CN202176948U - Light-emitting diode (LED) lamp based on composite heat dissipating technique - Google Patents
Light-emitting diode (LED) lamp based on composite heat dissipating technique Download PDFInfo
- Publication number
- CN202176948U CN202176948U CN2011203085501U CN201120308550U CN202176948U CN 202176948 U CN202176948 U CN 202176948U CN 2011203085501 U CN2011203085501 U CN 2011203085501U CN 201120308550 U CN201120308550 U CN 201120308550U CN 202176948 U CN202176948 U CN 202176948U
- Authority
- CN
- China
- Prior art keywords
- lamp
- led
- ceramic substrate
- housing
- aluminium sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a light-emitting diode (LED) lamp based on a composite heat dissipating technique, which comprises a casing unit, a lamp module unit and a power source unit. The casing unit utilizes a plastic lamp holder as a connecting body, a metal lamp holder is connected onto the plastic lamp holder, and a plastic or aluminum lamp casing is connected with the bottom surface of the plastic lamp holder. Convection slot lamps are engraved on the periphery of a casing body, and black nano radiation coating are coated outside the casing body. A ceramic substrate of the lamp module unit and an aluminum plate of the lamp module unit are tightly welded through silver foil of the ceramic substrate and tin coating of the aluminum plate, porous copper is welded on the other face of the aluminum plate, and LED pipes are welded on the other face of the ceramic substrate. Because composite techniques including the ceramic substrate, the porous copper, the nano coating and the like are utilized to dissipate heat, the heat is effectively dissipated fully through heat dissipating ways of conduction, convection and radiation, and power of the LED lamps can be large.
Description
Technical field
The utility model relates to the LED lighting technical field, relates in particular to a kind of LED lamp that adopts the composite radiating technology.
Background technology
In recent years, LED was used widely in every field as new light sources; But the luminous current drives that needs of LED, in the electric energy of input LED, the 15%-25% that only has an appointment can effectively be converted into luminous energy, mean that the LED lamp of a 10W has only 2W to be converted into light, and all the other 8W will be converted into heat automatically, so can produce heat in the LED luminescence process.Along with the rising of LED power, thermal property not only can make sharply decay device lifetime to the more and more significant that influences of LED, and also can have a strong impact on the wavelength of LED, power, parameters such as luminous flux; Great power LED that uses at present in addition and LED light fixture basically all are welded in the LED pipe on the aluminium base, and aluminium base is mutually bonding with aluminium radiator through heat-conducting glue again.Because aluminium base and heat-conducting glue thermal resistance are big, many heats can not in time distribute, therefore do the LED lamp especially bulb lamp power be not bold enough to do greatly, can only accomplish below the 8W, can not solve because dispel the heat exactly.
The utility model content
The purpose of the utility model is the heat dissipation problem to LED, and a kind of LED lamp based on the composite radiating technology is provided.
The purpose of the utility model realizes through following technical scheme: a kind of LED lamp based on the composite radiating technology, and it comprises: outer cover unit, lamp set unit and three parts of power subsystem; Wherein, lamp set unit and power subsystem all are fixed in the outer cover unit, and lamp set unit links to each other with power subsystem.
Further, said outer cover unit mainly is made up of metallic lamp holder, Plastic lamp socket, housing and lampshade; Wherein, said metallic lamp holder and housing are screwed in the two ends of Plastic lamp socket respectively through screw thread, and lampshade is screwed in the other end of housing through screw thread.
Further, said housing is plastic housing, aluminum hull or the Al alloy shell of hollow, and its outer surface scribbles the nm radiation coating of black; Be carved with chute around the housing.
Further, said lamp set unit mainly is made up of porous copper, aluminium sheet, ceramic substrate and LED pipe; Wherein, the upper and lower surfaces of aluminium sheet is zinc-plated formation first tin coating and second tin coating respectively, and two surperficial sintering of ceramic substrate form the first silver foil layer and the second silver foil layer; The metab of the first silver foil layer of first tin coating of porous copper and aluminium sheet, second tin coating of aluminium sheet and ceramic substrate, the second silver foil layer of ceramic substrate and LED pipe is all welded together through Reflow Soldering, becomes the LED lamp set unit.Aluminium sheet is fixed on the housing.
Further, said power subsystem one end links to each other with metallic lamp holder through exchanging the input line, and other end DC leadout links to each other with second tin coating of aluminium sheet.
The utility model has three unit and forms: outer cover unit, lamp set unit and power subsystem.Outer cover unit with Plastic lamp socket as connector; Be connected with metallic lamp holder above it; Lamp housing with plastics or aluminium (aluminium alloy) below it is connected, and links to each other with lampshade again below the lamp housing, and Plastic lamp socket and housing are hollow; At the inner power subsystem of placing of the Plastic lamp socket of hollow, at the lamp housing internal fixation lamp set unit of hollow; Lamp set unit is made up of porous copper, aluminium sheet, ceramic substrate and LED pipe.Ceramic substrate and aluminium sheet closely weld through the silver foil of ceramic substrate and the tin coating of aluminium sheet, and the porous brazing is connected on the another side of aluminium sheet, and the LED pipe is welded in the ceramic substrate another side; Power subsystem is inserted at the two ends of alternating current through metallic lamp holder, and the direct current after the power rectifier step-down is added on the LED of lamp set unit and makes it luminous.Owing to adopt complex technique heat radiations such as ceramic substrate, porous copper and nano paint, make LED lamp power do greatlyyer, LED bulb lamp power is reached more than the 10W.
The beneficial effect of the utility model is: owing to adopt complex technique; The heat that LED lamp group is produced is sent to aluminium sheet through the good conductive performance of ceramic substrate; Can carry out convection current effectively and heat loss through radiation through porous copper and the shell that scribbles the black nano radiation paint again.At present greatly partial L ED lamp group adopts aluminium base heat conduction, because aluminium base bonds through heat-conducting glue with radiator, heat heat radiation approach has stopping of epoxy resin and heat-conducting glue in the aluminium base; Their thermal conductivity factor is respectively 0.2W/mK and 1W/mK, and radiating effect is poor, and ceramic substrate and aluminium that the utility model uses all are direct welding; Not only thermal resistance is little, and firm, difficult drop-off; The thermal conductivity factor of ceramic substrate and aluminium is respectively 24W/mK and 240W/mK, is the hundred times of aluminium base; So common LED bulb lamp can only be accomplished below the 8W at present, and the LED lamp based on the composite radiating technology of the utility model, its power can be accomplished more than the 10W.
Description of drawings
Fig. 1 is the structural representation of the utility model LED lamp;
Fig. 2 is the structure cutaway view of the utility model LED lamp;
Fig. 3 is the structural representation of porous copper;
Fig. 4 is that the porous brazing connects sketch map;
Fig. 5 is the front view of the utility model LED lamp;
Fig. 6 is LED circuit for lamp figure;
Among the figure, the DC leadout 19 of metallic lamp holder 1, Plastic lamp socket 2, power subsystem 3, housing 4, the second silver foil layer 16, LED metab 17, screw 18, power subsystem to the first silver foil layer 15 of second tin coating 14 of first tin coating 13 of the interchange input line 12 of the fixing threaded hole 11 of chute 5, lampshade 6, porous copper 7, aluminium sheet 8, ceramic substrate 9, LED pipe 10, aluminium sheet, power subsystem, aluminium sheet, aluminium sheet, ceramic substrate, ceramic substrate.
The specific embodiment
Shown in Fig. 1-5, the utility model comprises based on the LED lamp of composite radiating technology: outer cover unit, lamp set unit and three parts of power subsystem.Wherein, lamp set unit and power subsystem all are fixed in the outer cover unit, and lamp set unit links to each other with power subsystem.Outer cover unit comprises: metallic lamp holder 1, Plastic lamp socket 2, housing 4, lampshade 6.And lamp set unit comprises porous copper 7, aluminium sheet 8, ceramic substrate 9 and LED pipe 10.Power subsystem comprises that power supply 3, power supply exchange input line 12, power supply DC leadout 19.The utility model utilizes complex technique, and through shell, ceramic substrate 9 and porous copper 7, the radiating mode of fully using conduction, convection current and radiation dispels the heat effectively, and the LED bulb can be worked under high-power situation.
1, outer cover unit: mainly form by metallic lamp holder 1, Plastic lamp socket 2, housing 4 and lampshade 6.Metallic lamp holder 1 and housing 4 are screwed in the two ends of Plastic lamp socket 2 respectively among Fig. 1 through screw thread, and lampshade 6 is screwed in the other end of housing 4 through screw thread.Housing 4 is the plastics or aluminium (aluminium alloy) shell of hollow, and its outer surface scribbles the nm radiation coating of black.Be carved with chute 5 around the housing 4, make the evolution of heat of lamp set unit can be through chute 5 is dealt into the external world.The Plastic lamp socket 2 inner power subsystems 3 of placing in hollow.Metallic lamp holder can adopt the standard lamp head of E27; Also can adopt lamp holders such as other B that can link to each other with power supply, GU, MR, PAR, metallic lamp holder 1 closely is tightened on the Plastic lamp socket 2, and adds press fit; See Fig. 2; The metal two ends of metallic lamp holder 1 are for getting alternating current usefulness, and alternating current becomes DC current after the interchange input line 12 of power subsystem is input to power subsystem, and dc source is through DC leadout 19; Pass on second silver foil that aluminium sheet 8 is welded in ceramic substrate 9 (second silver foil is the printed circuit of silvery), see Fig. 5.The material of housing 4 can be plastics, aluminum or aluminum alloy, and as adopting the PBT plastics, PBT is the crystalline thermoplastic polyester; Have high-fire resistance, toughness, fatigue durability; Self-lubricating, low-friction coefficient, weatherability, the characteristics that water absorption rate is low also can adopt plastics such as PC, ABS; Housing 4 also can be formed through die casting or extruding by aluminum or aluminum alloy, housing 4 external spray black nano nm radiation coating; Housing 4 surfaces through with the upper type preparation are black and coarse.Lampshade 6 is handled through frosted, and the light that LED is sent passes through the frosted lampshade and even free from glare.
2, lamp set unit is seen Fig. 3, mainly is made up of with LED pipe 10 porous copper 7, aluminium sheet 8, ceramic substrate 9.Among Fig. 4 first tin coating 13 of aluminium sheet 8 above zinc-plated processing forms with below second tin coating 14, the first silver foil layer 15 of ceramic substrate above oversintering forms with below the second silver foil layer 16.First tin coating 13 of porous copper 7 and aluminium sheet 8, second tin coating 14 of aluminium sheet 8 and the first silver foil layer 15 of ceramic substrate 9, the second silver foil layer 16 of ceramic substrate 9 is all welded together through Reflow Soldering with the metab 17 of LED pipe 10, becomes the LED lamp set unit.On the lamp housing 4 of hollow, screw is arranged, can be corresponding with the fixing hole 11 of aluminium sheet.Be fixed on LED lamp group power supply in the screw of housing 4 bottoms with screw 18, see Fig. 5.
3, power subsystem 3 one ends link to each other with metallic lamp holder 1 through exchanging input line 12; Other end DC leadout links to each other with printed circuit 14; As shown in Figure 5; Power subsystem is seen Fig. 6, and this unit comprises integrated one, 7 diodes of XL5002,1 voltage-stabiliser tube, 3 resistance, 5 electric capacity, 1 triode and 1 inductance.Integrated product that can adopt Shanghai Xinlong Semiconductor Co., Ltd. of XL5002 wherein; 4 diode D1-D4 form full-wave rectifying circuit; The input of full-wave rectifying circuit links to each other with metallic lamp holder 1; The positive output end of rectification circuit respectively with an end of capacitor C 1, the negative pole of diode D7, the colelctor electrode of triode Q1; ( pin 5,6 VIN) links to each other the voltage input end that one end of resistance R 1 and XL5002 are integrated, and the negative output terminal of rectification circuit links to each other with the positive pole of diode D5, an end of capacitor C 2, the positive pole of voltage-stabiliser tube D8 and an end of capacitor C 5 respectively; The other end of capacitor C 1 links to each other with the negative pole of diode D5 and the positive pole of diode D6 respectively; The negative pole of diode D6 links to each other with the positive pole of diode D7 and the other end of capacitor C 2 respectively; The base stage of triode Q1 respectively with the startup end (pin one of integrated of the other end of resistance R 1 and XL5002; START) link to each other, the reference voltage pin that the emitter stage of triode Q1 and XL5002 are integrated (pin two, VREG) and an end of capacitor C 3 continuous; And the current detecting negative pole of integrated of the C3 other end and XL5002 ( pin 7,8 CSN) and with an end of resistance R 2, inductance L 1 links to each other; The other end of resistance R 2 and the power take-off of XL5002 (pin 4, SW), the negative pole of voltage-stabiliser tube D8, resistance R 3 links to each other with an end of capacitor C 4, and resistance R 3 links to each other with the other end of capacitor C 4, and anodal (pin 3 CSP) links to each other for back and the current detecting of XL5002; The other end of inductance L 1 links to each other with the other end of capacitor C 5 and afterwards outputs to the positive pole of LED as the positive pole of dc source, and the negative output terminal of capacitor C 5 and rectification circuit outputs to the negative pole of LED pipe as the negative pole of dc source.
Among Fig. 6; D1, D2, D3, D4 are commutation diode; Through being added in C1, D5 and C2, D7 two ends for the direct current about 310V after the rectification; The centre has two groups of circuit of D6 and this to link to each other, and this circuit is claimed " filling out paddy " circuit, can be being filled and led up through capacitor C 1 and discharging and recharging as far as possible of C2 by the trough after the rectification entirely.It is a kind of passive pfc circuit, and its effect improves power factor to 0.85; The upper end of D7 and C1 is connected to the positive pole of power supply, directly links to each other with 5,6 of XL5002 with voltage-reg-ulator tube Q1, adjustment resistance R 1 again.The lower end of C2 and the positive terminal of D5 are connected to power cathode, and the negative pole with voltage-stabiliser tube D8, filter capacitor C5 and LED directly links to each other again.Be added in 5,6 and L1, R2 and the LED pipe of XL5002 through the 310V of rectification high direct voltage.XL5002 pin 3 links to each other with R3, C4, and its effect is a normal voltage of utilizing voltage-stabiliser tube D8, detects the output voltage size, and through the size of adjustment R1 and R3, the voltage with output is imported in adjustment.The pin 7,8 of XL5002 links to each other with R2, L1, can adjust the size that R2 can control output current through for detecting the electric current of output current R2, and pin 4 is power switch output, and the output constant current promotes LED and manages luminous through the filtering of L1.C3 is a weakening electric capacity, and C4 is a shunt capacitance; L1 and C5 form filter circuit, and the clutter part in the filtering circuit makes to produce stable continuous current confession LED use.This circuit LED can the series connection from 1 to 10, and electric current is about 350mA.The direct power output of LED can change from 1W to 10W.
For example: the bulb lamp of 9W is installed, 4 LEDs pipes are installed on ceramic substrate, pipe should be symmetrical, makes its bright dipping even.See Fig. 5, LED adopts the Luxeon Rebel pipe of Philip, and model is LXML-PW31, and colour temperature is the white light pipe of 6500K, and this tube current can be from 350mA to 700mA, and power is from 1W to 3W.This primary current is transferred to 550mA, and the real output single tube is 3.3V*0.55mA, is 1.82W, and power output is that 1.82*4 is 7.3W, considers that power-efficient is 0.85, and general power is that 7.3W/0.85 is about 9W.
It is the diode of MRA4007T3G that rectifying tube D1, D2, D3, D4 adopt the model of ON Onsemi company; IC is the XL5002 of Shanghai Xinlong Semiconductor Co., Ltd.; Capacitor C 1 and C2 adopt the aluminium electroloysis of Japanese red jewel (rubycon), and specification is 4.7uF/200V; Triode Q1 adopts 13001 pipes of thomson ST company; The D5 voltage-stabiliser tube is the MURA160T3G of ON Onsemi company; C3 and C4 employing black japan Buddha's warrior attendant company are that the specification of NCC is the chip ceramic capacitor of 2.2uF/35V and 100pF; The Chip-R that R1, R2, R3 adopt the huge Yageo of company of state in Taiwan to produce, specification is divided into 1M, 0.47 Ω, 2K; It is the 2.2mH/0.5A inductance that L1 adopts the specification of US business's line skill coilcraft company.
