CN102966927B - Heat radiation structural unit for LED (light emitting diode) bulb lamp - Google Patents
Heat radiation structural unit for LED (light emitting diode) bulb lamp Download PDFInfo
- Publication number
- CN102966927B CN102966927B CN201110258206.0A CN201110258206A CN102966927B CN 102966927 B CN102966927 B CN 102966927B CN 201110258206 A CN201110258206 A CN 201110258206A CN 102966927 B CN102966927 B CN 102966927B
- Authority
- CN
- China
- Prior art keywords
- bulb lamp
- lamp body
- led
- heat radiation
- bulb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000005855 radiation Effects 0.000 title abstract 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000004033 plastic Substances 0.000 claims abstract description 4
- 239000004411 aluminium Substances 0.000 claims description 18
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a heat radiation structural unit for an LED (light emitting diode) bulb lamp. The heat radiation structural unit comprises a lamp head, a bulb lamp body, an aluminum base board which is provided with an LED, and a lamp cover; the lamp head is fixedly connected with one end of the bulb lamp body through an insulating plastic shell; the lamp cover is fixedly connected with the other end of the bulb lamp body; the aluminum base board is connected onto the bulb lamp body; the bulb lamp body is of a heat radiation structure made of aluminum materials; and a layer of metal film is uniformly plated on the face inside the aluminum base board connected with the bulb lamp body, the layer of metal film is uniformly plated on the face of the bulb lamp body connected with the aluminum base board, and the metal films of the aluminum base board and the bulb lamp body are bonded together in a thermal compression way in a vacuum environment. According to the LED bulb lamp provided by the invention, heat-conducting paste is not adopted, thermal resistance of a heat radiation system is lowered, and the heat radiation performance of the LED bulb lamp is greatly improved.
Description
Technical field
The technical program relates to a kind of LED field of radiating, particularly relates to a kind of LED bulb lamp heat-radiating structure.
Background technology
The basic structure of LED is the P-N junction of a semiconductor.Generally the temperature in P-N junction district is defined as the junction temperature of LED.The height of junction temperature directly has influence on LED light extraction efficiency, the parameters such as life-span.Because LED chip generally adopts epoxy glue to be packaged on aluminium base, but epoxide-resin glue heat conductivility is poor.In traditional LED technology, between the bulb lamp body of LED lamp and its circuit board, general employing heat-conducting cream is affixed, but the composition due to heat-conducting cream is macromolecular material, thermal conductivity factor is lower, although wherein with the addition of the recipe ingredient of Heat Conduction Material, the heat-conducting effect of heat-conducting cream can not show a candle to the good heat conduction effect of metal.For this reason, the technical program is devoted to study a kind of draw bail that the bulb lamp body of LED lamp can be made integrated with realizing complete metal between aluminium base, thus greatly improves the radiating effect of LED.Because the solderability of aluminium is very poor, general Copper Foil or the copper coin of adopting replaces, and improves its solderability with this.But because the cost of Copper Foil is higher, therefore, this way of prior art, is unfavorable for applying.
Summary of the invention
The object of the technical program is the deficiency overcoming prior art, a kind of LED bulb lamp heat-radiating structure is provided, the mode of vacuum coating bonding one deck tin or indium is adopted to carry out bonding between bulb lamp body and aluminium base, thus the radiator structure achieved close to integration, the LEDbulb lamp radiating effect overcoming prior art is not good, the shortcomings such as service life is shorter.
The technical program solves the technical scheme that its technical problem adopts: a kind of LED bulb lamp heat-radiating structure, comprises lamp holder, bulb lamp body, the aluminium base that LED is housed and lampshade; Lamp holder passes through one end Joint of insulated plastic shell and bulb lamp body; The other end Joint of lampshade and bulb lamp body; Aluminium base is connected on bulb lamp body; This bulb lamp body is the radiator structure that aluminum is made, it is characterized in that: in aluminium base, evenly plate layer of metal film with the joining one side of bulb lamp body, bulb lamp body and the joining one side of aluminium base also evenly plate layer of metal film, the metal film heating pressurization of aluminium base and bulb lamp body are bonded together in vacuum environment.
Described metallic diaphragm thickness is 20-200nm.
Described rete bonding temperature is 200-300 degree Celsius.
Described rete bonding carries out under vacuum.
The described metallic diaphragm material be coated with can be tin, indium.
Described rete bonding pressure is 10-35Kg/cm
3.
Accompanying drawing explanation
Fig. 1 is the LED bulb lamp heat-radiating structure schematic diagram described in the technical program.
Detailed description of the invention
Embodiment one: by lampshade buckle closure in bulb lamp body one end, lamp holder is fixed on the other end of bulb lamp body by insulation plastic cement, LED light source is welded on aluminium base one side, under vacuum, be coated with the indium film of one deck 300nm at aluminium base another side, at the same indium film being coated with one deck 300nm of one side that bulb lamp body is connected with aluminium base, under vacuum, bulb lamp body and aluminium base are heated pressurization be bonded together, heating-up temperature is 300 degrees Celsius, and pressure is 30Kg/cm
3.
Claims (1)
1. a LED bulb lamp heat-radiating structure, comprises lamp holder, bulb lamp body, the aluminium base that LED is housed and lampshade; Lamp holder passes through one end Joint of insulated plastic shell and bulb lamp body; The other end Joint of lampshade and bulb lamp body; Aluminium base is connected on bulb lamp body; Described bulb lamp body is the radiator structure that aluminum is made, it is characterized in that: in aluminium base, evenly plate layer of metal film with the joining one side of bulb lamp body, bulb lamp body and the joining one side of aluminium base also evenly plate layer of metal film, described metallic diaphragm material is tin or indium, metallic diaphragm thickness is 20-200nm, in vacuum environment, the metal film heating pressurization of aluminium base and bulb lamp body is bonded together, described bonding temperature is 200-300 degree Celsius, and described rete bonding pressure is 10-35Kg/cm
3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110258206.0A CN102966927B (en) | 2011-09-01 | 2011-09-01 | Heat radiation structural unit for LED (light emitting diode) bulb lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110258206.0A CN102966927B (en) | 2011-09-01 | 2011-09-01 | Heat radiation structural unit for LED (light emitting diode) bulb lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102966927A CN102966927A (en) | 2013-03-13 |
| CN102966927B true CN102966927B (en) | 2015-03-04 |
Family
ID=47797244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110258206.0A Active CN102966927B (en) | 2011-09-01 | 2011-09-01 | Heat radiation structural unit for LED (light emitting diode) bulb lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102966927B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201448794U (en) * | 2009-07-10 | 2010-05-05 | 常州市树杰灯饰有限公司 | Radiating structure for LED ball light |
| CN202216026U (en) * | 2011-09-01 | 2012-05-09 | 中国科学院福建物质结构研究所 | A kind of heat dissipation structure of LED bulb lamp |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101769455A (en) * | 2009-12-28 | 2010-07-07 | 深圳市成光兴实业发展有限公司 | LED bulb adopting whole-body fluorescence conversion technology |
-
2011
- 2011-09-01 CN CN201110258206.0A patent/CN102966927B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201448794U (en) * | 2009-07-10 | 2010-05-05 | 常州市树杰灯饰有限公司 | Radiating structure for LED ball light |
| CN202216026U (en) * | 2011-09-01 | 2012-05-09 | 中国科学院福建物质结构研究所 | A kind of heat dissipation structure of LED bulb lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102966927A (en) | 2013-03-13 |
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| ASS | Succession or assignment of patent right |
Owner name: FUJIAN COASTAL E-LIGHTING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FUJIAN INSTITUTE OF RESEARCH ON THE STRUCTURE OF MATTER, CHINESE ACADEMY OF SCIE Effective date: 20131226 |
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Free format text: CORRECT: ADDRESS; FROM: 350002 FUZHOU, FUJIAN PROVINCE TO: 350003 FUZHOU, FUJIAN PROVINCE |
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Effective date of registration: 20131226 Address after: Water Street Gutian Road, Gulou District of Fuzhou city in Fujian province 350003 No. 101 building 11 room 04 min Applicant after: FUJIAN COASTAL E-LIGHTING TECHNOLOGY CO., LTD. Address before: Fuzhou City, Fujian province 350002 Yangqiao Road No. 155 Applicant before: Fujian Institute of Research on the Structure of Matter, Chinese Academy of Scie |
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