WO2014008773A1 - Procédé de fabrication d'un module à del montée en surface - Google Patents

Procédé de fabrication d'un module à del montée en surface Download PDF

Info

Publication number
WO2014008773A1
WO2014008773A1 PCT/CN2013/074164 CN2013074164W WO2014008773A1 WO 2014008773 A1 WO2014008773 A1 WO 2014008773A1 CN 2013074164 W CN2013074164 W CN 2013074164W WO 2014008773 A1 WO2014008773 A1 WO 2014008773A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
led chip
pad
led
manufacturing
Prior art date
Application number
PCT/CN2013/074164
Other languages
English (en)
Chinese (zh)
Inventor
廖泳
吕宗宜
Original Assignee
厦门吉瓦特照明科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 厦门吉瓦特照明科技有限公司 filed Critical 厦门吉瓦特照明科技有限公司
Publication of WO2014008773A1 publication Critical patent/WO2014008773A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1366—Spraying coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a production method for manufacturing a chip type LED module.
  • LED With the development of lighting LED technology, compared with the traditional incandescent lamp, halogen lamp type of illumination source, LED has obvious advantages of energy saving, reliability, longevity, and can gradually achieve the lighting performance of fluorescent lamps, such as light effect and display Color index, life aspect. Therefore, the global development of lighting LEDs is on the rise, and the annual output of LED light sources is gradually increasing.
  • LED light sources Compared with traditional light sources, LED light sources have some obvious features. Usually, in terms of volume, LED light sources are in units of a single chip, with electrodes, phosphors, package structures, etc., with a small volume and With less luminous flux, if it is necessary to form a suitable lighting fixture, it is inevitable to use multiple LED light sources to form an array of modules. On the one hand, it can integrate volume, structure shape and uniform power supply, on the other hand, sufficient luminous flux must be achieved. These features are already prominent in general lighting and indoor lighting: a more common practice is to arrange a complete package of LED light sources on the substrate to be fixed and connected to form an LED module that can be illuminated as a whole, and then assembled into a complete module. Lighting.
  • the luminaire is large in shape and the luminous flux required for a single luminaire is high (such as 1000 lm or more), the number of single LED light sources must be very large, especially when using LED light sources packaged in medium and small power (such as 10 mil). Therefore, the manufacturing process of the entire module is very long, and it is necessary to complete the packaging of a single LED light source before soldering on the substrate to form a module.
  • COB chip-on-board
  • the chip is fixed on the substrate, and then the wire is connected, and finally the phosphor is coated and the protective glue is covered.
  • This type of method eliminates the package of a single LED light source, but brings a new problem: after the LED chip is fixed on the substrate, it is always necessary to perform single wire bonding, powder coating, etc., taking into account the strength of the wire, its failure rate. Higher, the processing causes more hidden dangers. Moreover, the process time is too long and the quantity of materials is large, so the material cost and time cost of manufacturing are difficult to reduce.
  • the main object of the present invention is to provide a method for manufacturing a chip-type LED module, which solves the problem of excessive material cost of the packaged material when the LED module is mass-produced, and another object is to solve the problem of large-scale pressing of the LED module.
  • the time cost of the process time is too long during production; the other purpose is to solve the hidden danger of the single LED light source on the finished LED module without the high reliability of the processing technology:
  • a method for manufacturing a chip type LED module comprising the following steps:
  • Preparation providing a flip-chip structure of the LED chip, one side of the LED chip has a metal electrode, and the surface spacing of the metal electrode is not less than 80 ⁇ m;
  • the metal electrodes of the LED chip are located at the bottom of the tape receiving space, and the light emitting surface of the LED chip is located at the opening of the receiving space;
  • the LED chip is sucked out from the braid by a vacuum nozzle, and placed on a pad of a substrate; the metal electrode is opposite to the pad, and the light emitting surface of the LED chip faces upward;
  • the pad and the metal electrode are fixed and connected correspondingly.
  • the mounting step is occupied, the tape is placed on an automatically fed placement machine, and controlled to feed one by one.
  • a solder paste is preliminarily disposed on the pad, and a metal electrode of the LED chip is temporarily fixed to the substrate by a surface tension of the solder paste.
  • a solder reflow machine is used to cure the solder paste between the metal electrode and the pad.
  • the reflow soldering machine includes the following processes:
  • Sending a plate placing the already mounted substrate on a conveyor belt, the conveyor belt being controlled and traveling;
  • Preheating volatilizing the auxiliary solvent in the solder paste
  • Average temperature activate the flux in the solder paste and evaporate excess water
  • Reflow soldering melting the solder paste to fill the area between the metal electrode and the pad and connecting the two;
  • Cooling The temperature of the solder paste, metal electrode, and pad is lowered to a cooling temperature.
  • the pad has a plurality of pads on the substrate, and the solder paste is attached to the pad by screen printing.
  • the light emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is in one-to-one correspondence with the LED chip, and is separately mounted.
  • the light emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is in the form of a monolithic film covering the surface portion of the LED chip together with the substrate on which it is placed.
  • the light emitting surface of the LED chip is covered with a fluorescent film, and the fluorescent film is directly sprayed on the light emitting surface of the LED chip by liquid spraying, together with the same side thereof.
  • the surface of the substrate is covered with a fluorescent film, and the fluorescent film is directly sprayed on the light emitting surface of the LED chip by liquid spraying, together with the same side thereof.
  • the LED chip emits visible light and is in the range of 440-470 nm. It can also be used to emit ultraviolet light with a wavelength range of 240-355 nm.
  • an auxiliary colloid having a bottom portion of the LED chip temporarily fixed to the surface of the substrate is disposed adjacent to the pad.
  • the flip chip LED chip is directly loaded by braiding, which avoids the packaging of a single LED light source, saves the packaging material and packaging process time of a single LED light source, and the production line;
  • the vacuum nozzle absorbs the light-emitting surface of the LED chip, and its geometric characteristics are consistent, and there is no leakage failure caused by irregular shape, and the patch has low failure rate and accurate positioning;
  • FIG. 1 is a side view of a flip chip structure LED chip 10 used in Embodiment 1 of the present invention.
  • FIG. 2 is a view showing the form of the LED chip 10 in the braid 20 after receiving the LED chip tapping step of the embodiment
  • Figure 3 is a plan view of the braid 20 of the embodiment
  • Figure 4 is a state of the mounting step of the first embodiment
  • Figure 5 is another state of the mounting step of the first embodiment
  • Figure 6 is a plan view of the first embodiment after the fixing step is completed
  • Figure 7 is a side view of the state shown in Figure 6;
  • Figure 8 is a state diagram of a powder coating step after the mounting step of the first embodiment
  • Figure 9 is a state diagram of the second mounting step of the embodiment of the present invention.
  • Fig. 10 is a view showing the state of the powder coating step after the completion of the mounting step of the second embodiment.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the LED chip 10 of the Flip-chip structure used in the present invention has a main body 10 as a semiconductor material portion and a lower and a negative metal electrode which is in ohmic contact with the main body 10, and is below the main body 10.
  • the distance G1 between the electrodes 13 is 80 ⁇ m; the LED chip of the flip-chip structure, the light-emitting surface 12 and the metal electrode 13 of the conductive portion are located on both sides of the body 10, and do not interfere with each other, and the luminous efficiency thereof is high. .
  • the LED chips 10 are placed one by one in the braid 20, each LED chip occupies an accommodating space 23, and is independent of each other; and the metal electrode 13 of the LED chip 10 is located at the bottom of the accommodating space 23; The light exit surface 12 is located at the opening of the accommodating space.
  • the protective film 21 is closed at the opening of the braid 20 to protect the accommodating space 23.
  • the braid 20 has a positioning hole along its length direction, which facilitates the ratcheting mechanism of the braiding machine to grasp and drive its travel, and realize automatic feeding one by one.
  • the tape of this embodiment is suitable for the placement machine of all the patch products, and has good versatility.
  • the two states of the mounting steps are respectively performed; after the tape 20 is mounted on the automatic placement machine, the placement machine is loaded on the substrate 40 to be mounted; the vacuum nozzle 30 is extended.
  • the accommodating space after touching the light-emitting surface 12 of the LED chip 10, the same position is sucked out, which is the suction state shown in FIG. 4; and then translated to the upper surface of the substrate 41, wherein the pad 41 is the final One-to-one correspondence with the metal electrodes 13 has a screen-printed solder paste 42 on the pad 41; the pad 41 gap G2 is also 80 ⁇ m.
  • the metal electrode 13 and the pad 41 are temporarily fixed by the tension of the solder paste 42 itself, and are not randomly displaced due to air flow or shaking.
  • solder paste 42 passes through the following steps in the reflow soldering machine:
  • Sending board placing the already mounted substrate 40 on the conveyor belt, and the conveyor belt is controlled and travels;
  • Average temperature activate the flux in the solder paste 42 and evaporate excess water
  • molten solder paste 42 fills the area between the metal electrode 13 and the pad 41 and connects the two;
  • Cooling The temperature of the solder paste 42, the metal electrode 13, and the pad 41 is lowered to the cooling temperature.
  • the LED chip 10 which has been mounted and fixed, the metal electrode 13 and the pad 41 have been fixed and kept in communication by the solid solder paste 42.
  • the solder paste 42 has pulled the metal electrode 13 in alignment by its own tension before solidification.
  • the LED chip 10 has been fixed on the substrate 40, and all the LED chips 10 on the substrate 40 are connected according to the line of the pad 41, and a complete module has been formed, which can be illuminated by being connected to the power source.
  • the 455 nm blue LED chip 10 is used, and the entire module needs to realize white light output of 4000K color temperature. Therefore, the module must be coated with phosphor.
  • the liquid powder is sprayed directly to spray the phosphor.
  • the flip chip LED chip 10 adopts the method of tape loading directly, and has obvious features, so that the manufacturing process of the whole LED module avoids the packaging of a single LED light source, and finally all the LED chips 10 can be removed without a single package. Fixed and connected to the substrate 40, saving the packaging material and packaging process time of the single LED light source, and the production line; Moreover, the placement machine of the vacuum nozzle 30 absorbs the light emitting surface of the LED chip 10, and the geometric characteristics thereof are consistent.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • FIG. 9 two state diagrams of Embodiment 2 of the present invention:
  • the substrate 40 has an auxiliary colloid 45 between the pads 41.
  • the auxiliary colloid 45 functions when the LED chip 10 is large in volume. It is difficult to temporarily fix the LED chip 10 to the substrate by the tension of the solder paste 42, and the auxiliary colloid 45 serves as a temporary component to make the LED chip 10 and the pad 41 relatively accurate and stable, and the posture deviation does not occur even after the reflow oven. .
  • the fluorescent film is in the form of a monolithic film, which is separately formed, so that the appropriate pressure and bonding can be directly used.
  • the fluorescent film 50 is entirely covered on the LED chip 10 together with the surface portion of the substrate 40. This method further shortens the molding time of the entire module, does not require spraying, and does not need to be baked for curing, so it is very fast. Process flow.
  • the direct bonding of the LED chip 10 to the substrate 40 by the placement machine has obvious convenience for coating the phosphor on a large area, so that the fluorescent film can be efficiently formed by various methods.
  • the flip chip LED chip is directly loaded by the tape, which avoids the packaging of a single LED light source, saves the packaging material and packaging process time of a single LED light source, and the production line.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention porte sur un procédé de fabrication d'un module à DEL montée en surface, comprenant les étapes suivantes : la préparation, en fournissant une puce de DEL (10) d'une structure à puce retournée, un côté de la puce de DEL (10) ayant des électrodes métalliques (13), et le pas de surface des électrodes métalliques (13) n'étant pas inférieur à 80 µm; l'agencement, en plaçant une pluralité de puces de DEL (10) dans une bande, les électrodes métalliques (13) de la puce de DEL (10) étant localisées à la partie inférieure d'un espace de réception de bande (23), et la surface émettrice de lumière (12) de la puce de DEL (10) étant localisée à l'ouverture de l'espace de réception (23); l'adhésion, en aspirant la puce de DEL (10) depuis la bande en utilisant une ventouse à vide (30), et en plaçant la puce de DEL (10) sur un plage d'accueil d'un substrat, de telle sorte que l'électrode métallique (13) est opposée au plage d'accueil, et la surface émettrice de lumière (12) de la puce de DEL (10) est tournée vers le haut; et la fixation, en fixant et en assemblant de manière correspondante le plage d'accueil et l'électrode métallique (13). Par adoption directe d'une manière de support de bande pour une puce de DEL à puce retournée, l'encapsulation d'une unique source de lumière à DEL est évitée; le matériau d'encapsulation, le temps de processus d'encapsulation, et la ligne de production pour une unique source de lumière à DEL sont économisés.
PCT/CN2013/074164 2012-07-09 2013-04-12 Procédé de fabrication d'un module à del montée en surface WO2014008773A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210236106.2 2012-07-09
CN201210236106.2A CN102779923B (zh) 2012-07-09 2012-07-09 一种贴片式led模组的制造方法

Publications (1)

Publication Number Publication Date
WO2014008773A1 true WO2014008773A1 (fr) 2014-01-16

Family

ID=47124774

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2013/074164 WO2014008773A1 (fr) 2012-07-09 2013-04-12 Procédé de fabrication d'un module à del montée en surface

Country Status (2)

Country Link
CN (1) CN102779923B (fr)
WO (1) WO2014008773A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106992169A (zh) * 2017-04-27 2017-07-28 山东晶泰星光电科技有限公司 一种倒装rgb‑led封装模组及其显示屏
CN107123724A (zh) * 2017-03-29 2017-09-01 华南理工大学 一种电控变曲面荧光膜片模压方法及装置
CN107830416A (zh) * 2017-11-02 2018-03-23 江苏稳润光电科技有限公司 一种表贴式的led光源
CN111785752A (zh) * 2020-07-07 2020-10-16 深圳市微组半导体科技有限公司 主板返修方法
CN113782471A (zh) * 2021-09-14 2021-12-10 深圳市兆驰晶显技术有限公司 基于led倒装芯片封装技术的led屏封装工艺及led屏
CN115003151A (zh) * 2022-07-11 2022-09-02 浙江机电职业技术学院 一种计算机主板生产加工用贴片装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102779923B (zh) * 2012-07-09 2015-02-04 厦门吉瓦特照明科技有限公司 一种贴片式led模组的制造方法
CN105590994A (zh) * 2014-10-22 2016-05-18 泉州市金太阳照明科技有限公司 一种led光源基板及其制作方法
CN105489734A (zh) * 2015-04-10 2016-04-13 郭垣成 一种免绑线的cob生产工艺
CN105514097A (zh) * 2015-04-10 2016-04-20 郭垣成 一种可折弯陶瓷的cob led光源片
CN105318200A (zh) * 2015-10-12 2016-02-10 深圳万城节能股份有限公司 发光单元的制造方法
CN106129212A (zh) * 2016-08-24 2016-11-16 厦门忠信达工贸有限公司 正装覆晶led芯片封装体、封装方法及其应用
KR102481413B1 (ko) * 2017-10-27 2022-12-26 라디안트 옵토-엘렉트로닉스(쑤저우) 컴퍼니 리미티드 Led 광원 모듈 및 이의 제조방법
US11686896B2 (en) 2017-10-27 2023-06-27 Radiant Opto-Electronics(Suzhou) Co., Ltd. LED light source module
CN109285788A (zh) * 2018-10-11 2019-01-29 深圳市修颐投资发展合伙企业（有限合伙） 丝网印刷胶的贴片方法
CN111613709A (zh) * 2020-05-27 2020-09-01 深圳市华星光电半导体显示技术有限公司 迷你发光二极管背光模组、其制作方法及显示装置
CN113410219A (zh) * 2021-07-17 2021-09-17 北京梦之墨科技有限公司 一种led贴膜屏及其制作方法
CN115832124B (zh) * 2022-11-21 2024-01-05 江苏宜美照明科技股份有限公司 一种全自动化cob贴片焊接方法和系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007014880A1 (fr) * 2005-08-04 2007-02-08 Siemens Aktiengesellschaft Procede de transfert, et dispositif pour manipuler des composants electroniques
CN101532612A (zh) * 2009-03-10 2009-09-16 广州南科集成电子有限公司 一种集成led芯片光源的制造方法
CN102779923A (zh) * 2012-07-09 2012-11-14 厦门飞德利照明科技有限公司 一种贴片式led模组的制造方法
CN102915933A (zh) * 2012-09-11 2013-02-06 厦门锐迅达电子有限公司 一种祼晶的表面贴装焊接工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4881358B2 (ja) * 2008-08-28 2012-02-22 株式会社東芝 発光装置
JP5310536B2 (ja) * 2009-12-25 2013-10-09 豊田合成株式会社 発光装置の製造方法
CN102143678B (zh) * 2010-02-01 2015-11-25 未来产业株式会社 用于供应电子元件的设备
CN202026521U (zh) * 2011-02-28 2011-11-02 张�林 带散热金属的电路板
CN102271468B (zh) * 2011-07-07 2013-07-10 余耀国 贴片机的贴装结构和贴装方法
CN102222667A (zh) * 2011-07-14 2011-10-19 东莞市邦臣光电有限公司 一种led光源模块及其封装工艺
CN202276603U (zh) * 2011-09-07 2012-06-13 温云龙 一种led发光柔性灯带贴片机
CN102290524B (zh) * 2011-09-21 2013-03-06 晶科电子（广州）有限公司 一种led器件及其led模组器件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007014880A1 (fr) * 2005-08-04 2007-02-08 Siemens Aktiengesellschaft Procede de transfert, et dispositif pour manipuler des composants electroniques
CN101532612A (zh) * 2009-03-10 2009-09-16 广州南科集成电子有限公司 一种集成led芯片光源的制造方法
CN102779923A (zh) * 2012-07-09 2012-11-14 厦门飞德利照明科技有限公司 一种贴片式led模组的制造方法
CN102915933A (zh) * 2012-09-11 2013-02-06 厦门锐迅达电子有限公司 一种祼晶的表面贴装焊接工艺

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107123724A (zh) * 2017-03-29 2017-09-01 华南理工大学 一种电控变曲面荧光膜片模压方法及装置
CN107123724B (zh) * 2017-03-29 2023-05-23 华南理工大学 一种电控变曲面荧光膜片模压方法及装置
CN106992169A (zh) * 2017-04-27 2017-07-28 山东晶泰星光电科技有限公司 一种倒装rgb‑led封装模组及其显示屏
CN107830416A (zh) * 2017-11-02 2018-03-23 江苏稳润光电科技有限公司 一种表贴式的led光源
CN111785752A (zh) * 2020-07-07 2020-10-16 深圳市微组半导体科技有限公司 主板返修方法
CN111785752B (zh) * 2020-07-07 2023-01-17 深圳市微组半导体科技有限公司 主板返修方法
CN113782471A (zh) * 2021-09-14 2021-12-10 深圳市兆驰晶显技术有限公司 基于led倒装芯片封装技术的led屏封装工艺及led屏
CN115003151A (zh) * 2022-07-11 2022-09-02 浙江机电职业技术学院 一种计算机主板生产加工用贴片装置
CN115003151B (zh) * 2022-07-11 2023-07-18 浙江机电职业技术学院 一种计算机主板生产加工用贴片装置

Also Published As

Publication number Publication date
CN102779923A (zh) 2012-11-14
CN102779923B (zh) 2015-02-04

Similar Documents

Publication Publication Date Title
WO2014008773A1 (fr) Procédé de fabrication d'un module à del montée en surface
CN205264271U (zh) 一种全彩rgb集成发光单元模块及led显示屏
CN101761810A (zh) 一种白光平面光源led模块及其制作方法
AU2019382303B2 (en) LED flexible light bar
KR20130036754A (ko) 형광체 막들을 갖는 패키징된 led들, 및 연관 시스템들과 방법들
CN113054072A (zh) Led芯片单元、led器件及其制作方法
WO2016197496A1 (fr) Module électroluminescent intégré à del
CN101126485A (zh) 具发光二极管的光源模块及其形成方法
EP4016649A1 (fr) Dispositif électroluminescent et procédé de fabrication, et écran d'affichage et équipement d'éclairage comprenant ledit dispositif électroluminescent
CN107256921A (zh) Cob‑led封装方法、显示装置和照明装置
CN109449145A (zh) 一种高可靠性的cob封装结构及其高效封装方法
WO2011029219A1 (fr) Source lumineuse à del tridimensionnelle à support de fixation de plaquette de del et son procédé de mise en boîtier
CN104051603A (zh) 一种双面发光的led灯条的制造工艺
CN216749944U (zh) Led封装器件
CN214176060U (zh) 一种蓝光晶粒和csp晶粒混合的cob光源及灯具
CN108461613A (zh) 一种uv-led光源及其灯具
WO2021213204A1 (fr) Substrat de del, boîtier de del et son procédé de fabrication, et dispositif d'affichage
CN210956669U (zh) 一种镜面铝基板cob光源
WO2022057937A1 (fr) Substrat, et ensemble source de lumière à del et procédé de fabrication s'y rapportant
US20080237626A1 (en) LED chip packaging structure
CN212011018U (zh) Led芯片单元及led器件
CN210778653U (zh) 一种软灯条点胶结构
CN101477954A (zh) 具高效率侧向发光效果的发光二极管芯片封装方法及结构
CN205335256U (zh) 集成led封装结构
CN203799604U (zh) 一种增强散热的led显示单元模组

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13817333

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13817333

Country of ref document: EP

Kind code of ref document: A1