The described composite radiating technology of the utility model specifically comprises following three kinds of radiating modes:
1, the heat loss through convection of porous copper 7: porous copper is a kind of of porous metal material; Be a kind of comparatively rapidly new material of development in the present material science, produce porous metals at present, inner 3 D stereo grid for communicating; Porosity is more than 90%; Through-hole rate can be up to more than 97%, and porous copper is applied in fields such as filter, heat dump, catalyst, especially as heat sink material.Because large-power light-emitting diodes is because temperature rise when using; Power can only be accomplished 3 watts, and 3 watts of power are by calculating the area of dissipation that just needs more than 80 square centimeters, and adopting cutting to add fin, to increase the effect of radiating surface little; And the module combinations of large-power light-emitting diodes multitube core will reach 100 watts from now on; And area requirements is littler, in 1 square centimeter, will accomplish tens watts of power, and heat radiation will propose requirements at the higher level.Existing in addition large-power light-emitting diodes will adopt a large amount of copper or aluminum, causes cost high, and these factors have all seriously restricted the development of semiconductor lighting.And porous copper can increase area of dissipation (more than actual about 200-1000 of increasing times) in the polar region, so help the heat radiation of large-power light-emitting diodes.According to calculating; Adopt common radiator, 5 watts of large-power light-emitting diodes area of dissipations need 200 square centimeters, and 10 watts of large-power light-emitting diodes area of dissipations need 500 square centimeters; This is unrealistic certainly in practical application; And porous copper only needs several square centimeters real area, just can be used for the large-power light-emitting diodes heat radiation about 10 watts, and radiating effect is very obvious.The hot transmission of stream of between the surface of solids and fluid, transmitting heat during thermal convection current can be expressed as: φ=hA (tw – tf); A is the surface area of solid, and tw is the surface temperature of solid, and tf is a fluid temperature (F.T.); H is heet transfer rate or carry-over factor, and its unit is W/ (℃ m2).This relational expression is called newton and cools off formula.The effect that therefrom can know the convection current of heat transmission mainly is relevant with the size of the surface area of air contact by thermal source, and effectively contact area is big more, and temperature difference is high more, and the heat that can take away is also just many more.And adopt porous copper as heat abstractor, and to compare with the copper of same volume, the porous copper surface area is original 200-1000 times, that is to say originally original in other words radiating surface; Be to say that original area of dissipation wants 200 square centimeters, now as long as 1 square centimeter is just passable,
2, the heat loss through radiation of nano paint: radiation is a kind of mode of efficiently radiates heat, and when high temp objects placed low temperature environment, this object did not need medium just can emit heat, and this phenomenon is called heat radiation.The heat that radiates is an electromagnetic wave, and its wave-length coverage is for o.1 μ m is to 15 μ m, and visible light also comprises in this scope.The material that radiance equals l is an ideal radiation, is called black matrix.Heat loss through radiation cooling coating is a kind of emerging coating; Heat loss through radiation cooling coating is the coating that a kind of radiant energy is taken away object heat and insulating water-proof; The coating direct brushing is being wanted the body surface of radiating and cooling; Heat loss through radiation cooling coating can be walked the heat of brushing on object to the airspace autoemission with 8-13.5 μ m infrared wavelength, reduces body surface and internal temperature, and radiating and cooling is obvious.Coating also has the characteristics of good self-cleaning, insulating properties, anti-corrosive properties, water proofing property, antiacid alkali, easy construction when playing radiation cooling.Transfer of radiant heat is the behavior of giving and accepting of heat that object is not carried out through intermediary matter, and nano paint can adopt the product of Chinese Academy of Sciences's Tangshan research in new high-tech and transformation center, but is not limited thereto.
3, the heat loss through conduction of ceramic substrate 9: heat is a kind of energy, and the mean state of the represented energy of thermometer.Heat is t from temperature
1Face, passing thickness is that the homogeneous of A is dull and stereotyped for the L area, the arrival temperature is t
2Face the time, the heat that the unit interval is flow through is called hot-fluid.Hot-fluid φ (W) and temperature difference (t
2-t
l) and area A be directly proportional, become ratio with thickness L, available Fourier is conducted law and is represented: φ=-λ A (t
2-t
l)/L, proportionality constant λ is called the coefficient of heat conduction of this object, its unit be W/ (m. ℃).Although usual aluminium base has aluminium; But it is inner in order to have epoxy resin to separate with the copper foil plate insulation; And the epoxy resin coefficient of heat conduction have only 0.2W/ (m. ℃). adopt its coefficient of heat conduction of ceramic substrate be 24W/ (m. ℃), be more than 100 times of aluminium base, so radiating effect is better.Ceramic substrate is a kind of working material of novel heater element, and three kinds of aluminium oxide, aluminium nitride and LTCC LTCC are arranged at present.Ceramic substrate has the good electric insulating properties, and high thermal conduction characteristic is anticorrosive and ultraviolet.And can etch various figures as pcb board, have very big electric current current capacity.Therefore ceramic substrate has become the basic material of high-power electric and electronic circuit structure technology and interconnection technique, and its thermal conductivity factor is 24W/mK, and aluminium nitride even up to 200W/mK is approaching with the thermal conductivity factor of aluminium.The utility model is exactly with our the ceramic substrate replacement aluminium base with the sintering silver of oneself making, and receives good heat-transfer effect.The thick film firing of pottery can be fired silver foil on pottery.Its process has silk screen to be coated with photoresists, system circuit board, silk screen make publics, wash, are coated with silver and starch cream, print, send ceramic post sintering stove sintering silver foil.
Claims (5)
1. the LED lamp based on the composite radiating technology is characterized in that it comprises: outer cover unit, lamp set unit and three parts of power subsystem; Wherein, lamp set unit and power subsystem all are fixed in the outer cover unit, and lamp set unit links to each other with power subsystem.
2. according to the said LED lamp of claim 1, it is characterized in that said outer cover unit mainly is made up of metallic lamp holder (1), Plastic lamp socket (2), housing (4) and lampshade (6) based on the composite radiating technology; Wherein, said metallic lamp holder (1) and housing (4) are screwed in the two ends of Plastic lamp socket (2) respectively through screw thread, and lampshade (6) is screwed in the other end of housing (4) through screw thread.
3. according to the said LED lamp based on the composite radiating technology of claim 2, it is characterized in that said housing (4) is plastic housing, aluminum hull or the Al alloy shell of hollow, its outer surface scribbles the nm radiation coating of black; Be carved with chute (5) around the housing (4).
4. according to the said LED lamp of claim 1, it is characterized in that said lamp set unit mainly is made up of with LED pipe (10) porous copper (7), aluminium sheet (8), ceramic substrate (9) based on the composite radiating technology; Wherein, the upper and lower surfaces of aluminium sheet (8) is zinc-plated formation first tin coating (13) and second tin coating (14) respectively, and two surperficial sintering of ceramic substrate (9) form the first silver foil layer (15) and the second silver foil layer (16); All welded together between the metab (17) of the first silver foil layer (15) of first tin coating (13) of porous copper (7) and aluminium sheet (8), second tin coating (14) of aluminium sheet (8) and ceramic substrate (9), the second silver foil layer (16) of ceramic substrate (9) and LED pipe (10) through Reflow Soldering; Aluminium sheet (8) is fixed on the housing (4).
5. according to the said LED lamp of claim 1 based on the composite radiating technology; It is characterized in that; Said power subsystem (3) one ends link to each other with metallic lamp holder (1) through exchanging input line (12), and the other end links to each other with second tin coating (14) of aluminium sheet through DC leadout (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203085501U CN202176948U (en) | 2011-08-23 | 2011-08-23 | Light-emitting diode (LED) lamp based on composite heat dissipating technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203085501U CN202176948U (en) | 2011-08-23 | 2011-08-23 | Light-emitting diode (LED) lamp based on composite heat dissipating technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202176948U true CN202176948U (en) | 2012-03-28 |
Family
ID=45866824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203085501U Expired - Fee Related CN202176948U (en) | 2011-08-23 | 2011-08-23 | Light-emitting diode (LED) lamp based on composite heat dissipating technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202176948U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297352A (en) * | 2011-08-23 | 2011-12-28 | 甄海威 | LED (light-emitting diode) lamp based on composite heat-radiating technique |
| WO2013053198A1 (en) * | 2011-10-09 | 2013-04-18 | Chen Jeong-Shiun | Light-emitting diode lighting having plastic light housing |
| CN103868036A (en) * | 2014-02-21 | 2014-06-18 | 厦门广泓工贸有限公司 | Lamp holder negative terminal, installation structure and installation process for lamp holder negative terminal and driving board, and LED (Light Emitting Diode) lamp |
| CN103968277A (en) * | 2013-02-04 | 2014-08-06 | 铼钻科技股份有限公司 | Light-emitting diode bulb |
-
2011
- 2011-08-23 CN CN2011203085501U patent/CN202176948U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102297352A (en) * | 2011-08-23 | 2011-12-28 | 甄海威 | LED (light-emitting diode) lamp based on composite heat-radiating technique |
| CN102297352B (en) * | 2011-08-23 | 2014-10-01 | 何永祥 | LED (light-emitting diode) lamp based on composite heat-radiating technique |
| WO2013053198A1 (en) * | 2011-10-09 | 2013-04-18 | Chen Jeong-Shiun | Light-emitting diode lighting having plastic light housing |
| CN103968277A (en) * | 2013-02-04 | 2014-08-06 | 铼钻科技股份有限公司 | Light-emitting diode bulb |
| CN103868036A (en) * | 2014-02-21 | 2014-06-18 | 厦门广泓工贸有限公司 | Lamp holder negative terminal, installation structure and installation process for lamp holder negative terminal and driving board, and LED (Light Emitting Diode) lamp |
| CN103868036B (en) * | 2014-02-21 | 2018-06-19 | 厦门广泓工贸有限公司 | Lamp cap negative terminal and its with the mounting structure of driving plate and mounting process and LED light |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102297352B (en) | LED (light-emitting diode) lamp based on composite heat-radiating technique | |
| CN104421682B (en) | LED light source module and the LEDbulb lamp comprising the module | |
| CN202176948U (en) | Light-emitting diode (LED) lamp based on composite heat dissipating technique | |
| CN201204203Y (en) | Radiating device for high-power LED | |
| CN101482233A (en) | LED spot light | |
| CN203309614U (en) | High-power light-emitting diode (LED) spotlight capable of radiating actively | |
| CN201887992U (en) | LED lamp and radiating control circuit thereof | |
| CN201377772Y (en) | Heat conducting and radiating device for high-power LED lamp | |
| CN201425286Y (en) | Heat dissipation structure of LED lamp | |
| CN203927476U (en) | A kind of heat abstractor and with the LED illuminating source of heat abstractor | |
| CN203533494U (en) | Heat dissipation system of high-power LED lamp | |
| CN201344395Y (en) | LED spot light | |
| CN209309711U (en) | A kind of light source is the light bulb of COB mould group | |
| CN103196080B (en) | Super-power searchlight | |
| CN105720185A (en) | LED module welded with semiconductor temperature difference power generation chips | |
| CN201731301U (en) | Powerful radiation type high-power LED explosion-proof lamp | |
| CN103939803A (en) | Efficient LED overwater attracting fish lamp | |
| CN205619227U (en) | Heat dissipation structure of light -emitting diode (LED) lamp | |
| CN203823571U (en) | High-power LED waterborne fish attraction lamp structure | |
| CN201983240U (en) | Heat radiating device and light emitting diode (LED) lamp using same | |
| CN104110590A (en) | Low-thermal-resistance radiating LED lamp | |
| CN103900044A (en) | Welding type LED substrate and manufacturing technology thereof | |
| CN203757671U (en) | Heat-conducting waterproof silicone pad | |
| CN203927580U (en) | A kind of high-power LED spotlight | |
| CN202216026U (en) | Heat dissipation structure body of LED (light-emitting diode) lamp with ball bulb |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120328 Termination date: 20140823 |
|
| EXPY | Termination of patent right or utility model |