb lamp heat-radiating structure of claim 1, it is characterized in that: said rete is bonded under the vacuum condition and carries out.
5. according to the described a kind of LED bulb lamp heat-radiating structure of claim 1, it is characterized in that: the said metallic diaphragm material that is coated with can be tin, indium.
6. according to the described a kind of LED bulb lamp heat-radiating structure of claim 1, it is characterized in that said rete bonding pressure is 10-35Kg/cm
3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203274433U CN202216026U (en) | 2011-09-01 | 2011-09-01 | Heat dissipation structure body of LED (light-emitting diode) lamp with ball bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203274433U CN202216026U (en) | 2011-09-01 | 2011-09-01 | Heat dissipation structure body of LED (light-emitting diode) lamp with ball bulb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202216026U true CN202216026U (en) | 2012-05-09 |
Family
ID=46015279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203274433U Expired - Fee Related CN202216026U (en) | 2011-09-01 | 2011-09-01 | Heat dissipation structure body of LED (light-emitting diode) lamp with ball bulb |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202216026U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102966927A (en) * | 2011-09-01 | 2013-03-13 | 中国科学院福建物质结构研究所 | Heat radiation structural unit for LED (light emitting diode) bulb lamp |
-
2011
- 2011-09-01 CN CN2011203274433U patent/CN202216026U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102966927A (en) * | 2011-09-01 | 2013-03-13 | 中国科学院福建物质结构研究所 | Heat radiation structural unit for LED (light emitting diode) bulb lamp |
| CN102966927B (en) * | 2011-09-01 | 2015-03-04 | 福建省两岸照明节能科技有限公司 | Heat radiation structural unit for LED (light emitting diode) bulb lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201918430U (en) | Integral heat dissipation structure for LED substrate | |
| CN104421682B (en) | LED light source module and the LEDbulb lamp comprising the module | |
| CN104896330A (en) | Led light source module | |
| CN102748626B (en) | LED (Light-Emitting Diode) tube and manufacturing method thereof | |
| CN101482233A (en) | LED spot light | |
| CN202406450U (en) | Radiator with uniform temperature plate | |
| CN202712182U (en) | LED COB light source packaging structure with high light efficiency and heat conduction | |
| TW201251148A (en) | Manufacturing method of LED heat conduction device | |
| CN102748609A (en) | LED (light emitting diode) lamp | |
| CN202216026U (en) | Heat dissipation structure body of LED (light-emitting diode) lamp with ball bulb | |
| CN201448618U (en) | Dispersed liquid heat emission LED lamp | |
| CN201448619U (en) | Liquid heat radiation LED lamp | |
| CN202176948U (en) | Light-emitting diode (LED) lamp based on composite heat dissipating technique | |
| CN202474027U (en) | Combined type LED (Light-Emitting Diode) substrate | |
| CN204929528U (en) | Heat conduction bubble is cotton | |
| CN204986521U (en) | Light -emitting diode device | |
| CN102966927B (en) | Heat radiation structural unit for LED (light emitting diode) bulb lamp | |
| CN203927476U (en) | A kind of heat abstractor and with the LED illuminating source of heat abstractor | |
| CN203642131U (en) | LED heat sink with high-heat dissipation performance and LED lamp provided with LED heat sink | |
| CN203560754U (en) | LED bulb lamp | |
| CN201344395Y (en) | LED spot light | |
| CN202177080U (en) | LED (light-emitting diode) lamp device applying silicon-urethane foaming and radiating materials | |
| CN105977227A (en) | Integrated circuit package with composite substrate | |
| CN204834690U (en) | Emitting diode integrated optical source | |
| CN105244432A (en) | LED point-like COB module and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120509 Termination date: 20200901 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |